A semiconductor chip processing slitting device

Abstract

The utility model discloses a semiconductor chip processing slitting device relates to the field of semiconductor processing device. The semiconductor chip processing slitting device includes the frame, is equipped with the slitting station on the frame, and its characterized in that: the clamping unit for limiting semiconductor chip is equipped with on the slitting station top, and the cutting unit for cutting semiconductor chip is equipped with on the slitting station top. The semiconductor chip processing slitting device utilizes the design of air -blower, guide seat, round hole and convex slot, can make in the cutting unit cutting process, to the liquid that the spray head sprays adds the wind power, thereby guaranteeing that liquid and cutting unit's cutting head blade are fully contacted, and the cooling effect is better to cutting position, and the convex slot guides waste liquid and waste chip mixture, reduces the residue of the waste material after cutting on semiconductor chip, further ensures that cutting effect is good, and the design of collection bin also makes cutting fluid and waste material collection convenient.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, specifically a semiconductor chip processing and slitting device. Background Technology

[0002] In the semiconductor manufacturing field, semiconductor chip slitting is the process of dividing a large semiconductor chip into individual semiconductor chips, thereby enabling the processing of multiple sets of semiconductor chips.

[0003] Currently, existing semiconductor chip processing and slitting devices on the market generate high temperatures at the contact point between the chip and the blade during the cutting process. These high temperatures can cause chip deformation or blade damage, leading to increased wear. Therefore, it is necessary to use a nozzle to cool the cutting area. However, the liquid sprayed from the nozzle may not make sufficient contact with the blade. Furthermore, traditional cooling methods directly use liquid spraying, but during operation, the sprayed liquid mixes with waste debris, which can easily remain on the surface of the semiconductor chip, causing damage to the semiconductor chip during processing. Moreover, the mixture of waste liquid and waste debris is difficult to collect, making subsequent cleaning inconvenient. To address the shortcomings of existing technologies, this utility model provides a semiconductor chip processing and slitting device to solve the above problems. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a semiconductor chip processing and slitting device. Utilizing the design of a blower, guide seat, circular hole, and convex groove, it enables the application of airflow to the liquid sprayed from the spray head during the cutting process of the cutting unit. This ensures that the liquid makes full contact with the cutting head blades of the cutting unit, resulting in better cooling of the cutting position. At the same time, the convex groove guides the mixture of waste liquid and waste chips, reducing the residue of waste material on the semiconductor chip after cutting and further ensuring good cutting results. The design of the collection chamber also facilitates the collection of cutting fluid and waste materials.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solution: a semiconductor chip processing and slitting device, including a frame, wherein a slitting table is provided on the frame, characterized in that: a clamping unit for limiting the semiconductor chip is provided above the slitting table;

[0006] Above the slitting table is a cutting unit for cutting semiconductor chips. The cutting unit includes a robotic arm fixedly connected to the frame and a cutting head and a spray head mounted on the robotic arm. The spray head is aligned with the cutting position of the cutting head.

[0007] The cutting table is provided with a convex groove, the frame is provided with a blower, the output end of the blower is fixedly connected to a guide seat and the guide seat is provided with a round hole corresponding to the position of the convex groove, the frame is provided with a collection bin for collecting waste chips and waste liquid, and the inside of the collection bin is provided with a filter screen.

[0008] Preferably, the clamping unit includes:

[0009] An electric push rod is fixedly connected to the collection bin;

[0010] The bracket is fixedly connected to the output end of the electric push rod;

[0011] The clamp is fixedly connected to the bracket.

[0012] Preferably, the collection chamber has a groove corresponding to the bracket.

[0013] Preferably, the guide seat is fixedly connected to the frame.

[0014] Preferably, the collection chamber is fixedly connected to a retaining bracket for limiting the position of the filter screen, and a locking bolt is threadedly connected between the retaining bracket and the filter screen.

[0015] Preferably, the bottom of the collection chamber is provided with a waste liquid pool.

[0016] Its beneficial effects are as follows:

[0017] This semiconductor chip processing and slitting device utilizes a design of a blower, guide seat, round hole, and convex groove to apply airflow to the liquid sprayed from the spray head during the cutting process. This ensures that the liquid makes full contact with the cutting head blades of the cutting unit, resulting in better cooling of the cutting position. At the same time, the convex groove guides the mixture of waste liquid and waste chips, reducing the residue of waste material on the semiconductor chip after cutting and further ensuring good cutting results. The design of the collection chamber also makes it convenient to collect cutting fluid and waste material. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the clamping unit of this utility model;

[0021] Figure 3 This is a schematic diagram of the installation of the filter screen of this utility model;

[0022] Figure 4 This is a disassembly diagram of the filter screen of this utility model.

[0023] In the diagram: 1. Frame; 2. Cutting table; 21. Convex groove; 3. Clamping unit; 31. Electric push rod; 32. Support; 33. Clamping frame; 4. Cutting unit; 41. Robotic arm; 42. Cutting head; 43. Spray head; 5. Blower; 51. Guide seat; 52. Round hole; 6. Collection bin; 61. Card seat; 62. Filter screen; 63. Locking bolt; 7. Waste liquid pool. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model are described clearly and completely. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0025] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0026] This utility model discloses a semiconductor chip processing and slitting apparatus, according to the appendix. Figure 1 To be continued Figure 4 As shown, the system includes a frame 1, a slitting table 2 on the frame 1, a clamping unit 3 above the slitting table 2 for limiting the semiconductor chip, a cutting unit 4 above the slitting table 2 for cutting the semiconductor chip, the cutting unit 4 including a robotic arm 41 fixedly connected to the frame 1, and a cutting head 42 and a spray head 43 set on the robotic arm 41, the spray head 43 being aligned with the cutting position of the cutting head 42; a convex groove 21 is provided on the slitting table 2, a blower 5 is provided on the frame 1, a guide seat 51 is fixedly connected to the output end of the blower 5, and a circular hole 52 corresponding to the position of the convex groove 21 is provided on the guide seat 51; a collection chamber 6 for collecting waste chips and waste liquid is provided on the frame 1, and a filter screen 62 is provided inside the collection chamber 6.

[0027] According to the appendix Figure 2 As shown, the clamping unit 3 further includes:

[0028] The electric push rod 31 is fixedly connected to the collection chamber 6;

[0029] The bracket 32 ​​is fixedly connected to the output end of the electric push rod 31;

[0030] The clamping frame 33 is fixedly connected to the support 32. The support 32 and the clamping frame 33 are moved by the extension and retraction of the electric push rod 31, thereby realizing the clamping and releasing operation of the semiconductor chip, which facilitates the positioning and cutting of the chip.

[0031] According to the appendix Figure 2 As shown, the collection chamber 6 is further provided with a groove corresponding to the bracket 32. This groove provides guidance for the movement of the bracket 32, enabling the bracket 32 ​​to move smoothly in a straight line under the drive of the electric push rod 31, thus ensuring the stability of the clamping unit 3 during operation.

[0032] According to the appendix Figure 1 As shown, the guide seat 51 is further fixedly connected to the frame 1. When the blower 5 is working, the airflow is blown out through the round hole 52 on the guide seat 51. Since the round hole 52 corresponds to the position of the convex groove 21 on the cutting table 2, the airflow can blow the waste generated during the cutting process to the collection bin 6, which facilitates the collection of waste.

[0033] According to the appendix Figure 3 and attached Figure 4 As shown, furthermore, a retaining bracket 61 for limiting the position of the filter screen 62 is fixedly connected to the collection chamber 6, and a locking bolt 63 is threadedly connected between the retaining bracket 61 and the filter screen 62. The retaining bracket 61 provides an installation position for the filter screen 62, and the filter screen 62 is fixed to the retaining bracket 61 by the locking bolt 63, which facilitates the installation and removal of the filter screen 62 and makes it easy to clean or replace the filter screen 62.

[0034] According to the appendix Figure 1 As shown, the bottom of the collection chamber 6 is further provided with a waste liquid pool 7. During the cutting process, the liquid sprayed from the spray head 43 mixes with the waste chips and flows into the collection chamber 6. The filter screen 62 can filter out the waste chips, while the liquid flows into the waste liquid pool 7 for collection, which facilitates the subsequent separate treatment of waste liquid and waste chips.

[0035] The working principle of this semiconductor chip processing and slitting device is as follows:

[0036] The semiconductor chip is placed on the slitting table 2, and the electric push rod 31 is activated. The electric push rod 31 pushes the support 32 and the clamping frame 33 to move, and the clamping frame 33 clamps and limits the semiconductor chip. Then, the robotic arm 41 is controlled to move the cutting head 42 and the spray head 43 to the appropriate position. The cutting head 42 cuts the semiconductor chip, while the spray head 43 sprays liquid to cool and lubricate the cutting area. During the cutting process, the blower 5 is activated. The airflow generated by the blower 5 blows out through the round hole 52 on the guide seat 51, blowing the cutting waste into the collection chamber 6. After the waste and waste liquid mixture enters the collection chamber 6, the filter screen 62 filters out the waste, and the liquid flows into the waste liquid pool 7 for collection.

[0037] The steps for using this semiconductor chip processing and slitting device are as follows:

[0038] The semiconductor chip is placed on the slitting stage 2.

[0039] Activate the electric push rod 31 to clamp the semiconductor chip with the clamping frame 33.

[0040] The robotic arm 41 is controlled to move the cutting head 42 and the spray head 43 to the cutting position.

[0041] The cutting head 42 is activated to cut, while the spray head 43 sprays out liquid.

[0042] Start blower 5 to blow the waste debris into collection bin 6.

[0043] After cutting, release the clamp 33 and remove the cut semiconductor chip.

[0044] The filter screen 62 in the collection chamber 6 should be cleaned or replaced regularly, and the waste liquid in the waste liquid pool 7 should be treated.

[0045] The beneficial effects of this semiconductor chip processing and slitting device are as follows:

[0046] The clamping unit 3, through the cooperation of the electric push rod 31, the bracket 32 ​​and the clamping frame 33, can accurately clamp and limit the semiconductor chip, ensuring the cutting accuracy.

[0047] The cutting head 42 and spray head 43 in the cutting unit 4 can cool and lubricate the cutting part in time during the cutting process, reduce the heat and dust generated during cutting, and improve the cutting quality.

[0048] The device utilizes the design of blower 5, guide seat 51, round hole 52 and convex groove 21 to apply air force to the liquid sprayed by spray head 43 during the cutting process of cutting unit 4, thereby ensuring that the liquid is in full contact with the blade of cutting head 42 of cutting unit 4, and the cooling effect of cutting position is better. At the same time, convex groove 21 guides the mixture of waste liquid and waste chips, reducing the residue of waste material on semiconductor chip after cutting, and further ensuring good cutting effect. The design of collection chamber 6 also makes it convenient to collect cutting fluid and waste material.

[0049] The filter screen 62 and waste liquid pool 7 in the collection chamber 6 can separate and collect waste debris and waste liquid, which facilitates subsequent treatment and recycling and reduces environmental pollution.

[0050] The design of the mounting bracket 61 and the locking bolt 63 facilitates the installation and removal of the filter screen 62, and makes it easy to clean or replace the filter screen 62, thus improving the maintenance convenience of the device.

[0051] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0052] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip processing and slitting apparatus, comprising a frame (1), wherein a slitting table (2) is provided on the frame (1), characterized in that: The slitting table (2) is provided with a clamping unit (3) for limiting the semiconductor chip above it; The slitting table (2) is provided with a cutting unit (4) for cutting semiconductor chips. The cutting unit (4) includes a robotic arm (41) fixedly connected to the frame (1) and a cutting head (42) and a spray head (43) provided on the robotic arm (41). The spray head (43) is aligned with the cutting position of the cutting head (42). The cutting table (2) has a convex groove (21), the frame (1) has a blower (5), the output end of the blower (5) is fixedly connected to a guide seat (51), and the guide seat (51) has a round hole (52) corresponding to the position of the convex groove (21). The frame (1) has a collection chamber (6) for collecting waste chips and waste liquid, and the inside of the collection chamber (6) is equipped with a filter screen (62).

2. The semiconductor chip processing and slitting apparatus according to claim 1, characterized in that, The clamping unit (3) includes: An electric push rod (31) is fixedly connected to the collection bin (6); The bracket (32) is fixedly connected to the output end of the electric push rod (31); The clamp (33) is fixedly connected to the bracket (32).

3. The semiconductor chip processing and slitting apparatus according to claim 2, characterized in that, The collection chamber (6) is provided with a groove corresponding to the bracket (32).

4. The semiconductor chip processing and slitting apparatus according to claim 1, characterized in that, The guide seat (51) is fixedly connected to the frame (1).

5. A semiconductor chip processing and slitting apparatus according to claim 1, characterized in that, The collection chamber (6) is fixedly connected to a retainer (61) for limiting the filter screen (62), and a locking bolt (63) is threaded between the retainer (61) and the filter screen (62).

6. A semiconductor chip processing and slitting apparatus according to claim 1, characterized in that, The bottom of the collection chamber (6) is provided with a waste liquid pool (7).

Images