Crystal bar bonding platform with precision adjustment

Abstract

The utility model discloses a crystal bar bonding platform of precision adjustment can be done, relates to crystal bar bonding technical field, including: the base is equipped with the cushion block, and the crystal bar is set up on the cushion block, the mounting seat is set up on the base, and the mounting seat is equipped with the mounting panel on the side close to the base, and the both ends of mounting panel are equipped with two support plates relatively, the adjusting assembly includes the fastening bolt and the positioning pin, a plurality of fastening bolts are set up on the lateral wall of support plate and are used for carrying out Y axle adjustment, a plurality of fastening bolts are set up on the lateral wall of mounting panel and are used for carrying out X axle adjustment, a plurality of positioning pins are set up on the lateral wall of support plate and are used for being Y axle adjustment base point, a plurality of positioning pins are set up on the lateral wall of mounting panel and are used for being X axle adjustment base point, the high accuracy iron block is set up on the base, and the crystal bar is connected with the high accuracy iron block on the side away from the mounting panel. The utility model discloses a crystal bar bonding platform of precision adjustment can be done, can reduce the loss caused by angle precision out of tolerance, can cut the wafer of higher precision requirement.

Description

Technical Field

[0001] This utility model relates to the field of crystal rod bonding technology, and more specifically to a crystal rod bonding stage with adjustable precision. Background Technology

[0002] The existing bonding method of the bonding station cannot make precision adjustments when bonding crystal rods. When using a wire saw that cannot be dial gauged or read lines for cutting, high-precision cutting cannot be performed. Currently, it can only cut single crystal materials with ±0.5°, which cannot meet the cutting requirements of higher crystal orientation.

[0003] The existing operating method cannot adjust the precision during crystal rod bonding, nor can it adjust the precision in the horizontal direction (X-axis) and vertical direction (Y-axis). Furthermore, the wire saw used to cut the crystal rod cannot be dial-up or line-reading, resulting in large cutting errors and failing to meet the requirements of high-precision crystal orientation for wafer cutting.

[0004] Therefore, how to provide a crystal rod bonding stage that can reduce losses caused by out-of-tolerance angle accuracy and has adjustable cutting accuracy to meet higher requirements is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] In view of this, the present invention provides a crystal rod bonding stage with adjustable precision, which reduces losses caused by out-of-tolerance angle accuracy and can meet higher requirements for cutting precision.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A crystal rod bonding stage with adjustable precision, comprising:

[0008] A base, wherein a pad is provided on the base, and a crystal rod is disposed on the pad;

[0009] Mounting base, the mounting base is disposed on the base, the mounting base is provided with a mounting plate on the side of the mounting base near the base, and two support plates are provided at opposite ends of the mounting plate;

[0010] The adjustment assembly includes fastening bolts and locating pins, with multiple fastening bolts and locating pins provided. The multiple fastening bolts are located on the sidewalls of the support plate that are far apart from each other for Y-axis adjustment, and the multiple fastening bolts are located on the sidewalls of the mounting plate that are far apart from the mounting base for X-axis adjustment. The multiple locating pins are located on the sidewalls of the support plate that are far apart from each other as Y-axis adjustment base points, and the multiple locating pins are located on the sidewalls of the mounting plate that are far apart from the mounting base as X-axis adjustment base points.

[0011] A high-precision iron block is vertically movable on the base via fastening bolts, and the crystal rod is connected to the side of the high-precision iron block away from the mounting plate.

[0012] Furthermore, the crystal rod and the high-precision iron block are connected by a graphite block.

[0013] Furthermore, the adjustment assembly also includes two dial indicators, which are disposed on the top of the mounting plate, and the two dial indicators assist in the adjustment of the X-axis and the Y-axis respectively.

[0014] Furthermore, the adjustment assembly also includes multiple set screws. Two set screws are disposed opposite each other on the side of the support plate away from the mounting base for Y-axis adjustment, and two set screws are disposed opposite each other on the top of the mounting plate for X-axis adjustment.

[0015] Furthermore, the mounting plate has two through holes facing each other in the vertical direction, and a plurality of fastening bolts and positioning pins are arranged around the periphery of the two through holes.

[0016] Furthermore, the mounting bracket is perpendicular to the base.

[0017] As can be seen from the above technical solution, compared with the prior art, this utility model discloses a crystal rod bonding stage with adjustable precision, which has the following advantages:

[0018] By setting adjustment components, the original error of the cutting machine relative to the base can be verified in advance during use. First, the X-axis is adjusted to be parallel to the base plane, and the Y-axis is adjusted to be perpendicular to the X-axis, which can reduce the losses caused by out-of-tolerance angle accuracy.

[0019] After adjusting the base, fix the high-precision iron block onto the base, and then attach the crystal rod to the high-precision iron block. The operator only needs to level the X and Y axes of the crystal rod angle surface. The cutting accuracy can meet higher requirements, and currently it can achieve a wafer with an accuracy requirement of ±0.1°. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0021] Figure 1 A schematic diagram of the crystal rod bonding stage with adjustable precision provided by this utility model (without high-precision iron block installed);

[0022] Figure 2 A schematic diagram of the structure of the crystal rod bonding stage with adjustable precision provided by this utility model (with high-precision iron block installed);

[0023] Figure 3 A schematic diagram of the structure (working state) of the crystal rod bonding stage with adjustable precision provided by this utility model.

[0024] Wherein: 1 is the base; 2 is the pad; 3 is the crystal rod; 4 is the mounting base; 5 is the mounting plate; 6 is the support plate; 7 is the fastening bolt; 8 is the positioning pin; 9 is the high-precision iron block; 10 is the graphite block; 11 is the dial indicator; 12 is the set screw. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] See Figure 1-3 This utility model discloses a crystal rod bonding stage with adjustable precision, comprising:

[0027] Base 1, with pad 2 on base 1, and crystal rod 3 on pad 2;

[0028] Mounting base 4 is set on base 1. Mounting base 4 has a mounting plate 5 on the side of base 1 and two support plates 6 at opposite ends of mounting plate 5.

[0029] The adjustment assembly includes multiple fastening bolts 7 and multiple positioning pins 8. Multiple fastening bolts 7 are positioned on the sidewalls of the support plate 6 away from each other for Y-axis adjustment, and multiple fastening bolts 7 are positioned on the sidewalls of the mounting plate 5 away from the mounting base 4 for X-axis adjustment. Multiple positioning pins 8 are positioned on the sidewalls of the support plate 6 away from each other as Y-axis adjustment base points, and multiple positioning pins 8 are positioned on the sidewalls of the mounting plate 5 away from the mounting base 4 as X-axis adjustment base points. By using adjustable fastening screws, both the X-axis and Y-axis can be adjusted around the adjustment base points with a large adjustment range and high precision.

[0030] The high-precision iron block 9 is vertically movable on the base 1 by fastening bolts 7, and the crystal rod 3 is connected to the side of the high-precision iron block 9 away from the mounting plate 5.

[0031] In this embodiment, the crystal rod 3 and the high-precision iron block 9 are connected by a graphite block 10.

[0032] In this embodiment, the adjustment assembly also includes a dial indicator 11. Two dial indicators 11 are set on the top of the mounting plate 5. The two dial indicators 11 assist in the adjustment of the X-axis and the Y-axis respectively. The dial indicator 11 fluctuates within ±10 micrometers, so that the angle surface of the crystal rod 3 is parallel to the plane of the base 1.

[0033] In this embodiment, the adjustment assembly also includes set screws 12. Multiple set screws 12 are provided. Two set screws 12 are arranged opposite each other on the side of the support plate 6 away from the mounting base 4 for Y-axis adjustment, and two set screws 12 are arranged opposite each other on the top of the mounting plate 5 for X-axis adjustment.

[0034] In this embodiment, the mounting plate 5 has two through holes facing each other in the vertical direction, and a plurality of fastening bolts 7 and positioning pins 8 are arranged around the periphery of the two through holes.

[0035] In this embodiment, the mounting base 4 is arranged perpendicularly to the base 1.

[0036] Detailed usage instructions

[0037] like Figure 2 As shown, the multi-wire cutting machine used for cutting is the NTC442 model. Before use, verify the original error of the cutting machine relative to the base 1. First, adjust the X-axis to be parallel to the plane of the base 1 and the Y-axis to be perpendicular to the X-axis. This can reduce the loss caused by out-of-tolerance angle accuracy.

[0038] like Figure 3 As shown, after adjusting the base 1, fix the high-precision iron block 9 onto the base 1, and then attach the crystal rod 3 to the high-precision iron block. The operator only needs to level the X-axis and Y-axis of the angle surface of the crystal rod 3. The cutting accuracy can meet higher requirements, and currently it can achieve a wafer with an accuracy requirement of ±0.1°.

[0039] After the wire saw cuts out the wafer, the cut wafer is compared with the precision sheet when the crystal rod 3 is angled. The difference in error is calculated, and the X and Y axes of the base 1 can be adjusted to make precision compensation.

[0040] The micrometers on the X and Y axes of the base 1 can be adjusted at the micrometer level. Calculations show that the X and Y axes can be adjusted in a minimum step of 0.02°.

[0041] Since the mechanical errors of each multi-wire cutting machine are different, the device can be customized for each multi-wire cutting machine, so that each multi-wire cutting machine can meet the cutting requirements of higher precision.

[0042] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0043] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A crystal rod bonding stage with adjustable precision, characterized in that, include: A base, wherein a pad is provided on the base, and a crystal rod is disposed on the pad; Mounting base, the mounting base is disposed on the base, the mounting base is provided with a mounting plate on the side of the mounting base near the base, and two support plates are provided at opposite ends of the mounting plate; The adjustment assembly includes fastening bolts and locating pins, with multiple fastening bolts and locating pins provided. The multiple fastening bolts are located on the sidewalls of the support plate that are far apart from each other for Y-axis adjustment, and the multiple fastening bolts are located on the sidewalls of the mounting plate that are far apart from the mounting base for X-axis adjustment. The multiple locating pins are located on the sidewalls of the support plate that are far apart from each other as Y-axis adjustment base points, and the multiple locating pins are located on the sidewalls of the mounting plate that are far apart from the mounting base as X-axis adjustment base points. A high-precision iron block is vertically movable on the base via fastening bolts, and the crystal rod is connected to the side of the high-precision iron block away from the mounting plate.

2. The crystal rod bonding stage with adjustable precision according to claim 1, characterized in that, The crystal rod and the high-precision iron block are connected by a graphite block.

3. The crystal rod bonding stage with adjustable precision according to claim 1, characterized in that, The adjustment assembly also includes two dial indicators, which are disposed on the top of the mounting plate. The two dial indicators assist in the adjustment of the X-axis and the Y-axis, respectively.

4. The crystal rod bonding stage with adjustable precision according to claim 3, characterized in that, The adjustment assembly also includes multiple set screws. Two set screws are disposed opposite each other on the side of the support plate away from the mounting base for Y-axis adjustment, and two set screws are disposed opposite each other on the top of the mounting plate for X-axis adjustment.

5. The crystal rod bonding stage with adjustable precision according to claim 1, characterized in that, The mounting plate has two through holes facing each other in the vertical direction, and a plurality of fastening bolts and positioning pins are arranged around the two through holes.

6. The crystal rod bonding stage with adjustable precision according to claim 1, characterized in that, The mounting bracket is perpendicular to the base.

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