Metal ion electro-physical cleaning device

CN224662986UActive Publication Date: 2026-08-21ZHEJIANG MODING MASCH CO LTD
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Patent Information

Application Number
CN202521764481.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-19
Publication Date
2026-08-21
Estimated Expiration
2035-08-19

AI Technical Summary

Technical Problem

[0003]在现有的磁控溅射清洗装置中,当采用等离子体对基板进行清洗并同时引入金属离子源和氩气进行辅助清洗或表面改性时,通常需要通入氩气等惰性气体,氩气通过一根进气管通入真空室内,而这种设计存在显著的局限性:首先,由于氩气仅从一个位置进入真空腔体,气体分布往往不均匀,导致部分区域的等离子体密度较低,无法有效覆盖整个靶材与基板之间的空间,其次,这种不均匀的气体分布会导致局部区域的清洗效果不佳,某些区域可能得不到充分的离子轰击清洗,从而影响基板表面的清洁度和一致性,此外,不均匀的等离子体密度还可能导致沉积膜层厚度不均、附着力差等问题,最终影响后续镀膜工艺的质量和性能,这些问题不仅限制了设备的整体效率,还可能导致产品批次间的质量波动,增加了生产成本和时间消耗,因此,优化氩气的引入方式,确保其均匀分布在靶材与基板之间,是提高清洗质量和镀膜一致性的关键所在

Benefits of technology

[0013]1、实现惰性气体的均匀分布,提升等离子体清洗效率:在传统磁控溅射清洗装置中,氩气等惰性气体通常通过单一进气管通入真空腔体,导致气体分布不均,无法有效覆盖整个靶材与基片之间的空间,本方案通过设置分流组件,使惰性气体在进入真空腔体后能够均匀分散,并通过多个气孔定向喷向靶材与基片之间的关键区域,确保清洗气体充分覆盖整个清洗空间,从而提升清洗效率和均匀性,也为金属离子的引出、传输和轰击提供了更理想的环境;

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Abstract

The utility model relates to the technical field of electric physical cleaning, and disclose metal ion electric physical cleaning device, including vacuum box, the inside of vacuum box is equipped with a plurality of cylindrical target material, the inner bottom surface of vacuum box is equipped with the substrate frame, be equipped with the air inlet pipe for going in inert gas on the vacuum box, the top of vacuum box is fixed with the support, the top of air inlet pipe passes through the support, and air inlet pipe outer wall is fixed with the support, the inside of vacuum box is equipped with the shunt component, the shunt component is connected with the air inlet pipe and is arranged. This scheme is through setting up gas shunt and dynamic distribution structure, effectively solved the traditional magnetron sputtering cleaning uneven gas distribution, cleaning effect is unstable, cleaning and deposition consistency difference key problem, not only has promoted the cleaning efficiency and the subsequent coating quality, but also strengthened the stability and adaptability of equipment, has the significant technical advantage and the application prospect.
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Description

Technical Field

[0001] This utility model relates to the field of electrophysical cleaning technology, and in particular to a metal ion electrophysical cleaning device. Background Technology

[0002] Before magnetron sputtering coating, the substrate surface usually needs to be pretreated to ensure high-quality film adhesion. Common pretreatment methods include plasma cleaning and ion bombardment cleaning. In the case of ion implantation cleaning, metal ion sources such as aluminum, chromium, and titanium are used to bombard the substrate surface, which can not only clean the surface but also change the surface composition and improve the adhesion of subsequent film layers.

[0003] In existing magnetron sputtering cleaning equipment, when plasma is used to clean the substrate and metal ion source and argon are introduced simultaneously for auxiliary cleaning or surface modification, inert gases such as argon are usually introduced. Argon is introduced into the vacuum chamber through an inlet pipe. However, this design has significant limitations: First, since argon enters the vacuum chamber from only one location, the gas distribution is often uneven, resulting in low plasma density in some areas, which cannot effectively cover the entire space between the target and the substrate. Second, this uneven gas distribution leads to poor cleaning in some areas, and some areas may not receive sufficient ion bombardment cleaning, thus affecting the cleanliness and consistency of the substrate surface. In addition, uneven plasma density may also lead to uneven deposition film thickness and poor adhesion, ultimately affecting the quality and performance of subsequent coating processes. These problems not only limit the overall efficiency of the equipment but may also lead to quality fluctuations between product batches, increasing production costs and time consumption. Therefore, optimizing the introduction method of argon to ensure its uniform distribution between the target and the substrate is the key to improving cleaning quality and coating consistency. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a metal ion electrophysical cleaning device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A metal ion electrophysical cleaning device includes a vacuum chamber, with several cylindrical targets arranged inside the vacuum chamber. A substrate holder is provided on the inner bottom surface of the vacuum chamber. An inlet pipe for introducing inert gas is provided on the vacuum chamber. A bracket is fixed on the top of the vacuum chamber. The top end of the inlet pipe passes through the bracket, and the outer wall of the inlet pipe is fixed to the bracket. A flow splitting assembly is provided inside the vacuum chamber, and the flow splitting assembly is connected to the inlet pipe.

[0007] As a preferred technical solution of this utility model, the flow splitting component includes a disk disposed on the top surface of the vacuum chamber, the disk having a cavity inside, a plurality of air holes being opened at the bottom of the disk and communicating with the cavity, a slot being opened on the upper surface of the disk, the bottom end of the air inlet pipe extending into the interior of the slot, and a rotary joint being provided at the bottom end of the air inlet pipe, a plurality of telescopic tubes being connected to the rotary joint and communicating with the cavity.

[0008] As a preferred embodiment of this utility model, the diversion assembly further includes a movable component, which includes a sleeve disposed on the top of the vacuum chamber. The bottom end of the sleeve extends into the interior of the vacuum chamber and is rotatably connected to the vacuum chamber. The upper surface of the disc is provided with a sliding groove, which is connected to a slot. The bottom end of the sleeve is slidably connected in the sliding groove, and several springs are provided between the outer side of the sleeve and the inner side of the sliding groove. The interior of the sleeve is connected to the slot, and the air inlet pipe is located inside the sleeve. A motor is fixed on the bracket, and gears are fixedly sleeved on both the sleeve and the output shaft of the motor. The two gears mesh with each other. Several protrusions are fixed on the inner side of the vacuum chamber, and a pressing block is fixed on the side wall of the disc.

[0009] As a preferred embodiment of this utility model, the protrusion has a hemispherical structure and the extrusion block has a spherical structure.

[0010] As a preferred embodiment of this utility model, the longitudinal section of the slide groove is an inverted T-shaped structure, and the bottom end of the sleeve is adapted to the slide groove.

[0011] As a preferred embodiment of this invention, the cross-section of the cavity is annular.

[0012] This utility model has the following beneficial effects:

[0013] 1. Achieving uniform distribution of inert gas and improving plasma cleaning efficiency: In traditional magnetron sputtering cleaning devices, inert gases such as argon are usually introduced into the vacuum chamber through a single inlet pipe, resulting in uneven gas distribution and failure to effectively cover the entire space between the target and the substrate. This solution sets up a flow distribution component to ensure that the inert gas can be evenly dispersed after entering the vacuum chamber and sprayed directionally to the key area between the target and the substrate through multiple gas holes, ensuring that the cleaning gas fully covers the entire cleaning space, thereby improving cleaning efficiency and uniformity, and providing a more ideal environment for the extraction, transport and bombardment of metal ions;

[0014] 2. Improve gas flow efficiency between the target and the substrate, and enhance cleaning and deposition consistency: In traditional devices, gas enters only from a fixed position, resulting in poor gas flow in some areas, affecting plasma density and ion bombardment intensity. This solution uses a combination of disk rotation and pore movement structure, which enables gas to be evenly distributed. During disk rotation, the pores are periodically displaced through a linkage mechanism with bumps and extrusion blocks, thereby achieving dynamic and uniform gas distribution in the space between the target and the substrate. This structural design greatly improves the gas flow efficiency in key areas, which helps to enhance cleaning uniformity and film deposition consistency.

[0015] 3. Improve production efficiency and reduce batch-to-batch quality fluctuations: In traditional equipment, uneven gas distribution leads to inconsistent cleaning and deposition processes, often resulting in quality differences between product batches, affecting yield and production efficiency. This solution optimizes the gas distribution structure to achieve high uniformity and repeatability of the cleaning and deposition processes, thereby significantly reducing performance differences between different batches, improving product consistency, and enhancing overall production efficiency and process stability. Attached Figure Description

[0016] Figure 1 This is a three-dimensional cross-sectional view of the interior of the metal ion electrophysical cleaning device proposed in this utility model.

[0017] Figure 2 for Figure 1 Enlarged view of the structure at point A;

[0018] Figure 3 This is a schematic diagram of the disk structure;

[0019] Figure 4 for Figure 3 Enlarged view of the structure at point B.

[0020] In the diagram: 1 Vacuum chamber, 2 Target material, 3 Substrate holder, 4 Inlet pipe, 5 Support, 6 Disc, 7 Cavity, 8 Air hole, 9 Telescopic tube, 10 Rotary joint, 11 Slot, 12 Sleeve, 13 Motor, 14 Gear, 15 Spring, 16 Slide groove, 17 Protrusion, 18 Extrusion block. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Reference Figures 1-4The metal ion electrophysical cleaning device includes a vacuum chamber 1. Several cylindrical targets 2 are arranged inside the vacuum chamber 1. A substrate holder 3 is provided on the inner bottom surface of the vacuum chamber 1. An inlet pipe 4 for introducing inert gas is provided on the vacuum chamber 1. A support 5 is fixed to the top of the vacuum chamber 1. The top end of the inlet pipe 4 passes through the support 5, and the outer wall of the inlet pipe 4 is fixed to the support 5. A gas tank for storing inert gas is connected to the outside of the inlet pipe 4. A flow distribution assembly is provided inside the vacuum chamber 1, and the flow distribution assembly is connected to the inlet pipe 4. Specifically, the flow distribution assembly includes a disk 6 disposed on the inner top surface of the vacuum chamber 1. The disk 6 has a cavity 7 inside, and the cross-section of the cavity 7 is annular. The bottom of the disc 6 has several air holes 8, which are connected to the cavity 7. The positions of the air holes 8 correspond to those of the target material 2 and the substrate holder 3. The upper surface of the disc 6 has a slot 11. The bottom end of the air inlet pipe 4 extends into the slot 11, and the bottom end of the air inlet pipe 4 is provided with a rotary joint 10. Several telescopic pipes 9 are connected to the rotary joint 10. Under the connection of the rotary joint 10, the air inlet pipe 4 can always be connected to the telescopic pipes 9 during the rotation of the disc 6. The telescopic pipes 9 are connected to the cavity 7. Through this design, the inert gas in the air inlet pipe 4 can be dispersed and flow evenly between the target material 2 and the substrate holder 3 through the air holes 8.

[0023] Furthermore, the diversion assembly also includes a movable component, which includes a sleeve 12 disposed on the top of the vacuum chamber 1. The bottom end of the sleeve 12 extends into the interior of the vacuum chamber 1 and is rotatably connected to the vacuum chamber 1. The upper surface of the disc 6 is provided with a groove 16, which is connected to the slot 11. The bottom end of the sleeve 12 is slidably connected in the groove 16, and the bottom sidewall of the sleeve 12 is in contact with and slidably connected to the inner side of the groove 16. The longitudinal section of the groove 16 is an inverted T-shaped structure. The bottom end of the sleeve 12 is adapted to the groove 16, which can prevent the sleeve 12 from detaching from the groove 16, ensuring the stability of the device structure, and at the same time limiting the disc 6, so that the rotation of the sleeve 12 can drive the disc 6 to rotate. The outer side of the sleeve 12 and the inner side of the groove 16 are connected together. The device is equipped with several springs 15. The inside of the sleeve 12 is connected to the slot 11, and the air inlet pipe 4 is located inside the sleeve 12. A motor 13 is fixed on the bracket 5. Gears 14 are fixedly mounted on the output shafts of both the sleeve 12 and the motor 13. The two gears 14 mesh with each other. Several protrusions 17 are fixed on the inner side of the vacuum box 1. A pressing block 18 is fixed on the side wall of the disc 6. The protrusions 17 are hemispherical and the pressing block 18 is spherical. The protrusions 17 are equidistant from each other in the circumference. The pressing block 18 and the slide 16 are on the same diameter of the disc 6. When the pressing block 18 is pressed by the protrusions 17, the disc 6 will move, causing the sleeve 12 and the slide 16 to move relative to each other. It is worth mentioning that during this process, the inner wall of the slot 11 is never in contact with the air inlet pipe 4.

[0024] The specific working principle of this utility model is as follows:

[0025] Inert gas enters the telescopic tube 9 through the inlet pipe 4, and then is split through the cavity 7 and the vent 8 before being sprayed between the target material 2 and the substrate holder 3. Simultaneously, the motor 13 is started, and under the transmission action of the gear 14, the sleeve 12 rotates. Under the limiting action of the slide groove 16 and the bottom end of the sleeve 12, the disc 6, the telescopic tube 9, and the vent 8 all move in the same direction as the sleeve 12. With the connection of the rotary joint 10, the inert gas can always maintain normal communication. At the same time, during the rotation of the disc 6, the extrusion block 18 also undergoes... When the extrusion block 18 rotates and comes into contact with the protrusion 17, it will be squeezed, causing the disc 6 and the air hole 8 to move together, and the sleeve 12 and the slide groove 16 to move relative to each other. Conversely, when the extrusion block 18 and the protrusion 17 are not in contact, the disc 6 and the slide groove 16 will return to their original positions under the elastic action of the spring 15. Thus, under this design, the disc 6 and the air hole 8 on it can rotate and move at the same time, which allows the inert gas to flow evenly and fully between the target material 2 and the substrate holder 3, ensuring the uniformity and quality of ionization and subsequent coating.

[0026] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A metal ion electrophysical cleaning device, comprising a vacuum chamber (1), wherein a plurality of cylindrical targets (2) are provided on the inner side of the vacuum chamber (1), and a substrate holder (3) is provided on the inner bottom surface of the vacuum chamber (1), characterized in that, The vacuum chamber (1) is provided with an inlet pipe (4) for introducing inert gas. A bracket (5) is fixed on the top of the vacuum chamber (1). The top end of the inlet pipe (4) passes through the bracket (5), and the outer wall of the inlet pipe (4) is fixed to the bracket (5). A flow divider is provided inside the vacuum chamber (1), and the flow divider is connected to the inlet pipe (4).

2. The metal ion electrophysical cleaning device according to claim 1, characterized in that, The diversion assembly includes a disc (6) disposed on the top surface of the vacuum chamber (1). The disc (6) has a cavity (7) inside. The bottom of the disc (6) has several air holes (8) connected to the cavity (7). The upper surface of the disc (6) has a slot (11). The bottom end of the air inlet pipe (4) extends into the inside of the slot (11). The bottom end of the air inlet pipe (4) has a rotary joint (10). The rotary joint (10) is connected to several telescopic pipes (9). The telescopic pipes (9) are connected to the cavity (7).

3. The metal ion electrophysical cleaning device according to claim 2, characterized in that, The diversion assembly also includes a movable component, which includes a sleeve (12) disposed on the top of the vacuum chamber (1). The bottom end of the sleeve (12) extends into the interior of the vacuum chamber (1), and the sleeve (12) is rotatably connected to the vacuum chamber (1). The upper surface of the disc (6) is provided with a sliding groove (16), and the sliding groove (16) is connected to the slot (11). The bottom end of the sleeve (12) is slidably connected in the sliding groove (16), and the outer side of the sleeve (12) is flush with the inner side of the sliding groove (16). Several springs (15) are provided in the space. The inside of the sleeve (12) is connected to the slot (11), and the air inlet pipe (4) is located inside the sleeve (12). A motor (13) is fixed on the bracket (5). Gears (14) are fixedly sleeved on the output shafts of the sleeve (12) and the motor (13). The two gears (14) mesh with each other. Several protrusions (17) are fixed on the inner side of the vacuum box (1), and a pressing block (18) is fixed on the side wall of the disc (6).

4. The metal ion electrophysical cleaning device according to claim 3, characterized in that, The protrusion (17) has a hemispherical structure, and the extrusion block (18) has a spherical structure.

5. The metal ion electrophysical cleaning device according to claim 3, characterized in that, The longitudinal section of the groove (16) is an inverted T-shaped structure, and the bottom end of the sleeve (12) is adapted to the groove (16).

6. The metal ion electrophysical cleaning device according to claim 2, characterized in that, The cross-section of the cavity (7) is annular.