A quick opening and closing device for semiconductor seal ring mold

Abstract

The utility model discloses a kind of semiconductor sealing ring mould quick opening and closing device, including base, the top surface of base is slidably connected with moving seat, the top surface of moving seat is clamped two lower moulds, the top surface of base is slidably connected with top plate, the bottom surface of top plate is fixedly connected with upper mould, the top surface of top plate is fixedly connected with sprue sleeve, the top surface of top plate is symmetrically equipped with two racks, rack is fixedly connected with base, the bottom surface of rack is liftably connected with pressing block, the top surface of top plate is slidably worn and set up post, post is vertically fixed on the top surface of base, the top surface of top plate is fixedly connected with locking piece, the rear side of post is equipped with the positioning groove compatible with locking piece.The utility model slides and connects upper mould on the top surface of base by support column and spring, slide and set up post in upper mould, and fixed locking piece on the top surface of top plate, when opening mould, locking piece is unlocked, spring resets, and upper mould is quickly raised under the spring elastic force, the quick opening of mould is realized.

Description

Technical Field

[0001] This utility model relates to the technical field of sealing ring production equipment, and in particular to a quick opening and closing device for semiconductor sealing ring molds. Background Technology

[0002] The semiconductor industry is the cornerstone of modern technology, and its manufacturing processes are carried out under extremely high cleanliness, vacuum, and harsh chemical and physical conditions. Various process chambers (such as etching, deposition, and ion implantation equipment) must be absolutely sealed to prevent the entry of external contaminants or leakage of internal process gases. The reliability of this seal directly affects product yield, equipment uptime, and production safety.

[0003] High-precision sealing rings (typically made of special elastic materials such as perfluoroelastomer rubber) are key components for achieving this ultra-clean, ultra-high vacuum seal. They are installed at hundreds of critical connections, including chamber flanges, valves, viewing windows, and gas pipeline interfaces. As semiconductor manufacturing processes continue to shrink (from the nanometer scale to the angstrom scale), the requirements for the dimensional accuracy, surface cleanliness, burr-free nature, and stress-free properties of the sealing rings have reached near-extreme levels.

[0004] When producing sealing rings, molds are required. Nowadays, cylinders are used as driving components to open and close the molds. However, the cylinders operate slowly when opening the molds, which affects the mold opening speed. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a rapid opening and closing device for semiconductor sealing ring molds.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a quick opening and closing device for a semiconductor sealing ring mold, comprising a base, a movable seat slidably connected to the top surface of the base, two lower molds being snapped onto the top surface of the movable seat, a top plate slidably connected to the top surface of the base, an upper mold being fixedly connected to the bottom surface of the top plate, a sprue sleeve being fixedly connected to the top surface of the top plate, two frames symmetrically provided on the top surface of the top plate, the frames being fixedly connected to the base, a pressure block being lifted and lowered onto the bottom surface of the frames, a vertical rod slidably passing through the rear side of the top surface of the top plate, the vertical rod being vertically fixed to the top surface of the base, a locking member being fixedly connected to the top surface of the top plate, and a positioning groove adapted to the locking member being provided on the rear side of the vertical rod.

[0007] As a further description of the above technical solution: a guide groove is formed on the top surface of the base, a guide block is slidably connected in the guide groove, a screw is threaded through the side of the guide block, one end of the screw is rotatably connected to the inner wall of one side of the guide groove, and the other end is fixedly connected to a drive motor, the drive motor is fixed in the guide groove.

[0008] As a further description of the above technical solution: support columns are slidably provided at the four corners of the top surface of the top plate, the support columns are fixed to the top surface of the base, springs are sleeved on the outer edge of the support columns, the springs abut against the base and the top plate, and buffer blocks are fixedly connected to the top surface of the support columns, the buffer blocks abut against the top surface of the top plate.

[0009] As a further description of the above technical solution: the top surface of the frame is vertically fixed with a cylinder, the end of the piston rod of the cylinder slides through the frame, and the pressure block is fixedly connected to the end of the piston rod of the cylinder.

[0010] As a further description of the above technical solution: the locking component includes an electric push rod fixed to the top surface of the top plate, the piston rod end of the electric push rod is fixedly connected to a push plate, the push plate is slidably connected to the top surface of the top plate, and the end of the push plate is fixedly connected to a positioning pin adapted to the positioning groove.

[0011] As a further description of the above technical solution: the top surface of the base has two symmetrical slots, the lower mold is engaged in the slots, the front side of the lower mold is fixedly connected to a handle, the top surface of the lower mold is provided with an anti-overflow groove, and the bottom surface of the upper mold is fixed with a sealing block that matches the anti-overflow groove.

[0012] As a further description of the above technical solution: two limiting grooves are symmetrically opened in the slot, and a limiting block is slidably connected in the limiting groove, and the limiting block is fixedly connected to the lower mold.

[0013] This utility model has the following beneficial effects:

[0014] 1. Compared with the prior art, the semiconductor sealing ring mold quick opening and closing device connects the upper mold to the top surface of the base via a support column and a spring. Two pressure blocks are telescopically connected above the upper mold, and a vertical rod slides through the upper mold. A locking component adapted to the vertical rod is fixed on the top surface of the top plate. When the mold is closed, the spring is compressed and the locking component is fixed. When the mold is opened, the locking component is unlocked, the spring is reset, and the upper mold rises rapidly under the action of the spring force, thus realizing the quick opening of the mold.

[0015] 2. Compared with existing technologies, this semiconductor sealing ring mold quick opening and closing device achieves continuous production of sealing rings by sliding the base on the top surface of the base and clamping two lower molds on the top surface of the base. It eliminates the need to remove the sealing rings from the lower molds before mold closing, thereby improving the production efficiency of sealing rings. The lower molds are quickly installed and positioned through a combination of slots, limiting slots, and limiting blocks, and are easy to pick up and put down with the handle on the front side. This modular design makes it very quick to change different types of molds, reducing equipment downtime and adapting to the production needs of multiple varieties and small batches. The anti-overflow groove on the top surface of the lower mold and the sealing block on the bottom surface of the upper mold cooperate to form an effective seal after mold closing, preventing the high-temperature and high-pressure rubber material from overflowing during the molding process. Attached Figure Description

[0016] Figure 1 This is a three-dimensional view of the overall structure of a semiconductor sealing ring mold quick opening and closing device proposed in this utility model;

[0017] Figure 2 This utility model proposes a quick opening and closing device for a semiconductor sealing ring mold. Figure 1 Enlarged view of the structure at point A in the middle;

[0018] Figure 3 This utility model proposes a quick opening and closing device for a semiconductor sealing ring mold. Figure 1 Enlarged view of the structure at point B;

[0019] Figure 4 This is a main sectional view of the overall structure of a semiconductor sealing ring mold quick opening and closing device proposed in this utility model;

[0020] Figure 5 This is a side sectional view of the connection between the top plate and the upright of a semiconductor sealing ring mold quick opening and closing device proposed in this utility model.

[0021] Legend:

[0022] 1. Base; 2. Frame; 3. Lower mold; 4. Moving seat; 5. Spring; 6. Support column; 7. Buffer block; 8. Top plate; 9. Pressure block; 10. Cylinder; 11. Sprue sleeve; 12. Upper mold; 13. Push plate; 14. Electric push rod; 15. Slot; 16. Limit slot; 17. Limit block; 18. Handle; 19. Anti-overflow slot; 20. Upright pole; 21. Guide slot; 22. Screw; 23. Guide block; 24. Drive motor; 25. Positioning pin; 26. Positioning slot. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Reference Figures 1 to 5 This utility model provides a quick opening and closing device for a semiconductor sealing ring mold: It includes a base 1, a movable seat 4 slidably connected to the top surface of the base 1, two lower molds 3 clamped to the top surface of the movable seat 4, a top plate 8 slidably connected to the top surface of the base 1, an upper mold 12 fixedly connected to the bottom surface of the top plate 8, a sprue sleeve 11 fixedly connected to the top surface of the top plate 8, two frames 2 symmetrically arranged on the top surface of the top plate 8, the frames 2 fixedly connected to the base 1, a pressure block 9 lifted and lowered to the bottom surface of the frames 2, and a cylinder 10 vertically fixed to the top surface of the frames 2, the piston rod end of the cylinder 10 slidingly penetrating through the frame. 2. The pressure block 9 is fixedly connected to the end of the piston rod of the cylinder 10. The upright rod 20 slides through the rear side of the top surface of the top plate 8. The upright rod 20 is vertically fixed to the top surface of the base 1. The top surface of the top plate 8 is fixedly connected to the locking component. The rear side of the upright rod 20 is provided with a positioning groove 26 that matches the locking component. The four corners of the top surface of the top plate 8 are all slidably connected to the support column 6. The support column 6 is fixed to the top surface of the base 1. The outer edge of the support column 6 is fitted with a spring 5. The spring 5 abuts between the base 1 and the top plate 8. The top surface of the support column 6 is fixedly connected to the buffer block 7. The buffer block 7 abuts against the top surface of the top plate 8.

[0025] The locking component includes an electric push rod 14 fixed to the top surface of the top plate 8. The piston rod end of the electric push rod 14 is fixedly connected to a push plate 13. The push plate 13 is slidably connected to the top surface of the top plate 8. The end of the push plate 13 is fixedly connected to a positioning pin 25 that is adapted to the positioning groove 26.

[0026] A guide groove 21 is provided on the top surface of the base 1. A guide block 23 is slidably connected in the guide groove 21. A screw 22 is threaded through the side of the guide block 23. One end of the screw 22 is rotatably connected to the inner wall of one side of the guide groove 21, and the other end is fixedly connected to the drive motor 24. The drive motor 24 is fixed in the guide groove 21.

[0027] Two slots 15 are symmetrically opened on the top surface of the base 1. The lower mold 3 is snapped into the slot 15. The handle 18 is fixedly connected to the front side of the lower mold 3. The top surface of the lower mold 3 is provided with an anti-overflow groove 19. The bottom surface of the upper mold 12 is fixed with a sealing block that matches the anti-overflow groove 19. Two limiting grooves 16 are symmetrically opened in the slot 15. A limiting block 17 is slidably connected in the limiting groove 16. The limiting block 17 is fixedly connected to the lower mold 3.

[0028] Working principle: During use, the drive motor 24 moves the lower mold 3 on the left side of the base 1 to the lower part of the upper mold 12. Then, the cylinder 10 drives the pressure block 9 to descend, pushing the upper mold 12 downwards, causing the lower mold 3 to close with the upper mold 12. At the same time, the spring 5 is compressed, aligning the positioning pin 25 with the positioning groove 26. Then, the electric push rod 14 pushes the push plate 13 to move, inserting the positioning pin 25 into the positioning groove 26 to fix the mold. Then, the cylinder 10 retracts the pressure block 9 upwards. After molding, the electric push rod... 14. Retract the positioning pin 25 from the positioning groove 26. After the mold is unlocked, the spring 5, which is in a compressed state, is reset. Under the elasticity of the spring 5, the upper mold 12 rises quickly to achieve rapid mold opening. After the mold is opened, the drive motor 24 drives the left lower mold 3, which is equipped with the forming sealing ring, to move to the left, so that the left lower mold 3 moves out of the lower mold 12. At the same time, the empty lower mold 3 on the right moves to the lower mold 12. Then, the mold is closed again for production. At the same time, the sealing ring in the left lower mold 3 is removed from the lower mold 3.

[0029] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A quick opening and closing device for a semiconductor sealing ring mold, comprising a base (1), characterized in that: The top surface of the base (1) is slidably connected to the movable seat (4), the top surface of the movable seat (4) is engaged with two lower molds (3), the top surface of the base (1) is slidably connected to the top plate (8), the bottom surface of the top plate (8) is fixedly connected to the upper mold (12), the top surface of the top plate (8) is fixedly connected to the sprue sleeve (11), the top surface of the top plate (8) is symmetrically provided with two frames (2), the frames (2) are fixedly connected to the base (1), the bottom surface of the frames (2) is raised and lowered connected to the pressure block (9), the rear side of the top surface of the top plate (8) is slidably connected to the upright rod (20), the upright rod (20) is vertically fixed to the top surface of the base (1), the top surface of the top plate (8) is fixedly connected to the locking member, and the rear side of the upright rod (20) is provided with a positioning groove (26) adapted to the locking member.

2. The semiconductor sealing ring mold quick opening and closing device according to claim 1, characterized in that: The top surface of the base (1) has a guide groove (21), and a guide block (23) is slidably connected in the guide groove (21). A screw (22) is threaded through the side of the guide block (23). One end of the screw (22) is rotatably connected to the inner wall of one side of the guide groove (21), and the other end is fixedly connected to a drive motor (24). The drive motor (24) is fixed in the guide groove (21).

3. The semiconductor sealing ring mold quick opening and closing device according to claim 1, characterized in that: Support columns (6) are slidably inserted through the four corners of the top surface of the top plate (8). The support columns (6) are fixed to the top surface of the base (1). Springs (5) are sleeved on the outer edge of the support columns (6). The springs (5) abut against the base (1) and the top plate (8). A buffer block (7) is fixedly connected to the top surface of the support columns (6). The buffer block (7) abuts against the top surface of the top plate (8).

4. The semiconductor sealing ring mold quick opening and closing device according to claim 1, characterized in that: The top surface of the frame (2) is vertically fixed with a cylinder (10), the piston rod end of the cylinder (10) slides through the frame (2), and the pressure block (9) is fixedly connected to the piston rod end of the cylinder (10).

5. The semiconductor sealing ring mold quick opening and closing device according to claim 1, characterized in that: The locking element includes an electric push rod (14) fixed to the top surface of the top plate (8), the piston rod end of the electric push rod (14) is fixedly connected to a push plate (13), the push plate (13) is slidably connected to the top surface of the top plate (8), and the end of the push plate (13) is fixedly connected to a positioning pin (25) adapted to the positioning groove (26).

6. The semiconductor sealing ring mold quick opening and closing device according to claim 1, characterized in that: The base (1) has two symmetrical slots (15) on its top surface. The lower mold (3) is engaged in the slots (15). The front side of the lower mold (3) is fixedly connected to a handle (18). The top surface of the lower mold (3) is provided with an anti-overflow groove (19). The bottom surface of the upper mold (12) is fixed with a sealing block that is compatible with the anti-overflow groove (19).

7. The semiconductor sealing ring mold quick opening and closing device according to claim 6, characterized in that: Two limiting grooves (16) are symmetrically opened in the slot (15), and a limiting block (17) is slidably connected in the limiting groove (16). The limiting block (17) is fixedly connected to the lower mold (3).

Images