A baffle device for an evaporation process of indium

Abstract

The utility model discloses a baffle device for resistance evaporation coating film indium evaporation process, including rotating mechanism, rotating mechanism is connected with power mechanism, and one side of rotating mechanism is connected with connecting rod, and one side of connecting rod is fixed with indium evaporation baffle, indium evaporation baffle includes curved surface cover, and the edge below curved surface cover is equipped with the circular ring inner recess that surrounds the periphery of curved surface cover, and the outer side of circular ring inner recess is equipped with the flow guide hole, power mechanism can drive rotating mechanism rotation, and corresponding drive indium evaporation baffle switches to open station and close station through rotation, when locating close station, indium evaporation baffle is located in the above of indium evaporation source of resistance evaporation coating film equipment, and the indium liquid of splashing and the indium steam of evaporation can flow from the curved surface cover of indium evaporation baffle to circular ring inner recess, when locating open station, indium evaporation baffle is not located in the above of indium evaporation source of resistance evaporation coating film equipment, and the device avoids the indium evaporation source of dripping pollution in the process, improves the purity of coating layer, and is easy to maintain.

Description

Technical Field

[0001] This utility model relates to the field of vacuum evaporation coating equipment technology, and particularly to resistance evaporation coating equipment, and more specifically, to a baffle device for the indium evaporation process of resistance evaporation coating. Background Technology

[0002] In thin film preparation or materials science research, resistance evaporation coating processes often employ specific materials, such as indium evaporation. Due to the low melting point of indium, the molten indium droplets are prone to splashing during indium evaporation, contaminating the substrate. Therefore, a baffle is typically designed above the indium evaporation source in such equipment. In existing technologies, this baffle is generally designed as a flat circular plate or a circular flat cover, mounted above the indium evaporation source via a mounting rod. The baffle is opened and closed by a drive mechanism. When not in the indium evaporation process, it blocks splashed indium droplets and indium vapor that has not met the evaporation conditions. The baffle also isolates indium vapor after the indium evaporation process is complete. However, these splashes and indium vapor condense at the baffle edge, forming indium nodules. During subsequent indium evaporation processes, these nodules periodically fall off, contaminating the indium evaporation source, and are difficult to clean completely. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention provides a baffle device for the indium evaporation process in resistive evaporation coating. During the indium evaporation process, it effectively isolates and blocks splashes and indium vapor that has not met the required evaporation conditions. It also isolates indium vapor after the evaporation process is complete. Furthermore, through structural design, it prevents the formation of indium nodules at the edges of the baffle after condensation, thus avoiding the periodic falling of these nodules and contamination of the indium evaporation source during subsequent evaporation processes.

[0004] The complete technical solution of this utility model includes:

[0005] A baffle device for resistive evaporation coating indium evaporation process includes a rotating mechanism connected to a power mechanism, the power mechanism providing power for the rotating mechanism to rotate, a connecting rod connected to one side of the rotating mechanism, and an indium evaporation baffle fixed to one side of the connecting rod.

[0006] The indium evaporation baffle includes a curved cover plate; the lower edge of the curved cover plate is provided with an annular inner groove surrounding the curved cover plate, and a guide hole is provided on the outer side of the annular inner groove.

[0007] The power mechanism can drive the rotating mechanism to rotate, and correspondingly drive the indium evaporation baffle to switch between the open and closed positions by rotation. When in the closed position, the indium evaporation baffle is located above the indium evaporation source of the resistance evaporation coating equipment, and the splashed indium liquid and evaporated indium vapor can flow from the curved cover plate of the indium evaporation baffle into the inner groove of the ring. When in the open position, the indium evaporation baffle is not located above the indium evaporation source of the resistance evaporation coating equipment.

[0008] Furthermore, the baffle device of the indium evaporation process for resistive evaporation coating is maintained by removing the indium evaporation baffle, positioning the guide hole downwards, and heating the baffle. After being heated, the indium melts and flows out from the guide hole along the inner groove of the ring.

[0009] Furthermore, the inner and outer surfaces of the curved cover plate are surface-treated using a high-polishing process.

[0010] Furthermore, the power mechanism is a power cylinder.

[0011] Furthermore, the inner groove of the annulus is a U-shaped inner groove of the annulus.

[0012] Furthermore, the size of the indium evaporation baffle is determined according to the size of the indium evaporation source.

[0013] Furthermore, the guide hole is a circular hole.

[0014] Furthermore, a connecting block is provided at the top center of the curved cover plate. The connecting block has a connecting hole for the connecting rod to pass through, and a fastening threaded hole is provided at the top of the connecting block. The connecting rod passes through the connecting hole, and the fastening screw is screwed into the fastening threaded hole, thereby fixing the indium vapor baffle to the connecting rod.

[0015] Furthermore, the edges of the curved cover plate and the outer edges of the U-shaped circular groove are connected by welding.

[0016] Furthermore, the surfaces of the curved cover plate edges and the outer edges of the U-shaped circular groove after welding are ground and highly polished.

[0017] The advantages of this utility model over the prior art are as follows:

[0018] 1. Optimize the structural design so that splashed indium liquid or condensed indium vapor can flow into the groove of the baffle during the indium evaporation process, avoiding the formation of indium nodules on the baffle surface and their dripping and contamination of the indium evaporation source in subsequent processes, which would result in impure substrate coating and affect the quality of the substrate coating.

[0019] 2. Indium has a melting point of 156℃ and requires regular maintenance. The baffle designed in this invention can be positioned so that the baffle guide hole is facing downwards. It can be heated using an oven or electric melting gun. After the indium is melted at high temperature, it is discharged from the guide hole along the inner groove, thus achieving the purpose of easy maintenance. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. The features and advantages of this utility model will be more clearly understood by referring to the drawings. The drawings are schematic and should not be construed as limiting this utility model in any way. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] in:

[0022] Figure 1 This is a schematic diagram of the overall indium evaporation baffle device of this utility model.

[0023] Figure 2 This is a schematic diagram of the baffle shape.

[0024] In the figure, 1-rotating mechanism, 2-power cylinder, 3-connecting rod, 4-fastening screw, 5-indium vapor baffle, 6-curved cover plate, 7-U-shaped annular groove, 8-guide hole, 9-connecting hole, 10-fastening threaded hole, 11-central guide section, 12-transition buffer section, 13-groove connection section. Detailed Implementation

[0025] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments of this utility model and the features thereof can be combined with each other.

[0026] like Figures 1-2 As shown, a baffle device for resistive evaporation coating indium evaporation process includes a rotating mechanism 1, a power cylinder 2 connected to the rotating mechanism, the power cylinder 2 providing power for the rotating mechanism to rotate, a connecting rod 3 connected to one side of the rotating mechanism, and an indium evaporation baffle 5 fixed to one side of the connecting rod 3 by fastening screws 4.

[0027] The dimensions of the indium evaporation baffle 5 are designed according to the size of the evaporation source. The evaporation source baffle structure includes a curved cover plate 6, with a U-shaped annular groove 7 below the curved cover plate 6. A guide hole 8 is provided on the outer side of the U-shaped annular groove 7. A cylindrical connecting block is provided at the top center of the curved cover plate 6. The two are fixed together by welding. A circular connecting hole 9 is opened on the connecting block for the connecting rod 3 to pass through, and a fastening threaded hole 10 is opened at the top to mate with the fastening screw 4. The connecting rod passes through the connecting hole, and the hexagonal socket fastening screw is screwed into the fastening threaded hole, thereby fixing the indium evaporation baffle to the connecting rod.

[0028] The inner and outer surfaces of the curved cover plate are treated with a high-polishing process.

[0029] The size of the U-shaped inner groove is based on the design of the curved cover plate. Finally, the edge of the curved cover plate and the outer edge of the U-shaped inner groove are connected by welding. The surface after welding is then ground and highly polished.

[0030] The guide hole designed on the outer side of the U-shaped ring inner groove is a round hole, which is used for later maintenance to remove indium solution.

[0031] During operation, activating the power cylinder rotates the indium evaporation baffle, switching between the open and closed positions. In the open position, the indium evaporation baffle is not positioned above the evaporation source; in the closed position, it is positioned directly above the evaporation source. This design allows splashed liquid indium and evaporated indium vapor to flow smoothly from the curved cover of the indium evaporation baffle into the U-shaped annular groove during repeated use of the resistance evaporation coating process. This prevents indium vapor from condensing and forming indium nodules that could fall into the indium evaporation source below and contaminate it, thus ensuring the purity of the indium-plated substrate film.

[0032] Furthermore, to facilitate the flow of condensed indium into the U-shaped annular groove without occupying excessive space, the shape of the curved cover plate is further optimized. This includes dividing the curved surface of the cover plate into a central guide section 11, a transition buffer section 12, and a groove connection section 13. The central guide section receives the condensed indium in the central area, providing a stable initial slope to guide the indium to flow outwards with uniform curvature. The transition buffer section connects the central section and the groove section, achieving a transition from a gentle downward slope to a flat slope, avoiding abrupt changes in indium flow, and the curved surface is "concave then flat" to prevent indium accumulation at the transition point. The groove connection section "accelerates the introduction" of indium from the transition section into the annular groove, ensuring no residue, with a gradually steepening downward slope. The curvature of the central guide section remains constant, gradually increasing from the center to the end of the section. The curvature of the groove connection section remains constant, but its curvature value is greater than that of the central guide section.

[0033] Meanwhile, the baffle device of the indium evaporation process for resistive evaporation coating can be maintained regularly. During maintenance, the indium evaporation baffle is removed, the indium evaporation baffle guide hole is facing down, and the baffle is heated with an oven or electric melting gun. After the indium is melted at high temperature, it is discharged from the guide hole along the inner groove, which is easy to maintain.

[0034] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A baffle device for a resistive evaporation coating process for indium deposition, characterized in that, It includes a rotating mechanism, which is connected to a power mechanism that provides power for the rotating mechanism to rotate. A connecting rod is connected to one side of the rotating mechanism, and an indium evaporation baffle is fixed to one side of the connecting rod. The indium evaporation baffle includes a curved cover plate; the lower edge of the curved cover plate is provided with an annular inner groove surrounding the curved cover plate, and a guide hole is provided on the outer side of the annular inner groove. The power mechanism can drive the rotating mechanism to rotate, and correspondingly drive the indium evaporation baffle to switch between the open and closed positions by rotation. When in the closed position, the indium evaporation baffle is located above the indium evaporation source of the resistance evaporation coating equipment, and the splashed indium liquid and evaporated indium vapor can flow from the curved cover plate of the indium evaporation baffle into the inner groove of the ring. When in the open position, the indium evaporation baffle is not located above the indium evaporation source of the resistance evaporation coating equipment.

2. The baffle device for indium evaporation process in resistive evaporation coating according to claim 1, characterized in that, When maintaining the baffle device of the indium evaporation process for resistive evaporation coating, remove the indium evaporation baffle, position the guide hole downwards, and heat the baffle. After being heated, the indium melts and flows out from the guide hole along the inner groove of the ring.

3. A baffle device for resistive evaporation deposition of indium as described in claim 2, characterized in that, The inner and outer surfaces of the curved cover plate are treated with a high-polishing process.

4. A baffle device for resistive evaporation deposition of indium as described in claim 3, characterized in that, The power mechanism is a power cylinder.

5. A baffle device for resistive evaporation coating indium evaporation process according to claim 4, characterized in that, The inner groove of the annulus is a U-shaped inner groove.

6. A baffle device for an indium evaporation process for resistive evaporation coating according to claim 5, characterized in that, The size of the indium evaporation baffle is determined according to the size of the indium evaporation source.

7. A baffle device for resistive evaporation deposition of indium as described in claim 6, characterized in that, The guide hole is a circular hole.

8. A baffle device for an indium evaporation process for resistive evaporation coating according to claim 7, characterized in that, A connecting block is provided at the top center of the curved cover plate. The connecting block has a connecting hole for the connecting rod to pass through, and a fastening threaded hole is provided at the top of the connecting block. The connecting rod passes through the connecting hole, and the fastening screw is screwed into the fastening threaded hole, thereby fixing the indium evaporation baffle to the connecting rod.

9. A baffle device for resistive evaporation deposition of indium according to claim 8, characterized in that, The edges of the curved cover plate and the outer edge of the U-shaped inner groove are connected by welding. The surfaces of the curved cover plate and the outer edge of the U-shaped inner groove after welding are then ground and highly polished.

10. A baffle device for an indium evaporation process for resistive evaporation coating according to claim 9, characterized in that, The curved cover plate, extending from the center towards the U-shaped annular groove, includes a central guide section, a transition buffer section, and a groove connection section.

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