A cleaning solvent tank device for a solder paste printer

CN224660333UActive Publication Date: 2026-08-21苏州松下生产科技有限公司
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Patent Information

Application Number
CN202521997373.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-17
Publication Date
2026-08-21
Estimated Expiration
2035-09-17

AI Technical Summary

Technical Problem

这种模式下不仅操作繁琐,而且工作效率比较低下,会导致生产工程的作业损失

Benefits of technology

[0036]本实用新型的锡膏印刷机用清洗溶剂罐装置,通过安装基板与锡膏印刷机实现连接,在安装基板上设置搁置部件用于固定清洗溶剂罐,通过直线式的液位传感器设置用于实时检测溶剂罐内溶剂的液位,在检测到的液位达到设定的液位高度也即补充液位预设值时进行在线自动补充清洗溶剂,解决了现有技术中需要中断清洗作业手动进行补液操作导致的操作繁琐、工作效率低,生产工程作业损失的问题。

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Abstract

The utility model discloses a kind of cleaning solvent tank devices for solder paste printing machine, including installation base plate;Rest component is fixed in the lower end of mounting face;Liquid level sensor is located at the upper end of mounting face and above fixed part, and liquid level sensor includes the sensing part that extends linearly along vertical direction and sensing part is electrically connected with controller;Suction device is suitable for supplementing solvent into cleaning solvent tank and extracting solvent in cleaning solvent tank, and suction device is electrically connected with controller;Solvent pipe connects cleaning solvent tank, suction device, nozzle and supplementing solvent tank;When cleaning operation, pipeline communication between cleaning solvent tank, suction device and nozzle, when supplementing solvent is needed, pipeline communication between cleaning solvent tank, suction device and supplementing solvent tank.Solve the problem that the operation is complicated, work efficiency is low in prior art, production engineering operation loss caused by manually supplementing liquid operation needing to interrupt cleaning operation.
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Description

Technical Field

[0001] This utility model relates to the field of SMT technology, specifically to a cleaning solvent tank device for a solder paste printer. Background Technology

[0002] SMT is short for Surface Mount Technology, also known as Surface Mount Technology or Surface Mount Technology. A pick-and-place machine, also known as a placement machine or surface mount system, is a device that is placed on the PCB pads by moving the placement head after the dispensing machine or screen printer in the production line.

[0003] Solder paste printing is a crucial step in the SMT production line, directly determining the quality of the SMT process. The solder paste printer is a key piece of equipment in the Surface Mount Technology (SMT) production line for manufacturing printed circuit boards. During solder paste printing, the stencil often becomes contaminated due to solder paste adhesion, leading to performance degradation of the printer and an increase in PCB printing defects. Therefore, timely cleaning of the stencil is necessary. The company's existing stencil cleaning method uses cleaning nozzles located below the stencil, connected to a cleaning solvent tank via solvent tubing. The tank is filled with solvent for cleaning the stencil. Before each cleaning cycle, the presence of cleaning solvent in the tank is manually checked. However, due to the limited capacity of the cleaning solvent tank, if the solvent level is insufficient during cleaning, the solder paste printer will issue an alarm signal. At this point, workers need to either use robotic equipment to replace the cleaning solvent tank or manually refill it before repeating the cleaning operation. This method is not only cumbersome but also inefficient, leading to production losses. Therefore, this invention addresses this issue. Utility Model Content

[0004] In view of at least one of the above-mentioned technical problems, the purpose of this utility model is to provide a cleaning solvent tank device for solder paste printing machines.

[0005] The technical solution of this utility model is:

[0006] The purpose of this utility model is to provide a cleaning solvent tank device for a solder paste printing machine, comprising:

[0007] The mounting substrate is fixed to the side panel of the solder paste printer or is implemented as the side panel of the solder paste printer, and one side of the mounting substrate in the thickness direction is implemented as the mounting surface.

[0008] A support component, which is fixed to the lower end of the mounting surface and has a fixing part formed on its upper surface for fixing the cleaning solvent tank;

[0009] A liquid level sensor is disposed at the upper end of the mounting surface and above the fixing part. The liquid level sensor includes a sensing part that extends in a straight line in the vertical direction and is electrically connected to the controller. In use, the bottom end of the sensing part is submerged in the bottom of the cleaning solvent tank to detect the liquid level of the solvent in the cleaning solvent tank in real time.

[0010] A suction device adapted to replenish solvent into the cleaning solvent tank and extract solvent from the cleaning solvent tank, the suction device being electrically connected to the controller;

[0011] A solvent tube connects the cleaning solvent tank, the suction device, a nozzle that sprays cleaning solvent onto the steel mesh, and a replenishment solvent tank that replenishes the cleaning solvent tank.

[0012] During the cleaning operation, the pipeline between the cleaning solvent tank, the suction device and the nozzle is connected, while the pipeline between the cleaning solvent tank, the suction device and the replenishment solvent tank is closed. When the liquid level sensor detects that the liquid level in the cleaning solvent tank is lower than the preset height and needs to be replenished, the pipeline between the cleaning solvent tank, the suction device and the nozzle is closed, while the pipeline between the cleaning solvent tank, the suction device and the replenishment solvent tank is connected.

[0013] Preferably, it also includes a lifting device, which is disposed on the mounting surface and located above the supporting component;

[0014] The sensing unit has a first position where it is lowered and submerged in the bottom of the cleaning solvent tank, and a second position where it is raised and located outside the top of the cleaning solvent tank.

[0015] The liquid level sensor is installed on the lifting device and is driven by the lifting device to switch between the first position and the second position. When the liquid level sensor is in the first position, it detects the liquid level of the solvent in the cleaning solvent tank in real time.

[0016] Preferably, the lifting device includes:

[0017] A lifting slide rail is mounted on the mounting surface and extends upward in the vertical direction;

[0018] A lifting slider is slidably mounted on the lifting slide rail;

[0019] A fixing frame, one end of which is connected to the lifting slider and the other end extends horizontally outward to form a horizontal fixing plate, wherein the liquid level sensor is mounted on the horizontal fixing plate and the sensing part is located below the horizontal fixing plate;

[0020] A drive mechanism is provided on the mounting substrate or the solder paste printer. The drive end of the drive mechanism is connected to the lifting slider to drive the lifting slider to move vertically up and down relative to the lifting slide rail.

[0021] Preferably, the lifting device further includes a guide component, the guide component comprising:

[0022] A guide plate, which is disposed on the mounting surface and located on one side of the lifting slide rail and extends vertically;

[0023] The lifting slider and the guide plate are connected by a sliding fit structure to achieve a sliding connection between them.

[0024] Preferably, the sliding fit structure includes a sliding groove provided on one of the lifting slider and the guide plate, and a protrusion provided on the other of the lifting slider and the guide plate that matches the sliding groove.

[0025] Preferably, the solvent tube includes a connecting tube, an output tube, and a replenishment tube, and the suction device includes a first suction pump disposed on the mounting surface and a second suction pump disposed on the replenishment solvent tank;

[0026] One end of the connecting tube is adapted to be inserted into the bottom of the cleaning solvent tank, and the other end is connected to the first suction pump.

[0027] One end of the output pipe is connected to the first suction pump, and the other end is connected to the nozzle;

[0028] One end of the replenishment tube is connected to the second suction pump, and the other end is connected to the replenishment interface of the cleaning solvent tank;

[0029] During the cleaning operation, the pipeline between the connecting pipe, the first suction pump and the output pipe is connected and the pipeline between the second suction pump and the replenishment pipe is closed. When the liquid level sensor detects that the liquid level in the cleaning solvent tank is lower than the preset height and solvent needs to be replenished, the pipeline between the connecting pipe, the first suction pump and the output pipe is closed and the pipeline between the second suction pump and the replenishment pipe is connected.

[0030] Preferably, the system further includes valves disposed on the pipeline between the first suction pump and the nozzle and / or on the pipeline between the second suction pump and the cleaning solvent tank, the valves being electrically connected to the controller.

[0031] Preferably, the horizontal fixing plate is further provided with a solvent conduit extending downward in the vertical direction and spaced parallel to the sensing part of the liquid level sensor, and one end of the connecting pipe is connected to the upper end of the solvent conduit.

[0032] In the first position, the bottom end of the solvent conduit is submerged in the bottom of the cleaning solvent tank; in the second position, the bottom end of the solvent conduit is located outside the top of the cleaning solvent tank.

[0033] Preferably, a clearance through hole is also provided on the mounting surface for the output pipe to pass through.

[0034] Preferably, the shelf component includes a horizontal shelf and a plurality of side baffles extending vertically upward from the outer periphery of the horizontal shelf, wherein one of the side baffles has a clearance notch to avoid the replenishment port of the cleaning solvent tank.

[0035] Compared with the prior art, the advantages of this utility model are:

[0036] This invention relates to a cleaning solvent tank device for a solder paste printer. The device is connected to the solder paste printer via a mounting base. A support component is installed on the mounting base to fix the cleaning solvent tank. A linear liquid level sensor is used to detect the liquid level of the solvent in the tank in real time. When the detected liquid level reaches the set liquid level height, i.e., the preset replenishment liquid level value, the cleaning solvent is automatically replenished online. This solves the problems of cumbersome operation, low work efficiency, and production losses caused by the need to interrupt the cleaning operation for manual replenishment in the prior art. Attached Figure Description

[0037] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0038] Figure 1 This is a schematic diagram of the structure of a cleaning solvent tank device (including a replenishing solvent tank) for a solder paste printer according to an embodiment of the present invention;

[0039] Figure 2 This is a schematic diagram of the cleaning solvent tank device for a solder paste printer according to an embodiment of the present invention, omitting an angle of the replenishing solvent tank and the cleaning solvent tank.

[0040] Figure 3 The schematic diagram of the cleaning solvent tank device for solder paste printing machine according to an embodiment of the present invention omits the replenishment solvent tank and the cleaning solvent tank from another angle.

[0041] The components are as follows: 10. Mounting base plate; 11. Mounting surface; 12. Clearance through hole; 20. Shelf component; 21. Horizontal shelf plate; 22. Side baffle; 221. Clearance notch; 30. Liquid level sensor; 31. Sensing unit; 40. Lifting device; 41. Lifting slide rail; 42. Lifting slider; 43. Fixing frame; 431. Horizontal fixing plate; 432. Vertical connecting plate; 44. Guide plate; 45. Protrusion; 51. First suction pump; 52. Second suction pump; 60. Valve; 70. Cleaning solvent tank; 71. Liquid replenishment interface; 80. Replenishing solvent tank; 90. Solvent conduit; 91. Connection port. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this utility model. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of this utility model.

[0043] See Figures 1 to 3 The solvent cleaning tank device for a solder paste printer according to this embodiment mainly includes a mounting substrate 10, a support component 20, a liquid level sensor 30, a suction device, and a solvent tube. The mounting substrate 10 is used to mount and fix the support component 20, the liquid level sensor 30, and the suction device. The mounting substrate 10 is a square flat plate, which can be fixed to the side of an existing conventional solder paste printer or directly implemented as the side of the solder paste printer. One surface of the mounting substrate 10 in the thickness direction is specifically the outer surface, i.e.,... Figure 1 The front side (facing the reader) shown is implemented as the mounting surface 11, that is, the support component 20, the liquid level sensor 30, and the suction device are fixed on the mounting surface 11. The support component 20 is fixed to the lower end of one side of the mounting surface 11, that is, as shown... Figure 1The lower right end and upper surface of the shown part have a fixing part for fixing the cleaning solvent tank 70, that is, the support part 20 is used to fix the cleaning solvent tank 70. The liquid level sensor 30 is located at the upper end of the mounting surface 11 and above the fixing part. The liquid level sensor 30 in this embodiment is preferably a conventional liquid level sensor 30 available on the market, such as the KEYENCE Guided Pulse Liquid Level Sensor 30FL series. Specifically, the liquid level sensor 30 in this embodiment includes a sensing part 31, which is equivalent to the probe of the KEYENCE Guided Pulse Liquid Level Sensor 30FL series. An amplifier is also provided above the sensing part 31 (to amplify, adjust the signal, and improve the signal-to-noise ratio to make the detection more accurate; specific details are not described or limited, as this is prior art). The sensor unit 31 is electrically connected to the controller (not shown, but optionally mounted on the solder paste printer; it can be the main controller of the solder paste printer or a separate controller for the cleaning solvent tank 70; it is a conventional PLC controller, and its specific working principle and control circuit are not described or limited, but are easily understood and implemented by those skilled in the art, and are not the innovation of this utility model). In use, the sensor is inserted entirely into the cleaning solvent tank 70 and submerged to the bottom, thereby enabling real-time detection of the solvent level in the tank. Based on the detected levels, the amount of solvent consumed and the remaining solvent in the tank can be calculated. A threshold for reminding the user to replenish or replace solvent, i.e., a preset replenishment level, can be pre-set in the controller's program. When the level sensor 30 detects that the level has reached this threshold, it sends a signal to the controller, which then automatically replenishes the solvent to solve the problem in the prior art where manual replenishment is required when the cleaning solvent is insufficient. The controller's control program and circuit are not the innovation of this utility model and belong to the prior art. The suction device is disposed on the mounting surface 11 of the mounting base plate 10 and located on one side of the support member 20, i.e. Figure 1As shown on the left, the suction device is adapted to extract solvent from the cleaning solvent tank 70 and spray it onto the steel mesh through the nozzle when cleaning is required. Simultaneously, when the liquid level in the cleaning solvent tank 70 falls below a preset threshold and requires replenishment, solvent is extracted from the replenishment solvent tank 80 and added to the cleaning solvent tank 70. The solvent pipe connects the suction device, the cleaning solvent tank 70, the nozzle, and the replenishment solvent tank 80. In other words, the cleaning solvent tank 70 device of this invention has two operating states: one is the operating state during cleaning, and the other is the replenishment state for adding solvent. Specifically, during cleaning, the pipeline between the cleaning solvent tank 70, the suction device, and the nozzle is connected, while the pipeline between the cleaning solvent tank 70, the suction device, and the replenishment solvent tank 80 is closed. When the liquid level sensor 30 detects that the liquid level in the cleaning solvent tank 70 is below a preset height and requires replenishment, the pipeline between the cleaning solvent tank 70, the suction device, and the nozzle is closed, while the pipeline between the cleaning solvent tank 70, the suction device, and the replenishment solvent tank 80 is connected. The solvent cleaning tank device for solder paste printers according to this utility model is connected to the solder paste printer via a mounting base 10. A support component 20 is provided on the mounting base 10 to fix the solvent cleaning tank 70. A linear liquid level sensor 30 is used to detect the liquid level of the solvent in the tank in real time. When the detected liquid level reaches the set liquid level height, i.e., the preset liquid level, the solvent cleaning is automatically replenished online. This solves the problems of cumbersome operation, low work efficiency, and production loss caused by the need to interrupt the cleaning operation for manual replenishment in the prior art.

[0044] Preferably, such as Figures 1 to 3As shown, the solder paste printing machine cleaning solvent tank 70 device of this embodiment further includes a lifting device 40. The lifting device 40 is vertically and slidably disposed on the mounting surface 11 relative to the mounting base 10 and located above the fixing portion of the support member 20. The liquid level sensor 30 is mounted on the lifting device 40 and thus vertically moves up and down under the lifting drive of the lifting device 40. The sensing unit 31 has a first position where it descends and is submerged in the bottom of the cleaning solvent tank 70, and a second position where it rises and is located outside the top of the cleaning solvent tank 70. In other words, the liquid level sensor 30 can be switched between a first position and a second position by the lifting device 40. When the liquid level sensor 30 is in the first position, it can detect the liquid level of the solvent in the cleaning solvent tank 70 in real time. In the second position, the sensing part 31 of the liquid level sensor 30 leaves the cleaning solvent tank 70. At this time, the cleaning solvent tank 70 can be removed from the resting part 20 manually or by automated equipment such as a robotic arm, or a new cleaning solvent tank 70 filled with cleaning solvent can be placed on the fixing part of the resting part 20. This realizes the replacement of the cleaning solvent tank 70, which solves the problem that the cleaning solvent tank 70 may have impurities remaining in the cleaning solvent tank 70 due to prolonged use or that the cleaning solvent tank 70 may be damaged and need to be replaced. There is no need to disassemble the liquid level sensor 30; it is only necessary to lift the liquid level sensor 30 away from the cleaning solvent tank 70.

[0045] More specifically, such as Figure 2 and Figure 3 As shown, the lifting device 40 of this embodiment includes a lifting slide rail 41, a lifting slider 42, a fixing frame 43, and a driving mechanism. The lifting slide rail 41 is vertically fixed to the mounting surface 11 of the mounting base plate 10 and is located above the top of the cleaning solvent tank 70, which is placed and fixed on the support component 20. In this embodiment, the lifting slide rail 41 is a cylindrical slide rail. The lifting slider 42 is a square slider and is slidably mounted on the lifting slide rail 41. One end of the fixing frame 43 is connected and fixed to the lifting slider 42, and the other end extends outward (…). Figure 1The mounting bracket 43 of this embodiment is an inverted L-shaped fixing structure, which also includes a vertical connecting plate 432 that is vertically arranged and integral with the horizontal fixing plate 431. The vertical connecting plate 432 is fixedly connected to the lifting slider 42 by fasteners such as bolts. The liquid level sensor 30 is mounted on the horizontal fixing plate 431, with the sensing part 31 located below the horizontal fixing plate 431 and the amplifier located above the horizontal fixing plate 431. The drive mechanism is mounted on the mounting substrate 10 or on the solder paste printer (in this embodiment, it is mounted on the solder paste printer). The drive end of the drive mechanism is connected to the lifting slider 42. The drive mechanism drives the lifting slider 42 to move up and down along the lifting slide rail 41 and can be fixed at any position on the lifting slide rail 41. In this embodiment, the lifting slider 42 only needs to be positioned at the lowest and highest positions on the lifting slide rail 41. At the highest position, the sensing part 31 of the liquid level sensor 30 is in the second position, and at the lowest position, the sensing part 31 of the liquid level sensor 30 is in the first position. The drive mechanism can be a conventional motor with a control program. That is, the lifting device 40 in this embodiment is preferably a conventional electric slide rail or linear module. The specific structure and working principle are not described or limited here, as they are existing technologies that are easily known and implemented by those skilled in the art. Preferred embodiments, such as... Figure 2 and Figure 3 As shown, on the mounting surface 11 of the mounting base plate 10, on one side of the lifting slide rail 41, that is... Figure 2 The left side also features a vertically extending guide component, which includes a guide plate 44 and a sliding engagement structure. The guide plate 44 is a vertically extending square plate. The sliding engagement structure includes a side of the guide plate 44 facing the lifting rail 41 or the lifting slider 42, i.e.,... Figure 2 The right side or the side of the lifting slider 42 facing the guide plate 44 shown is also as follows Figure 2 The left side shown has a sliding groove on one of the surfaces and a protrusion 45 on the other surface that matches the sliding groove. In this embodiment, the sliding groove is preferably provided on the side of the lifting slider 42 facing the guide plate 44, and the protrusion 45 is provided on the side of the guide plate 44 facing the lifting slider 42. Both the sliding groove and the protrusion 45 extend vertically and slide together.

[0046] The solvent tube (not shown) of this embodiment includes a connecting tube (not shown), an output tube (not shown), and a replenishment tube (not shown). Two suction devices are included, one of which is disposed on the mounting surface 11 of the mounting substrate 10, i.e., located as shown in the figure. Figure 1On the left side of the mounting surface 11 shown, for ease of distinction, this suction device is described as a first suction pump 51. Another suction device is located on the replenishment solvent tank 80, and similarly, this suction device is described as a second suction pump 52. The first suction pump 51 is configured to extract the cleaning solvent from the cleaning solvent tank 70 and spray it onto the steel mesh via nozzles to clean the steel mesh. The second suction pump 52 is configured to extract the cleaning solvent from the replenishment solvent tank 80 and replenish it to the cleaning solvent tank 70, ensuring sufficient cleaning solvent in the cleaning solvent tank 70. The replenishment solvent tank 80 is preferably a container with a capacity several times or even tens of times that of the cleaning solvent tank 70, which reduces the need for replenishing the cleaning solvent in the replenishment solvent tank 80. Similarly, the replenishment solvent tank 80 also has a liquid level alarm to indicate when to replenish the solvent, which is prior art and will not be described further here. One end of the connecting pipe is connected to the outlet (not shown) of the cleaning solvent tank 70, and the other end is connected to the first suction pump 51. One end of the output pipe is connected to the first suction pump 51, and the other end is connected to the nozzle for cleaning the steel mesh. One end of the replenishment pipe is connected to the replenishment interface 71 of the cleaning solvent tank 70, and the other end is connected to the second suction pump 52. Of course, there is also a pipeline between the second suction pump 52 and the replenishment solvent tank 80, which is described as the replenishment connection pipe for ease of description. That is to say, the pipeline between the cleaning solvent tank 70 and the nozzle includes the output pipe, the first suction pump 51, and the connecting pipe, and the pipeline between the replenishment solvent tank 80 and the cleaning solvent tank 70 includes the replenishment pipe, the second suction pump 52, and the replenishment connection pipe. During cleaning operations, the connecting pipe, the first suction pump 51, and the output pipe are connected, while the pipe between the second suction pump 52 and the replenishment pipe is closed. When the level sensor 30 detects that the level of the cleaning solvent in the cleaning solvent tank 70 is lower than a preset height and requires replenishment, the connecting pipe, the first suction pump 51, and the output pipe are closed, while the pipe between the second suction pump 52 and the replenishment pipe is connected. Preferably, a valve 60 is provided on the pipe between the first suction pump 51 and the nozzle, and a valve 60 may also be provided on the pipe between the second suction pump 52 and the cleaning solvent tank 70. The valves 60 are used to respectively open and close the pipe between the cleaning solvent tank 70 and the nozzle, and the pipe between the cleaning solvent tank 70 and the replenishment solvent tank 80. Figure 1 Only one valve 60 is shown on the mounting surface 11 of the mounting base 10. This valve 60 is mounted above the first suction pump 51 and located on the pipeline between the first suction pump 51 and the nozzle. The valve 60 is electrically connected to the controller and is controlled by the valve 60. As an alternative embodiment, the valve 60 may be omitted, and the first suction pump 51 and the second suction pump 52 may be existing water pumps with valve 60.

[0047] Preferred embodiments, in the embodiments of this utility model, such as Figure 2 and Figure 3As shown, a sensing part 31 of the liquid level sensor 30 is also provided on the horizontal fixed plate 431, which is parallel to and spaced apart from the sensing part 31 of the liquid level sensor 30 (e.g., Figure 1 The solvent conduit 90, which is a hollow, vertically extending tube (as shown in the diagram, arranged in parallel intervals), is submerged at the bottom of the cleaning solvent tank 70 in the first position and located outside the top of the cleaning solvent tank 70 in the second position, similar to the sensing unit 31. This design reduces the length of the connecting tube. The connecting tube can be a flexible tube, while the solvent conduit 90 is a rigid tube. A connection port 91 for connecting the connecting tube is provided at the top of the solvent conduit 90. During installation, only one end of the connecting tube needs to be connected and fixed to the connection port 91 of the solvent conduit 90.

[0048] like Figure 1 As shown, a clearance through hole 12 is also formed on the mounting substrate 10. The clearance through hole 12 is located at the upper end of the mounting substrate 10, specifically above the valve 60, and is used to allow the output pipe to pass through the mounting substrate 10 and connect to the nozzle inside the solder paste printer. For example, the clearance through hole 12 is a square hole.

[0049] like Figures 1 to 3 As shown, the shelf component 20 is a square container structure with an open top. Specifically, the shelf component 20 includes a square, horizontally arranged horizontal shelf plate 21 and several side baffles 22 extending vertically upward from the outer periphery of the horizontal shelf plate 21, i.e., the four sides. The horizontal shelf plate 21 and the multiple (four in the example) side baffles 22 enclose and define the fixing part of the shelf component 20. Since a liquid replenishment port 71 protruding outward is provided on the side of the cleaning solvent tank 70, in order to avoid interference between the side baffles 22 and the liquid replenishment port 71, one of the side baffles 22, i.e., Figure 1A U-shaped clearance notch 221 is provided on the right side baffle 22. This notch 221 also serves a positioning function. Since the sensing part 31 of the level sensor 30 and the solvent conduit 90 for connection need to be inserted into the bottom of the cleaning solvent tank 70 during use, when the replaced cleaning solvent tank 70 is placed on the fixing part of the support component 20 and the replenishment port 71 of the cleaning solvent tank 70 is located within the clearance notch 221, the positions of the sensing part 31 of the level sensor 30 and the solvent conduit 90 roughly correspond one-to-one with the two openings at the top of the cleaning solvent tank 70. This can be adjusted slightly manually. It should be noted that the dimensions of the two openings at the top of the cleaning solvent tank 70 are correspondingly larger than the sensing part 31 and the solvent conduit 90. Furthermore, a positioning component such as a photoelectric sensor (not shown) can be provided on the mounting component 20, such as the side baffle 22, to achieve a one-to-one precise correspondence between the sensing part 31 and the solvent conduit 90 and the two openings at the top of the cleaning solvent tank 70. The specific working principle is not limited here, as it is existing technology that can be easily known and implemented by those skilled in the art, and is not the inventive point of this utility model.

[0050] It should be understood that the specific embodiments described above are merely illustrative or explanatory of the principles of this utility model and do not constitute a limitation thereof. Therefore, any modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and scope of this utility model should be included within its protection scope. Furthermore, the appended claims are intended to cover all variations and modifications falling within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. A cleaning solvent tank device for a solder paste printing machine, characterized in that, include: The mounting substrate is fixed to the side panel of the solder paste printer or is implemented as the side panel of the solder paste printer, and one side of the mounting substrate in the thickness direction is implemented as the mounting surface. A support component, which is fixed to the lower end of the mounting surface and has a fixing part formed on its upper surface for fixing the cleaning solvent tank; A liquid level sensor is disposed at the upper end of the mounting surface and above the fixing part. The liquid level sensor includes a sensing part that extends in a straight line in the vertical direction and is electrically connected to the controller. In use, the bottom end of the sensing part is submerged in the bottom of the cleaning solvent tank to detect the liquid level of the solvent in the cleaning solvent tank in real time. A suction device adapted to replenish solvent into the cleaning solvent tank and extract solvent from the cleaning solvent tank, the suction device being electrically connected to the controller; A solvent tube connects the cleaning solvent tank, the suction device, a nozzle that sprays cleaning solvent onto the steel mesh, and a replenishment solvent tank that replenishes the cleaning solvent tank. During the cleaning operation, the pipeline between the cleaning solvent tank, the suction device and the nozzle is connected, while the pipeline between the cleaning solvent tank, the suction device and the replenishment solvent tank is closed. When the liquid level sensor detects that the liquid level in the cleaning solvent tank is lower than the preset height and needs to be replenished, the pipeline between the cleaning solvent tank, the suction device and the nozzle is closed, while the pipeline between the cleaning solvent tank, the suction device and the replenishment solvent tank is connected.

2. The cleaning solvent tank device for a solder paste printing machine according to claim 1, characterized in that, It also includes a lifting device, which is disposed on the mounting surface and located above the supporting component; The sensing unit has a first position where it is lowered and submerged in the bottom of the cleaning solvent tank, and a second position where it is raised and located outside the top of the cleaning solvent tank. The liquid level sensor is installed on the lifting device and is driven by the lifting device to switch between the first position and the second position. When the liquid level sensor is in the first position, it detects the liquid level of the solvent in the cleaning solvent tank in real time.

3. The cleaning solvent tank device for a solder paste printing machine according to claim 2, characterized in that, The lifting device includes: A lifting slide rail is mounted on the mounting surface and extends upward in the vertical direction; A lifting slider is slidably mounted on the lifting slide rail; A fixing frame, one end of which is connected to the lifting slider and the other end extends horizontally outward to form a horizontal fixing plate, wherein the liquid level sensor is mounted on the horizontal fixing plate and the sensing part is located below the horizontal fixing plate; A drive mechanism is provided on the mounting substrate or the solder paste printer. The drive end of the drive mechanism is connected to the lifting slider to drive the lifting slider to move vertically up and down relative to the lifting slide rail.

4. The cleaning solvent tank device for a solder paste printer according to claim 3, characterized in that, The lifting device further includes a guide component, the guide component comprising: A guide plate, which is disposed on the mounting surface and located on one side of the lifting slide rail and extends vertically; The lifting slider and the guide plate are connected by a sliding fit structure to achieve a sliding connection between them.

5. The cleaning solvent tank device for a solder paste printing machine according to claim 4, characterized in that, The sliding fit structure includes a sliding groove on one of the lifting slider and the guide plate, and a protrusion on the other of the lifting slider and the guide plate that matches the sliding groove.

6. The cleaning solvent tank device for a solder paste printer according to claim 3, characterized in that, The solvent tube includes a connecting tube, an output tube, and a replenishment tube; the suction device includes a first suction pump located on the mounting surface and a second suction pump located on the replenishment solvent tank. One end of the connecting tube is adapted to be inserted into the bottom of the cleaning solvent tank, and the other end is connected to the first suction pump. One end of the output pipe is connected to the first suction pump, and the other end is connected to the nozzle; One end of the replenishment tube is connected to the second suction pump, and the other end is connected to the replenishment interface of the cleaning solvent tank; During the cleaning operation, the pipeline between the connecting pipe, the first suction pump and the output pipe is connected and the pipeline between the second suction pump and the replenishment pipe is closed. When the liquid level sensor detects that the liquid level in the cleaning solvent tank is lower than the preset height and solvent needs to be replenished, the pipeline between the connecting pipe, the first suction pump and the output pipe is closed and the pipeline between the second suction pump and the replenishment pipe is connected.

7. The cleaning solvent tank device for a solder paste printer according to claim 6, characterized in that, It also includes valves disposed on the pipeline between the first suction pump and the nozzle and / or on the pipeline between the second suction pump and the cleaning solvent tank, the valves being electrically connected to the controller.

8. The cleaning solvent tank device for a solder paste printer according to claim 6, characterized in that, The horizontal fixing plate is also provided with a solvent conduit that extends vertically downward and is parallel to and spaced apart from the sensing part of the liquid level sensor. One end of the connecting pipe is connected to the upper end of the solvent conduit. In the first position, the bottom end of the solvent conduit is submerged in the bottom of the cleaning solvent tank; in the second position, the bottom end of the solvent conduit is located outside the top of the cleaning solvent tank.

9. The cleaning solvent tank device for a solder paste printing machine according to claim 7, characterized in that, An obstacle clearance hole is also provided on the mounting surface for the output pipe to pass through.

10. The cleaning solvent tank device for a solder paste printer according to claim 1, characterized in that, The mounting component includes a horizontal mounting plate and several side baffles extending vertically upward from the outer periphery of the horizontal mounting plate, one of which has a clearance notch to avoid the liquid replenishment port of the cleaning solvent tank.