Epoxy plastic encapsulation melt rapid cooling and tabletting device

Abstract

The utility model belongs to epoxy plastic package material processing equipment technical field especially relates to a kind of epoxy plastic package material melt rapid cooling tablet press device, including bottom plate and support leg, the bottom plate upper portion is provided with tablet press structure, and the tablet press structure includes tablet press mechanism and cooling mechanism, and the tablet press mechanism includes support rod, bearing plate, electric telescopic link, upper pressure mould, moving plate, and the support rod top and bearing plate inner wall are interconnected.The epoxy plastic package material melt rapid cooling tablet press device realizes the height position of the quick adjustment adjusting plate, and then accurately limits the maximum closing distance of upper pressure mould and lower pressure mould, and the setting of pressure sensor can monitor pressing pressure in real time, when moving plate extrudes sensor, electric telescopic link can be automatically controlled to stop working, ensure that the thickness of each tablet is consistent, storage tank is uniformly fed to lower pressure mould by double flow guide pipe, reduce melt accumulation phenomenon, improve tabletting continuity and production efficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of epoxy molding compound processing equipment, specifically to a rapid cooling and pressing device for epoxy molding compound melt. Background Technology

[0002] Packaging of semiconductor devices (such as chips, power modules, and sensors) is a crucial step in ensuring stable performance and extending service life. In the field of packaging materials, epoxy molding compounds are favored due to their excellent insulation properties (volume resistivity ≥10). 14 With its superior performance (Ω・cm), high temperature resistance (glass transition temperature Tg≥120℃), mechanical strength (flexural strength≥100MPa), and cost advantages, epoxy molding compound has become the mainstream choice for semiconductor packaging (accounting for over 70%). It is widely used in traditional packaging forms such as DIP, SOP, and QFP, as well as high-density packaging scenarios such as CSP (chip-level packaging) and SiP (system-in-package). In semiconductor packaging, epoxy molding compound needs to go through the process of "melt preparation - cooling and shaping - pressing and subsequent processing". Among them, the cooling and pressing process directly determines the final performance of the packaging material, thus requiring the use of a rapid cooling and pressing device.

[0003] Existing rapid cooling tableting devices typically involve directly pouring the melt into the device for tableting. However, in practice, it is not easy to quickly and conveniently adjust the maximum closing distance between the upper and lower dies. This results in a significant amount of time being spent adjusting the device when pressing tablets of different sizes, thus reducing the efficiency of the tableting device.

[0004] Therefore, we urgently need to provide a device for rapid cooling and tableting of epoxy molding compound melt. Utility Model Content

[0005] The purpose of this invention is to provide a rapid cooling and tableting device for epoxy molding compound melt, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a rapid cooling and pressing device for epoxy molding compound melt, comprising a base plate and supporting legs, wherein a pressing structure is provided above the base plate; The tablet compression structure includes a tablet compression mechanism and a cooling mechanism; The tablet pressing mechanism includes a support rod, a bearing plate, an electric telescopic rod, an upper pressing mold, and a movable plate. The top of the support rod is connected to the inner wall of the bearing plate, the inner wall of the bearing plate is connected to the outer wall of the electric telescopic rod, the bottom of the electric telescopic rod is connected to the top of the upper pressing mold, one side of the upper pressing mold is connected to one end of the movable plate, one end of the movable plate is slidably connected to a guide plate, the inner side of the guide plate is slidably connected to an adjusting plate, the inner wall of the adjusting plate is threaded with a fixing bolt, a pressure sensor is fixedly installed on the top of the adjusting plate, a storage box is fixedly installed on the top of the bearing plate, a guide pipe is connected to the bottom of the storage box, one end of the guide pipe is connected to a lower pressing mold, an electric push rod is fixedly installed on the inner wall of the lower pressing mold, and a release plate is fixedly installed on the top of the electric push rod.

[0007] A further improvement is that the number of support rods is four, which are symmetrically distributed on the top of the base plate, and the number of electric telescopic rods is two, which are symmetrically distributed on the inner wall of the bearing plate. This allows for quick and convenient adjustment of the position of the upper pressure mold, thereby enabling better tablet pressing.

[0008] A further improvement is that there are four guide plates, which are symmetrically distributed on both sides of the lower die. A movable groove is provided on one side of each guide plate, and one end of the movable plate is slidably connected to the inner wall of the movable groove. This allows for quick and convenient adjustment of the position of the adjustment plate, thereby enabling quick and convenient adjustment of the maximum closing distance between the upper and lower dies.

[0009] A further improvement is that an adjustment hole is provided on one side of the guide plate, one end of the fixing bolt is threaded to the inner wall of the adjustment hole, the adjustment plate is T-shaped, and there are two guide tubes, which are symmetrically distributed on both sides of the lower die, so that the melt can be poured into the lower die quickly and conveniently, thereby enabling better tableting.

[0010] A further improvement is that the cooling mechanism includes a cooling box, a circulating pump, a water pipe, a heat absorption plate, and a blower box. The inner wall of the cooling box is connected to the bottom of the circulating pump. One end of the circulating pump is connected to one end of the water pipe, and the other end of the water pipe is connected to one end of the heat absorption plate. One end of the lower pressure mold is connected to one end of the blower box. A dustproof net and a refrigeration device are fixedly installed on the inner wall of the blower box. A fixing plate is fixedly installed on the inner wall of the blower box, and a blower fan is fixedly installed on one side of the fixing plate.

[0011] A further improvement is that there are two blower boxes, which are symmetrically distributed at both ends of the lower die; there are two refrigeration devices, which are symmetrically distributed on the inner wall of the blower boxes; and there are several blower fans, which are symmetrically distributed on the inner wall of the two blower boxes. This allows for quick and convenient cooling of the pressed tablets, thereby enabling better processing and production.

[0012] A further improvement is that the bottom of the base plate is connected to the top of the support leg, the top of the base plate is connected to the bottom of the support rod, and the bottom of the base plate is connected to the top of the cooling box.

[0013] Compared with the prior art, the beneficial effects of this utility model are: 1. This epoxy molding compound melt rapid cooling and tableting device achieves sliding cooperation between the guide plate and the adjusting plate through the tableting mechanism. Combined with the limiting function of the fixing bolts, the height position of the adjusting plate can be quickly adjusted, thereby accurately limiting the maximum closing distance between the upper and lower die. The pressure sensor can monitor the pressing pressure in real time. When the moving plate squeezes the sensor, the electric telescopic rod can be automatically controlled to stop working, ensuring that the tablet thickness is consistent each time. The storage box feeds material evenly to the lower die through the double guide tube, reducing melt accumulation and improving tableting continuity and production efficiency.

[0014] 2. This epoxy molding compound melt rapid cooling and tableting device employs a dual cooling design of "liquid cooling + air cooling" through its cooling mechanism. A circulating pump delivers coolant from the cooling tank to the heat absorption plate via water pipes, directly absorbing heat from the tableting process within the lower mold, achieving efficient heat exchange. Simultaneously, the refrigeration equipment in the blower box lowers the air temperature, and the blower fan directs cool air towards the tableting area, accelerating surface heat dissipation. This synergistic dual cooling effect significantly improves the cooling rate of the epoxy molding compound melt, preventing tablet deformation or performance degradation caused by slow cooling. The dust filter prevents impurities from the air from adhering to the tableting surface or clogging the cooling channels, ensuring stable cooling efficiency. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a cross-sectional structural diagram of the present invention; Figure 3 This is a schematic diagram of the tablet compression mechanism of this utility model. Figure 1 ; Figure 4 This is a schematic diagram of the tablet compression mechanism of this utility model. Figure 2 ; Figure 5 This is a schematic diagram of the cooling mechanism of this utility model. Figure 1 ; Figure 6 This is a schematic diagram of the cooling mechanism of this utility model. Figure 2 .

[0016] In the diagram: 1. Base plate; 2. Support leg; 3. Pressing mechanism; 301. Support rod; 302. Bearing plate; 303. Electric telescopic rod; 304. Upper pressing mold; 305. Moving plate; 306. Guide plate; 307. Adjusting plate; 308. Fixing bolt; 309. Pressure sensor; 310. Storage box; 311. Guide pipe; 312. Lower pressing mold; 313. Electric push rod; 314. Release plate; 4. Cooling mechanism; 401. Cooling box; 402. Circulating pump; 403. Water guide pipe; 404. Heat absorption plate; 405. Blower box; 406. Dustproof net; 407. Refrigeration equipment; 408. Fixing plate; 409. Blower fan. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figures 1-6 This utility model provides a technical solution: Example 1: A rapid cooling and pressing device for epoxy molding compound melt includes a base plate 1 and a support leg 2, with a pressing structure disposed above the base plate 1; The tablet compression structure includes a tablet compression mechanism 3 and a cooling mechanism 4; The tablet compression mechanism 3 includes a support rod 301, a bearing plate 302, an electric telescopic rod 303, an upper die 304, and a movable plate 305. The top of the support rod 301 is connected to the inner wall of the bearing plate 302, the inner wall of the bearing plate 302 is connected to the outer wall of the electric telescopic rod 303, the bottom of the electric telescopic rod 303 is connected to the top of the upper die 304, one side of the upper die 304 is connected to one end of the movable plate 305, and a guide plate 306 is slidably connected to one end of the movable plate 305. An adjusting plate 307 is slidably connected to the inner side of 06. A fixing bolt 308 is threadedly connected to the inner wall of the adjusting plate 307. A pressure sensor 309 is fixedly installed on the top of the adjusting plate 307. A storage box 310 is fixedly installed on the top of the bearing plate 302. A guide pipe 311 is connected to the bottom of the storage box 310. A lower pressure mold 312 is connected to one end of the guide pipe 311. An electric push rod 313 is fixedly installed on the inner wall of the lower pressure mold 312. A demolding plate 314 is fixedly installed on the top of the electric push rod 313. In this embodiment, there are four support rods 301, which are symmetrically distributed on the top of the base plate 1. There are two electric telescopic rods 303, which are symmetrically distributed on the inner wall of the bearing plate 302. A control panel is fixedly installed on one side of the storage box 310. The control panel is electrically connected to the electric telescopic rods 303, pressure sensor 309, circulation pump 402, refrigeration equipment 407, and blower fan 409, so that the position of the upper pressure mold 304 can be quickly and conveniently adjusted, thereby enabling better tablet pressing. Furthermore, there are four guide plates 306, which are symmetrically distributed on both sides of the lower die 312. A movable groove is provided on one side of the guide plate 306, and one end of the movable plate 305 is slidably connected to the inner wall of the movable groove, so that the position of the adjusting plate 307 can be adjusted quickly and conveniently, thereby allowing for quick and convenient adjustment of the maximum closing distance between the upper die 304 and the lower die 312. Furthermore, an adjustment hole is provided on one side of the guide plate 306, and one end of the fixing bolt 308 is threaded to the inner wall of the adjustment hole. The adjustment plate 307 is T-shaped, and there are two guide tubes 311. The guide tubes 311 are symmetrically distributed on both sides of the lower die 312, so that the melt can be poured into the lower die 312 quickly and conveniently, thereby enabling better tablet pressing.

[0019] When epoxy molding compound melt needs to be pressed into tablets, the operator pours the melt into the storage tank 310 for temporary storage. The operator sets the values ​​and controls the equipment through the control panel installed on the front of the storage tank 310. During operation, the melt flows into the lower die 312 through the guide pipe 311. At this time, by rotating the fixing bolt 308, it moves on the inner wall of the adjusting plate 307. The movement of the fixing bolt 308 allows it to be pulled out from one side of the guide plate 306, thereby releasing the limiting fixation of the adjusting plate 307. At this time, pulling the adjusting plate 307 to slide inside the guide plate 306 drives the pressure sensor 309 to move, thereby quickly and conveniently adjusting the position of the pressure sensor 309, and thus adjusting the maximum closing distance between the upper die 304 and the lower die 312, so as to better process tablets of different thicknesses. At this time, by activating the electric telescopic rod 303, for example, model The XTL-500 mechanism drives the upper die 304 to move. This movement causes the moving plate 305 to slide on the guide plate 306, increasing the stability of the upper die 304 during movement. The upper die 304 moves to perform tableting. When the moving plate 305 slides and presses against the pressure sensor 309 (e.g., PT124G-111), the pressure sensor 309 receives a pressure signal and controls the electric telescopic rod 303 to stop working, thus completing the tableting process. After tableting, the cooling mechanism 4 is activated to cool and reduce the tablet size. After cooling, the electric push rod 313 is activated to move the demolding template 314. The demolding template 314 moves to quickly demold the tablet. Initially, the demolding template 314 is in contact with the inner wall of the lower template 312, which facilitates better demolding of the tablet.

[0020] Example 2: Based on Embodiment 1, the cooling mechanism 4 includes a cooling box 401, a circulating pump 402, a water pipe 403, a heat absorption plate 404, and a blower box 405. The inner wall of the cooling box 401 is connected to the bottom of the circulating pump 402. One end of the circulating pump 402 is connected to one end of the water pipe 403, and the other end of the water pipe 403 is connected to one end of the heat absorption plate 404. The other end of the circulating pump 402 is connected to the end of the water pipe 403 that passes through the heat absorption plate 404. One end of the lower pressure mold 312 is connected to one end of the blower box 405. A dustproof net 406 and a refrigeration device 407 are fixedly installed on the inner wall of the blower box 405. A fixing plate 408 is fixedly installed on the inner wall of the blower box 405, and a blower fan 409 is fixedly installed on one side of the fixing plate 408. In this embodiment, there are two blower boxes 405, which are symmetrically distributed at both ends of the lower mold 312. There are two refrigeration devices 407, which are symmetrically distributed on the inner wall of the blower box 405. There are several blower fans 409, which are symmetrically distributed on the inner wall of the two blower boxes 405. This allows for quick and convenient cooling of the pressed tablets, thus enabling better processing and production. Furthermore, the bottom of the base plate 1 is connected to the top of the support leg 2, the top of the base plate 1 is connected to the bottom of the support rod 301, and the bottom of the base plate 1 is connected to the top of the cooling box 401.

[0021] When it is necessary to press the epoxy molding compound melt into tablets, the operator pours the melt into the storage tank 310 for temporary storage. The tablet pressing mechanism 3 enables quick and convenient tablet pressing, and allows for quick and easy adjustment of the maximum closing distance between the upper and lower molds. After tablet pressing is completed, the circulation pump 402, for example, model MP-15R, is started. The small magnetic circulation pump can transport the coolant inside the cooling box 401 to the heat absorption plate 404 through the water guide pipe 403. The heat absorption plate 404 can absorb the heat of the pressing plate in the lower mold 312, and the coolant entering the heat absorption plate 404 can absorb the heat of the heat absorption plate 404, thereby achieving rapid and convenient cooling. At this time, by starting the refrigeration equipment 407, such as the TEC1-12706, the air temperature inside the blower box 405 can be reduced. By starting the blower fan 409, the DC12V model can blow the air inside the blower box 405 into the lower mold 312, thereby accelerating the cooling speed and cooling the coolant, thus achieving better processing. By installing the dust filter 406, impurities in the external air entering the blower box 405 can be filtered, thereby effectively preventing them from affecting heat dissipation.

[0022] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A rapid cooling and pressing device for epoxy molding compound melt, comprising a base plate (1) and supporting legs (2), characterized in that: A pressing structure is provided above the base plate (1); The tablet compression structure includes a tablet compression mechanism (3) and a cooling mechanism (4); The tablet pressing mechanism (3) includes a support rod (301), a bearing plate (302), an electric telescopic rod (303), an upper die (304), and a moving plate (305). The top of the support rod (301) is connected to the inner wall of the bearing plate (302), the inner wall of the bearing plate (302) is connected to the outer wall of the electric telescopic rod (303), the bottom of the electric telescopic rod (303) is connected to the top of the upper die (304), one side of the upper die (304) is connected to one end of the moving plate (305), and one end of the moving plate (305) is slidably connected to a guide plate (306). 306) An adjusting plate (307) is slidably connected to the inner side. A fixing bolt (308) is threadedly connected to the inner wall of the adjusting plate (307). A pressure sensor (309) is fixedly installed on the top of the adjusting plate (307). A storage box (310) is fixedly installed on the top of the bearing plate (302). A guide pipe (311) is connected to the bottom of the storage box (310). A lower pressing mold (312) is connected to one end of the guide pipe (311). An electric push rod (313) is fixedly installed on the inner wall of the lower pressing mold (312). A demolding plate (314) is fixedly installed on the top of the electric push rod (313).

2. The epoxy molding compound melt rapid cooling and tableting device according to claim 1, characterized in that: There are four support rods (301), which are symmetrically distributed on the top of the base plate (1). There are two electric telescopic rods (303), which are symmetrically distributed on the inner wall of the bearing plate (302).

3. The epoxy molding compound melt rapid cooling and tableting device according to claim 1, characterized in that: There are four guide plates (306), which are symmetrically distributed on both sides of the lower die (312). A moving groove is provided on one side of the guide plate (306), and one end of the moving plate (305) is slidably connected to the inner wall of the moving groove.

4. The epoxy molding compound melt rapid cooling and tableting device according to claim 1, characterized in that: The guide plate (306) has an adjustment hole on one side, and one end of the fixing bolt (308) is threaded to the inner wall of the adjustment hole. The adjustment plate (307) is T-shaped, and there are two guide tubes (311). The guide tubes (311) are symmetrically distributed on both sides of the lower die (312).

5. The epoxy molding compound melt rapid cooling and tableting device according to claim 1, characterized in that: The cooling mechanism (4) includes a cooling box (401), a circulating pump (402), a water pipe (403), a heat absorption plate (404), and a blower box (405). The inner wall of the cooling box (401) is connected to the bottom of the circulating pump (402). One end of the circulating pump (402) is connected to one end of the water pipe (403), and the other end of the water pipe (403) is connected to one end of the heat absorption plate (404). One end of the lower pressure mold (312) is connected to one end of the blower box (405). A dustproof net (406) and a refrigeration device (407) are fixedly installed on the inner wall of the blower box (405). A fixing plate (408) is fixedly installed on the inner wall of the blower box (405), and a blower fan (409) is fixedly installed on one side of the fixing plate (408).

6. The epoxy molding compound melt rapid cooling and tableting device according to claim 5, characterized in that: There are two blower boxes (405), which are symmetrically distributed at both ends of the lower pressure mold (312). There are two refrigeration devices (407), which are symmetrically distributed on the inner wall of the blower box (405). There are several blower fans (409), which are symmetrically distributed on the inner wall of the two blower boxes (405).

7. The epoxy molding compound melt rapid cooling and tableting device according to claim 1, characterized in that: The bottom of the base plate (1) is connected to the top of the support leg (2), the top of the base plate (1) is connected to the bottom of the support rod (301), and the bottom of the base plate (1) is connected to the top of the cooling box (401).

Images