Multi-channel high-precision temperature measurement module

Abstract

The utility model aims at providing a kind of low cost, high integration, high-precision temperature measurement module of high efficiency of measuring precision of multichannel. The utility model includes several groups of thermocouple probe, acquisition unit and processing unit, the acquisition unit includes analog-digital conversion module and switch module, several the thermocouple probe is equipped with acquisition compensation component, the input port of several switch modules is respectively connected with several the thermocouple probe corresponding, the output port of switch module is connected with the input port of analog-digital conversion module, the digital signal of analog-digital conversion module is exported to the processing unit, and the control end of processing unit is connected with switch module. The utility model is applied to the technical field of temperature test.

Description

Technical Field

[0001] This invention relates to the technical field of temperature testing, and in particular to a multi-channel high-precision temperature measurement module. Background Technology

[0002] With the development of technology, electronic products have become increasingly common in people's lives, and their use is unavoidable in various scenarios such as daily life, work, and entertainment. Common electronic products such as smartphones, smartwatches, and tablets typically use built-in batteries for power to meet portability requirements. The batteries and processing chips generate heat during operation, which causes the temperature of the electronic product to rise, affecting its performance. Furthermore, heat accumulation in certain areas can also affect the user's grip. Therefore, electronic products incorporate heat dissipation structures to disperse heat, achieving rapid heat dissipation, ensuring stable operation, and improving the user experience.

[0003] To meet both heat dissipation requirements and size constraints, vapor chambers are typically used as heat dissipation structures. Their function is to rapidly dissipate heat from heat sources such as chips and batteries. For components with structures like vapor chambers and specific performance requirements, multiple temperature sampling points need to be set up during performance testing. Furthermore, the sampling time at each temperature sampling point must be as close as possible to ensure more accurate performance parameters. Traditional high-precision temperature measurement technologies mostly use standard instruments. These are expensive and bulky, resulting in significant resource waste due to the limited layout space and cost-effectiveness requirements of the consumer automation testing industry. Currently, high-precision temperature measurement equipment on the market is mainly divided into contact and non-contact types. Contact-type high-precision temperature measurement equipment is further divided into thermistor (PT100 / PT1000 platinum resistance) temperature measurement equipment and thermocouple temperature measurement equipment. Compared to thermocouple temperature measurement, thermistors are larger and cannot be properly positioned to fit the target surface, potentially leading to measurement errors. Furthermore, achieving high-precision multi-channel temperature measurement with thermistors requires higher costs, thus offering no advantage in terms of surface temperature measurement or cost. Non-contact high-precision temperature measurement devices, primarily infrared thermometers and laser pyrometers, utilize infrared radiation for temperature measurement. They offer advantages such as fast response and strong anti-interference capabilities. However, non-contact high-precision temperature measurement devices are too expensive and have lower measurement accuracy compared to contact devices. Therefore, in stable environments, their temperature measurement accuracy is not as high as that of thermocouples.

[0004] Therefore, a multi-channel high-precision temperature measurement module that can take into account multi-channel acquisition and high integration is needed, which can effectively solve the problems of the existing technology. Utility Model Content

[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a multi-channel high-precision temperature measurement module with low cost, high integration, high measurement accuracy and high testing efficiency.

[0006] The technical solution adopted by this utility model is as follows: This utility model includes several sets of thermocouple probes, a data acquisition unit, and a processing unit. The data acquisition unit includes an analog-to-digital converter module and a switching module. Each of the thermocouple probes is equipped with a data acquisition compensation component. Several input ports of the switching module are respectively connected to several of the thermocouple probes. The output port of the switching module is connected to the input port of the analog-to-digital converter module. The analog-to-digital converter module outputs a digital signal to the processing unit. The processing unit is connected to the control terminal of the switching module.

[0007] As can be seen from the above scheme, multiple sets of thermocouple probes contact multiple points on the product under test for temperature acquisition. The acquisition unit and processing unit work together to switch the acquisition channels, thereby enabling rapid acquisition of temperature data from each channel. This ensures the reliability and consistency of the acquired data, facilitating the evaluation of the overall heat transfer performance of the product. Using the switching module for channel switching reduces the number of components, increasing integration, lowering module costs, and ensuring testing efficiency. Cold junction compensation is achieved through the acquisition compensation component, thus ensuring the accuracy and reliability of the data acquired by the thermocouple probes.

[0008] In a preferred embodiment, the thermocouple probe includes a receiving end and a cold end. The receiving end includes two sets of metal receiving wires, and the cold end includes a connected RFI filter and a receiving wire connector. The two sets of metal receiving wires are connected to the RFI filter through the receiving wire connector, and the RFI filter is connected to the input end of the switching module.

[0009] In a preferred embodiment, the acquisition compensation component includes a digital temperature sensor, which is in contact with the acquisition line connector and is communicatively connected to the processing unit.

[0010] In a preferred embodiment, the acquisition compensation component further includes a pressure block, which is fixedly connected to the acquisition line connector via a mounting bracket. The pressure block cooperates with the digital temperature sensor and presses the digital temperature sensor onto the acquisition line connector.

[0011] A preferred embodiment is that the mating surface between the pressure block and the digital temperature sensor is provided with an insulating foam layer.

[0012] In a preferred embodiment, a plurality of first forward bias resistors are provided between the acquisition line connector and the RFI filter, and a plurality of second forward bias resistors are provided between the RFI filter and the analog-to-digital conversion module. Attached Figure Description

[0013] Figure 1 This is a system block diagram of this utility model;

[0014] Figure 2 This is the circuit schematic of the analog-to-digital conversion module;

[0015] Figure 3 This is the circuit schematic of the switch module;

[0016] Figure 4 This is a circuit schematic diagram of the RFI filter and the acquisition compensation component. Detailed Implementation

[0017] like Figures 1 to 4 As shown, in this embodiment, the present invention includes several sets of thermocouple probes 1, a data acquisition unit 2, and a processing unit 3. The data acquisition unit 2 includes an analog-to-digital converter module 21 and a switching module 22. Each of the thermocouple probes 1 is equipped with a data acquisition compensation component 11. Several input ports of the switching module 22 are respectively connected to several of the thermocouple probes 1, and the output port of the switching module 22 is connected to the input port of the analog-to-digital converter module 21. The analog-to-digital converter module 21 outputs digital signals to the processing unit 3, and the processing unit 3 is connected to the control terminal of the switching module 22. The processing unit 3 is a microprocessor, such as an STM32 series processor chip. The analog-to-digital converter module 21 includes an ADC chip U5 of model ADS1220IRVAR, and the switching module 22 includes a multiplexer U4 of model DG1207EUI+. Multi-channel temperature measurement is realized through the switching module 22.

[0018] In this embodiment, the thermocouple probe 1 includes a acquisition end 12 and a cold end. The acquisition end 12 includes two sets of metal acquisition lines. The cold end includes an RFI filter 13 and an acquisition line connector 14 connected to each other. The two sets of metal acquisition lines are connected to the RFI filter 13 through the acquisition line connector 14. The RFI filter 13 is connected to the input end of the switch module 22. The RFI filter 13 is used to prevent RFI signal interference, thereby filtering out high-frequency common-mode and differential-mode signals and retaining effective low-frequency acquisition signals. The two sets of metal acquisition lines of the acquisition end 12 are made of different metals. At different temperatures, the two metals will generate different potential differences at the junction. The higher the temperature, the higher the corresponding potential difference. Several input ports of the switch module 22 are respectively connected to the output ends of the RFI filters 13 of several thermocouple probes 1. Then, during testing, the signals of several input ports are sequentially conducted to the analog-to-digital conversion module 21. The analog-to-digital conversion module 21 acquires the potential difference generated by the two metals on the metal acquisition lines of each channel at different temperatures and converts it into the corresponding temperature value. The cold junction temperature data is then collected and compensated by the acquisition and compensation component 11 to obtain the temperature of the corresponding channel test. The analog-to-digital conversion module 21 converts the collected thermocouple analog signal into a voltage digital signal. At the same time, the temperature output by the acquisition and compensation component 11 is converted into a corresponding voltage and added together to obtain the total voltage value. The voltage value is then converted into the corresponding temperature again. The final corresponding temperature is the temperature of the thermocouple hot junction.

[0019] In this embodiment, the acquisition compensation component 11 includes a digital temperature sensor U3, which is in contact with the acquisition line connector 14 and is communicatively connected to the processing unit 3. The acquisition compensation component 11 also includes a pressure block, which is fixedly connected to the acquisition line connector 14 via a mounting bracket. The pressure block cooperates with the digital temperature sensor U3 and presses the digital temperature sensor U3 firmly onto the acquisition line connector 14. The digital temperature sensor U3 is a TMP117 temperature sensor. An isolation foam layer is provided on the mating surface between the pressure block and the digital temperature sensor U3. By providing the isolation foam layer, other temperature interference factors are isolated while ensuring that the digital temperature sensor U3 is tightly attached to the acquisition line connector 14. Several first forward bias resistors R37 and R41 are provided between the acquisition line connector 14 and the RFI filter 13, and several second forward bias resistors R39 and R43 are provided between the RFI filter 13 and the analog-to-digital conversion module 21. The thermocouple voltage is forward DC biased by the first forward bias resistor and the second forward bias resistor.

[0020] Although the embodiments of this utility model are described with reference to actual solutions, they do not constitute a limitation on the meaning of this utility model. For those skilled in the art, modifications to the implementation schemes and combinations with other schemes based on this specification are obvious.

Claims

1. A multi-channel high-precision temperature measurement module, characterized in that: It includes several sets of thermocouple probes (1), a data acquisition unit (2) and a processing unit (3). The data acquisition unit (2) includes an analog-to-digital converter (21) and a switch module (22). Each of the thermocouple probes (1) is provided with a data acquisition compensation component (11). Several input ports of the switch module (22) are respectively connected to several of the thermocouple probes (1). The output port of the switch module (22) is connected to the input port of the analog-to-digital converter (21). The analog-to-digital converter (21) outputs digital signals to the processing unit (3). The processing unit (3) is connected to the control terminal of the switch module (22).

2. The multi-channel high-precision temperature measurement module according to claim 1, characterized in that: The thermocouple probe (1) includes a collection end (12) and a cold end. The collection end (12) includes two sets of metal collection lines. The cold end includes an RFI filter (13) and a collection line connector (14) connected to each other. The two sets of metal collection lines are connected to the RFI filter (13) through the collection line connector (14). The RFI filter (13) is connected to the input end of the switch module (22).

3. The multi-channel high-precision temperature measurement module according to claim 2, characterized in that: The acquisition compensation component (11) includes a digital temperature sensor, which is in contact with the acquisition line connector (14) and is communicatively connected to the processing unit (3).

4. The multi-channel high-precision temperature measurement module according to claim 3, characterized in that: The acquisition compensation component (11) also includes a pressure block, which is fixedly connected to the acquisition line connector (14) via a mounting bracket. The pressure block cooperates with the digital temperature sensor and presses the digital temperature sensor onto the acquisition line connector (14).

5. A multi-channel high-precision temperature measurement module according to claim 4, characterized in that: The mating surface between the pressure block and the digital temperature sensor is provided with an insulating foam layer.

6. A multi-channel high-precision temperature measurement module according to claim 2, characterized in that: A plurality of first forward bias resistors are provided between the acquisition line connector (14) and the RFI filter (13), and a plurality of second forward bias resistors are provided between the RFI filter (13) and the analog-to-digital conversion module (21).

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