A heat dissipation structure for an infrared thermal imager

Abstract

The utility model relates to measuring instrument technical field especially, it is a kind of heat dissipation structure for infrared thermal imager, comprising: first heat dissipation frame, and set up on the first heat dissipation frame first heat dissipation structure, second heat dissipation structure and third heat dissipation structure;The first side of the first heat dissipation frame is provided with the infrared camera module installation slot of accommodating infrared camera module;The second side of the first heat dissipation frame is provided with the visible light camera module installation slot of accommodating visible light camera module;The first heat dissipation structure is correspondingly set with the infrared camera module installation slot, is used to heat dissipation to the infrared camera module;Second heat dissipation structure is correspondingly set with the visible light camera module installation slot, is used to heat dissipation to the visible light camera module;The third heat dissipation structure is located between the first heat dissipation structure and second heat dissipation structure, is used to heat dissipation to the infrared camera module and the visible light camera module simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of measuring instrument technology, and in particular to a heat dissipation structure for an infrared thermal imager. Background Technology

[0002] Most existing thermal imager acquisition modules employ a dual-module acquisition approach, combining infrared and visible light camera modules to achieve dual-spectrum imaging. By fusing visible and infrared image information, environmental adaptability and target recognition capabilities are enhanced. The advantages of dual-spectrum imaging include improved environmental adaptability: visible light lenses can capture details (such as color and texture) under normal lighting conditions, while infrared lenses can penetrate harsh environments such as smoke and darkness, imaging through the object's own thermal radiation. The combination of the two enables all-weather monitoring.

[0003] In existing acquisition structures, both the visible light camera module and the infrared camera module are directly soldered onto the main control circuit board. During operation, both the main control circuit board and the camera module generate a large amount of heat. Lacking an effective heat dissipation structure, the temperature rise will exceed 12 degrees Celsius (the sensor's optimal operating temperature is below 12 degrees Celsius, where accuracy and stability are best). In order to achieve the IP54 protection level, handheld thermal imagers all adopt a sealed design. Due to the limitation of internal space, the heat dissipation of the acquisition module is affected. The high concentrated heat generation will seriously affect the service life and accuracy of the camera module and circuit board components. Therefore, how to improve the heat dissipation efficiency of image acquisition devices has become an urgent problem to be solved. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a heat dissipation structure for an infrared thermal imager, which solves the technical problem of poor heat dissipation efficiency of existing thermal imager acquisition modules.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, the main technical solutions adopted by this utility model include:

[0008] A heat dissipation structure for an infrared thermal imager includes: a first heat sink frame, and a first heat dissipation structure, a second heat dissipation structure, and a third heat dissipation structure disposed on the first heat sink frame.

[0009] The first side of the first heat sink is provided with an infrared camera module mounting slot for accommodating the infrared camera module;

[0010] The second side of the first heat sink is provided with a visible light camera module mounting slot for accommodating the visible light camera module;

[0011] The first heat dissipation structure is configured correspondingly to the mounting slot of the infrared camera module, and is used to dissipate heat from the infrared camera module;

[0012] The second heat dissipation structure is correspondingly disposed to the visible light camera module mounting slot and is used to dissipate heat from the visible light camera module; the third heat dissipation structure is located between the first heat dissipation structure and the second heat dissipation structure and is used to dissipate heat from both the infrared camera module and the visible light camera module simultaneously.

[0013] It also includes a second heat sink, which is located on the first side of the first heat sink and is configured to correspond to the mounting slot of the infrared camera module, so as to dissipate heat from the infrared camera module.

[0014] The second heat sink includes a first side plate, a second side plate, and a third side plate. The first side plate is fixedly connected to the first heat sink to close the infrared camera module mounting slot.

[0015] The second side plate and the first side plate are connected to each other in an L-shaped structure. The opposite side of the second side plate and the third side plate is provided with a fixed limiting structure. The fixed limiting structure is fixedly connected to the third side plate so that an installation space for the infrared acquisition and control circuit board of the infrared camera module is formed between the second side plate and the third side plate.

[0016] The fixed limiting structure includes a limiting guide post, a fixed support post, and a support side plate, wherein the limiting guide post and the fixed support post are respectively disposed at both ends of the support side plate;

[0017] The fixed support column is used to connect the infrared acquisition and control circuit board;

[0018] The limiting guide post is used to limit and fix the end of the infrared acquisition and control circuit board;

[0019] The support side plate has a limiting protrusion in the middle, which cooperates with the slot of the third side plate.

[0020] The first heat dissipation structure is located at the end of the first heat dissipation frame that is away from the second side plate and the third side plate;

[0021] The first heat dissipation structure includes a plurality of first heat dissipation fins, and a first heat dissipation cavity is formed between adjacent first heat dissipation fins.

[0022] It also includes an infrared camera module housing, which is located on the second side of the first heat sink and is fixedly connected to the infrared camera module mounting slot;

[0023] The second side of the infrared camera module mounting slot is provided with a through hole for the lens of the infrared camera module to pass through.

[0024] The infrared camera module housing has a through groove in the middle corresponding to the through hole for fixing the lens of the infrared camera module.

[0025] It also includes a visible light camera module housing, which is located on the second side of the first heat sink and is fixedly connected to the visible light camera module mounting slot to seal the visible light camera module mounting slot.

[0026] The second heat dissipation structure is located below the visible light camera module mounting slot;

[0027] The second heat dissipation structure includes a plurality of second heat dissipation fins, and a second heat dissipation cavity is formed between adjacent second heat dissipation fins.

[0028] The third heat dissipation structure includes multiple third heat dissipation fins, and a third heat dissipation cavity is formed between adjacent third heat dissipation fins.

[0029] A fourth heat dissipation structure is provided at the corner where the second side plate meets the first side plate;

[0030] The fourth heat dissipation structure includes multiple fourth heat dissipation fins, and a fourth heat dissipation cavity is formed between adjacent fourth heat dissipation fins.

[0031] (III) Beneficial Effects

[0032] The beneficial effects of this utility model are as follows: The heat dissipation structure for an infrared thermal imager provided by this utility model includes a first heat sink and a second heat sink connected in sequence. Both the infrared camera module and the visible light camera module are independently mounted on the first heat sink. By independently mounting the main heat sources (the infrared camera module and the visible light camera module) on the first heat sink and isolating them from the temperature-sensitive main control circuit board, heat can be prevented from directly accumulating on the circuit board, protecting the stability and lifespan of electronic components, and preventing performance degradation or system crashes due to overheating, thus achieving thermal isolation and protection.

[0033] Each module is equipped with a heat dissipation structure, which can effectively dissipate heat from the heat source and avoid cross-contamination and heat concentration. Multiple heat dissipation fins form a regular airflow channel, increasing the surface area for air contact and making heat dissipation more efficient and uniform.

[0034] By setting up an L-shaped second heat sink to work in conjunction with the first heat sink to create a heat dissipation space, the infrared camera module, visible light camera module, and main control circuit board are separated by a distance, creating an airflow channel and improving heat dissipation efficiency. At the same time, the mounting space for the infrared acquisition and control circuit board can be integrated within the heat sink body structure, making the structure more compact. Attached Figure Description

[0035] Figure 1 This is a perspective view (front view) of the heat dissipation structure of this utility model;

[0036] Figure 2 This is a perspective view (rear view) of the heat dissipation structure of this utility model;

[0037] Figure 3 This is a cross-sectional view of the heat dissipation structure of this utility model;

[0038] Figure 4 This is a perspective view (front view) of the first heat sink of this utility model;

[0039] Figure 5 This is a perspective view (rear view) of the first heat sink of this utility model;

[0040] Figure 6 This is a perspective view of the second heat sink of this utility model.

[0041] [Explanation of Labels in the Attached Image]

[0042] 1: Infrared camera module; 12: Infrared camera module housing; 13: Infrared acquisition and control circuit board;

[0043] 2: Visible light camera module; 21: Visible light camera module housing;

[0044] 31: First heat sink; 311: Infrared camera module mounting slot; 312: First heat sink fin; 313: Visible light camera module mounting slot; 314: Second heat sink fin; 315: Third heat sink fin;

[0045] 32: Second heat sink bracket; 321: First side plate; 322: Second side plate; 323: Third side plate; 324: Fourth heat sink fin; 325: Limiting guide post; 326: Fixed support post; 327: Supporting side plate; 328: Limiting bracket protrusion. Detailed Implementation

[0046] To better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention can be understood more clearly and thoroughly, and that the scope of the present invention can be fully conveyed to those skilled in the art.

[0047] See appendix Figure 1-6As shown, this embodiment of the present invention provides a heat dissipation structure for an infrared thermal imager. The heat dissipation structure is fixedly connected to the housing of the thermal imager and includes: a first heat dissipation frame 31, and a first heat dissipation structure, a second heat dissipation structure, and a third heat dissipation structure disposed on the first heat dissipation frame 31. A first side of the first heat dissipation frame 31 has an infrared camera module mounting slot 311 for accommodating an infrared camera module 1. A second side of the first heat dissipation frame 31 has a visible light camera module mounting slot 313 for accommodating a visible light camera module 2. The first heat dissipation structure is correspondingly disposed to the infrared camera module mounting slot 311 and is used to dissipate heat from the infrared camera module 1. The second heat dissipation structure is correspondingly disposed to the visible light camera module mounting slot 313 and is used to dissipate heat from the visible light camera module 2. The third heat dissipation structure is located between the first and second heat dissipation structures and is used to dissipate heat from both the infrared camera module 1 and the visible light camera module 2 simultaneously. By independently placing the main heat sources (infrared camera module 1 and visible light camera module 2) on the heat sink and isolating them from the temperature-sensitive main control circuit board, heat can be prevented from directly accumulating on the circuit board, protecting the stability and lifespan of electronic components and preventing performance degradation or system crashes due to overheating, thus playing a role in thermal isolation and protection.

[0048] The infrared camera module mounting slot 311 is located above the visible light camera module mounting slot 313. The opening of the infrared camera module mounting slot 311 is located on the first side of the first heat sink 31, and the opening of the visible light camera module mounting slot 313 is located on the second side of the first heat sink 31.

[0049] It also includes a second heat sink 32, which is located on the first side of the first heat sink 31. The second heat sink 32 covers the opening of the infrared camera module mounting slot 311 and is fixedly connected to the first heat sink 31 by screws to close the infrared camera module mounting slot 311.

[0050] By dividing the heat sink into two parts, the manufacturing process is simplified, and the installation of the infrared camera module 1 is made more convenient. It can be inserted into the mounting slot from the rear and then sealed by the second heat sink 32, facilitating the connection of the infrared acquisition and control circuit board 13. The infrared camera module mounting slot 311 and the second heat sink 32 form a relatively closed cavity, which can protect the infrared camera module 1 from physical impact.

[0051] The main control circuit board of the handheld thermal imager is located on the side of the second heat sink 32 away from the first heat sink 31 (the first side of the second heat sink 32). This creates a heat dissipation space between the first heat sink 31 and the main control circuit board, separating the infrared camera module 1 and the visible light camera module 2 from the main control circuit board, creating an airflow channel and improving heat dissipation efficiency. During installation, there is a small gap between the main control circuit board and the second heat sink 32, or the main control circuit board may be in contact with the second heat sink 32.

[0052] Infrared camera module 1 is electrically connected to infrared acquisition control circuit board 13 via FPC cable, and visible light camera module 2 and infrared acquisition control circuit board 13 are electrically connected to main control circuit board via FPC cable respectively.

[0053] Both the first heat sink 31 and the second heat sink 32 are made of metal, enabling effective heat transfer and heat dissipation for the image acquisition structure. Specifically, the first heat sink 31 and the second heat sink 32 can be made of aluminum or copper, which is beneficial for heat dissipation.

[0054] The second heat sink 32 includes a first side plate 321, a second side plate 322, and a third side plate 323. The first side plate 321 is fixedly connected to the first heat sink 31. The second side plate 322 and the first side plate 321 are connected to each other in an L-shaped structure. A fixing limiting structure is provided on the opposite sides of the second side plate 322 and the third side plate 323. The fixing limiting structure is fixedly connected to the third side plate 323 with screws, so that an installation space for the infrared acquisition control circuit board 13 of the infrared camera module 1 is formed between the second side plate 322 and the third side plate 323, preventing physical collisions between the infrared acquisition control circuit board 13 and other components. The infrared acquisition control circuit board 13 is fixedly installed between the fixing limiting structures with screws.

[0055] By setting up an L-shaped second heat sink 32, the infrared camera module 1, the visible light camera module 2, and the main control circuit board 4 are isolated, forming a heat dissipation space with a certain spacing. At the same time, the mounting space of the infrared acquisition and control circuit board 13 is integrated into the main structure of the heat sink, which greatly saves internal space and makes the structure more compact. The infrared acquisition and control circuit board 13 is directly mounted on the metal heat sink, and the heat it generates can be directly dissipated through the surface of the second heat sink 32, avoiding heat accumulation inside and ensuring the stability of the main control board.

[0056] The fixed limiting structure includes a limiting guide post 325, a fixed support post 326, and a support side plate 327. The limiting guide post 325 and the fixed support post 326 are respectively located at both ends of the support side plate 327. The fixed support post 326 is used to fix and support the infrared acquisition control circuit board 13. The fixed support post 326 also has a threaded hole in the middle, and the infrared acquisition control circuit board 13 is fixedly connected to the fixed support post 326 by screws. The height of the limiting guide post 325 is higher than that of the fixed support post 326. The limiting guide post 325 is used to limit the end of the infrared acquisition control circuit board 13, providing installation positioning for the operator during installation. The infrared acquisition control circuit board 13 is supported and fixed by the cooperation of the limiting guide post 325 and the fixed support post 326.

[0057] The supporting side plate 327 has a limiting protrusion 328 in the middle, which cooperates with the groove on the opposite side of the third side plate 323 to facilitate the installation and positioning of the supporting side plate 327 and the third side plate 323. The supporting side plate 327 also has threaded holes for connecting screws to further fix the supporting side plate 327 and the third side plate 323.

[0058] The first heat sink 31 and the first side plate 321 are also provided with a limiting protrusion 328 on the opposite side. The first side plate 321 is provided with a slot corresponding to the limiting protrusion 328. The limiting protrusion 328 and the slot facilitate quick positioning and connection between components.

[0059] The first heat dissipation structure is located at the end of the first heat sink 31 that is away from the second side plate 322 and the third side plate 323. The heat dissipation fin structure increases the surface area in contact with the air, thereby significantly improving the heat dissipation efficiency, and heat can be conducted from the heat dissipation fins to the air more quickly.

[0060] The first heat dissipation structure includes multiple first heat dissipation fins 312, and a first heat dissipation cavity is formed between adjacent first heat dissipation fins 312. The heat dissipation cavity between the heat dissipation fins forms a regular airflow channel, making heat dissipation more efficient and uniform.

[0061] An infrared camera module housing 12 is provided on the front side of the infrared camera module mounting slot 311, and the infrared camera module housing 12 is fixedly connected to the infrared camera module mounting slot 311. The front side of the infrared camera module mounting slot 311 has a through hole for the lens of the infrared camera module 1 to pass through, and the infrared camera module housing 12 has a through groove corresponding to this through hole for fixing the lens of the infrared camera module 1, thereby fixing and protecting the lens and lens of the camera module and providing them with an optical path. The housing and mounting slot together provide a dustproof and moisture-proof barrier for the internal precision optical components.

[0062] The slot of the visible light camera module mounting slot 313 is located on the second side of the heat sink 3, and the visible light camera module 2 can be inserted into the mounting slot from the front, which is convenient for installation and removal.

[0063] A visible light camera module housing 21 is provided on the front side of the visible light camera module mounting slot 313, and the visible light camera module housing 21 is fixedly connected to the visible light camera module mounting slot 313. By setting the visible light camera module housing 21 and the visible light camera module mounting slot 313 to form a closed mounting cavity, the visible light camera module 2 can be protected from physical impact.

[0064] The second heat dissipation structure is located below the visible light camera module mounting slot 313. This structure includes multiple second heat dissipation fins 314, with adjacent fins forming a second heat dissipation cavity. By providing this second heat dissipation structure, a dedicated heat dissipation area is created for the visible light camera module 2. Since the visible light module also generates heat during operation, the independent second heat dissipation structure effectively targets this heat source, preventing overheating and its impact on image quality. By dissipating the heat from infrared and visible light sources through different areas of the heat sink 3, cross-contamination and heat concentration are avoided, resulting in more balanced overall thermal management.

[0065] The third heat dissipation structure is located in the middle of the first heat dissipation frame 31. The third heat dissipation structure includes multiple third heat dissipation fins 315, and a third heat dissipation cavity is formed between adjacent third heat dissipation fins 315. The third heat dissipation cavity can dissipate heat from both the infrared camera module 1 and the visible light camera module 2 simultaneously, further improving heat dissipation efficiency.

[0066] A fourth heat dissipation structure is provided at the corner between the second side plate 322 and the first side plate 321. The fourth heat dissipation structure includes multiple fourth heat dissipation fins 324, and a fourth heat dissipation cavity is formed between adjacent fourth heat dissipation fins 324. By increasing the heat dissipation area at the corner of the structure, the space is fully utilized to enhance heat dissipation. The heat dissipation design is strengthened at the weak link of the structural connection (corner), thereby improving the heat dissipation efficiency of the heat sink.

[0067] Infrared camera module 1 and visible light camera module 2 are connected via FPC cables. FPC cable outlets are located on both the infrared camera module mounting slot 311 and the visible light camera module mounting slot 313 side. Infrared camera module 1 is connected to infrared acquisition control circuit board 13 via an FPC cable, and visible light camera module 2 is connected to the main control circuit board via an FPC cable.

[0068] When the above-mentioned heat dissipation structure is applied to a handheld infrared thermal imager, it is fixed inside the housing of the thermal imager. The front side of the first heat dissipation bracket 31 is provided with a slot or threaded hole for fixed connection, which can be fixedly connected to the housing of the thermal imager by a slot or screw.

[0069] Infrared camera module 1 is electrically connected to infrared acquisition control circuit board 13 via FPC cable, and visible light camera module 2 and infrared acquisition control circuit board 13 are electrically connected to main control circuit board via FPC cables respectively. Windows are provided on the housing of the thermal imager corresponding to the lens positions of infrared camera module 1 and visible light camera module 2 installed within the heat dissipation structure.

[0070] The heat dissipation structure for an infrared thermal imager provided by this utility model includes a first heat sink 31 and a second heat sink 32 fixedly connected in sequence. The infrared camera module 1 and the visible light camera module 2 are both independently mounted on the first heat sink 31, and the second heat sink 32 is located on the front side (second side) of the main control circuit board of the infrared thermal imager. By independently mounting the main heat sources (infrared camera module 1 and visible light camera module 2) on the first heat sink 31, isolating them from the temperature-sensitive main control circuit board, heat can be prevented from directly accumulating on the circuit board, protecting the stability and lifespan of electronic components, and preventing performance degradation or system crashes due to overheating, thus achieving thermal isolation and protection.

[0071] Each module is equipped with a heat dissipation structure, which can effectively dissipate heat from the heat source and avoid cross-contamination and heat concentration. Multiple heat dissipation fins form a regular airflow channel, increasing the surface area for air contact and making heat dissipation more efficient and uniform.

[0072] By setting up an L-shaped second heat sink 32 to cooperate with the first heat sink 31 to form a heat dissipation space, the infrared camera module 1, the visible light camera module 2 and the main control circuit board are separated by a distance, creating an airflow channel and improving heat dissipation efficiency. At the same time, the installation space of the infrared acquisition and control circuit board 13 can be integrated into the heat sink body structure, making the structure more compact.

[0073] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0074] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0075] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0076] In the description of this specification, the terms "one embodiment," "some embodiments," "embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0077] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications, alterations, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A heat dissipation structure for an infrared thermal imager, characterized in that, include: A first heat sink (31), and a first heat sink structure, a second heat sink structure and a third heat sink structure disposed on the first heat sink (31); The first heat sink (31) has an infrared camera module mounting slot (311) on its first side to accommodate the infrared camera module (1); The second side of the first heat sink (31) is provided with a visible light camera module mounting slot (313) for accommodating the visible light camera module (2); The first heat dissipation structure is correspondingly provided with the infrared camera module mounting slot (311) and is used to dissipate heat from the infrared camera module (1); The second heat dissipation structure is correspondingly provided with the visible light camera module mounting slot (313) and is used to dissipate heat from the visible light camera module (2); the third heat dissipation structure is located between the first heat dissipation structure and the second heat dissipation structure and is used to dissipate heat from both the infrared camera module (1) and the visible light camera module (2) at the same time.

2. The heat dissipation structure for an infrared thermal imager according to claim 1, characterized in that, It also includes a second heat sink (32), which is located on the first side of the first heat sink (31) and is provided corresponding to the infrared camera module mounting slot (311) to dissipate heat from the infrared camera module (1).

3. The heat dissipation structure for an infrared thermal imager according to claim 2, characterized in that, The second heat sink (32) includes: a first side plate (321), a second side plate (322) and a third side plate (323), wherein the first side plate (321) is fixedly connected to the first heat sink (31) to close the infrared camera module mounting slot (311); The second side plate (322) and the first side plate (321) are connected to each other in an L-shaped structure. The second side plate (322) and the third side plate (323) are provided with a fixed limiting structure on their opposite sides. The fixed limiting structure is fixedly connected to the third side plate (323) so that an installation space for the infrared acquisition control circuit board (13) of the infrared camera module (1) is formed between the second side plate (322) and the third side plate (323).

4. The heat dissipation structure for an infrared thermal imager according to claim 3, characterized in that, The fixed limiting structure includes a limiting guide post (325), a fixed support post (326), and a support side plate (327), wherein the limiting guide post (325) and the fixed support post (326) are respectively disposed at both ends of the support side plate (327); The fixed support column (326) is used to connect the infrared acquisition and control circuit board (13); The limiting guide post (325) is used to limit and fix the end of the infrared acquisition control circuit board (13); The support side plate (327) has a limiting protrusion (328) in the middle, which cooperates with the slot of the third side plate (323).

5. The heat dissipation structure for an infrared thermal imager according to claim 3, characterized in that, The first heat dissipation structure is located at the end of the first heat sink (31) that is away from the second side plate (322) and the third side plate (323); The first heat dissipation structure includes a plurality of first heat dissipation fins (312), and a first heat dissipation cavity is formed between adjacent first heat dissipation fins (312).

6. The heat dissipation structure for an infrared thermal imager according to claim 1, characterized in that, It also includes an infrared camera module housing (12), which is located on the second side of the first heat sink (31) and is fixedly connected to the infrared camera module mounting slot (311); The second side of the infrared camera module mounting slot (311) is provided with a through hole for the lens of the infrared camera module (1) to pass through; The infrared camera module housing (12) has a through groove in the middle corresponding to the through hole for fixing the lens of the infrared camera module (1).

7. The heat dissipation structure for an infrared thermal imager according to claim 1, characterized in that, It also includes a visible light camera module housing (21), which is located on the second side of the first heat sink (31) and is fixedly connected to the visible light camera module mounting slot (313) to close the visible light camera module mounting slot (313).

8. The heat dissipation structure for an infrared thermal imager according to claim 1, characterized in that, The second heat dissipation structure is located below the visible light camera module mounting slot (313); The second heat dissipation structure includes a plurality of second heat dissipation fins (314), and a second heat dissipation cavity is formed between adjacent second heat dissipation fins (314).

9. The heat dissipation structure for an infrared thermal imager according to claim 1, characterized in that, The third heat dissipation structure includes a plurality of third heat dissipation fins (315), and a third heat dissipation cavity is formed between adjacent third heat dissipation fins (315).

10. The heat dissipation structure for an infrared thermal imager according to claim 3, characterized in that, A fourth heat dissipation structure is provided at the corner between the second side plate (322) and the first side plate (321); The fourth heat dissipation structure includes a plurality of fourth heat dissipation fins (324), and a fourth heat dissipation cavity is formed between adjacent fourth heat dissipation fins (324).

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