A positioning and punching device for a flexible film substrate

Abstract

The utility model discloses a positioning and punching device for flexible film base material belongs to positioning and punching technical field, including the first sleeve on the lift platform mesa, first sleeve top rotatory connection pressure lever, inside setting cutter die subassembly, first sleeve is equipped with first, second passageway, cutter die subassembly includes connecting shaft, connecting shaft upper end connection pressure lever stem, lower end connection second sleeve, and the cutter die is set to the outside of second sleeve, and the bottom of second sleeve is connected with positioning assembly, positioning assembly includes third sleeve, and the microneedle is slid in the third sleeve, and the microneedle needle head end is stretched out from the bottom of third sleeve and is located below the bottom of cutter die, and the first spring is arranged between the non needle head end and the top of third sleeve. The flexible film base material with micro mark is placed on the lift platform mesa, makes the flexible film base material rise and close to the microneedle, when micro mark is aligned with the microneedle needle head end, press the pressure lever to make cutter die downward and contact with the mesa, and leave the punching on the flexible film base material.

Description

Technical Field

[0001] This utility model belongs to the field of positioning punching technology, specifically relating to a positioning punching device for flexible thin film substrates. Background Technology

[0002] The statements in this section are merely background information related to this utility model and do not necessarily constitute prior art.

[0003] Flexible thin film substrates refer to ultra-thin (usually micron-level) transparent polymer films that can be repeatedly bent and folded while maintaining stable function. They are mainly used in flexible electronics, wearable devices, and other fields that require deformation adaptation.

[0004] During processing, the micro-marks on the flexible film substrate need to be positioned and marked, and positioning holes need to be punched. However, existing production lines need to add large-scale vision recognition equipment and equip them with robotic arms and other devices to form positioning holes on flexible film substrates with micro-marks, which is very expensive.

[0005] When using a handheld die to position and punch holes in a flexible film substrate, the force and angle (vertically downward) are difficult to control, easily damaging the die. Existing technology discloses a hand-operated sampler, including a support base. The upper end of the support base is hinged to a connecting shaft, and the other end of the connecting shaft is hinged to a hook plate. The other end of the hook plate is hinged to the right end of a sleeve in the middle of the support base. A shaft is provided at the lower end of the connecting shaft, installed inside the sleeve. A connector is provided at the bottom of the shaft, and a die is threaded onto the connector. A spring is provided between the shaft and the sleeve. A pressure rod is provided on the hook plate. When the pressure rod is pressed down, the connector causes the die to move vertically downward.

[0006] However, the above solution still has the following problems:

[0007] Although the above solution uses the sleeve and shaft to make the die die point vertically downward and the spring can provide cushioning, it cannot be used to position and mark the flexible film substrate, and cannot form positioning holes. Utility Model Content

[0008] In view of this, the purpose of this utility model is to provide a positioning punching device for flexible film substrates, which can solve the problem that the existing sampler cannot position and mark the flexible film substrate and cannot form positioning holes.

[0009] To achieve the above objectives, the present invention adopts the following technical solution:

[0010] A positioning and punching device for flexible film substrate is provided, including a first sleeve suspended and fixed above the lifting platform by a connecting rod, a pressure rod hinged to the periphery of the first sleeve, and a die assembly disposed inside the first sleeve; a first channel and a second channel are disposed coaxially inside the first sleeve.

[0011] The die assembly includes a connecting shaft that is slidably disposed in the first channel. The upper end of the connecting shaft is connected to the body of the pressure rod, and the lower end is connected to the second sleeve. The die is sleeved on the outside of the second sleeve, and a ring of cutting edges is provided at the bottom of the die. The bottom ends of the second sleeve and the die extend out of the second channel, and the bottom end of the die is located below the bottom end of the second sleeve. A positioning component is connected inside the lower end of the second sleeve.

[0012] The positioning assembly includes a third sleeve disposed at the bottom end of the second sleeve, and the diameter of the first channel is larger than that of the third sleeve;

[0013] The microneedle is slidably positioned inside the third sleeve. The tip of the microneedle extends from the bottom of the third sleeve and is located below the bottom of the die. A first spring is provided between the non-tip end and the top of the third sleeve.

[0014] Preferably, the connecting shaft includes a connecting plate, with a first shaft fixed to the top surface of the connecting plate and a second shaft fixed to the bottom surface; the first shaft and the second shaft are coaxially connected to the connecting plate; and a second spring is provided between the bottom of the first channel and the bottom surface of the connecting plate.

[0015] Preferably, the rod body of the pressure rod is provided with a downward protrusion, one end of the third spring is sleeved on the protrusion, and the other end is fixedly connected to the top of the first shaft.

[0016] Preferably, the elastic force of the third spring is greater than that of the second spring, and the elastic force of the second spring is greater than that of the first spring; the two ends of the first spring are fixedly connected to the non-needle tip end of the microneedle and the top of the third sleeve, respectively.

[0017] Preferably, the second sleeve includes a first section and a second section that are coaxially fixed; the first section has an internal thread channel, and the second section has a positioning channel, the internal thread channel and the positioning channel are not connected; the internal thread channel has an internal thread that matches the external thread on the second shaft.

[0018] Preferably, the outer wall diameter of the first segment is larger than that of the second segment, and the outer wall diameter of the first segment is the same as that of the inner wall diameter of the second channel, with the first segment and the second channel being slidably arranged.

[0019] Preferably, the outer diameter of the third sleeve is equal to the inner diameter of the second section. The third sleeve is inserted into the positioning channel of the second section, and the positioning component is installed at the bottom of the die assembly. The length of the third sleeve is greater than the length of the positioning channel.

[0020] Preferably, there are multiple cutting dies and second sleeves that can be replaced; the diameters of the multiple cutting dies are different, the outer diameter of the second section of the multiple second sleeves is different, the first section remains unchanged, the inner diameter of the second section remains unchanged, and each cutting die has a corresponding second sleeve.

[0021] Preferably, a small electronic magnifying glass is fixedly connected to the periphery of the first sleeve, with the lens of the small electronic magnifying glass facing the tip of the microneedle.

[0022] Preferably, the lifting platform can be a manual lifting platform; the connecting rod includes a vertical rod and a horizontal rod, the vertical rod is vertically connected to the non-platform part of the lifting platform, so that the horizontal rod is parallel to the platform, and the horizontal rod is fixedly connected to the first sleeve, so that the first sleeve is perpendicular to the platform and is directly above the platform.

[0023] Compared with the prior art, the advantages and positive effects of this utility model are:

[0024] This invention places a flexible film substrate with micro-marks on the platform of a lifting platform, and raises the flexible film substrate close to the micro-needle tip of the positioning component. Using a small electronic magnifying glass, it is observed whether the micro-marks on the flexible film substrate are aligned with the micro-needle tip. When the micro-marks are aligned, the platform continues to rise, bringing the flexible film substrate into contact with the micro-needle tip, completing the positioning. Then, the pressure rod is pressed down, causing the connecting shaft to move the second sleeve and the die downwards, bringing the die downwards into contact with the platform of the lifting platform and leaving a punch hole on the flexible film substrate. This allows for positioning and marking of the flexible film substrate and the formation of positioning holes. Attached Figure Description

[0025] The accompanying drawings, which form part of this specification, are used to provide a further understanding of this utility model. The illustrative embodiments of this utility model and their descriptions are used to explain this utility model and do not constitute an improper limitation of this utility model.

[0026] Figure 1 This is an overall schematic diagram of the positioning punching device according to an embodiment of the present utility model;

[0027] Figure 2 This is a cross-sectional schematic diagram of the positioning punching device according to an embodiment of the present utility model;

[0028] Figure 3 This is an exploded view of the positioning punching device according to an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of the connection between the connecting shaft and the second sleeve in an embodiment of this utility model;

[0030] Figure 5 This is a schematic diagram showing the connection between the connecting shaft and the third spring and the second spring in an embodiment of this utility model;

[0031] Figure 6 This is a schematic diagram showing the connection between the second sleeve, the die, and the positioning assembly in this embodiment of the present invention. Figure 1 ;

[0032] Figure 7 This is a schematic diagram showing the connection between the second sleeve, the die, and the positioning assembly in this embodiment of the present invention. Figure 2 ;

[0033] Figure 8 This is a partial bottom view of the positioning punching device according to an embodiment of the present invention;

[0034] Figure 9 This is a schematic diagram illustrating the application of the positioning punching device according to an embodiment of the present invention;

[0035] Figure 10 This is a schematic diagram showing the alignment of microneedles with micromarkers on a flexible thin film substrate according to an embodiment of this utility model;

[0036] In the picture:

[0037] 1. Pressure rod; 11. Protrusion; 12. Third spring; 2. First sleeve; 21. First channel; 22. Second channel; 3. Die-cutting assembly; 31. Connecting shaft; 311. Connecting plate; 312. First shaft; 313. Second shaft; 32. Second spring; 33. Second sleeve; 331. First section; 332. Second section; 34. Die-cutting mold; 4. Positioning assembly; 41. Third sleeve; 42. Micro needle; 43. First spring; 5. Lifting platform; 51. Connecting rod; 6. Small electronic magnifying glass. Detailed Implementation

[0038] It should be noted that the following detailed description is illustrative and intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains.

[0039] The present invention will now be described in detail with reference to the accompanying drawings.

[0040] This embodiment discloses a positioning and punching device for flexible thin film substrates, such as... Figures 1 to 4As shown, the assembly includes a first sleeve 2, which is suspended and fixed above the platform of the lifting platform 5 via a connecting rod 51; a pressure rod 1 is hinged to the periphery of the first sleeve 2; a die-cutting assembly 3 is slidably disposed inside the first sleeve 2; the first sleeve 2 is hollow inside and has a first channel 21 and a second channel 22, which are coaxially arranged with the first sleeve 2; the diameter of the first channel 21 is larger than the diameter of the third sleeve 22. The die-cutting assembly 3 includes a connecting shaft 31 slidably disposed in the first channel 21, the upper end of the connecting shaft 31 is connected to the body of the pressure rod 1, and the lower end is threaded to the second sleeve 33, with a die-cutting 34 sleeved on the outside of the second sleeve 33; a cutting edge is provided at the bottom end of the die-cutting 34; the bottom ends of the second sleeve 33 and the die-cutting 34 both extend out of the second channel, and the bottom end of the die-cutting 34 is located below the bottom end of the second sleeve 33, with a positioning assembly 4 connected inside the bottom end of the second sleeve 33.

[0041] like Figure 2 As shown, when the pressure rod 1 drives the connecting shaft 31 to move downward, the connecting shaft 31 will drive the second sleeve 33 and the die 34 to move downward.

[0042] like Figure 1 , Figure 2 , Figure 3 , Figure 6 , Figure 7 As shown, in order to achieve the positioning effect, a positioning component 4 is provided at the bottom of the die-cutting assembly 3. Specifically, the positioning component 4 includes a third sleeve 41 located at the bottom of the second sleeve 33. The third sleeve 41 is hollow inside and closed at the top and open at the bottom. The micro needle 42 is slidably disposed inside the third sleeve 41, and the needle tip of the micro needle 42 extends from the bottom of the third sleeve 41. A first spring 43 is provided between the non-needle tip of the micro needle 42 and the top of the third sleeve 41. The micro needle 42 and the third sleeve 41 are coaxially arranged.

[0043] In this embodiment, as Figure 2 , Figure 3 As shown, the connecting shaft 31 includes a connecting disk 311, with a first shaft 312 fixedly connected to its top surface and a second shaft 313 fixedly connected to its bottom surface; the first shaft 312, the second shaft 313, and the connecting disk 311 are coaxially connected; the connecting disk 311 has the same diameter as the first channel 21, and the connecting disk 311 is slidably disposed within the first channel 21; as shown... Figure 3 , Figure 4 , Figure 5 As shown, a second spring 32 is provided between the bottom of the first channel 21 and the bottom surface of the connecting plate 311. When the pressure rod 1 drives the connecting shaft 31 to move downward, the second spring 32 can act as a buffer. At the same time, when the pressure rod 1 moves upward, it can drive the connecting plate 311 to return to its original position.

[0044] In this embodiment, as Figure 2 , Figure 3As shown, the pressure rod 1 has a downward protrusion 11 on its body. One end of the third spring 12 is sleeved on the protrusion 11, and the other end is fixedly connected to the top of the first shaft 312. When an external force is applied to the pressure rod 1 to make it move downward (for example, when the operator's hand holds the pressure rod 1 and presses it down), the third spring 12 is compressed to generate a spring force. The third spring 12 transmits the spring force downward to the first shaft 312, causing the first shaft 312 to move downward. This causes the connecting shaft 31 to drive the second sleeve 33 and the die 34 to move downward.

[0045] It should be noted that the two ends of the first spring 43 are fixedly connected to the non-needle tip end of the microneedle 42 and the top of the third sleeve 41, respectively; and the elastic force of the first spring 43 is less than the elastic force of the second spring 32, and the elastic force of the second spring 32 is less than the elastic force of the third spring 31.

[0046] When the tip of the microneedle 42 contacts the flexible film substrate on the platform 5, pressing the pressure rod 1 and applying downward force to the third spring 31 will deform the second spring 32, allowing the connecting shaft 31 to move downward. At this point, the tip of the microneedle 42 cannot move downward, and the non-tip end of the microneedle 42 moves relative to the inner wall of the third sleeve. The non-tip end of the microneedle 42 gradually approaches the top of the third sleeve 41 until the bottom edge of the die 34 contacts the flexible film substrate. The non-tip end of the microneedle 42 then no longer approaches the top of the third sleeve 41. The force of the second spring 32 will cause the die 34 to continue downward, leaving a hole in the flexible film substrate and contacting the platform 5.

[0047] In this embodiment, as Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown, the second sleeve 33 includes a first section 331 and a second section 332 coaxially fixedly connected; wherein the first section 331 has an internal threaded channel, and the second section 332 has a positioning channel, the internal threaded channel and the positioning channel are not connected. The diameter of the internal threaded channel is the same as that of the second shaft 313, and the internal threaded channel is provided with internal threads, which match the external threads on the shaft of the second shaft 313; thus realizing the threaded connection between the second sleeve 33 and the second shaft 313.

[0048] It should be noted that the outer diameter of the first segment 331 is larger than that of the second segment 332, and the outer diameter of the first segment 331 is the same as the inner diameter of the second channel 22. The first segment 331 and the second channel 22 are slidably connected. The first segment is slidably connected to the first channel via a connecting plate, and the first segment is slidably connected to the second channel, serving a guiding function.

[0049] like Figure 3 , Figure 4 , Figure 6As shown, the bottom end of the second segment 332 extends beyond the bottom of the first sleeve 2. A die 34 is fitted onto the outer wall of the second segment 332, meaning the outer wall of the second segment 332 fits against the inner wall of the die 34. The die 34 is hollow inside, and its length is greater than that of the second segment 332, so that the bottom end of the die 34 is located at the bottom end of the second sleeve 33. The cutting edge is located at the end of the die 34 away from the second sleeve 33. When an external force is applied to the first shaft 312, causing the connecting shaft 31 to move downward, the die 34 moves downward together, allowing the cutting edge to contact the flexible film substrate and punch a hole in it.

[0050] like Figure 2 As shown, the outer diameter of the third sleeve 41 is equal to the inner diameter of the second section 332 of the second sleeve 33. The third sleeve 41 and the second section 332 are coaxially arranged. The third sleeve 41 is inserted into the positioning channel of the second section 332, thereby installing the positioning assembly 4 at the bottom of the die-cutting assembly 3. Furthermore, the length of the third sleeve 41 needs to be greater than the length of the positioning channel. When changing the die-cutting 34, after removing the second sleeve 33 from the connecting shaft, the third sleeve 41 is removed from the second sleeve 33 and then installed on the new second sleeve 33.

[0051] In this embodiment, there are multiple die-cutting molds 34 and second sleeves 33, which can be replaced. Multiple die-cutting molds 34 with different diameters are prepared in advance according to the desired hole shape. It is understood that each die-cutting mold 34 has a corresponding second sleeve 33. When processing the second sleeve 33, it is processed according to the diameter of each die-cutting mold 34. Specifically, the first segment 331 of the second sleeve 33 remains unchanged, the inner diameter of the second segment 332 remains unchanged, and the outer diameter of the second segment 332 matches the diameter of the corresponding die-cutting mold 34.

[0052] When it is necessary to replace the die 34, remove the second sleeve 33 from the connecting shaft and replace it with a second sleeve 33 and die 34 of a different size.

[0053] like Figure 8 As shown, a small electronic magnifying glass 6 is fixedly connected to the bottom of the first sleeve 2. The lens of the small electronic magnifying glass 6 faces the tip of the micro needle 42. The data transmission line of the small electronic magnifying glass 6 is connected to the display screen to assist in the observation and positioning of the micro-markers on the flexible film substrate on the lifting platform 5.

[0054] In this embodiment, the lifting platform 5 can be a manual lifting platform (such as the LTP125-RM-2N from Shuxing Optics), which mainly drives the platform through a lead screw. A lifting nut is generally installed on the manual lifting platform, connecting to the lead screw inside the platform. By turning the lifting nut, the lead screw inside the platform rotates, thereby raising or lowering the platform. This is achievable with existing technology, and this embodiment does not involve any improvement to the lifting platform; therefore, it will not be elaborated upon further.

[0055] In this embodiment, the connecting rod 51 includes a vertical rod and a horizontal rod. The vertical rod is vertically connected to the non-platform part of the lifting platform, so that the horizontal rod is parallel to the platform. The horizontal rod is fixedly connected to the first sleeve, so that the first sleeve is perpendicular to the platform and is directly above the platform.

[0056] It should be noted that the positioning punching device in this embodiment contains multiple springs. The stiffness of these springs dynamically changes at different compression stages. When the force required for hole forming on the substrate is unknown, it can withstand impacts of larger forces, preventing damage to the micro-needles and lifting platform, and avoiding fatigue failure of a single spring due to long-term exposure to high frequency and high load. Furthermore, the device in this embodiment is small, portable, and low-cost, overcoming the disadvantages of large equipment being expensive and difficult to move. The second sleeve and die can also be replaced according to the actual positioning hole shape requirements and are easily disassembled.

[0057] Working principle:

[0058] like Figure 9 , Figure 10 As shown, a flexible film substrate with micro-marks is placed on the platform of the lifting platform 5, and the lifting platform 5 drives the flexible film substrate to rise and approach the micro needle 42 tip of the positioning component 4.

[0059] Using a small electronic magnifying glass 6, observe whether the micro-marks on the flexible film substrate are aligned with the tips of the micro-needles 42. When the micro-marks are aligned with the tips of the micro-needles 42, continue to raise the platform 5 so that the flexible film substrate contacts the tips of the micro-needles 42, thus completing the positioning.

[0060] Then press down on the pressure rod 1, causing the connecting shaft 31 to drive the second sleeve 33 and the die 34 to move downwards; the needle tip of the micro needle 42 cannot move downwards, and the non-needle tip moves relative to the inner wall of the third sleeve 41 and gradually approaches the top of the third sleeve 41 until the bottom edge of the die 34 contacts the flexible film substrate, and the non-needle tip of the micro needle 42 no longer approaches the top of the third sleeve 41; the elastic force of the second spring 32 will cause the die 34 to continue to contact the platform of the lifting platform 5 downwards and leave a punch in the flexible film substrate;

[0061] When the die 34 needs to be replaced, the second sleeve 33 is removed from the connecting shaft 31, and the third sleeve 41 is removed from the second sleeve 33 and then installed on the new second sleeve 33.

[0062] Although the specific embodiments of the present utility model have been described above in conjunction with the accompanying drawings, this is not intended to limit the scope of protection of the present utility model. Those skilled in the art should understand that various modifications or variations that can be made by those skilled in the art without creative effort based on the technical solution of the present utility model are still within the scope of protection of the present utility model.

Claims

1. A positioning punching device for flexible thin film substrates, characterized in that, It includes a first sleeve that is suspended and fixed above the lifting platform by a connecting rod, a pressure rod is hinged to the periphery of the first sleeve, and a die assembly is provided inside the first sleeve; a first channel and a second channel are provided inside the first sleeve. The die-cutting assembly includes a connecting shaft slidably disposed within the first channel. The upper end of the connecting shaft is connected to the body of the pressure rod, and the lower end is connected to a second sleeve. The die-cutting is sleeved on the outside of the second sleeve. The bottom ends of the second sleeve and the die-cutting extend out of the second channel, and the bottom end of the die-cutting is located below the bottom end of the second sleeve. A positioning component is connected inside the bottom end of the second sleeve. The positioning component includes a third sleeve disposed at the bottom end of the second sleeve, and the diameter of the first channel is larger than that of the third sleeve; The microneedle is slidably disposed inside the third sleeve, with the tip of the microneedle extending from the bottom end of the third sleeve and located below the bottom end of the die-cutting mold, and a first spring disposed between the non-tip end and the top of the third sleeve.

2. The positioning and punching device for flexible thin film substrates as described in claim 1, characterized in that, The connecting shaft includes a connecting plate, with a first shaft fixed to the top surface and a second shaft fixed to the bottom surface of the connecting plate; the first shaft and the second shaft are coaxially connected to the connecting plate; a second spring is provided between the bottom of the first channel and the bottom surface of the connecting plate.

3. The positioning and punching device for flexible thin film substrates as described in claim 2, characterized in that, The pressure rod has a downward protrusion on its body, one end of the third spring is sleeved on the protrusion, and the other end is fixedly connected to the top of the first shaft.

4. The positioning and punching device for flexible thin film substrates as described in claim 3, characterized in that, The elastic force of the third spring is greater than that of the second spring, and the elastic force of the second spring is greater than that of the first spring; the two ends of the first spring are fixedly connected to the non-needle tip end of the microneedle and the top of the third sleeve, respectively.

5. The positioning and punching device for flexible thin film substrates as described in claim 2, characterized in that, The second sleeve includes a first section and a second section that are coaxially fixed; the first section has an internal thread channel, and the second section has a positioning channel, the internal thread channel and the positioning channel are not connected; the internal thread channel has an internal thread that matches the external thread on the second shaft.

6. The positioning and punching device for flexible thin film substrates as described in claim 5, characterized in that, The outer diameter of the first segment is larger than that of the second segment, and the outer diameter of the first segment is the same as the inner diameter of the second channel. The first segment and the second channel are slidably arranged.

7. The positioning and punching device for flexible thin film substrates as described in claim 5, characterized in that, The inner diameter of the second segment is equal to the outer diameter of the third sleeve. The third sleeve is inserted into the positioning channel, and the positioning component is installed inside the bottom end of the die assembly. The length of the third sleeve is greater than the length of the positioning channel.

8. The positioning and punching device for flexible thin film substrates as described in claim 7, characterized in that, The die-cutting mold and the second sleeve are multiple and can be replaced; the diameters of the multiple die-cutting molds are different, the outer diameter of the second section of the multiple second sleeves is different, the first section remains unchanged, the inner diameter of the second section remains unchanged, and each die-cutting mold has a corresponding second sleeve.

9. The positioning and punching device for flexible thin film substrates as described in claim 1, characterized in that, A small electronic magnifying glass is fixedly connected to the periphery of the first sleeve, with the lens of the small electronic magnifying glass facing the tip of the microneedle.

10. The positioning and punching device for flexible thin film substrates as described in claim 1, characterized in that, The lifting platform is a manual lifting platform. The connecting rod includes a vertical rod and a horizontal rod. The vertical rod is vertically connected to the non-platform part of the lifting platform, so that the horizontal rod is parallel to the platform. The horizontal rod is fixedly connected to the first sleeve, so that the first sleeve is perpendicular to the platform and is directly above the platform.

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