Silicon material processing tool and apparatus

CN224659798UActive Publication Date: 2026-08-21INNER MONGOLIA ZHONGHUAN GCL PHOTOVOLTAIC MATERIALS CO LTD
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Patent Information

Application Number
CN202521867716.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-29
Publication Date
2026-08-21
Estimated Expiration
2035-08-29

AI Technical Summary

Technical Problem

在硅管与硅盒的传统加工过程中均需要进行钻取操作,但是钻取操作需要使用两支不同直径的刀刃在硅料的同一位置分次钻取,一方面,多次装夹刀刃导致生产效率低下,另一方面,分次钻取易产生累积误差,难以保证加工精度,影响产品尺寸精度和表面质量

Benefits of technology

[0019]本实用新型提供了一种硅料加工刀具,包括刀柄、内钻头与外钻头,刀柄的顶部能够安装于机床的动力轴,内钻头与外钻头安装于刀柄的底部,外钻头同轴套设于内钻头的外侧,用于加工硅料为硅管或硅盒,通过机床的动力轴带动内钻头与外钻头同步加工,钻取过程中无需换刀进行分次钻取,减少误差,提高加工精度,无需二次装夹刀刃,能够减少机床空程,提高生产效率;本实用新型还提供了一种硅料加工装置,包括上述硅料加工刀具及置于其下方的装夹模块,装夹模块包括底座与两个相对的抵紧单元,底座包括上底座、缓冲圈与下底座,将下底座置于工作台,缓冲圈夹设于上底座与下底座之间,在上底座贯穿开设通孔,并且通孔的孔径不小于外钻头的外径,抵紧单元包括固定座、顶紧螺杆与抵紧块,固定座固设于上底座,顶紧螺杆水平贯穿并螺接于固定座,抵紧块固设于顶紧螺杆的端部,通过旋拧顶紧螺杆,能够将不同尺寸的硅料稳定夹持于两个抵紧块之间,提高加工精度,通过设置缓冲圈吸收部分振动,降低加工过程中硅料的颤振现象,提高加工精度和表面质量,并且加工过程中外钻头与内钻头能够穿过上底座开设的通孔,直接获取硅管,减少加工工序。

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Abstract

The utility model belongs to the technical field of semiconductor element processing, disclose a kind of silicon material processing cutter and device, inner drill bit is installed in the bottom of tool shank with outer drill bit, outer drill bit coaxial sleeve is set in the outside of inner drill bit, the power shaft of machine tool drives inner drill bit and outer drill bit synchronous processing, without changing tool during drilling process carries out fractional drilling, improve processing accuracy and production efficiency, the workbench below silicon material processing cutter is provided with lower base, buffer ring is clamped between upper base and lower base, two fixed seats are oppositely arranged on upper base, top screw rod is horizontally penetrated and is screwed on fixed seat, the end of top screw rod is fixedly provided with abutting block, screw top screw rod, two abutting blocks stably hold silicon material of different sizes, improve processing accuracy, part vibration is absorbed by buffer ring, reduce the chattering phenomenon of silicon material in processing process, improve processing accuracy and surface quality, outer drill bit and inner drill bit can pass through the through hole of upper base, directly obtain silicon tube, reduce processing procedure, improve production efficiency.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor component processing technology, and in particular to a silicon material processing tool and apparatus. Background Technology

[0002] Silicon tubes and silicon boxes are both auxiliary materials in single crystal production. By placing the silicon tube on the stainless steel tube inside the re-doping cylinder, the silicon material is prevented from directly contacting the stainless steel, which improves the purity of the process, reduces pollution, and optimizes the thermal field and crystal growth quality. The dopant is placed in the silicon box and added at the same time as the silicon material, which enables precise doping control. The silicon box carrier reduces the loss of dopant and improves the resistance targeting hit rate.

[0003] With the rapid development of the semiconductor, photovoltaic, and precision electronics industries, the demand for processing silicon tubes and silicon cells has increased dramatically. For example, silicon tubes and silicon cells are used to prepare G12R rectangular single-crystal silicon to produce high-quality silicon rods. Traditional processing of silicon tubes and silicon cells requires drilling operations. However, this drilling operation requires using two cutting tools of different diameters to drill through the same location of the silicon material in multiple stages. On the one hand, repeatedly clamping the cutting tools leads to low production efficiency; on the other hand, multiple drilling operations easily generate cumulative errors, making it difficult to guarantee processing accuracy and affecting product dimensional accuracy and surface quality. Utility Model Content

[0004] The purpose of this utility model is to provide a silicon material processing tool that has high production efficiency and high processing accuracy.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A silicon material processing tool includes a tool holder, an inner drill bit, and an outer drill bit. The top of the tool holder can be mounted on the power shaft of a machine tool. The inner drill bit and the outer drill bit are both mounted on the bottom of the tool holder, and the outer drill bit is coaxially sleeved on the outside of the inner drill bit.

[0007] Preferably, both the inner drill bit and the outer drill bit can be detachably installed at the bottom of the tool holder.

[0008] Preferably, both the inner drill bit and the outer drill bit are screwed to the bottom of the tool holder.

[0009] Preferably, the tool holder has a water outlet hole, which connects a water source to the interior of the inner drill bit, and the interlayer formed by the inner drill bit and the outer drill bit connects the interior of the inner drill bit to the outside.

[0010] Preferably, both the port of the outer drill bit away from the shank and the port of the inner drill bit away from the shank are coated with a diamond layer.

[0011] Preferably, the inner drill bit has an inner through groove at its end away from the tool holder, the inner through groove connecting the interior of the inner drill bit and the interlayer formed by the inner drill bit and the outer drill bit, and the outer drill bit has an outer through groove at its end away from the tool holder, the outer through groove connecting the interlayer formed by the inner drill bit and the outer drill bit with the outside.

[0012] Preferably, the inner wall of the inner drill bit has an inner guide groove that extends to the end of the inner drill bit away from the shank, and the inner wall of the outer drill bit has an outer guide groove that extends to the end of the outer drill bit away from the shank.

[0013] Preferably, the length of the outer drill bit is greater than the length of the inner drill bit, and the silicon material processing tool is used to process silicon boxes.

[0014] Another objective of this invention is to provide a silicon material processing device that stably clamps silicon material and improves processing accuracy.

[0015] To achieve this objective, the present invention adopts the following technical solution:

[0016] A silicon material processing apparatus includes the aforementioned silicon material processing tool and a clamping module placed below it. The clamping module includes a base and two opposing clamping units. The base includes an upper base, a buffer ring, and a lower base. The lower base is placed on a worktable. The buffer ring is clamped between the upper base and the lower base. The upper base has a through hole with a diameter not less than the outer diameter of the external drill bit. The clamping unit includes a fixed seat, a tightening screw, and a clamping block. The fixed seat is fixed to the upper base. The tightening screw passes horizontally through and is screwed to the fixed seat. The clamping block is fixed to the end of the tightening screw. The silicon material is placed on the upper base and clamped between the two clamping blocks.

[0017] Preferably, the silicon material processing apparatus further includes a cooling pipe installed on the machine tool, one end of which is connected to a water source, and the other end is directly facing the silicon material.

[0018] The beneficial effects of this utility model are:

[0019] This utility model provides a silicon material processing tool, including a tool holder, an inner drill bit, and an outer drill bit. The top of the tool holder can be mounted on the power shaft of a machine tool. The inner and outer drill bits are mounted on the bottom of the tool holder, and the outer drill bit is coaxially sleeved on the outside of the inner drill bit. It is used to process silicon material into silicon tubes or silicon boxes. The inner and outer drill bits are driven synchronously by the power shaft of the machine tool. During the drilling process, there is no need to change tools in multiple drilling operations, reducing errors and improving processing accuracy. There is no need for secondary clamping of the cutting edge, which can reduce the machine tool idle time and improve production efficiency. This utility model also provides a silicon material processing device, including the above-mentioned silicon material processing tool and a clamping module placed below it. The clamping module includes a base and two opposing clamping units. The base includes an upper base, a buffer ring, and a... The lower base is placed on the worktable, and a buffer ring is clamped between the upper and lower bases. A through hole is made in the upper base, and the diameter of the through hole is not less than the outer diameter of the outer drill bit. The clamping unit includes a fixed seat, a clamping screw, and a clamping block. The fixed seat is fixed to the upper base, the clamping screw is horizontally threaded through and screwed to the fixed seat, and the clamping block is fixed to the end of the clamping screw. By tightening the clamping screw, silicon materials of different sizes can be stably clamped between the two clamping blocks, improving processing accuracy. By setting a buffer ring to absorb some vibration, the chattering phenomenon of silicon materials during processing is reduced, improving processing accuracy and surface quality. Furthermore, during processing, the outer and inner drill bits can pass through the through hole in the upper base to directly obtain silicon tubes, reducing processing steps. Attached Figure Description

[0020] Figure 1 This is a cross-sectional view of the silicon material processing tool provided in Embodiment 1 of this utility model;

[0021] Figure 2 This is a cross-sectional view of the silicon material processing tool provided in Embodiment 1 of this utility model;

[0022] Figure 3 This is a schematic diagram of the silicon tube processing device provided in Embodiment 2 of this utility model;

[0023] Figure 4 This is a schematic diagram of the clamping module provided in Embodiment 2 of this utility model.

[0024] In the picture:

[0025] 10. Silicon material; 20. Machine tool; 201. Power shaft; 30. Worktable;

[0026] 11. Tool holder; 111. Water outlet; 112. Screw hole; 12. Internal drill bit; 121. Internal through groove; 122. Internal guide groove; 13. External drill bit; 131. External through groove; 132. External guide groove; 14. Diamond material layer; 2. Clamping module; 21. Base; 211. Upper base; 2111. Through hole; 212. Buffer ring; 213. Lower base; 22. Clamping unit; 221. Fixing seat; 222. Clamping screw; 223. Clamping block; 224. Reinforcing plate; 3. Cooling pipe. Detailed Implementation

[0027] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0028] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0029] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0031] Example 1

[0032] This embodiment provides a silicon material processing tool that eliminates the need for tool changes during drilling, thereby reducing processing errors and improving processing accuracy. It also eliminates the need for secondary clamping of the cutting edge, reducing machine tool idle time and improving production efficiency.

[0033] Specifically, please refer to Figure 1 and Figure 2 The silicon material processing tool provided in this embodiment can be installed on the power shaft 201 of the machine tool 20. The power shaft 201 drives the silicon material processing tool to feed and cut the silicon material 10 to process silicon tubes or silicon boxes. The cutting speed of the silicon material processing tool is ≥40m / min.

[0034] Please see Figure 1 The silicon material processing tool includes a tool holder 11, an inner drill bit 12, and an outer drill bit 13. The tool holder 11 can be mounted on the power shaft 201 of the machine tool 20. Both the inner drill bit 12 and the outer drill bit 13 are cylindrical and are mounted on the bottom of the tool holder 11. The outer drill bit 13 is coaxially sleeved on the outside of the inner drill bit 12. The power shaft 201 drives the inner drill bit 12 and the outer drill bit 13 to simultaneously cut the silicon material 10. The inner drill bit 12 is used to process the inner wall of the formed silicon tube or silicon box, and the outer drill bit 13 is used to process the outer wall of the formed silicon tube or silicon box. Drilling in stages without changing tools reduces processing errors and improves processing accuracy. It also eliminates the need for secondary clamping of the cutting edge, reduces machine tool idle time, and improves production efficiency.

[0035] In addition, by using the inner drill bit 12 and the outer drill bit 13 to cut the silicon material 10 simultaneously, the cutting force on the inner drill bit 12 and the outer drill bit 13 is reduced compared to single-edge cutting, thus reducing the risk of edge chipping.

[0036] Specifically, the top of the tool holder 11 is mounted on the power shaft 201 of the machine tool 20. In some feasible embodiments, the top of the tool holder 11 can be directly inserted into the shaft hole of the power shaft 201 and fixed by a lock nut or chuck.

[0037] Furthermore, both the inner drill bit 12 and the outer drill bit 13 are made of ultra-fine grain cemented carbide, which has high hardness and high toughness.

[0038] Furthermore, since both the port of the inner drill bit 12 away from the shank 11 and the port of the outer drill bit 13 away from the shank 11 are used to cut silicon material 10, a diamond layer 14 is coated on both the port of the inner drill bit 12 away from the shank 11 and the port of the outer drill bit 13 away from the shank 11. This improves wear resistance and reduces the coefficient of friction, thereby reducing wear on the inner drill bit 12 and the outer drill bit 13 and extending their service life.

[0039] When the silicon material processing tool provided in this embodiment is used to process silicon boxes, the length of the outer drill bit 13 needs to be greater than the length of the inner drill bit 12, so that the distance between the end of the outer drill bit 13 away from the tool holder 11 and the tool holder 11 is greater than the distance between the end of the inner drill bit 12 away from the tool holder 11 and the tool holder 11. That is, the end of the inner drill bit 12 away from the tool holder 11 is always located inside the outer drill bit 13, so as to realize the drilling of the silicon material 10 with height difference and prevent the inner drill bit 12 from penetrating the silicon material 10.

[0040] In this embodiment, both the inner drill bit 12 and the outer drill bit 13 can be detachably installed at the bottom of the tool holder 11. The inner drill bit 12 or the outer drill bit 13 can be installed separately, switching the double-edged machining mode to the single-edged machining mode to meet different actual machining needs, thereby improving the flexibility of use.

[0041] Optionally, in this embodiment, both the inner drill bit 12 and the outer drill bit 13 are screwed to the bottom of the tool holder 11. In other feasible embodiments, other methods can be used to achieve the detachable installation of the inner drill bit 12, the outer drill bit 13 and the tool holder 11, such as snap-fit, etc., which are not specifically limited here.

[0042] The silicon machining tool provided in this embodiment also has a chip removal function. Please refer to [link / reference]. Figure 1 and Figure 2 In this embodiment, an inner through groove 121 is formed at the end of the inner drill bit 12 away from the shank 11. The inner through groove 121 connects the interior of the inner drill bit 12 and the interlayer formed by the inner drill bit 12 and the outer drill bit 13. An outer through groove 131 is formed at the end of the outer drill bit 13 away from the shank 11. The outer through groove 131 connects the interlayer formed by the inner drill bit 12 and the outer drill bit 13 to the outside. With the above configuration, the inner through groove 121 can discharge the chips generated by the cutting of the inner drill bit 12 to the interlayer formed by the inner drill bit 12 and the outer drill bit 13, and can further discharge the chips generated by the cutting of the inner drill bit 12 and the outer drill bit 13 to the outside through the outer through groove 131.

[0043] Preferably, the inner drill bit 12 has a plurality of internal through slots 121 evenly spaced at the end away from the tool holder 11, so that the chips generated by the cutting of the inner drill bit 12 can be discharged to the interlayer formed by the inner drill bit 12 and the outer drill bit 13 through any one of the internal through slots 121, thereby accelerating the chip removal speed; similarly, the outer drill bit 13 has a plurality of external through slots 131 evenly spaced at the end away from the tool holder 11, so that the chips generated by the cutting of the inner drill bit 12 and the outer drill bit 13 can be discharged through any one of the external through slots 131, thereby accelerating the chip removal speed.

[0044] Please continue reading. Figure 2In this embodiment, two internal through grooves 121 are evenly spaced at the end of the inner drill bit 12 away from the shank 11, and the two internal through grooves 121 divide the end of the inner drill bit 12 equally. Two external through grooves 131 are evenly spaced at the end of the outer drill bit 13 away from the shank 11, and the two external through grooves 131 divide the end of the outer drill bit 13 equally.

[0045] Please continue reading. Figure 1 and Figure 2 Furthermore, an inner guide groove 122 can be formed on the inner wall of the inner drill bit 12, extending to the end of the inner drill bit 12 away from the tool holder 11. During drilling, the chips generated by the cutting of the inner drill bit 12 are guided from the center of the inner drill bit 12 to the inner guide groove 122 by the airflow generated by the drilling operation, thereby improving chip removal efficiency, preventing chip accumulation and blockage, and avoiding scratching the machined surface. Similarly, an outer guide groove 132 can be formed on the inner wall of the outer drill bit 13, extending to the end of the outer drill bit 13 away from the tool holder 11. During drilling, the chips in the interlayer formed by the inner drill bit 12 and the outer drill bit 13 can be guided to the outer guide groove 132 by the airflow generated by the drilling operation, thereby improving chip removal efficiency, preventing chip accumulation and blockage, and avoiding scratching the machined surface.

[0046] Preferably, the inner guide groove 122 is arranged along the axial direction of the inner drill bit 12, and the outer guide groove 132 is arranged along the axial direction of the outer drill bit 13.

[0047] Please continue reading. Figure 2 In this embodiment, two inner guide grooves 122 are opened at intervals on the inner wall of the inner drill bit 12. The two inner guide grooves 122, together with two inner through grooves 121, divide the end of the inner drill bit 12 into four equal parts. Two outer guide grooves 132 are opened at intervals on the inner wall of the outer drill bit 13. The two outer guide grooves 132, together with two outer through grooves 131, divide the end of the outer drill bit 13 into four equal parts.

[0048] Furthermore, the silicon processing tool provided in this embodiment also has a cooling function. For example, please refer to... Figure 1 A water outlet hole 111 is provided on the handle 11, which connects the water source to the interior of the inner drill bit 12. The interlayer formed by the inner drill bit 12 and the outer drill bit 13 connects the interior of the inner drill bit 12 to the outside. Cold water is introduced into the interior of the inner drill bit 12 through the water outlet hole 111. After the cold water lowers the temperature of the inner drill bit 12, it can enter the interlayer formed by the inner drill bit 12 and the outer drill bit 13, further lowering the temperature of the outer drill bit 13, and finally discharged to the outside.

[0049] It should be noted that the cold water introduced into the inner drill bit 12 can enter the interlayer formed by the inner drill bit 12 and the outer drill bit 13 through the inner channel 121, and can be further discharged to the outside through the outer channel 131.

[0050] For further information, please refer to [link / reference]. Figure 1In this embodiment, a water outlet 111 is provided and extends through the tool holder 11 along its axial direction. An internal thread is machined into the wall of the water outlet 111. An inner drill bit 12 is inserted from the bottom of the tool holder 11 and screwed into the water outlet 111, thus achieving a screwed connection between the inner drill bit 12 and the tool holder 11. Furthermore, a threaded hole 112 is provided on the tool holder 11. The threaded hole 112 is coaxially located on the outside of the water outlet 111 and extends to the bottom of the tool holder 11. An outer drill bit 13 is inserted from the bottom of the tool holder 11 and screwed into the threaded hole 112, thus achieving a screwed connection between the outer drill bit 13 and the tool holder 11, and ensuring that the outer drill bit 13 is coaxially sleeved on the outside of the inner drill bit 12.

[0051] Example 2

[0052] This embodiment provides a silicon material processing device that integrates clamping and processing into one unit. Please refer to [link / reference]. Figure 3 and Figure 4 It includes the aforementioned silicon material processing tool and clamping module 2. The clamping module 2 is placed below the silicon material processing tool to stably clamp silicon materials 10 of different sizes, thereby improving processing accuracy.

[0053] For example, please refer to Figure 3 and Figure 4 The clamping module 2 includes a base 21 and two clamping units 22. The base 21 is located below the silicon material processing tool. The two clamping units 22 are both installed on the base 21 and are arranged opposite to each other. The silicon material 10 is clamped between the two clamping units 22.

[0054] Please see Figure 3 and Figure 4 The base 21 includes an upper base 211, a buffer ring 212, and a lower base 213. The lower base 213 is placed on the worktable 30. The buffer ring 212 is sandwiched between the upper base 211 and the lower base 213. The silicon material 10 is placed on the upper base 211. The buffer ring 212 is made of rubber and has good elasticity. During the process of the silicon material processing tool drilling the silicon material 10, vibration will be generated. The buffer ring 212 can absorb some of the vibration energy and reduce the vibration transmitted to the silicon material 10, thereby reducing the chatter phenomenon during the processing, improving the processing accuracy and surface quality, and avoiding burrs, cracks, or dimensional deviations.

[0055] Furthermore, a through hole 2111 is formed in the upper base 211, and the diameter of the through hole 2111 is not less than the outer diameter of the outer drill bit 13. During the processing of silicon tubes, the outer drill bit 13 and the inner drill bit 12 can pass through the through hole 2111 formed in the upper base 211 to directly obtain silicon tubes, reduce processing steps, and improve production efficiency.

[0056] Accordingly, the inner diameter of the buffer ring 212 is larger than the diameter of the through hole 2111 to avoid affecting the processing of silicon tubes.

[0057] Please see Figure 4 The clamping unit 22 includes a fixed base 221, a clamping screw 222, and a clamping block 223. The fixed base 221 is fixed to the upper base 211, and an internal threaded hole is formed in the middle region of the fixed base 221. The clamping screw 222 is horizontally positioned and is threaded through and connected to the internal threaded hole of the fixed base 221 via its external thread. Furthermore, the clamping block 223 is fixed to one end of the clamping screw 222. By screwing the clamping screw 222, the length of the end where the clamping block 223 extends out of the internal threaded hole of the fixed base 221 can be adjusted. For example, the adjustment stroke of the clamping screw 222 is 223-305 mm.

[0058] With the above setup, the silicon material 10 is placed on the upper base 211 and positioned between two opposing clamping blocks 223. Tightening either clamping screw 222 adjusts the distance between the two clamping blocks 223, thus clamping the silicon material 10 between them. In actual use, the two clamping screws 222 are usually tightened simultaneously to ensure that the silicon material 10 is approximately clamped in the middle area of ​​the upper base 211.

[0059] In some feasible embodiments, the clamping unit 22 further includes a reinforcing plate 224 to enhance the clamping effect on the silicon material 10. Specifically, the reinforcing plate 224 is a right-angled triangle, with one right-angled side fixed to the upper base 211 and the other right-angled side pressed against the side of the fixing seat 221 away from the silicon material 10. Preferably, the other right-angled side of the reinforcing plate 224 is fixed to the side of the fixing seat 221 away from the silicon material 10. By providing the reinforcing plate 224, during the process of tightening the clamping screw 222 to clamp the silicon material 10, the reinforcing plate 224 always presses against the fixing seat 221, preventing the fixing seat 221 from loosening, thereby improving the clamping effect on the silicon material 10.

[0060] Please see Figure 3 The silicon tube processing device provided in this embodiment also includes a cooling pipe 3 installed on the machine tool 20. One end of the cooling pipe 3 is connected to a water source, and the other end is directly facing the silicon material 10. During the process of the inner drill bit 12 and the outer drill bit 13 feeding and processing the silicon material 10, the cooling pipe 3 pours cold water onto the silicon material 10 to reduce the processing temperature.

[0061] When the silicon material processing device provided in this embodiment is used to process silicon tubes, the inner drill bit 12 and the outer drill bit 13 are first installed, and the tool holder 11 is fixed to the power shaft 201. The silicon material 10 is placed on the upper base 211 and positioned between two opposing clamping blocks 223. The two clamping screws 222 are screwed on to clamp the silicon material 10 between the two clamping blocks 223. The height of the silicon material 10 is detected, and then the X, Y, and Z axes are reset. The machining program of the machine tool 20 is set, and the X and Y coordinate positions of the power shaft 201 are edited. The inner drill bit 12 and the outer drill bit 13 are driven by the power shaft 201 to drill in the Z direction until the inner drill bit 12 and the outer drill bit 13 pass through the through hole 2111 opened in the upper base 211. During the drilling process, the silicon material processing tool reaches a distance of 3mm from the silicon material 10 in the Z direction. The water source is connected, and cold water is introduced into the water outlet 111 and the cooling pipe 3 to cool the inner drill bit 12, the outer drill bit 13 and the silicon material 10.

[0062] When the silicon material processing apparatus provided in this embodiment is used to process silicon boxes, the length of the outer drill bit 13 needs to be greater than the length of the inner drill bit 12, and the distance between the end of the outer drill bit 13 away from the shank 11 and the shank 11 needs to be greater than the distance between the end of the inner drill bit 12 away from the shank 11 and the shank 11 needs to be greater. That is, the end of the inner drill bit 12 away from the shank 11 is controlled to always be located inside the outer drill bit 13, so as to realize the drilling of the silicon material 10 with height difference and prevent the inner drill bit 12 from penetrating the silicon material 10.

[0063] When the silicon material processing device provided in this embodiment is used to process silicon boxes, the inner drill bit 12 and the outer drill bit 13 are first installed, and the tool holder 11 is fixed to the power shaft 201. The silicon material 10 is placed on the upper base 211 and positioned between two opposing clamping blocks 223. The two clamping screws 222 are tightened to clamp the silicon material 10 between the two clamping blocks 223. The height of the silicon material 10 is detected, and then the X, Y, and Z axes are reset. The machining program of the machine tool 20 is set, and the X and Y coordinate positions of the power shaft 201 are edited. The inner drill bit 12 and the outer drill bit 13 are driven by the power shaft 201 to perform Z-axis drilling. Similarly, during the drilling process, when the silicon material processing tool reaches a distance of 3 mm from the silicon material 10 in the Z-axis direction, the water source is connected, and cold water is introduced into the water outlet 111 and the cooling pipe 3 to cool the inner drill bit 12, the outer drill bit 13, and the silicon material 10.

[0064] The silicon tube processing device provided in this embodiment can stably clamp silicon materials 10 of different sizes between two clamping blocks 223, thereby improving processing accuracy. By setting a buffer ring 212 to absorb some vibration, it reduces the chattering phenomenon of silicon materials 10 during processing, thereby improving processing accuracy and surface quality. Furthermore, during the processing of silicon tubes, the outer drill bit 13 and the inner drill bit 12 can pass through the through hole 2111 opened in the upper base to directly obtain silicon tubes, reducing processing steps and improving production efficiency.

[0065] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A silicon material processing tool, characterized in that, The tool includes a tool holder (11), an inner drill bit (12), and an outer drill bit (13). The top of the tool holder (11) can be mounted on the power shaft (201) of the machine tool (20). The inner drill bit (12) and the outer drill bit (13) are both mounted on the bottom of the tool holder (11), and the outer drill bit (13) is coaxially sleeved on the outside of the inner drill bit (12).

2. The silicon material processing tool according to claim 1, characterized in that, Both the inner drill bit (12) and the outer drill bit (13) can be detachably installed at the bottom of the tool holder (11).

3. The silicon material processing tool according to claim 2, characterized in that, Both the inner drill bit (12) and the outer drill bit (13) are screwed to the bottom of the tool holder (11).

4. The silicon processing tool according to claim 1, characterized in that, The handle (11) has a water outlet hole (111) that connects the water source to the interior of the inner drill bit (12). The interlayer formed by the inner drill bit (12) and the outer drill bit (13) connects the interior of the inner drill bit (12) to the outside.

5. The silicon material processing tool according to claim 1, characterized in that, The port of the outer drill bit (13) away from the shank (11) and the port of the inner drill bit (12) away from the shank (11) are both coated with a diamond layer (14).

6. The silicon processing tool according to claim 1, characterized in that, The inner drill bit (12) has an inner through groove (121) at its end away from the tool holder (11). The inner through groove (121) connects the interior of the inner drill bit (12) and the interlayer formed by the inner drill bit (12) and the outer drill bit (13). The outer drill bit (13) has an outer through groove (131) at its end away from the tool holder (11). The outer through groove (131) connects the interlayer formed by the inner drill bit (12) and the outer drill bit (13) with the outside.

7. The silicon material processing tool according to claim 1, characterized in that, The inner wall of the inner drill bit (12) has an inner guide groove (122) extending to the end of the inner drill bit (12) away from the handle (11). The inner wall of the outer drill bit (13) has an outer guide groove (132) extending to the end of the outer drill bit (13) away from the handle (11).

8. The silicon processing tool according to claim 1, characterized in that, The length of the outer drill bit (13) is greater than the length of the inner drill bit (12), and the silicon material processing tool is used to process silicon boxes.

9. A silicon material processing apparatus, characterized in that, The device includes a silicon processing tool as described in any one of claims 1-8 and a clamping module (2) positioned below it. The clamping module (2) includes a base (21) and two opposing clamping units (22). The base (21) includes an upper base (211), a buffer ring (212), and a lower base (213). The lower base (213) is placed on a worktable (30). The buffer ring (212) is sandwiched between the upper base (211) and the lower base (213). The upper base (211) has a through hole (2111). The diameter of the through hole (2111) is not less than the outer diameter of the external drill bit (13). The clamping unit (22) includes a fixed seat (221), a clamping screw (222) and a clamping block (223). The fixed seat (221) is fixed to the upper base (211). The clamping screw (222) passes horizontally through and is screwed to the fixed seat (221). The clamping block (223) is fixed to the end of the clamping screw (222). The silicon material (10) is placed on the upper base (211) and clamped between the two clamping blocks (223).

10. The silicon material processing apparatus according to claim 9, characterized in that, The silicon material processing device also includes a cooling pipe (3) installed on the machine tool (20), one end of which is connected to a water source and the other end is directly facing the silicon material (10).