Lighting panel and backlight module

Abstract

The application provides a lamp panel and a backlight module. The lamp panel comprises a first circuit board, a light-emitting unit arranged on the first circuit board, a connector arranged on a side of the first circuit board away from the light-emitting unit, and a second circuit board, one end of the second circuit board being electrically connected to the light-emitting unit and the other end being electrically connected to the connector after being bent. The lamp panel can maintain electrical connection and ensure the uniformity of light emission.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a lamp panel and a backlight module. Background Technology

[0002] In the current display technology field, the application of circuit boards in lamp boards presents the following situation: when using a relatively low-cost single-sided circuit board as the lamp board in a backlight solution, slots are usually required on the lamp board to accommodate connectors in order to meet circuit connection requirements.

[0003] However, with the continuous development of backlight technology, the number of LEDs (Light Emitting Diodes) is increasing, while the spacing between LEDs on the light board is constantly decreasing. In this situation, continuing to use the method of slotting connectors on a single-sided circuit board will face several problems. On the one hand, space constraints may prevent the connectors from being placed smoothly; on the other hand, even if connectors can be placed, the spacing between the connectors and the LEDs will be too small, thus adversely affecting the uniformity of light output from the LEDs. Utility Model Content

[0004] This application provides a lamp board and a backlight module that can maintain electrical connection and ensure uniformity of light output.

[0005] This application provides a light panel, including:

[0006] First circuit board;

[0007] A light-emitting unit is disposed on the first circuit board;

[0008] A connector is disposed on the side of the first circuit board facing away from the light-emitting unit;

[0009] The second circuit board has one end electrically connected to the light-emitting unit and the other end bent and connected to the connector.

[0010] In some embodiments, the second circuit board is electrically connected to the connector via the edge of the first circuit board.

[0011] In some embodiments, the edge of the first circuit board is provided with a clearance opening, and the second circuit board passes through the clearance opening, the clearance opening being configured to position the second circuit board.

[0012] In some embodiments, the light panel further includes an adhesive disposed between the second circuit board and the first circuit board, the adhesive being configured to adhere the second circuit board to the first circuit board.

[0013] In some embodiments, the colloid is a thermally conductive adhesive.

[0014] In some embodiments, the lamp board further includes pads located on the same surface of the first circuit board as the light-emitting unit, and the pads are electrically connected to the light-emitting unit and the second circuit board, respectively.

[0015] In some embodiments, the light board further includes solder paste disposed on the pads, the solder paste being configured to electrically fix the second circuit board to the pads.

[0016] In some embodiments, the connector includes a slot body, a conductive spring, and a cover plate. The slot body has a channel, the conductive spring is disposed in the channel and electrically connected to the second circuit board, the cover plate is movably connected to the slot body, the cover plate covers the channel, and the cover plate is configured to abut against a wire inserted into the channel to fix the wire.

[0017] In some embodiments, the lamp panel further includes a reinforcing layer, which is fixed to the second circuit board.

[0018] This application embodiment also provides a backlight module, including multiple lamp boards, wherein the lamp boards are the aforementioned lamp boards, and the multiple lamp boards are arranged in an array.

[0019] The lamp board and backlight module provided in this application embodiment include a first circuit board, a light-emitting unit, a connector, and a second circuit board. The light-emitting unit is disposed on the first circuit board, and the connector is disposed on the side of the first circuit board opposite to the light-emitting unit. One end of the second circuit board is electrically connected to the light-emitting unit, and the other end is bent and electrically connected to the connector. Through the connection method of the second circuit board, the lamp board avoids the use of costly double-sided circuit boards, effectively reducing production costs, and does not interfere with the arrangement of the light-emitting units, ensuring the rationality of the light-emitting unit layout. Based on this, the lamp board can stably maintain the electrical connection between the components, ensuring error-free signal transmission, and also ensure the uniformity of light output, providing a high-quality, uniform light source for the backlight module and display device, improving display effects and user experience. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1This is a schematic diagram of the first structure of the lamp panel provided in the embodiments of this application.

[0022] Figure 2 This is a schematic diagram of a second structure of the lamp panel provided in an embodiment of this application.

[0023] Figure 3 This is a schematic diagram of the structure of the first circuit board provided in an embodiment of this application.

[0024] Figure 4 This is a schematic diagram of a third structure of the lamp panel provided in an embodiment of this application.

[0025] Figure 5 This is a schematic diagram of a fourth structure of the lamp panel provided in an embodiment of this application.

[0026] Figure 6 for Figure 5 A magnified schematic diagram of part A.

[0027] Figure 7 This is a schematic diagram of the backlight module provided in an embodiment of this application. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0029] This application provides a lamp board and a backlight module that can maintain electrical connection and ensure uniform light output. The following description is in conjunction with the accompanying drawings.

[0030] Please see Figure 1 as well as Figure 2 , Figure 1 This is a schematic diagram of a first structure of the lamp panel provided in an embodiment of this application. Figure 2 This is a schematic diagram of a second structure of the lamp panel provided in an embodiment of this application.

[0031] This application provides a lamp board 10, which includes a first circuit board 11, a light-emitting unit 12, a connector 13, and a second circuit board 14.

[0032] In this embodiment of the application, in order to clearly show the structure of the light panel 10, the following is provided: Figure 1 and Figure 2The structural diagrams of its front and back are shown respectively. It should be noted that the front and back here refer to the two opposite sides of the lamp panel 10. To facilitate the description of the relative positions of the components of the lamp panel 10, they are defined according to their functional characteristics: the lamp panel 10 is provided with light-emitting units 12, and the side that emits light from these light-emitting units 12 is called the front side, and the opposite side is the back side.

[0033] However, it should be emphasized that this naming of "front" and "back" is only to describe the relative positional relationship of the components and is not a substantial limitation on the structure of the lamp board 10. The actual structural design and functional realization of the lamp board 10 depend on various factors such as the layout of internal components, the connection method, and the overall circuit design. In practical applications, the performance and function of the lamp board 10 will not be affected by this definition of "front" and "back," regardless of the angle from which it is viewed or used.

[0034] Please continue reading. Figure 1 The first circuit board 11 can be a rigid circuit board. Rigid circuit boards typically use fiberglass cloth as the substrate and are then covered with copper foil, possessing excellent physical and electrical properties. The first circuit board 11 serves as the supporting foundation for the entire lamp board 10, providing a stable mounting platform for components such as the light-emitting unit 12 and connector 13, ensuring that the components do not loosen due to vibration or external force during operation.

[0035] The light-emitting unit 12 is disposed on the first circuit board 11. The light-emitting unit 12 is the core component of the lamp board 10 to achieve its light-emitting function. It can be a high-brightness, low-power light-emitting diode (LED) or a miniLED. A miniLED is a type of light-emitting diode; compared to traditional LEDs, its chip size is smaller, typically between 50-200 micrometers. MiniLEDs have advantages such as high brightness, high contrast, high color saturation, and low power consumption, enabling more precise local dimming and thus improving the quality of the displayed image. In the lamp board 10 of this application, the miniLED, as the light-emitting unit 12, can receive electrical energy from an external power source through conductive lines on the circuit board and efficiently convert it into light energy for emission. The layout of the miniLEDs is crucial to the light emission effect of the lamp board 10, directly affecting the uniformity and brightness distribution of the light, and consequently, the display quality of the entire display device.

[0036] Please continue reading. Figure 2Connector 13 is located on the side of the first circuit board 11 facing away from the light-emitting unit 12. Connector 13 serves to connect the lamp board 10 to external circuits or other components. For example, when the lamp board 10 needs to be connected to external power supplies, control systems, or other equipment, the lamp board 10 can receive stable power from the external power supply through connector 13 to ensure that the light-emitting unit 12 can work normally. At the same time, the lamp board 10 can also feed back the operating status information of the light-emitting unit 12, such as brightness and temperature, to the external control system through connector 13, thereby realizing intelligent control of the lamp board 10.

[0037] One end of the second circuit board 14 is electrically connected to the light-emitting unit 12, and the other end is bent and electrically connected to the connector 13. The second circuit board 14 can be a flexible printed circuit (FPC), which is a highly reliable and flexible printed circuit board made of polyimide or polyester film as a substrate. The second circuit board 14 has the characteristics of high wiring density, light weight, thinness, and good bending performance, and is used to realize the electrical connection between the light-emitting unit 12 and the connector 13.

[0038] The lamp board 10, utilizing the connection method of the second circuit board 14, avoids the use of costly double-sided circuit boards, effectively reducing production costs and preventing interference with the arrangement of the light-emitting units 12, thus ensuring the rationality of the layout of the light-emitting units 12. Based on this, the lamp board 10 can stably maintain the electrical connection between the components, ensuring error-free signal transmission, and also guarantee the uniformity of light output. It can provide a high-quality, uniform light source for the backlight module and display device, improving display effects and user experience.

[0039] Specifically, the second circuit board 14 can be bent through the edge of the first circuit board 11 to be electrically connected to the connector 13, so as to achieve efficient electrical connection while fully ensuring the structural integrity of the first circuit board 11, providing a foundation for the stable operation of the entire lamp board 10.

[0040] In some embodiments, please refer to Figure 3 as well as Figure 4 , Figure 3 This is a schematic diagram of the structure of the first circuit board provided in an embodiment of this application. Figure 4 This is a schematic diagram of a third structure of the lamp panel provided in an embodiment of this application. Figure 4 This is a schematic diagram of the structure of the lamp panel 10 before the second circuit board 14 is bent. The edge of the first circuit board 11 is provided with a clearance opening 111, and the second circuit board 14 passes through the clearance opening 111. The clearance opening 111 is configured to position the second circuit board 14.

[0041] In other words, the first circuit board 11 has a front side and a back side that are arranged opposite to each other along its thickness direction, and the clearance opening 111 passes through the first circuit board 11 along its thickness direction. One end of the second circuit board 14 is disposed on the front side of the first circuit board 11 and connected to the light-emitting unit 12, and the other end passes through the clearance opening 111 to the back side of the first circuit board 11. The second circuit board 14 is positioned by the clearance opening 111.

[0042] The clearance opening 111 is a groove structure formed at a specific position on the edge of the first circuit board 11. The function of the clearance opening 111 is to provide space for the second circuit board 14 and prevent the second circuit board 14 from interfering with other structures or components on the edge of the first circuit board 11 during its passage. The clearance opening 111 also has a limiting function, which can lock the second circuit board 14 in place to ensure that the second circuit board 14 can be accurately positioned in the designated location, thus ensuring the rationality and stability of the overall structure of the lamp board 10.

[0043] The depth of the clearance opening 111 is greater than or equal to the thickness of the second circuit board 14. From a structural rationality perspective, if the depth of the clearance opening 111 is less than the thickness of the second circuit board 14, when the second circuit board 14 is inserted into the clearance opening 111, the second circuit board 14 will protrude beyond the edge plane of the first circuit board 11. This will not only make the overall structure of the lamp board 10 less flat, increasing the difficulty of installation into the backlight module or display device, but may also damage the second circuit board 14 during subsequent use due to collisions or friction with adjacent lamp boards 10, thereby affecting its electrical connection performance and even causing lamp board 10 malfunction. The design in this application, where the depth of the clearance opening 111 is greater than or equal to the thickness of the second circuit board 14, ensures that the second circuit board 14 is completely embedded in the clearance opening 111, keeping the edge of the lamp board 10 flat, improving the convenience and stability of lamp board 10 installation, and effectively protecting the second circuit board 14, extending its service life.

[0044] The width of the clearance opening 111 is greater than or equal to the width of the second circuit board 14. If the width of the clearance opening 111 is less than the width of the second circuit board 14, the second circuit board 14 may be squeezed, causing deformation or breakage of its internal conductive lines, thereby affecting the transmission quality of electrical signals. The design of the clearance opening 111 being greater than or equal to the width of the second circuit board 14 in this application provides sufficient space for the second circuit board 14, ensuring that the second circuit board 14 can be smoothly and accurately arranged in the clearance opening 111, ensuring the integrity and stability of its internal conductive lines, and thus ensuring the accuracy and reliability of electrical signal transmission between the components of the lamp board 10.

[0045] Please see Figure 5 as well as Figure 6 , Figure 5 This is a schematic diagram of the fourth structure of the lamp panel provided in the embodiments of this application. Figure 6 for Figure 5 A magnified schematic diagram of part A. The lamp board 10 also includes an adhesive 15 disposed between the first circuit board 11 and the second circuit board 14. The adhesive 15 is connected to the second circuit board 14 and the other side of the first circuit board 11 away from the light-emitting unit 12, respectively. The adhesive 15 is configured to adhere the second circuit board 14 to the first circuit board 11.

[0046] During the actual operation of the lamp board 10, it may be affected by external forces such as vibration and impact. If the second circuit board 14 and the first circuit board 11 rely only on simple physical contact or a loose connection, they are easily displaced relative to each other under the action of external forces, leading to unstable electrical connections, or even problems such as poor contact or open circuits, which seriously affect the normal operation of the lamp board 10. In this application, the second circuit board 14 is pasted onto the first circuit board 11 using adhesive 15. The adhesive force of the adhesive 15 can ensure that the second circuit board 14 and the first circuit board 11 are tightly bonded together, forming a stable overall structure. Even in complex working environments, it can effectively resist interference from external forces, ensuring that the relative position between the second circuit board 14 and the first circuit board 11 remains unchanged, thereby ensuring the stability and reliability of electrical signal transmission.

[0047] When the lamp board 10 is working, the light-emitting unit 12 and the electronic components on the second circuit board 14 generate heat. If this heat cannot be dissipated in time, the component temperature will rise, thus affecting the component's performance and lifespan. To solve this technical problem, the colloid 15 is a thermally conductive adhesive. The thermally conductive adhesive has good thermal conductivity, enabling it to quickly conduct the heat generated by the second circuit board 14 and the connected electronic components to the first circuit board 11. The first circuit board 11 typically has a large heat dissipation area, and by cooperating with an external heat dissipation structure, it can dissipate heat even faster.

[0048] The thermally conductive adhesive material of this application comprises a base resin, thermally conductive fillers, and additives. The base resin is selected from epoxy resin, silicone resin, or polyurethane resin. Epoxy resin offers strong adhesion and heat resistance, silicone resin has a wide temperature range and good flexibility, and polyurethane resin has high elasticity and wear resistance. The thermally conductive fillers are metal oxides (such as alumina and magnesium oxide), metal powders (such as aluminum powder, copper powder, and silver powder), or carbon materials (such as graphite and carbon nanotubes) to improve thermal conductivity. The additives include curing agents to promote resin curing, diluents to adjust viscosity, coupling agents to improve interfacial bonding, and defoamers to remove bubbles. The synergistic effect of these components ensures the adhesion and thermal conductivity of the thermally conductive adhesive in applications such as the lamp panel 10.

[0049] The lamp panel 10 also includes one or more heat sinks, which are thermally connected to the first circuit board 11 and can be used to dissipate the heat from the light-emitting unit 12 and the heat transferred from the first circuit board 11. The heat sink can be made of metal (such as aluminum, copper, etc.) and is tightly connected to the first circuit board 11 by welding, pasting, or mechanical fixing, effectively conducting and dissipating the heat generated by the light-emitting unit 12, preventing the lamp panel 10 from being damaged due to overheating, and extending the product's service life.

[0050] Please continue reading. Figure 3 The lamp board 10 also includes a pad 16, which is located on the same surface as the light-emitting unit 12 on the first circuit board 11. From the perspective of electrical connection, placing the pad 16 and the light-emitting unit 12 on the same surface can greatly shorten the electrical connection path between the light-emitting unit 12 and the pad 16, and reduce loss and interference during signal transmission.

[0051] The pads 16 are electrically connected to the light-emitting unit 12 and the second circuit board 14 respectively, so as to realize the electrical signal transmission between the light-emitting unit 12 and the second circuit board 14.

[0052] Please continue reading. Figure 6 The lamp board 10 also includes solder paste 17, which is disposed on pads 16 and configured to connect the second circuit board 14 to the pads 16. During the soldering process, when the lamp board 10 is heated, the solder paste 17 melts and wets the soldering area between the pads 16 and the second circuit board 14. Under the action of surface tension, the molten solder paste 17 evenly fills the gap between the pads 16 and the second circuit board 14, forming a strong metal bond. This connection method ensures stable transmission of electrical signals between the pads 16 and the second circuit board 14 and also has good mechanical strength, capable of withstanding external forces such as vibration and impact that the lamp board 10 may experience during use.

[0053] Connector 13 is used to achieve stable electrical and mechanical connections between different circuits or components.

[0054] Please continue reading. Figure 6 The connector 13 includes a slot body 131, a conductive spring (not shown in the figure), and a cover plate 132.

[0055] The slot body 131 has a channel 1311 whose shape and size are carefully designed to match the wire 20 to be inserted (e.g., a power cord), providing suitable insertion and securing space for the wire 20.

[0056] A conductive spring is disposed within the slot 1311 and electrically connected to the second circuit board 14. The conductive spring is made of an elastic metal material with good conductivity and is disposed within the slot 1311 of the slot body 131. When the wire 20 is inserted into the slot 1311, the conductive spring, due to its own elasticity, can make tight contact with the wire 20, thereby achieving an electrical connection between the wire 20 and the second circuit board 14. This electrical connection method ensures stable and reliable transmission of current or signals between the two, ensuring the normal operation of the lamp board 10.

[0057] The cover plate 132 is movably connected to the slot body 131. The cover plate 132 covers the slot 1311 and is configured to abut against the wire 20 inserted into the slot 1311 to secure the wire 20. Specifically, after the wire 20 is inserted into the slot 1311, the cover plate 132 securely fixes the wire 20 within the slot 1311 by abutting against it. The movable connection of the cover plate 132 can take various forms, such as hinge connection or snap-fit ​​connection, to ensure that the cover plate 132 can be easily opened and closed. When the wire 20 is inserted into the slot 1311, closing the cover plate 132 will tightly abut against the wire 20, preventing the wire 20 from loosening or coming out due to external force during use. This fixing method is simple and reliable, effectively improving the stability and reliability of the connector 13.

[0058] To further enhance the securing effect of connector 13 on wire 20, the inner wall of the groove 1311 of the slot body 131 is provided with anti-slip texture. The function of the anti-slip texture is to increase the friction between the inner wall of the groove 1311 and wire 20, preventing wire 20 from loosening due to external forces such as vibration and pulling during use. Anti-slip texture can take various forms, among which raised stripes and dotted raised areas are two more common forms.

[0059] Raised stripes are distributed in a stripe pattern on the inner wall of the channel 1311, and can be arranged in different ways such as parallel or intersecting. This striped anti-slip texture increases the contact area between the inner wall of the channel 1311 and the cable 20, thereby improving the friction between them. Dot-like protrusions are evenly distributed in a dot-like pattern on the inner wall of the channel 1311. The advantage of this is that its uniform distribution ensures that the power cable is subjected to a certain amount of friction in all directions within the channel 1311, further improving the reliability of the connection.

[0060] To effectively reduce the impact of electromagnetic interference on the internal circuitry of the lamp board 10 and improve overall performance stability, a shielding layer is provided between the second circuit board 14 and the first circuit board 11 to reduce electromagnetic interference. The shielding layer works by blocking or absorbing external electromagnetic signals, preventing them from entering the circuit board. For example, the shielding layer is located on the side of the second circuit board 14 closest to the first circuit board 11.

[0061] The shielding layer can be a metal foil or a conductive coating, and is set on the side of the second circuit board 14 close to the first circuit board 11 to effectively isolate the influence of external electromagnetic signals on the internal circuit of the lamp board 10 and improve the overall performance stability.

[0062] Common metal foils, such as copper foil, have high electrical and magnetic conductivity, effectively reflecting and absorbing electromagnetic waves. By tightly bonding the metal foil between the second circuit board 14 and the first circuit board 11, a continuous conductive layer can be formed, effectively isolating external electromagnetic signals from affecting the internal circuitry of the lamp board 10. The conductive coating has good flexibility and adhesion to form a uniform conductive film, effectively shielding electromagnetic signals without significantly affecting the heat dissipation and mechanical properties of the circuit board.

[0063] In actual use, the second circuit board 14 may break or be damaged due to bending, thus affecting the overall performance and service life of the lamp board 10. The lamp board 10 also includes a reinforcing layer, which is fixed to the second circuit board 14.

[0064] The reinforcing layer can be a polyimide (PI) film or a metal mesh. The reinforcing layer can be bonded to the second circuit board 14 via lamination or adhesive bonding processes to enhance the mechanical strength of the bending area, prevent breakage or damage caused by bending, and extend the service life of the second circuit board 14.

[0065] A buffer layer is also provided between the reinforcing layer and the second circuit board 14 to absorb stress during bending.

[0066] The buffer layer can be made of silicone or rubber. Silicone has good elasticity and compression resistance, allowing it to deform elastically when bent and absorb most of the stress. Silicone also has excellent heat and cold resistance, maintaining stable performance under different temperature conditions. Rubber also possesses elasticity and compression resistance, effectively buffering the impact force generated during bending and protecting the second circuit board 14 and the reinforcing layer from damage.

[0067] Please see Figure 7 , Figure 7 This is a schematic diagram of the structure of a backlight module provided in an embodiment of this application. This application also provides a backlight module 100, which includes multiple lamp boards 10. The lamp boards 10 are the same as those in the above embodiments, and the multiple lamp boards 10 are arranged in an array and electrically connected to each other.

[0068] Specifically, the lamp board 10 effectively avoids the use of expensive double-sided circuit boards, thereby significantly reducing costs in the production process. At the same time, this connection method does not adversely interfere with the arrangement of the light-emitting units 12, allowing the light-emitting units 12 to be arranged as required.

[0069] Based on the description of the above embodiments, the lamp board 10 has excellent performance. On the one hand, it can stably maintain the electrical connection between the components, ensuring that the signal is accurate during transmission and avoiding signal distortion or interruption caused by connection problems; on the other hand, it can also effectively ensure the uniformity of light output, making the light emitted by the backlight module 100 more uniform and stable.

[0070] This application also provides a display device, which can be an electronic device with display function such as a television, billboard, display screen, computer, or industrial touch screen.

[0071] The display device includes a backlight module 100 and a display panel. The backlight module 100 is the same as the backlight module 100 described in the above embodiments. The display panel is disposed on the light-emitting side of the backlight module 100. The backlight module 100 serves as the light source providing part of the display device, and the light emitted by it is modulated by the display panel to finally display an image.

[0072] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0073] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features.

[0074] The lamp board and backlight module provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A light panel, characterized in that, include: First circuit board; A light-emitting unit is disposed on the first circuit board; A connector is disposed on the side of the first circuit board facing away from the light-emitting unit; The second circuit board has one end electrically connected to the light-emitting unit and the other end bent and connected to the connector.

2. The lamp panel according to claim 1, characterized in that, The second circuit board is electrically connected to the connector via the edge of the first circuit board.

3. The lamp panel according to claim 2, characterized in that, The first circuit board has an clearance opening on its edge, and the second circuit board passes through the clearance opening, which is configured to position the second circuit board.

4. The lamp panel according to any one of claims 1 to 3, characterized in that, It also includes an adhesive disposed between the second circuit board and the first circuit board, the adhesive being configured to adhere the second circuit board to the first circuit board.

5. The lamp panel according to claim 4, characterized in that, The colloid is a thermally conductive adhesive.

6. The lamp panel according to any one of claims 1 to 3, characterized in that, It also includes pads, which are located on the same surface of the first circuit board as the light-emitting unit, and the pads are electrically connected to the light-emitting unit and the second circuit board respectively.

7. The lamp panel according to claim 6, characterized in that, It also includes solder paste disposed on the pads, the solder paste being configured to electrically fix the second circuit board to the pads.

8. The lamp panel according to any one of claims 1 to 3, characterized in that, The connector includes a slot body, a conductive spring, and a cover plate. The slot body has a channel, the conductive spring is disposed in the channel and electrically connected to the second circuit board, the cover plate is movably connected to the slot body, the cover plate is disposed on the channel, and the cover plate is configured to abut against a wire inserted into the channel to fix the wire.

9. The lamp panel according to any one of claims 1 to 3, characterized in that, It also includes a reinforcing layer, which is fixed to the second circuit board.

10. A backlight module, characterized in that, It includes multiple light panels, wherein the light panels are the light panels according to any one of claims 1 to 9, and the multiple light panels are arranged in an array.

Images