Dicing apparatus for chip processing

Abstract

The utility model relates to the technical field of metal wire rod processing or processing, concretely is a kind of wire cutting segmentation device for chip processing, including wire cutting clamp, wire cutting clamp includes two wire cutting plates that can move relatively, the side of one wire cutting plate with another wire cutting plate is equipped with wire cutting blade, the number of wire cutting blade is multiple, multiple wire cutting blades are evenly distributed;It further includes horizontal moving mechanism and the wire collection box of top opening, wire cutting clamp is movably connected with horizontal moving mechanism, wire cutting clamp is used to move to the above of wire collection box along horizontal moving mechanism;Wire cutting plate all includes fixedly connected connecting portion and cutting portion, the top of connecting portion is fixedly connected with pneumatic finger, the bottom of connecting portion is fixedly connected with cutting portion, the cutting portion of two wire cutting plates can move relatively;It further includes vertical moving mechanism and pressing sheet, and pressing sheet can move vertically along vertical moving mechanism vertically.Using the scheme, wire head can be avoided when cutting wire splashing, and the influence on chip processing efficiency is reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of metal wire processing or treatment, specifically a wire cutting and splitting device for chip processing. Background Technology

[0002] Chip manufacturing involves the processing of wires such as metal wires and enameled wires. For example, in network filters, the wires need to be wound around a magnetic ring to form a coil. After winding, the wire ends need to be cut off. During the wire cutting process, the cut wire ends may splatter. These splattered wire ends may fall into the chip manufacturing equipment, causing equipment malfunctions and interfering with automated chip production.

[0003] To address the issue of wire splattering in existing technology, utility model patent CN210334149U discloses a wire cutting fixture for network filter production. This fixture adheres a double-sided adhesive layer to a processing boss. During network filter manufacturing, the filter is first installed, and then the remaining lead ends are individually adhered to the double-sided adhesive. Finally, the lead ends are cut with a blade. During cutting, the double-sided adhesive prevents wire splattering. However, the adhesive area and strength of the double-sided adhesive are limited, requiring frequent replacement, which affects production efficiency. Furthermore, the accumulation of wire ends adhered to the double-sided adhesive may interfere with the cutting quality of subsequent wire ends. Utility Model Content

[0004] The present invention aims to provide a wire cutting and splitting device for chip processing, which can avoid wire splattering during cutting and reduce the impact on chip processing efficiency.

[0005] This utility model provides the following basic solution: A wire cutting and separating device for chip processing includes a wire cutting clamp, which includes two wire cutting plates that can move relative to each other. Each wire cutting plate has a wire cutting edge on the side opposite to the other wire cutting plate. The number of wire cutting edges is multiple and they are evenly distributed.

[0006] Furthermore, it also includes a lateral movement mechanism and a top-opening hub box, with a wire cutter clamp movably connected to the lateral movement mechanism for moving along the lateral movement mechanism to above the hub box.

[0007] Furthermore, the lateral movement mechanism includes a telescopic cylinder, a telescopic guide rail, and a mounting plate. The telescopic cylinder is fixedly connected to one end of the mounting plate, the telescopic guide rail is fixedly connected to the telescopic cylinder, the mounting plate is slidably connected to the telescopic guide rail, and the tangent clamp is installed on the side of the mounting plate away from the telescopic guide rail.

[0008] Furthermore, the tangent clamp uses pneumatic fingers, which include two pneumatic grippers capable of relative movement, and the two tangent plates are fixedly connected to the two pneumatic grippers respectively.

[0009] Furthermore, each tangent plate includes a connecting part and a cutting part that are fixedly connected. The top end of the connecting part is fixedly connected to the pneumatic finger, and the bottom end of the connecting part is fixedly connected to the cutting part. The cutting parts of the two tangent plates can move relative to each other.

[0010] Furthermore, it also includes a vertical moving mechanism and a tablet press, which can move vertically along the vertical moving mechanism.

[0011] Furthermore, a notch is provided at the bottom of the tablet.

[0012] Furthermore, the vertical moving mechanism includes a moving cylinder and a connecting plate. The connecting plate is movably connected to the moving cylinder and can move vertically along the moving cylinder. The pressing plate is fixedly connected to the connecting plate.

[0013] Beneficial effects: In use, the chip to be processed is moved to the designated position, and the wire cutter is moved to the position where the wire end is located, so that the wire end is between the two wire cutters. The two wire cutters move relative to each other to cut the wire end.

[0014] In this solution, multiple cutting blades clamp the cut wire ends while simultaneously cutting them, confining the cut wire ends between two cutting plates to prevent wire splattering during cutting. Compared to existing technologies, this eliminates the need for frequent replacements, thus reducing the impact on chip processing efficiency. The junction box design, after cutting, moves the wire clamp under the control of a lateral movement mechanism to the top of the junction box. At this point, the two cutting plates move in opposite directions, and the wire ends located between them fall into the junction box for automatic collection and processing, improving production efficiency. The cutting plates prevent interference during the cutting process and ensure the cutting blades are close to the chip, reducing wire residue after cutting. The clamping mechanism, when used in chip production with moving molds, clamps the mold to prevent the wire clamp from sticking to the cut wire ends, causing mold movement and potential chip misalignment, which could affect subsequent production processes, thereby improving chip processing efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of an embodiment of the tangent dividing device for chip processing according to the present invention. Figure 2 This is a schematic diagram of the transverse moving mechanism and the wire cutting clamp in an embodiment of the wire cutting and splitting device for chip processing according to this utility model; Figure 3 This utility model relates to a tangent slitting device for chip processing. Figure 2 Enlarged view of point A in the middle; Figure 4 This is a schematic diagram of the vertical moving mechanism and the pressing sheet structure of an embodiment of the tangential cutting device for chip processing according to this utility model. Detailed Implementation

[0016] The following detailed description illustrates the specific implementation method: The reference numerals in the accompanying drawings include: frame 1, wire cutter 2, junction box 3, telescopic cylinder 4, mounting plate 5, wire cutter 6, wire cutter blade 7, extension block 8, cutting plate 9, pressure plate 10, moving cylinder 11, connecting plate 12, notch 13, and conveying guide rail 14.

[0017] Example A wire dicing device for chip processing, as shown in the attached document. Figure 1 As shown, the device includes a frame 1, a lateral movement mechanism, a wire cutter clamp 2, and a top-opening junction box 3. The lateral movement mechanism is mounted on the frame 1 and includes a telescopic cylinder 4, a telescopic guide rail, and a mounting plate 5. The telescopic cylinder 4 is fixedly connected to one end of the mounting plate 5, the telescopic guide rail is fixedly connected to the telescopic cylinder 4, and the mounting plate 5 is slidably connected to the telescopic guide rail. The wire cutter clamp 2 is mounted on the side of the mounting plate 5 away from the telescopic guide rail. Specifically: As attached Figure 2 As shown, the telescopic cylinder 4 is mounted on the frame 1. The telescopic cylinder 4 is horizontally oriented and includes a telescopic rod. The telescopic cylinder 4's telescopic direction is the axial direction of the telescopic rod, i.e., the telescopic rod is horizontally oriented. The structure and installation of the telescopic cylinder 4 are very mature existing technologies and are not the inventive point of this solution, therefore, they will not be described in detail.

[0018] Mounting plate 5 includes a horizontal part and a vertical part. One end of the horizontal part is fixedly connected to the bottom end of the vertical part, and one side of the vertical part is fixedly connected to the telescopic rod of the telescopic cylinder 4. The telescopic guide rail is fixedly connected to the bottom of the telescopic cylinder 4. The horizontal part is slidably connected to the telescopic guide rail. The length direction of the telescopic guide rail is parallel to the telescopic direction of the telescopic cylinder 4. That is, the top of the horizontal part is provided with a telescopic groove that matches the cross-sectional shape of the telescopic guide rail. The telescopic groove is used in conjunction with the telescopic guide rail.

[0019] In this embodiment, the telescopic cylinder 4 is fixedly connected to the frame 1 by bolts. The horizontal and vertical parts are integrally formed. The telescopic rod of the telescopic cylinder 4 is connected to the vertical part by a flange. The telescopic guide rail is installed at the bottom of the telescopic cylinder 4 by screws. The telescopic cylinder 4 provides driving force for the movement of the mounting plate 5. The telescopic guide rail limits the movement of the mounting plate 5, thereby controlling the movement of the mounting plate 5 in a specified direction. The mounting plate 5 provides an installation position for components that need to be driven later.

[0020] The wire tangent clamp 2 is movably connected to the lateral moving mechanism, and is used to move along the lateral moving mechanism to above the cable collection box 3. The wire tangent clamp 2 includes two tangent plates 6 capable of relative movement. Each tangent plate 6 has a tangent blade 7 on its opposite side. The number of tangent blades 7 is multiple, and they are evenly distributed along the length of the wire end. Specifically: The tangent clamp 2 uses pneumatic fingers. The structure and movement principle of pneumatic fingers are well-established existing technologies and will not be described in detail here. An extension block 8 is fixedly connected to the bottom of the transverse part, and the tangent clamp 2 is fixedly connected to the bottom of the extension block 8 away from the transverse part. The pneumatic fingers include two pneumatic grippers that can move relative to each other. Two tangent plates 6 are fixedly connected to the two pneumatic grippers respectively, and the two tangent plates 6 are fixedly connected to the opposite side of the two pneumatic grippers respectively. The direction of relative movement of the two pneumatic grippers is parallel to the extension and retraction direction of the telescopic cylinder 4.

[0021] As attached Figure 3 As shown, each tangent plate 6 includes a connecting part and a cutting part that are fixedly connected. The top end of the connecting part is fixedly connected to the pneumatic finger, that is, the connecting part is fixedly connected to the pneumatic gripper. The bottom end of the connecting part is fixedly connected to the cutting part. The cutting parts of the two tangent plates 6 can move relative to each other, and the direction of relative movement of the two cutting parts is parallel to the extension and retraction direction of the telescopic cylinder 4. One tangent plate 6 has multiple cutting blades 7 on the side facing the other tangent plate 6, and the other tangent plate 6 has a cutting plate 9 on the side facing the cutting blades 7.

[0022] In this embodiment, the extension block 8 is fixedly connected to the transverse part by screws, the tangent clamp 2 is fixedly connected to the extension block 8 by screws, and the tangent plate 6 is bolted to the pneumatic gripper, that is, the connecting part is bolted to the pneumatic gripper. The connecting part and the cutting part are integrally formed, and the tangent blade 7 and the cutting plate 9 are integrally formed with the two tangent plates 6 respectively, that is, the tangent blade 7 and the cutting plate 9 are integrally formed with the two cutting parts respectively. There are six tangent blades 7, and the length direction of the tangent blades 7 is horizontally arranged and perpendicular to the extension and retraction direction of the telescopic cylinder 4.

[0023] The expansion block 8 increases the installation area of ​​the wire cutter clamp 2 and the lateral movement mechanism, facilitating the installation of the wire cutter clamp 2. The wire cutting plate 6 prevents interference during the cutting process and allows the cutting blade 7 to be closer to the chip, reducing wire end residue after cutting. Multiple cutting blades 7 clamp the cut wire ends while cutting, confining them between the two wire cutting plates 6 to prevent wire end splattering. Compared to existing technologies, frequent replacements are unnecessary, reducing the impact on chip processing efficiency. The junction box 3, after cutting, allows the wire cutter clamp 2 to move above the junction box 3 under the control of the lateral movement mechanism. At this point, the two wire cutting plates 6 move in opposite directions, and the wire ends located between them fall into the junction box 3 for automatic collection and processing, improving production efficiency.

[0024] As attached Figure 4 As shown, it also includes a vertical moving mechanism and a pressing plate 10, which can move vertically along the vertical moving mechanism. The vertical moving mechanism includes a moving cylinder 11 and a connecting plate 12. The connecting plate 12 is movably connected to the moving cylinder 11 and can move vertically along the moving cylinder 11. The pressing plate 10 is fixedly connected to the connecting plate 12. A notch 13 is provided at the bottom of the pressing plate 10. Specifically: The vertical moving mechanism is mounted on the frame 1, that is, the moving cylinder 11 is mounted on the frame 1, and the extension and retraction direction of the moving cylinder 11 is vertical. The connecting plate 12 includes a guide rail part and a horizontal part. The bottom end of the guide rail part is fixedly connected to one end of the horizontal part, and one side of the guide rail part is slidably connected to the side of the moving cylinder 11 away from the frame 1. A sliding rail and a sliding groove are provided between the guide rail part and the moving cylinder 11 for cooperation, and the cross-sectional shapes of the sliding rail and the sliding groove match. The moving cylinder 11 includes a telescopic rod, and the top of the horizontal part is fixedly connected to the telescopic rod of the moving cylinder 11. The extension and retraction direction of the moving cylinder 11 is the extension and retraction direction of the telescopic rod, that is, the telescopic rod is vertical. The structure and installation of the moving cylinder 11 are very mature existing technologies and are not the inventive point of this solution, so they will not be described in detail.

[0025] A mounting bracket is provided on the side of the guide rail away from the moving cylinder 11. The pressing sheet 10 is mounted on the bottom of the mounting bracket, and a notch 13 is provided on the bottom of the pressing sheet 10 away from the mounting bracket. The notch 13 is designed to match the chip production mold.

[0026] In this embodiment, the movable cylinder 11 is fixedly connected to the frame 1 by bolts. The guide rail and the transverse part are integrally formed. The slide rail and the movable cylinder 11 are fixedly connected by screws. The slide groove is opened on the guide rail. The telescopic rod of the movable cylinder 11 is connected to the transverse part by a flange. The mounting bracket is fixedly connected to the guide rail by screws. The pressure plate 10 is mounted on the mounting bracket by screws.

[0027] The specific implementation process is as follows: In the chip manufacturing process, the chip is placed on a mold, which is then transported to different processing stages via a conveyor rail 14. In this application, the junction box 3 is located on one side of the conveyor rail 14, while the wire cutter 2 and the pressure plate 10 are located above it. Initially, the wire cutter 2 is positioned on the chip lead conveying track, and the pressure plate 10 is positioned above the chip conveying track. When the chip is transported to the designated position, the chip lead is located between the two wire cutters 6. The moving cylinder 11 is activated, and the pressure plate 10 moves downward under the action of the vertical moving mechanism, pressing against the chip mold. The pneumatic finger is activated, causing the two wire cutters 6 to move relative to each other. The wire cutter 7 clamps and cuts the chip lead. Subsequently, the telescopic cylinder 4 is activated, and the wire cutter 2 moves the cut lead to the top of the junction box 3. The two wire cutters 6 then move in opposite directions, and the lead falls into the junction box 3 for collection. The moving cylinder 11 is started again, and the pressing tablet 10 moves upward under the action of the vertical moving mechanism. The conveying guide rail 14 controls the movement of the mold, thereby repeatedly cutting and collecting the wire ends of the chip.

[0028] To facilitate installation and soldering, the chip wire ends are typically located on both sides. In this design, the wire cutter 2 only cuts the wire ends on one side of the chip, thus preventing interference between the pressure plate 10 and the wire cutter 2. To automate the cutting of chip wire ends, two sets of wire cutters 2, pressure plates 10, and related structures are installed on the conveyor rail 14 to cut the wire ends on both sides of the chip respectively. The notch 13 on the pressure plate 10 can be designed according to the specific shape of the mold, allowing the pressure plate 10 to fit more closely to the top of the mold, thereby pressing the mold firmly and preventing the wire cutter 2 from sticking to the wire ends after cutting, causing the mold to move and resulting in mold or chip displacement, affecting subsequent production processes, thus improving chip processing efficiency.

[0029] The above descriptions are merely embodiments of this utility model. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are knowledgeable of all existing technologies in that field, and possess the ability to apply conventional experimental methods prior to that date. Therefore, those skilled in the art can, based on the guidance provided in this application, improve and implement this solution in conjunction with their own capabilities. Typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A tangent dicing device for chip processing, characterized in that: It includes a wire clamp, which includes two wire clamps that can move relative to each other. Each wire clamp has a wire cutting edge on the side opposite to the other wire clamp. The number of wire cutting edges is multiple and they are evenly distributed.

2. The tangent dicing device for chip processing according to claim 1, characterized in that: It also includes a lateral movement mechanism and a top-opening hub box, with a wire cutter clamp movably connected to the lateral movement mechanism for moving along the lateral movement mechanism to the top of the hub box.

3. The tangent dicing device for chip processing according to claim 2, characterized in that: The lateral movement mechanism includes a telescopic cylinder, a telescopic guide rail, and a mounting plate. The telescopic cylinder is fixedly connected to one end of the mounting plate, the telescopic guide rail is fixedly connected to the telescopic cylinder, the mounting plate is slidably connected to the telescopic guide rail, and the wire clamp is installed on the side of the mounting plate away from the telescopic guide rail.

4. The tangent slitting device for chip processing according to claim 2, characterized in that: The wire tangent clamp uses pneumatic fingers, which include two pneumatic grippers that can move relative to each other. The two wire tangent plates are fixedly connected to the two pneumatic grippers respectively.

5. The tangent dicing device for chip processing according to claim 4, characterized in that: Each tangent plate includes a connecting part and a cutting part that are fixedly connected. The top end of the connecting part is fixedly connected to the pneumatic finger, and the bottom end of the connecting part is fixedly connected to the cutting part. The cutting parts of the two tangent plates can move relative to each other.

6. The tangent dicing apparatus for chip processing according to any one of claims 1-5, characterized in that: It also includes a vertical moving mechanism and a tablet press, which can move vertically along the vertical moving mechanism.

7. The tangent dicing apparatus for chip processing according to claim 6, characterized in that: The bottom of the tablet is notched.

8. The tangent dicing apparatus for chip processing according to claim 7, characterized in that: The vertical moving mechanism includes a moving cylinder and a connecting plate. The connecting plate is movably connected to the moving cylinder and can move vertically along the moving cylinder. The pressing plate is fixedly connected to the connecting plate.

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