High strength, hermetically sealed wireless temperature probe handle and food temperature probe
Patent Information
- Application Number
- CN202521918876.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-05
- Publication Date
- 2026-08-21
- Estimated Expiration
- 2035-09-05
AI Technical Summary
[0008]基于上述现有技术提到的现有的充电极与手柄主体连接的方式导致密封性不能高的问题，本申请提出一种高强度全密封的无线温度探针手柄及食物温度探针，能够提升充电极与手柄主体之间的密封性
[0018]根据本申请提供的高强度全密封的无线温度探针手柄及食物温度探针，有益效果在于：设置金属化层与焊料层，将金属化层与焊料层与手柄主体焊接，提升密封性。在手柄主体开设一贯通的通孔，金属导电丝通过通孔连接至设置在手柄主体的第二端的充电极，即手柄主体末端，手柄主体的第二端设置有金属化层与焊料层，金属化层与手柄主体焊接，焊料层与金属化层焊接，金属化层与焊料层形成充电极，金属化层与手柄主体焊接的方式防水性能更好，且金属化层盖设在手柄主体的第二端，也不容易出现因高温膨胀系数不同而导致出现间隙的情况。密封方式防水性能更好。能够在300℃以上的环境中使用。
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Figure CN224667118U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of temperature probe technology, specifically to a high-strength, fully sealed wireless temperature probe handle and a food temperature probe. Background Technology
[0002] In existing food temperature probes, the charger and handle body are separate. The existing charging cable and charging electrode are connected by crimping, spring compression, snap ring, etc. The connection between the charging electrode and the handle is generally by thread, interference fit, adhesive, copper fit, etc., which have gaps. Especially when the coefficients of thermal expansion are inconsistent, the gap between the charging electrode and the handle will be larger.
[0003] If the charging electrode and the handle are connected using organic adhesive materials, the organic adhesive materials are waterproof but not heat-resistant; if the charging electrode and the handle are connected using inorganic adhesive materials, the inorganic adhesive materials are heat-resistant but not waterproof enough.
[0004] During use or cleaning, due to thermal shock and the difference in thermal expansion coefficients among the top cap, colloid, and ceramic body, water can easily seep in through the gap between the charging electrode top cap and the handle, causing the probe to enter and the device to malfunction.
[0005] In addition, in the case of a rigid connection between the top cap and the ceramic handle body, or a flexible connection with adhesive materials, there will be gaps in the rigid connection, while the flexible connection with adhesive materials is limited by the temperature resistance of the organic adhesive materials, so the handle is not heat resistant and cannot be used in environments above 300°C.
[0006] The current method of connecting the charging electrode and the controller is not sealed well enough.
[0007] Therefore, finding a suitable connection method between the charging electrode and the main body of the handle is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0008] Based on the problem mentioned above that the existing connection method between the charging electrode and the handle body results in insufficient sealing, this application proposes a high-strength, fully sealed wireless temperature probe handle and food temperature probe, which can improve the sealing between the charging electrode and the handle body.
[0009] In one aspect, a high-strength, fully sealed wireless temperature probe handle is provided, comprising a handle body, a metallization layer, and a solder layer; The handle body has a through hole that extends from the first end to the second end of the handle body. The through hole is used to connect a metal conductive wire from the PCB board to a charging electrode located at the second end of the handle body. A metallization layer is provided at the second end of the handle body, and a solder layer is provided away from the handle body. The metallization layer and the solder layer are connected to the handle body by welding. A metal conductive wire is connected to the metallization layer and the solder layer. The metallization layer and the solder layer serve as charging electrodes.
[0010] Furthermore, the metallization layer is applied to the second end of the handle body, and the metallization layer is connected to the handle body by brazing; The solder layer is applied to one side of the handle body, which is based on the metallization layer. The metal conductive wire passes through the metallization layer and connects to the solder layer.
[0011] Furthermore, the area of the solder layer is smaller than the area of the metallization layer, the metallization layer serves as part of the charging electrode, and the solder layer connected to the metal conductive wire serves as another part of the charging electrode.
[0012] Furthermore, it also includes an electroplated layer, which is coated on the outer surface of the metallization layer and also coated on the outer surface of the solder layer.
[0013] Furthermore, the metallization layer is connected to the metal conductive wire by one of the following methods: brazing, silver soldering, or paste welding.
[0014] Furthermore, the metallization layer is one of the following: a Mo-Mn metallization layer, a silver layer, a silver-palladium layer, a nickel paste layer, and a platinum layer.
[0015] Furthermore, the handle body is made of ceramic material.
[0016] Furthermore, a metallization material is coated onto the second end of the handle body to form a metallization layer.
[0017] In a second aspect, a high-strength, fully sealed food temperature probe is provided, characterized in that it includes the high-strength, fully sealed wireless temperature probe handle as described in any one of the first aspects, and further includes a temperature measuring component and a communication component, wherein the temperature measured by the temperature measuring component is transmitted through the communication component.
[0018] The high-strength, fully sealed wireless temperature probe handle and food temperature probe provided in this application offer the following advantages: The metallization layer and solder layer are welded to the handle body, improving sealing. A through-hole is formed in the handle body, through which a conductive metal wire connects to a charging electrode located at the second end of the handle body. The second end of the handle body has a metallization layer and a solder layer. The metallization layer is welded to the handle body, and the solder layer is welded to the metallization layer, forming a charging electrode. This welding method of the metallization layer to the handle body provides better waterproofing, and since the metallization layer covers the second end of the handle body, gaps due to different coefficients of thermal expansion at high temperatures are less likely to occur. The sealing method provides better waterproofing and allows use in environments above 300℃. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is one of the structural schematic diagrams of a wireless temperature probe handle in one embodiment; Figure 2 This is one of the structural schematic diagrams of a wireless temperature probe handle in one embodiment; Figure 3 This is one of the structural schematic diagrams of a wireless temperature probe handle in one embodiment; 10. Handle body; 11. First end; 12. Second end; 20. Metallization layer; 30. Solder layer; 40. Electroplating layer; 50. Metal conductive wire. Detailed Implementation
[0021] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0022] See Figure 1 , Figure 2 , Figure 3 As shown, in one embodiment, a high-strength, fully sealed wireless temperature probe handle is provided, including a handle body 10, a metallization layer 20, and a solder layer 30. The handle body 10 has a through hole that extends from the first end 11 to the second end 12 of the handle body 10. The through hole is used to connect a metal conductive wire from the PCB board to the charging electrode provided at the second end 12 of the handle body 10. A metallization layer 20 is provided at the second end 12 of the handle body 10. A solder layer 30 is provided away from the handle body 10. The metallization layer 20 and the solder layer 30 are connected to the handle body 10 by welding. A metal conductive wire is connected to the metallization layer 20 and the solder layer 30. The metallization layer 20 and the solder layer 30 serve as charging electrodes.
[0023] Specifically, in existing technologies, the charging electrode and the handle body 10 are generally separate. The charging electrode is embedded in the second end 12 of the handle body 10. When the coefficients of thermal expansion are inconsistent at high temperatures, gaps can easily appear, resulting in insufficient waterproofing. In this application, a metallization layer 20 and a solder layer 30 are provided, and these layers are welded to the handle body 10 to improve sealing. A through-hole is formed in the handle body 10, through which a metal conductive wire is connected to the charging electrode located at the second end 12 of the handle body 10 (i.e., the end of the handle body 10). The second end 12 of the handle body 10 is provided with a metallization layer 20 and a solder layer 30. The metallization layer 20 is welded to the handle body 10, and the solder layer 30 is welded to the metallization layer 20. The metallization layer 20 and the solder layer 30 form the charging electrode. This method of welding the metallization layer 20 to the handle body 10 provides better waterproofing, and since the metallization layer 20 covers the second end 12 of the handle body 10, gaps caused by different coefficients of thermal expansion at high temperatures are less likely to occur. The sealing method provides better waterproofing. It can be used in environments above 300℃.
[0024] In one embodiment, the metallization layer 20 is disposed over the second end 12 of the handle body 10, and the metallization layer 20 is connected to the handle body 10 by brazing. The solder layer 30 is disposed on one side of the handle body 10, which is adjacent to the metallization layer 20. The metal conductive wire passes through the metallization layer 20 and is connected to the solder layer 30.
[0025] Specifically, the brazing of the metallization layer 20 and the handle body 10 can withstand temperatures above 300°C, and the welding of the solder layer 30 and the metal conductive wire further enhances the sealing performance, forming a three-layer gapless structure of "handle body 10-metallization layer 20-solder layer 30", which effectively blocks the path of moisture or pollutants to penetrate.
[0026] In one embodiment, the area of the solder layer 30 is smaller than the area of the metallization layer 20, the metallization layer 20 serves as part of the charging electrode, and the solder layer 30 connected to the metal conductive wire serves as another part of the charging electrode.
[0027] Specifically, the large-area coverage of the metallization layer 20 can enhance the welding seal with the handle body 10, while the small-area design of the solder layer 30 can precisely control the position of the conductive contacts. The layered structure of "substrate + contact" can reduce assembly errors and improve the contact stability between the charging electrode and the external charger.
[0028] In one embodiment, an electroplating layer 40 is also included, which is coated on the outer surface of the metallization layer 20 and the outer surface of the solder layer 30.
[0029] Specifically, the electroplated layer 40 fills the micropores on the surfaces of the metallization layer 20 and the solder layer 30, further blocking the path of moisture penetration; at the same time, the high conductivity of the metal plating layer can reduce the charging contact resistance and improve the charging efficiency. In addition, the electroplated layer 40 can also protect the metallization layer 20 and the solder layer 30 from chemical corrosion during the cleaning process, extending the probe's service life.
[0030] In one embodiment, the metallization layer 20 is connected to the metal conductive line 50 by one of the following methods: brazing, silver soldering, or paste welding.
[0031] Specifically, brazing is suitable for high-temperature applications and is compatible with the sintering process of the ceramic handle body 10; silver soldering and slurry soldering are suitable for temperature-sensitive components. All three soldering methods can form a gapless connection, further enhancing the sealing and structural strength of the charging electrode.
[0032] In one embodiment, the metallization layer 20 is one of Mo-Mn metallization layer 20, silver layer, silver-palladium layer, nickel paste layer, and platinum layer.
[0033] Specifically, it is prepared by printing and sintering molybdenum-manganese paste, which is suitable for high-temperature metallization of ceramic handle body 10 (such as alumina and zirconia ceramics). It has excellent compatibility with brazing process, can withstand welding temperature above 800℃, and is suitable for scenarios with high requirements for structural strength and high temperature resistance.
[0034] In one embodiment, the handle body 10 is made of ceramic material.
[0035] In one embodiment, a metallization material is coated on the second end 12 of the handle body 10 to form a metallization layer 20.
[0036] Specifically, the metallization layer 20 is formed by coating the surface of the second end 12 of the handle body 10 with metallization material through a printing-sintering process or physical vapor deposition.
[0037] In one embodiment, a high-strength, fully sealed food temperature probe is provided, characterized in that it includes the high-strength, fully sealed wireless temperature probe handle as described in any of the first aspects, and further includes a temperature measuring component and a communication component, wherein the temperature measured by the temperature measuring component is transmitted through the communication component.
[0038] The food temperature probe provided in this embodiment has the following advantages: In the prior art, the charging electrode and the handle body 10 are generally separate. When the charging electrode is embedded in the second end 12 of the handle body 10, gaps are easily formed due to inconsistent expansion coefficients at high temperatures, resulting in insufficient waterproof performance. In this application, a metallization layer 20 and a solder layer 30 are provided and welded to the handle body 10 to improve sealing. A through hole is opened in the handle body 10, and a metal conductive wire is connected through the through hole to the charging electrode provided at the second end 12 of the handle body 10, i.e., the end of the handle body 10. The second end 12 of the handle body 10 is provided with a metallization layer 20 and a solder layer 30. The metallization layer 20 is welded to the handle body 10, and the solder layer 30 is welded to the metallization layer 20. The metallization layer 20 and the solder layer 30 form the charging electrode. The method of welding the metallization layer 20 to the handle body 10 provides better waterproof performance, and since the metallization layer 20 covers the second end 12 of the handle body 10, gaps caused by different expansion coefficients at high temperatures are less likely to occur. The sealing method provides better waterproofing. It can be used in environments above 300℃.
Claims
1. A high-strength, fully sealed wireless temperature probe handle, characterized in that, Including the handle body, metallization layer, and solder layer; The handle body has a through hole that extends from the first end to the second end of the handle body. The through hole is used to connect a metal conductive wire from the PCB board to a charging electrode located at the second end of the handle body. A metallization layer is provided at the second end of the handle body, and a solder layer is provided away from the handle body. The metallization layer and the solder layer are connected to the handle body by welding. A metal conductive wire is connected to the metallization layer and the solder layer. The metallization layer and the solder layer serve as charging electrodes.
2. The high-strength, fully sealed wireless temperature probe handle according to claim 1, characterized in that, The metallization layer is applied to the second end of the handle body, and the metallization layer is connected to the handle body by brazing. The solder layer is applied to one side of the handle body, which is based on the metallization layer. The metal conductive wire passes through the metallization layer and connects to the solder layer.
3. The high-strength, fully sealed wireless temperature probe handle according to claim 2, characterized in that, The area of the solder layer is smaller than the area of the metallization layer. The metallization layer serves as part of the charging electrode, and the solder layer connected to the metal conductive wire serves as another part of the charging electrode.
4. The high-strength, fully sealed wireless temperature probe handle according to claim 1, characterized in that, It also includes an electroplated layer, which is coated on the outer surface of the metallized layer and also coated on the outer surface of the solder layer.
5. The high-strength, fully sealed wireless temperature probe handle according to claim 1, characterized in that, The metallization layer is connected to the metal conductive wire by one of the following methods: brazing, silver soldering, or paste welding.
6. The high-strength, fully sealed wireless temperature probe handle according to claim 1, characterized in that, The metallization layer is one of the following: Mo-Mn metallization layer, silver layer, silver-palladium layer, nickel paste layer, and platinum layer.
7. The high-strength, fully sealed wireless temperature probe handle according to claim 1, characterized in that, The handle body is made of ceramic.
8. The high-strength, fully sealed wireless temperature probe handle according to claim 1, characterized in that, A metallization material is coated onto the second end of the handle body to form a metallization layer.
9. A high-strength, fully sealed food temperature probe, characterized in that, The high-strength, fully sealed wireless temperature probe handle, as described in any one of claims 1 to 8, further includes a temperature measuring component and a communication component, wherein the temperature measured by the temperature measuring component is transmitted through the communication component.