A diffraction stress analyzer

Abstract

The utility model discloses a kind of diffraction stress analyzers, including shell, X-ray source and detection device, shell is provided with containing cavity and detection opening, and detection opening is communicated with containing cavity;X-ray source is housed in containing cavity, X-ray source is used to emit X-ray to detection opening, X-ray is emitted to outside shell via detection opening and is diffracted, forms diffraction X-ray;Detection device is housed in containing cavity and is exposed by detection opening, and detection device is used to detect diffraction X-ray, and diffraction X-ray is converted into electrical signal.Such, using detection device can directly detect diffraction X-ray and convert it into electrical signal, so as to quickly obtain the stress condition of the detection site of measured object, shorten the time of stress detection, improve the efficiency of stress detection.

Description

Technical Field

[0001] This utility model relates to the field of stress detection, and in particular to a diffraction stress analyzer. Background Technology

[0002] During the manufacturing or use of a product, stress may occur due to processing or external forces, affecting the product or at least some of its components. The magnitude of this stress typically impacts the product's usability. If the stress exceeds safety standards, it will affect the product's lifespan and even its normal operation. Therefore, stress analysis is usually required for stress detection. There are various types of stress analyzers, one of which is the diffraction stress analyzer, which uses X-ray diffraction technology to detect stress. Utility Model Content

[0003] To address the aforementioned technical problems, this utility model provides a user-friendly diffraction stress analyzer.

[0004] The technical problem solved by this utility model embodiment is addressed by the following technical solution:

[0005] A diffraction stress analyzer includes a housing, an X-ray source, and a detection device. The housing has a receiving cavity and a detection opening, the detection opening being in communication with the receiving cavity. The X-ray source is housed within the receiving cavity and is used to emit X-rays towards the detection opening. The X-rays are emitted outside the housing via the detection opening and are diffracted to form diffracted X-rays. The detection device is housed within the receiving cavity and exposed through the detection opening. The detection device is used to detect the diffracted X-rays and convert them into electrical signals.

[0006] In some embodiments, the detection device includes a plurality of detectors spaced apart around the X-ray's path of travel and not intersecting with it, wherein the X-ray's path of travel is the path the X-ray travels from its emission from the X-ray source to its diffraction.

[0007] The area surrounded by the plurality of detectors is the penetration zone through which the X-rays pass. The surfaces of the effective detection areas of the plurality of detectors are all facing the detection opening and exposed through the detection opening. The effective detection area is used to detect the diffracted X-rays.

[0008] In some embodiments, the plurality of detectors are capable of rotating around the path of the X-rays.

[0009] In some embodiments, the detection device includes at least four detectors.

[0010] In some embodiments, the surfaces of the effective detection areas of the plurality of detectors are arranged in a rotationally symmetrical manner, and the rotation center of the surfaces of the effective detection areas of the plurality of detectors is located in the path of the X-ray.

[0011] In some embodiments, the surfaces of the effective detection areas of the plurality of detectors are located on the same plane, and the travel path of the X-rays is perpendicular to the plane.

[0012] In some embodiments, the surfaces of the effective detection areas of the plurality of detectors are arranged in an axisymmetric manner, and the axis of symmetry of the surfaces of the effective detection areas of the plurality of detectors intersects the travel path of the X-rays.

[0013] In some embodiments, the detection device includes eight detectors, the surfaces of the effective detection areas of the eight detectors are arranged in a square, and the penetration area is located in the geometric center region of the square.

[0014] In some embodiments, the detection device includes eight detectors, which form four detection groups. Each detection group includes two detectors. The arrangement direction of the two detectors in each detection group is perpendicular to the arrangement direction of the two detectors in the adjacent detection group. The surface of the effective detection area of ​​the eight detectors is arranged in a square, and the penetration area is located in the geometric center region of the square.

[0015] In some embodiments, the surfaces of the effective detection areas of the plurality of detectors are not coplanar, and the area of ​​the surface of the effective detection area that is far from the penetration area is closer to the detection opening than the area of ​​the surface of the effective detection area that is adjacent to the penetration area.

[0016] In some embodiments, the diffraction stress analyzer further includes an integrated plate housed within the receiving cavity, wherein the plurality of detectors of the detection device are mounted on the surface of the integrated plate facing the detection opening, wherein the integrated plate is provided with a first through hole for the X-rays to pass through, the X-rays passing through the first through hole before passing through the penetration zone.

[0017] In some embodiments, the diffraction stress analyzer further includes a circuit board housed within the receiving cavity, the plurality of detectors of the detection device being electrically connected to the circuit board, the circuit board having a through-hole, and the integrated board being disposed within the through-hole of the circuit board.

[0018] In some embodiments, the diffraction stress analyzer further includes a main support plate housed within the receiving cavity, wherein the integrated plate and the circuit board are both mounted on the surface of the main support plate facing the detection opening, and the main support plate is provided with a second through hole for the X-ray to pass through, wherein the X-ray passes through the second through hole before passing through the first through hole.

[0019] In some embodiments, the diffraction stress analyzer further includes a thermally conductive insulating element disposed between the main support plate and the integrated plate, and the thermally conductive insulating element covers the surface of the integrated plate facing away from the detection opening, wherein the thermally conductive insulating element has a third through hole for the X-ray to pass through, and the X-ray sequentially passes through the second through hole, the third through hole, the first through hole and the penetration area.

[0020] In some embodiments, the diffraction stress analyzer further includes a collimator for adjusting the X-rays emitted by the X-ray source into a straight line. The collimator includes a cylindrical portion and a flange portion connected to the outer periphery of one end of the cylindrical portion. The other end of the cylindrical portion is further away from the X-ray source than one end of the cylindrical portion. The flange portion is mounted on the main support plate, and the cylindrical portion sequentially passes through the second through hole, the first through hole, and the penetration area, through which the X-rays pass.

[0021] In some embodiments, the main support plate is further provided with a positioning recess, the positioning recess is located on the surface of the main support plate opposite to the detection opening, the positioning recess communicates with the second through hole, and the flange abuts against the positioning recess.

[0022] In some embodiments, the diffraction stress analyzer further includes a thermally conductive insulating element disposed between the main support plate and the integrated plate, and the thermally conductive insulating element covers the surface of the integrated plate opposite to the detection opening, wherein the thermally conductive insulating element has a third through hole for the X-ray to pass through, and the cylindrical portion sequentially passes through the second through hole, the third through hole, the first through hole and the penetration area, and the X-ray passes through the cylindrical portion.

[0023] In some embodiments, the collimator's cylindrical portion has a lateral opening; the diffraction stress analyzer further includes a calibration system, the calibration system including a calibration light source, the calibration light source being able to enter the cylindrical portion through the lateral opening or exit the cylindrical portion through the lateral opening, and when the calibration light source is located inside the cylindrical portion, the calibration light source being able to emit calibration light along the X-ray's path of travel.

[0024] In some embodiments, the diffraction stress analyzer further includes a power module, which is housed within the receiving cavity or disposed outside the housing, and is electrically connected to the X-ray source for supplying power to the X-ray source.

[0025] The beneficial effects of this utility model embodiment are as follows: The diffraction stress analyzer provided in this application embodiment includes a housing, an X-ray source, and a detection device. The housing is provided with a receiving cavity and a detection opening, and the detection opening is connected to the receiving cavity. The X-ray source is housed in the receiving cavity and is used to emit X-rays into the detection opening. The X-rays are emitted outside the housing through the detection opening and are diffracted to form diffracted X-rays. The detection device is housed in the receiving cavity and exposed through the detection opening. The detection device is used to detect the diffracted X-rays and convert them into electrical signals. In this way, the detection device can directly detect the diffracted X-rays and convert them into electrical signals, thereby quickly obtaining the stress condition of the detection part of the tested object, shortening the stress detection time, and improving the efficiency of stress detection. Attached Figure Description

[0026] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0027] Figure 1 This is a schematic diagram of the external appearance of a diffraction stress analyzer according to one embodiment of this application;

[0028] Figure 2 yes Figure 1 A diagram from another perspective;

[0029] Figure 3 yes Figure 1 A schematic diagram of a portion of the diffraction stress analyzer in the image;

[0030] Figure 4 yes Figure 3 Exploded structural diagram;

[0031] Figure 5 This is a schematic diagram of the detector's structure;

[0032] Figure 6a This is a schematic diagram of the detection device in one embodiment;

[0033] Figure 6b This is a schematic diagram showing the distribution of multiple detectors in a detection device according to another embodiment;

[0034] Figure 6c This is a schematic diagram showing the distribution of multiple detectors in a detection device according to yet another embodiment;

[0035] Figure 6d This is a schematic diagram showing the distribution of multiple detectors in a detection device according to another embodiment;

[0036] Figure 6eThis is a schematic diagram showing the distribution of multiple detectors in a detection device according to another embodiment;

[0037] Figure 6f This is a schematic diagram showing the distribution of multiple detectors in a detection device according to yet another embodiment;

[0038] Figure 7 yes Figure 3 A sectional view;

[0039] Figure 8 yes Figure 4 A schematic diagram of a part of the structure;

[0040] Figure 9 yes Figure 8 Exploded structural diagram;

[0041] Figure 10 yes Figure 8 A sectional view;

[0042] Figure 11 yes Figure 10 A schematic diagram of part of the calibration system in the diagram;

[0043] Figure 12 yes Figure 11 Exploded structural diagram;

[0044] Figure 13 yes Figure 8 A bottom view;

[0045] Figure 14 The detector according to an embodiment is illustrated schematically.

[0046] Figure 15 A simplified cross-sectional view of the detector according to an embodiment is shown schematically.

[0047] Figure 16 A detailed cross-sectional view of the detector according to an embodiment is shown schematically.

[0048] Figure 17 A detailed cross-sectional view of the detector according to an alternative embodiment is schematically shown;

[0049] In the diagram: 1. Diffraction stress analyzer; 2. Housing; 3. X-ray source; 4. Detection device; 5. Integrated board; 6. Circuit board; 7. Main support plate; 8. Thermally conductive insulating component; 9. Collimator; 10. Calibration system; 11. Secondary support plate; 12. Heat dissipation system; 13. Power module; 16. Display screen; 17. Main control board; 18. Work indicator light; 19. Emergency brake switch; 20. Handle; 30. Robotic arm;

[0050] 201. Receiving cavity; 202. Detection opening; 203. Display opening; 204. Imaging window; 21. Shell body; 22. Shell cover;

[0051] 41. Detector; 42. Detection group;

[0052] 401. Penetration zone; 41a. Effective detection zone;

[0053] 51. First through hole;

[0054] 61. Through-passage;

[0055] 71. Second through hole; 72. Positioning recess; 73. Through area;

[0056] 81. Third through hole;

[0057] 91. Cylindrical portion; 92. Flange portion; 911. Lateral opening;

[0058] 101. Extension rod; 102. Drive mechanism; 103. Image capturing device; 104. Position detection device; 105. Mounting block; 106. Guide rod;

[0059] 1011. Calibration light source; 1021. Drive motor; 1022. Lead screw; 1023. Driven part; 10231. Connecting part; 10232. Transmission part;

[0060] 1041, Obstruction component; 1042, First infrared sensor; 1043, Second infrared sensor;

[0061] 10241, Guide hole;

[0062] 121. Radiator; 122. Fan;

[0063] 121a, First groove; 121b, Second groove; 1211, Cover part; 1212, Fin part. Detailed Implementation

[0064] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0065] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0066] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0067] Existing diffraction stress analyzers mainly consist of an X-ray emitter, an imaging plate, a drive mechanism for moving and rotating the imaging plate, a detection device for detecting diffraction rings (Debye rings) formed on the imaging plate, and an elimination device for removing the diffraction rings. When detecting stress in a sample, the X-ray emitter emits X-rays towards the sample. The X-rays diffracted by the sample cause diffraction rings to form on the imaging plate. The imaging plate does not rotate during the formation of the diffraction rings. After the diffraction rings are formed, the drive mechanism moves the imaging plate from the imaging position to the detection position, and then drives the imaging plate to rotate. Simultaneously, the detection device detects the shape of the diffraction rings and obtains relevant data. After detection, the drive mechanism moves the imaging plate to the elimination position, and then drives the imaging plate to rotate. Simultaneously, the elimination device removes the diffraction rings. After the diffraction rings are eliminated, the drive mechanism drives the imaging plate back to the imaging position, ready for the next detection. Because existing diffraction stress analyzers require imaging, detection, and elimination at the imaging, detection, and elimination positions respectively, and must include detection devices, elimination devices, and drive mechanisms to move and rotate the imaging plate, the diffraction stress analyzers have many internal components, devices, modules, and mechanisms. This results in a large size and poor portability. Furthermore, it is difficult to integrate the power module (which supplies power to the X-ray emitter) into the diffraction stress analyzer. Therefore, when using the diffraction stress analyzer, an external power module must be electrically connected to it, making it inconvenient for outdoor mobile use.

[0068] The diffraction stress analyzer of this application employs a detection device composed of multiple detectors with the following structure. It detects the X-rays diffracted after X-rays emitted from an X-ray source irradiate the object under test, converts the diffracted X-rays into electrical signals, and then derives the stress state of the object under test based on the obtained electrical signals. Compared to existing diffraction stress analyzers, it eliminates the need for a drive mechanism to move and rotate the imaging plate, a detection device to detect diffraction rings formed on the imaging plate, and a device to eliminate diffraction rings. This reduces the number of components, devices, modules, and mechanisms inside the diffraction stress analyzer, thereby reducing its size and improving portability.

[0069] To better understand how the detector converts diffracted X-rays into electrical signals, the detector's structure will be described in detail below.

[0070] As an example, Figure 14 Detector 41 is schematically shown. Detector 41 may include an array of pixels 150 (also called sensing elements). This array may be a rectangular array (such as...) Figure 14 (as shown), cellular array, hexagonal array, or any other suitable array. Figure 14The example of an array of 150 pixels has 4 rows and 7 columns; however, in general, an array of 150 pixels can have any number of rows and any number of columns.

[0071] Each pixel 150 can be configured to detect radiation incident upon it from a radiation source (not shown) and can be configured to measure characteristics of the radiation (e.g., particle energy, wavelength, and frequency). The radiation can include particles, such as photons and subatomic particles. Each pixel 150 can be configured to count the number of radiant particles incident upon it over a period of time, with energy falling into multiple energy ranges. All pixels 150 can be configured to count the number of radiant particles incident upon it within multiple energy ranges simultaneously over the same period of time. When the incident radiant particles have similar energies, pixel 150 can simply be configured to count the number of radiant particles incident upon it over a period of time without measuring the energy of individual radiant particles.

[0072] Each pixel 150 may have its own analog-to-digital converter (ADC) configured to digitize an analog signal representing the energy of an incident radiating particle into a digital signal, or to digitize an analog signal representing the total energy of multiple incident radiating particles into a digital signal.

[0073] Pixel 150 can be configured to operate in parallel. For example, while one pixel 150 is measuring an incident radiation particle, another pixel 150 may be waiting for the radiation particle to arrive. Pixel 150 does not necessarily need to be individually addressable.

[0074] The detector described herein can be applied to applications such as X-ray diffractometers, X-ray telescopes, X-ray mammography, industrial X-ray defect detection, X-ray microscopy or microradiography, X-ray casting inspection, X-ray non-destructive testing, X-ray welding inspection, and X-ray digital subtraction angiography. It may also be suitable to use this detector in place of photographic plates, photographic films, light-excited phosphor plates (PSP plates), X-ray image intensifiers, scintillators, or other semiconductor X-ray detectors.

[0075] Figure 15 The illustration schematically shows an embodiment. Figure 14 The detector is shown in a simplified cross-sectional view along line 2-2. Specifically, the detector may include a radiation-absorbing layer 110 and an electronic circuitry layer 120 (which may include one or more ASICs or application-specific integrated circuits) for processing or analyzing the electrical signals generated in the radiation-absorbing layer 110 by the incident radiation. The detector may or may not include a scintillator (not shown). The radiation-absorbing layer 110 may contain a semiconductor material, such as silicon, germanium, GaAs, CdTe, CdZnTe, or a combination thereof. The semiconductor material may have a high-quality attenuation coefficient for the radiation of interest.

[0076] Figure 16 The illustration is shown as an example. Figure 14 The detector is shown in a detailed cross-sectional view along line 2-2. Specifically, the radiation absorption layer 110 may include one or more diodes (e.g., pin or pn) formed by one or more discrete regions 114 of a first doped region 111 and a second doped region 113. The second doped region 113 may be separated from the first doped region 111 by an optional intrinsic region 112. The discrete regions 114 may be separated from each other by either the first doped region 111 or the intrinsic region 112. The first doped region 111 and the second doped region 113 may have opposite types of doping (e.g., the first doped region 111 is p-type and the second doped region 113 is n-type, or the first doped region 111 is n-type and the second doped region 113 is p-type). Figure 16 In the example, each discrete region 114 of the second doped region 113 forms a diode with the first doped region 111 and an optional intrinsic region 112. That is, in Figure 16 In the example, the radiation-absorbing layer 110 has multiple diodes (more specifically, 7 diodes correspond to...). Figure 14 In the array, each row has 7 pixels, 150. For simplicity, Figure 16 Only two pixels 150 are marked in the image. Multiple diodes may have electrical contacts 119A as a common electrode. The first doped region 111 may also have multiple discrete portions.

[0077] Electronic circuitry layer 120 may include electronic systems 121 suitable for processing or interpreting signals generated by radiation incident on radiation-absorbing layer 110. Electronic systems 121 may include analog circuitry such as filter networks, amplifiers, integrators, and comparators, or digital circuitry such as microprocessors and memories. Electronic systems 121 may include one or more ADCs (analog-to-digital converters). Electronic systems 121 may include components shared by pixels 150 or components dedicated to a single pixel 150. For example, electronic systems 121 may include amplifiers dedicated to each pixel 150 and microprocessors shared among all pixels 150. Electronic systems 121 may be electrically connected to pixels 150 via interconnect channels 131. The space between interconnect channels may be filled with filler material 130, which may increase the mechanical stability of the connection between electronic circuitry layer 120 and radiation-absorbing layer 110. Other bonding techniques may connect electronic systems 121 to pixels 150 without using interconnect channels 131.

[0078] When radiation from a radiation source (not shown) impacts the radiation-absorbing layer 110 of a diode, the radiation particles can be absorbed and generate one or more charge carriers (e.g., electrons, holes) through various mechanisms. The charge carriers can drift to the electrode of one of the diodes under an electric field. This electric field can be an external electric field. Electrical contacts 119B can include multiple discrete portions, each electrically contacting a discrete region 114. The term "electrical contact" is used interchangeably with the term "electrode." In one embodiment, charge carriers can drift in multiple directions such that the charge carriers generated by a single radiation particle are substantially not shared by two different discrete regions 114 (here, "substantially not shared" means that less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow to a different discrete region 114 compared to other portions of these charge carriers). The charge carriers generated by radiating particles incident on the footprint of one of these discrete regions 114 are substantially not shared with the other discrete region 114. A pixel 150 associated with a discrete region 114 can be a region surrounding that discrete region 114 where substantially all (greater than 98%, greater than 99.5%, greater than 99.9%, or greater than 99.99%) of the charge carriers generated by the radiating particles incident thereon flow towards that discrete region 114. That is, less than 2%, less than 1%, less than 0.1%, or less than 0.01% of these charge carriers flow out of that pixel 150.

[0079] Figure 17 A schematic illustration is shown according to an alternative embodiment. Figure 14 The detector is shown in a detailed cross-sectional view along line 2-2. More specifically, the radiation-absorbing layer 110 may comprise resistors made of semiconductor materials such as silicon, germanium, GaAs, CdTe, CdZnTe, or combinations thereof, but not diodes. This semiconductor material may have a high-quality attenuation coefficient for the radiation of interest. In one embodiment, Figure 17 The electronic circuit layer 120 is similar in structure and function to Figure 16 The electronic circuit layer 120.

[0080] When radiation impacts the radiation-absorbing layer 110, which includes resistors but not diodes, it can be absorbed and generate one or more charge carriers through various mechanisms. The radiating particles can generate 10 to 100,000 charge carriers. These charge carriers can drift to electrical contacts 119A and 119B under an electric field. This electric field can be an external electric field. Electrical contact 119B can include multiple discrete sections. In one embodiment, charge carriers can drift in multiple directions such that charge carriers generated by a single radiating particle are substantially not shared by two different discrete sections of electrical contact 119B (here, "substantially not shared" means that less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow to a different discrete section compared to the rest of these charge carriers). Charge carriers generated by radiating particles incident on the periphery of the space occupied by one of these discrete sections of electrical contact 119B are substantially not shared with the other discrete section of electrical contact 119B. A pixel 150 associated with a discrete portion of an electrical contact 119B can be a region surrounding that discrete portion, in which substantially all (greater than 98%, greater than 99.5%, greater than 99.9%, or greater than 99.99%) of the charge carriers generated by incident radiant particles flow towards that discrete portion of the electrical contact 119B. That is, less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow out of the pixel associated with that discrete portion of the electrical contact 119B.

[0081] Examples of other technical details regarding detector 41 can be found in the applicant's authorized patent CN108271415B.

[0082] like Figure 1-4 , Figure 9 As shown, one embodiment of the present application provides a diffraction stress analyzer 1, including a housing 2, an X-ray source 3, and a detection device 4. The housing 2 is provided with a receiving cavity 201 and a detection opening 202, the detection opening 202 communicating with the receiving cavity 201. The X-ray source 3 is housed within the receiving cavity 201 and is used to emit X-rays into the detection opening 202. The X-rays are emitted outside the housing 2 through the detection opening 202 and are diffracted by the object being tested located outside the housing 2, forming diffracted X-rays. The detection device 4 is exposed through the detection opening 202 and is used to detect the diffracted X-rays and convert them into electrical signals.

[0083] Thus, the detection device 4 can directly detect diffracted X-rays and convert them into electrical signals, thereby quickly obtaining the stress condition of the detection part of the object being tested, shortening the stress detection time and improving the efficiency of stress detection.

[0084] It should be noted that the shape and specific structure of the shell 2 can be set as needed, and are not limited to the attached... Figure 1-4 The shape shown in the figure is sufficient as long as it has a receiving cavity 201 for accommodating the X-ray source 3 and a detection opening 202 for the X-rays emitted by the X-ray source 3 to pass through. In this embodiment, the housing 2 includes a housing body 21 and a housing cover 22. The housing body 21 is provided with a receiving cavity 201 and a detection opening 202. The housing cover 22 is detachably installed on the housing body 21 and covers the receiving cavity 201 to protect the components, devices, modules and mechanisms housed in the receiving cavity 201.

[0085] In some embodiments, such as Figure 3 and Figure 4 As shown, the detection device 4 includes multiple detectors 41, which are spaced apart around the X-ray travel path L and do not intersect with it. This allows the detectors 41 to detect the diffracted X-rays formed after the X-rays travel to the object being measured. The X-ray travel path L is the path the X-rays travel from the X-ray source 3 until they are diffracted, excluding the path the X-rays travel inside the X-ray source 3. The area surrounded by the multiple detectors 41 is the penetration zone 401 through which the X-rays pass.

[0086] like Figure 5 and Figure 14 As shown, detector 41 has an effective detection area 41a (an array of pixels 150) for detecting diffracted X-rays incident on its surface and converting the diffracted X-rays into electrical signals. Figure 3 and Figure 4 As shown, the surfaces of the effective detection areas 41a of the multiple detectors 41 all face the detection opening 202 and are exposed through the detection opening 202. In this way, under the combined action of the multiple detectors 41, more diffracted X-rays can be detected, thereby obtaining more accurate stress detection results, that is, the stress condition of the detection part of the object being tested.

[0087] Understandably, multiple detectors 41 are spaced apart around the X-ray travel path L and do not intersect with it. That is, the detectors 41 are not positioned on the X-ray travel path L to avoid the X-rays emitted from the X-ray source 3 being blocked by the detectors 41 and affecting stress detection. The area surrounded by the multiple detectors 41 is defined as the penetration zone 401 through which the X-rays pass. After passing through the penetration zone 401 without being blocked by the multiple detectors 41, the X-rays exit the housing 2 through the detection opening 202. Then, the X-rays are diffracted at the detection site of the object being measured, forming diffracted X-rays. The diffracted X-rays travel to the detection device 4, forming X-ray diffraction rings on the surface of the effective detection area 41a of the multiple detectors 41. Because there are gaps between the multiple detectors 41, the diffraction rings are usually discontinuous. The effective detection area 41a converts the diffracted X-rays incident on its surface into electrical signals and analyzes these electrical signals to determine the shape and size of the diffraction rings. Then, by analyzing the shape and size of the diffraction rings, the stress at the test site of the object can be determined.

[0088] In some embodiments, multiple detectors 41 can rotate around the travel path L of the X-ray source. Thus, the detectors 41 can detect diffracted X-rays that have traveled to the gap between the surfaces of the effective detection region 41a of the detector 41 before rotation, thereby detecting more diffracted X-rays and obtaining more accurate stress detection results.

[0089] In some embodiments, such as Figure 6a , Figure 6b , Figure 6c , Figure 6d as well as Figure 6e As shown, the surfaces of the effective detection areas 41a of multiple detectors 41 are located on the same plane, and the X-ray travel path L is perpendicular to this plane. That is, the surfaces of the effective detection areas 41a of multiple detectors 41 are all perpendicular to the X-ray travel path L, thereby ensuring that the diffracted X-rays form diffraction rings with their centers located on the X-ray travel path L on the surfaces of the effective detection areas 41a of multiple detectors 41, thus obtaining more accurate stress detection results.

[0090] In some embodiments, such as Figure 6f As shown, the surfaces of the effective detection areas 41a of the multiple detectors 41 are not coplanar. The area of ​​the surface of the effective detection area 41a that is far from the penetration area 401 is closer to the detection opening 202 than the area of ​​the surface of the effective detection area 41a that is adjacent to the penetration area 401. That is, at least one detector 41 is in a tilted state at this time. Figure 6f As shown in the figure, the surfaces of the effective detection areas 41a of the multiple detectors 41 are not coplanar, and the multiple detectors 41 are all in an inclined state.

[0091] In some embodiments, such as Figure 6a , 6b , Figure 6c , Figure 6d , Figure 6e , Figure 6f As shown, the surfaces of the effective detection areas 41a of the multiple detectors 41 are arranged in a rotationally symmetrical manner, and the rotation center of the surfaces of the effective detection areas 41a of the multiple detectors 41 is located in the X-ray travel path L.

[0092] In some embodiments, such as Figure 6a , Figure 6b , Figure 6c As shown, the surfaces of the effective detection areas 41a of the multiple detectors 41 are arranged in an axisymmetric manner, and the axis of symmetry of the surfaces of the effective detection areas 41a of the multiple detectors 41 intersects the X-ray travel path L.

[0093] In some embodiments, the number of detectors 41 is at least four, and the at least four detectors 41 are distributed at intervals around the X-ray travel path L. The specific interval distribution of the at least four detectors 41 can be set as needed, as long as it is possible to detect diffracted X-rays.

[0094] For ease of understanding, the following explanation uses the specific distribution of multiple detectors 41 as an example. However, this does not mean that the distribution of the same number of detectors 41 in the following specific example is limited to this distribution. The distribution can be adjusted as needed, as long as it can detect diffracted X-rays.

[0095] In some embodiments, such as Figure 6a As shown in the figure, there are four detectors 41. The surfaces of the effective detection areas 41a of the four detectors 41 are distributed around the X-ray travel path L, and the penetration area 401 is rectangular. The surfaces of the effective detection areas 41a of the four effective detectors 41 are arranged in a rotationally symmetric and axisymmetric manner, and the center of rotation is located at the X-ray travel path L and the axis of symmetry intersects the X-ray travel path L.

[0096] In some embodiments, such as Figure 6b As shown, there are six detectors 41, and the surfaces of the effective detection areas 41a of the six detectors 41 are distributed around the X-ray travel path L, at which point the penetration area 401 is rectangular. The surfaces of the effective detection areas 41a of the six detectors 41 are arranged in a rotationally symmetric and axisymmetric manner, and the center of rotation is located at the X-ray travel path L and the axis of symmetry intersects the X-ray travel path L.

[0097] In some embodiments, such as Figure 6cAs shown, there are six detectors 41. The surfaces of the effective detection areas 41a of the six detectors 41 are distributed at equal angles around the X-ray travel path L, and the penetration area 401 is in the shape of a regular hexagon. The surfaces of the effective detection areas 41a of the six detectors 41 are arranged in a rotationally symmetric and axisymmetric manner, and the center of rotation is located at the X-ray travel path L and the axis of symmetry intersects the X-ray travel path L.

[0098] In some embodiments, such as Figure 6d As shown, there are seven detectors 41. The surfaces of the effective detection areas 41a of the seven detectors 41 are distributed at equal angles around the X-ray travel path L, and the penetration area 401 has a regular heptagonal shape. The surfaces of the effective detection areas 41a of the seven detectors 41 are arranged in a rotationally symmetrical manner, and the center of rotation is located at the X-ray travel path L.

[0099] In some embodiments, such as Figure 4 and Figure 13 As shown, there are eight detectors 41. The surfaces of the effective detection areas 41a of the eight detectors 41 are arranged in a square around the X-ray travel path L, and the penetration area 401 is located in the geometric center region of the square. In this way, the gaps between the surfaces of the effective detection areas 41a of the detectors 41 are small, which is conducive to the detection of more diffracted X-rays (diffraction rings) and thus obtaining more accurate stress detection results.

[0100] In some embodiments, such as Figure 6e As shown, there are eight detectors 41. The surface of the effective detection area 41a of each detector 41 is rectangular, and the eight detectors 41 form four detection groups 42. Each detection group 42 includes two detectors 41, and the arrangement direction of the two detectors 41 in each detection group 42 is perpendicular to the arrangement direction of the two detectors 41 in the adjacent detection group 42. The surface of the effective detection area 41a of the eight detectors 41 is arranged in a square, and the penetration area 401 is located in the geometric center region of the square. In this way, the gaps between the surfaces of the effective detection areas 41a of the detectors 41 are small, which is conducive to the detection of more diffracted X-rays (diffraction rings), thereby obtaining more accurate stress detection results.

[0101] In some embodiments, the detection device 4 may include only one detector 41. In this case, the single detector 41 does not intersect the X-ray travel path L and can only detect a portion of the diffracted X-rays, that is, the diffracted X-rays form an X-ray diffraction arc on the surface of the effective detection area 41a of the single detector 41.

[0102] In some embodiments, such as Figure 7-9As shown, the diffraction stress analyzer 1 also includes an integrated plate 5 housed within a receiving cavity 201. The integrated plate 5 is located between the detection device 4 and the X-ray source 3, and multiple detectors 41 are mounted on the surface of the integrated plate 5 facing the detection opening 202. The integrated plate 5 has a first through-hole 51 for X-rays to pass through, and the X-rays pass through the first through-hole 51 before passing through the penetration area 401. The integrated plate 5 facilitates the centralized mounting and fixing of the multiple detectors 41 of the detection device 4, and ensures that the surfaces of the effective detection areas 41a of the multiple detectors 41 are on the same plane. During assembly, the multiple detectors 41 can be indirectly fixed by fixing the integrated plate 5, which improves the assembly efficiency of the diffraction stress analyzer 1.

[0103] In some embodiments, such as Figure 7-9 As shown, the diffraction stress analyzer 1 also includes a circuit board 6, which is housed within the receiving cavity 201. Multiple detectors 41 of the detection device 4 are electrically connected to the circuit board 6. The circuit board 6 has a through-hole 61, and the integrated board 5 is disposed within the through-hole 61. This eliminates the need for the integrated board 5 and the circuit board 6 to overlap, thereby reducing the space occupied by the integrated board 5 and the circuit board 6 in their thickness direction. This helps to reduce the height and volume of the diffraction stress analyzer 1.

[0104] In some embodiments, such as Figure 7-9 As shown, the diffraction stress analyzer 1 also includes a main support plate 7 housed within a receiving cavity 201. The main support plate 7 is located between the integrated plate 5, the circuit board 6, and the X-ray source 3, and is fixedly connected to the housing 2. Both the integrated plate 5 and the circuit board 6 are mounted on the surface of the main support plate 7 facing the detection opening 202; that is, both the circuit board 6 and the integrated plate 5 are mounted on the surface of the main support plate 7 facing away from the X-ray source 3. At this time, the detection device 4 is mounted on the surface of the main support plate 7 facing the detection opening 202 via the integrated plate 5. The main support plate 7 has a second through-hole 71 for X-rays to pass through. The X-rays pass through the second through-hole 71 before passing through the first through-hole 51. That is, when the X-ray source 3 emits X-rays, the X-rays first pass through the second through-hole 71 and then through the first through-hole 51, and then exit the housing 2 through the penetration zone 401. Thus, by fixing the main support plate 7 inside the housing 2, the integrated plate 5 and the circuit board 6 are indirectly fixed. During installation, the integrated board 5 and the circuit board 6 can be fixed to the main support plate 7 first, and then the main support plate 7 can be fixed inside the housing 2, which helps to improve assembly efficiency.

[0105] In some embodiments, such as Figure 7 and Figure 9As shown, the diffraction stress analyzer 1 also includes a thermally conductive insulating component 8, which is disposed between the main support plate 7 and the integrated plate 5, and covers the surface of the back-facing detection opening 202 of the integrated plate 5. The thermally conductive insulating component 8 has a third through-hole 81 for X-rays to pass through. X-rays pass through the third through-hole 81 after passing through the second through-hole 71 and before passing through the first through-hole 51; that is, X-rays pass through the second through-hole 71, the third through-hole 81, the first through-hole 51, and the penetration area 401 in sequence. The detector 41 of the detection device 4 generates heat during operation, causing the temperature to rise. If the temperature is too high, the detector 41 may not operate stably. The thermally conductive insulating component 8 not only ensures insulation between the integrated plate 5 and the main support plate 7 used to mount the detection device 4, but also conducts the heat generated by the detection device 4 (conducted from the integrated plate 5 to the thermally conductive insulating component 8) to the main support plate 7, where the heat is dissipated. This facilitates heat dissipation and cooling of the detection device 4, ensuring stable operation.

[0106] The thermally conductive insulating component 8 can be a thermally conductive silicone sheet or other thermally conductive insulating materials, depending on the specific requirements.

[0107] In some embodiments, such as Figure 7 and Figure 9 As shown, the diffraction stress analyzer 1 also includes a collimator 9, which is used to straighten the X-rays emitted by the X-ray source 3. In this embodiment, the collimator 9 includes a cylindrical portion 91 and a flange portion 92 connected to the outer periphery of one end of the cylindrical portion 91. The other end of the cylindrical portion 91 is further away from the X-ray source 3 than the first end of the cylindrical portion 91, and the other end of the cylindrical portion 91 is thinner than the first end of the cylindrical portion 91. Therefore, the X-rays emitted by the X-ray source 3 can be straightened into a thinner straight shape by the other end of the cylindrical portion 91. The flange portion 92 is mounted on the main support plate 7, and the cylindrical portion 91 sequentially passes through a second through hole 71, a third through hole 81, a first through hole 51, and a penetration area 401. In use, the X-rays emitted by the X-ray source 3 enter from one end of the cylindrical portion 91 of the collimator 9 and exit from the other end of the cylindrical portion 91. That is, the travel path of the X-rays passes through the cylindrical portion 91.

[0108] In some embodiments, such as Figure 9 As shown, the cylindrical portion 91 of the collimator 9 is provided with a lateral opening 911.

[0109] In some embodiments, such as Figure 9 As shown, the main support plate 7 also has a positioning recess 72, which is located on the surface of the back-facing detection opening 202 of the main support plate 7. The positioning recess 72 communicates with the second through hole 71, and the flange 92 abuts against the positioning recess 72. The abutment between the flange 92 and the positioning recess 72 facilitates rapid positioning and installation between the collimator 9 and the main support plate 7, thereby improving installation efficiency.

[0110] In some embodiments, such as Figure 9-10 As shown, the diffraction stress analyzer 1 also includes a calibration system 10, which includes an extension rod 101, as shown in the figure. Figure 11 and Figure 12 As shown, a calibration light source 1011 is installed at one end of the extension rod 101. Figure 11 and Figure 12 In this configuration, a calibration light source 1011 is mounted on the lower surface of an extension rod 101. In some embodiments, the calibration light source 1011 is a visible light source. The extension rod 101 is movable, allowing the calibration light source 1011 to move between a first position and a second position.

[0111] When the calibration light source 1011 moves to the first position, one end of the extension rod 101 and the calibration light source 1011 do not enter the cylindrical part 91 of the collimator 9 or leave the cylindrical part 91 through the lateral opening 911, and the calibration light source 1011 is not located in the X-ray travel path L.

[0112] When the calibration light source 1011 moves to the second position, one end of the extension rod 101 and the calibration light source 1011 can enter the cylindrical portion 91 through the lateral opening 911, and the calibration light source 1011 is located in the X-ray travel path L. When the calibration light source 1011 is located in the X-ray travel path L, the calibration light source 1011 can emit calibration light along the X-ray travel path L. At this time, the calibration light enters the cylindrical portion 91 and passes through the detection opening 202 to be directed towards the object to be tested. In this way, when the calibration light source 1011 emits calibration light along the X-ray travel path L, the position and orientation of the object to be tested relative to the diffraction stress analyzer 1 can be calibrated, ensuring that after calibration, the X-rays emitted by the X-ray source 3 can be directed towards the detection area of ​​the object to be tested along the travel path L, and ensuring that the detection device 4 can detect the diffracted X-rays.

[0113] In some embodiments, such as Figure 11 and Figure 12 As shown, the calibration system 10 also includes a drive mechanism 102 housed within the receiving cavity 201. The drive mechanism 102 is connected to the calibration light source 1011 and is used to drive the calibration light source 1011 to move. In this embodiment, the drive mechanism 102 is connected to the extension rod 101, and the drive mechanism 102 indirectly drives the calibration light source 1011 to move between a first position and a second position by driving the extension rod 101 to move.

[0114] In some embodiments, such as Figure 10As shown, the calibration system 10 also includes an image capturing device 103 housed in the receiving cavity 201. The housing 2 is provided with a capturing window 204. The image capturing device 103 is exposed through the capturing window 204. The image capturing device 103 is used to capture images of the object to be tested illuminated by the calibration light emitted by the calibration light source 1011.

[0115] Thus, when calibration is required, the extension rod 101 can be moved by the drive mechanism 102 to drive the calibration light source 1011 into the cylindrical part 91 through the side opening 911. At this time, the calibration light source 1011 is in the second position, and the calibration light source 1011 emits calibration light along the X-ray travel path L. At this time, the X-ray source 3 does not emit X-rays. The calibration light irradiates the detection area of ​​the object to be tested, forming a light spot. At this time, the image capturing device 103 captures the image of the object to be tested irradiated by the calibration light source 1011 and the light spot. By analyzing the image and the light spot, it can be determined whether the current position and orientation of the object to be tested relative to the diffraction stress analyzer 1 are conducive to stress detection. If it is not conducive to stress detection, the position and orientation of the object to be tested relative to the diffraction stress analyzer 1 are adjusted until they are conducive to stress detection. Subsequently, when stress detection of the object to be tested is required, the drive mechanism 102 drives the extension rod 101 to move, thereby driving the calibration light source 1011 to the first position. At this time, the calibration light source 1011 has already left the cylindrical part 91 through the lateral opening 911 and is no longer located in the X-ray travel path L. The X-ray source 3 is then activated. The X-rays emitted by the X-ray source 3 enter the cylindrical part 91 and pass through the detection opening 202 towards the object to be tested, where they are then diffracted to form diffracted X-rays. The detector 41 of the detection device 4 detects the diffracted X-rays, thereby determining the stress condition of the detection area of ​​the object.

[0116] In some embodiments, such as Figure 11 and Figure 12 As shown, the drive mechanism 102 includes a drive motor 1021, a lead screw 1022, and a driven part 1023. The output end of the drive motor 1021 is connected to one end of the lead screw 1022. The driven part 1023 connects the lead screw 1022 to the other end of the extension rod 101. The drive motor 1021 drives the lead screw 1022 to rotate, thereby driving the driven part 1023 to move. This causes the driven part 1023 to move the extension rod 101, which in turn moves the calibration light source 1011 between a first position and a second position.

[0117] In some embodiments, the driven part 1023 includes a connecting member 10231 and a transmission member 10232 connected to each other. The lead screw 1022 is connected to the transmission member 10232, and the connecting member 10231 is connected to the other end of the extension rod. In this embodiment, the transmission member 10232 is a block with a threaded hole, and the threaded hole of the block is screwed to the thread on the surface of the lead screw 1022, so that the block can be driven to move by the rotation of the lead screw 1022.

[0118] In some embodiments, the lead screw 1022 is directly connected to the other end of the extension rod 101. In this case, the driven part can be omitted. The extension rod 101 is provided with a threaded hole that is threaded to the surface of the lead screw 1022. The extension rod 101 is directly threaded to the lead screw 1022 through the threaded hole.

[0119] It should be noted that the drive mechanism 102 here is only an example of one case. The drive mechanism 102 can also be other structures, as long as it can drive the calibration light source 1011 to move between the first position and the second position.

[0120] For example, the drive mechanism 102 includes a drive motor 1021, a worm gear, a worm, and a drive block. The output end of the drive motor 1021 is connected to the worm gear, the worm is connected to the worm gear, the worm is connected to the drive block via a thread, and the drive block is connected to the other end of the extension rod 101. Thus, the drive motor 1021 drives the worm gear to rotate, thereby driving the worm to rotate, which in turn enables the drive block to move the extension rod 101 to change the position of the calibration light source 1011.

[0121] In some embodiments, such as Figure 11 and Figure 12 As shown, the calibration system 10 also includes a position detection device 104, which is used to detect whether the calibration light source 1011 has moved to a first position or a second position. In this embodiment, the position detection device 104 includes a shielding member 1041, a first infrared sensor 1042, and a second infrared sensor 1043, wherein the first infrared sensor 1042 is further away from the X-ray travel path L than the second infrared sensor 1043. The shielding member 1041 is connected to the connector 10231 of the driven part 1023, and the shielding member 1041 moves together with the connector 1023. When the shielding member 1041 shields the first infrared sensor 1042, the calibration light source 1011 moves to the first position; when the shielding member 1041 shields the second infrared sensor 1043, the calibration light source 1011 moves to the second position.

[0122] Thus, based on whether the infrared light emitted by the transmitting ends of the first infrared sensor 1042 and the second infrared sensor 1043 is received by the receiving end, the position of the blocking member 1041 can be determined, thereby indirectly determining whether the calibration light source 1011 has reached the first position or the second position.

[0123] In some embodiments, the blocking member 1041 may be connected to the extension rod 101 or the transmission member 1024 of the driven part, and move together with the extension rod 101 or the transmission member 1024 of the driven part.

[0124] In some embodiments, such as Figure 11 and Figure 12 As shown, the calibration system 10 also includes a mounting block 105, which is connected to the drive motor 1021 and to the other end of the lead screw 1022. In this way, the mounting block 105 can provide further support for the lead screw 1022, preventing the lead screw 1022 from bending due to suspension, which helps to improve the stability of the drive mechanism 102.

[0125] In some embodiments, such as Figure 11 and Figure 12 As shown, the calibration mechanism also includes at least one guide rod 106. In this embodiment, there are two guide rods 106. The two ends of the guide rods 106 are respectively connected to the two ends of the mounting block 105. The transmission member 1024 has the same number of guide holes 10241 as the guide rods 106, and the guide rods 106 pass through the guide holes 10241 respectively. In this way, under the action of the guide rods 106, it is beneficial to guide the directional movement of the transmission member 1024, thereby ensuring that the connecting member 1023 drives the extension rod 101 to move to drive the calibration light source 1011 to move stably between the first position and the second position.

[0126] Understandably, the drive mechanism 102 can be directly connected to the housing 2 or mounted on other parts (for example, the drive mechanism 102 can be directly or indirectly mounted on the main support plate 7), as long as the drive mechanism 102 can drive the calibration light source 1011 to move between the first position and the second position.

[0127] In some embodiments, such as Figure 11-13As shown, the diffraction stress analyzer 1 also includes a secondary support plate 11, which is connected to the main support plate 7, and the drive mechanism 102 is mounted on the secondary support plate 11. In this case, the drive mechanism 102 is mounted on the main support plate 7 at intervals via the secondary support plate 11. This facilitates the installation of the drive mechanism 102 onto the secondary support plate 11 before it is jointly installed onto the main support plate 7, thus improving assembly efficiency. In this embodiment, the drive mechanism 102 is mounted on the surface of the secondary support plate 11 facing the X-ray source 3, and the main support plate 7 has a through region 73, with at least a portion of the drive mechanism 102 located within the through region 73. This reduces the space occupied by the secondary support plate 11 and the drive mechanism 102 mounted on it in the thickness direction, which helps to reduce the height and volume of the diffraction stress analyzer 1.

[0128] Heat dissipation solution

[0129] X-ray source 3 generates heat during operation, causing the temperature to rise. If the temperature becomes too high, X-ray source 3 may not operate stably. In some embodiments, please refer again... Figure 8 and Figure 9 The diffraction stress analyzer 1 also includes a heat dissipation system 12, which is housed within the receiving cavity 201. The heat dissipation system 12 is used to dissipate heat from the X-ray source 3. In this way, the temperature of the X-ray source 3 can be reduced, ensuring that the X-ray source 3 operates stably.

[0130] In some embodiments, the heat dissipation system 12 includes a radiator 121 and a fan 122. The radiator 121 surrounds the X-ray source 3 and is used to dissipate heat from the X-ray source 3. The air outlet of the fan 122 faces the radiator 121. The radiator 121 has a first groove 121a for guiding airflow, and the fan 122 blows air into the first groove 121a. Thus, at least a portion of the air blown by the fan 122 towards the radiator 121 will flow along a predetermined path under the action of the first groove 121a, thereby carrying away the heat conducted from the X-ray source 3 to the radiator 121 and reducing the operating temperature of the X-ray source 3.

[0131] In some embodiments, such as Figure 8 As shown, the opening at one end of the first groove 121a faces the detection device 4. This facilitates the guidance of a portion of the air blown by the blower 122 toward the radiator 121 to the main support plate 7, thereby accelerating the airflow speed around the main support plate 7 and carrying away the heat generated by the detection device 4 and conducted to the main support plate 7 by the integrated plate 5 and the thermally conductive insulation component 8. This helps to dissipate heat and cool down the detection device 4, reducing the risk of overheating during operation and ensuring the stable operation of the diffraction stress analyzer.

[0132] In some embodiments, such as Figure 8 As shown, the diffraction stress analyzer 1 also includes a power module 13 housed within the receiving cavity 201. The power module 13 is electrically connected to the X-ray source 3 and supplies power to the X-ray source 3. The X-ray source 3 and the heat dissipation system 12 are both located between the power module 13 and the main support plate 7. The opening at the other end of the first groove 121a faces the power module 13. Thus, under the action of the first groove 121a, a portion of the air blown by the blower 122 toward the heat sink 121 is guided to the power module 13, thereby accelerating the airflow speed around the power module 13, carrying away the heat generated by the power module 13 during operation, which is beneficial for heat dissipation and cooling of the power module 13, reducing the risk of overheating during operation, and ensuring stable operation of the power module 13.

[0133] In some embodiments, the power module 13 is disposed outside the housing 2 and is not housed within the receiving cavity 201. In this case, the volume of the housing 2 can be further reduced.

[0134] In some embodiments, the power module 13 may be an adapter that converts external voltage into the operating voltage of the X-ray source 3, or it may be an energy storage device, such as a lithium battery.

[0135] In some embodiments, such as Figure 8 and Figure 9 As shown, the radiator 121 also has a second groove 121b for guiding airflow. The second groove 121b is intersecting and communicating with the first groove 121a, and the blower 122 is also used to blow air into the second groove 121b. Thus, under the combined action of the first groove 121a and the second groove 121b, it is beneficial to direct the air blown by the blower 122 toward the radiator 121 in multiple directions, thereby accelerating the removal of heat conducted from the X-ray source 3 to the radiator 121 and accelerating the reduction of the temperature of the X-ray source 3 during operation.

[0136] It should be noted that the specific shape and structure of the heat sink 121 can be set according to needs, as long as it can achieve the purpose of heat dissipation for the X-ray source 3. For example, the heat sink 121 can be set into an arch shape, a C-shape, or other shapes.

[0137] In some embodiments, such as Figure 9As shown, the heat sink 121 includes a cover portion 1211 and a fin portion 1212. The cover portion 1211 covers the X-ray source 3, and the fin portion 1212 includes multiple fins for heat dissipation. The multiple fins are disposed on the surface of the cover portion facing away from the X-ray source 3, and the gaps between the multiple fins form a first groove 121a and a second groove 121b. In this embodiment, the cover portion 1211 is arched in shape. By utilizing the multiple first grooves 121a and second grooves 121b constructed by the fin portion 1212, the air delivered by the blower 122 can be directed in multiple directions to improve heat dissipation efficiency.

[0138] In some embodiments, there are two blowers 122, and the two blowers 122 are respectively located on opposite sides of the radiator 121. The air outlets of both blowers 122 face the radiator 121. Under the combined action of the two blowers 122, the heat conducted from the X-ray source 3 to the radiator 121 can be removed more quickly, and under the guidance of the first groove 121a, the power module 13 and the main support plate 7 can be cooled simultaneously.

[0139] In some embodiments, the diffraction stress analyzer 1 further includes a first support plate (not shown) and a second support plate (not shown). One end of the first support plate is connected to the main support plate 7, and the other end of the first support plate is connected to one end of the second support plate. The other end of the second support plate is connected to the housing 2. The power module 13 is provided on the second support plate, which serves to support the power module 13 and enhance the overall strength of the diffraction stress analyzer 1, reducing the risk of damage to the X-ray source 3 by external forces.

[0140] In some embodiments, please refer again Figure 1 The diffraction stress analyzer 1 also includes a display screen 16, which is housed within a receiving cavity 201 and connected to the housing 2. The display screen 16 is electrically connected to the circuit board 6. The housing 2 has a through display opening 203 through which the display screen 16 is exposed. The display screen 16 is used to display various parameters of the diffraction stress analyzer 1 during operation.

[0141] In some embodiments, please refer again Figure 7 The diffraction stress analyzer 1 also includes a main control board 17, which is housed in the receiving cavity 201 and connected to the housing 2. The main control board 17 is electrically connected to the power module 13, the X-ray source 3 and the blower 122 respectively. The main control board 17 is used to control the power module 13 to supply power to the X-ray source 3 and to control the power of the blower 122.

[0142] In some embodiments, please refer again Figure 1 , Figure 2 and Figure 7The diffraction stress analyzer 1 also includes a working indicator light 18 and an emergency stop switch 19. Both the working indicator light 18 and the emergency stop switch 19 are electrically connected to the main control board 17 and are located on the outer surface of the housing 2. The working indicator light 18 is used to indicate whether the diffraction stress analyzer 1 is in working condition, and the emergency stop switch 19 is used to stop the diffraction stress analyzer 1 from working in an emergency.

[0143] In some embodiments, please refer to Figure 1-2 The diffraction stress analyzer 1 also includes a handle 20, which is connected to the housing 2. The handle 20 makes it convenient for users to carry the diffraction stress analyzer 1.

[0144] In some embodiments, please refer to Figure 1-2 The diffraction stress analyzer 1 also includes a robotic arm 30, one end of which is connected to the housing 2, and the other end of which can be connected to a wall, floor, or table to provide support for the housing 2. By adjusting the robotic arm 30, the irradiation direction of the X-rays emitted by the X-ray source 3 inside the housing 2 can be adjusted, thereby performing stress detection on multiple detection points of the object to be tested.

[0145] This application provides a diffraction stress analyzer 1, comprising a housing 2, an X-ray source 3, and a detection device 4. The housing 2 has a receiving cavity 201 and a detection opening 202, with the detection opening 202 communicating with the receiving cavity 201. The X-ray source 3 is housed within the receiving cavity 201 and emits X-rays into the detection opening 202. The X-rays are emitted outside the housing 2 through the detection opening 202 and are diffracted to form diffracted X-rays. The detection device 4 is housed within the receiving cavity 201 and exposed through the detection opening 202. The detection device 4 detects the diffracted X-rays and converts them into electrical signals. Thus, the detection device 4 can directly detect diffracted X-rays and convert them into electrical signals, thereby quickly determining the stress condition of the detected part of the object, shortening the stress detection time, and improving the efficiency of stress detection.

[0146] The above are merely embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A diffraction stress analyzer, characterized in that, include: The housing has a receiving cavity and a detection opening, the detection opening being in communication with the receiving cavity; An X-ray source is housed within the receiving cavity. The X-ray source is used to emit X-rays toward the detection opening, wherein the X-rays are emitted outside the housing through the detection opening and are diffracted to form diffracted X-rays. The detection device is housed within the receiving cavity and exposed through the detection opening. The detection device is used to detect the diffracted X-rays and convert the diffracted X-rays into electrical signals.

2. The diffraction stress analyzer according to claim 1, characterized in that, The detection device includes multiple detectors spaced apart from and not intersecting the X-ray's path of travel. The X-ray's path of travel is the path it takes from its emission from the X-ray source to its diffraction. The area surrounded by the plurality of detectors is the penetration zone through which the X-rays pass. The surfaces of the effective detection areas of the plurality of detectors are all facing the detection opening and exposed through the detection opening. The effective detection area is used to detect the diffracted X-rays.

3. The diffraction stress analyzer according to claim 2, characterized in that, The plurality of detectors are capable of rotating around the path of the X-rays.

4. The diffraction stress analyzer according to claim 2, characterized in that, The detection device includes at least four detectors.

5. The diffraction stress analyzer according to claim 2, characterized in that, The surfaces of the effective detection areas of the multiple detectors are arranged in a rotationally symmetrical manner, and the rotation center of the surfaces of the effective detection areas of the multiple detectors is located in the path of the X-ray.

6. The diffraction stress analyzer according to claim 2, characterized in that, The effective detection areas of the multiple detectors are located on the same plane, and the X-ray travel path is perpendicular to the plane.

7. The diffraction stress analyzer according to claim 2, characterized in that, The surfaces of the effective detection areas of the multiple detectors are arranged in an axisymmetric manner, and the axis of symmetry of the surfaces of the effective detection areas of the multiple detectors intersects the travel path of the X-rays.

8. The diffraction stress analyzer according to any one of claims 2 to 7, characterized in that, The detection device includes eight detectors, the surfaces of the effective detection areas of the eight detectors are arranged in a square, and the penetration area is located in the geometric center region of the square.

9. The diffraction stress analyzer according to any one of claims 2 to 6, characterized in that, The detection device includes eight detectors, which form four detection groups. Each detection group includes two detectors. The arrangement direction of the two detectors in each detection group is perpendicular to the arrangement direction of the two detectors in the adjacent detection group. The surface of the effective detection area of ​​the eight detectors is arranged in a square, and the penetration area is located in the geometric center region of the square.

10. The diffraction stress analyzer according to any one of claims 2 to 5, characterized in that, The surfaces of the effective detection areas of the multiple detectors are not coplanar, and the area of ​​the surface of the effective detection area that is far from the penetration area is closer to the detection opening than the area of ​​the surface of the effective detection area that is adjacent to the penetration area.

11. The diffraction stress analyzer according to claim 2, characterized in that, The diffraction stress analyzer also includes an integrated plate housed within the receiving cavity, and the plurality of detectors of the detection device are mounted on the surface of the integrated plate facing the detection opening, wherein the integrated plate is provided with a first through hole for the X-rays to pass through, and the X-rays pass through the first through hole before passing through the penetration zone.

12. The diffraction stress analyzer according to claim 11, characterized in that, The diffraction stress analyzer also includes a circuit board housed within the receiving cavity, and the plurality of detectors of the detection device are electrically connected to the circuit board. The circuit board has a through-hole, and the integrated board is disposed within the through-hole of the circuit board.

13. The diffraction stress analyzer according to claim 12, characterized in that, The diffraction stress analyzer also includes a main support plate housed within the receiving cavity. The integrated plate and the circuit board are both mounted on the surface of the main support plate facing the detection opening. The main support plate is provided with a second through hole for the X-ray to pass through, and the X-ray passes through the second through hole before passing through the first through hole.

14. The diffraction stress analyzer according to claim 13, characterized in that, The diffraction stress analyzer also includes a thermally conductive insulating component, which is disposed between the main support plate and the integrated plate, and covers the surface of the integrated plate facing away from the detection opening. The thermally conductive insulating component is provided with a third through hole for the X-ray to pass through, and the X-ray passes through the second through hole, the third through hole, the first through hole and the penetration area in sequence.

15. The diffraction stress analyzer according to claim 13, characterized in that, The diffraction stress analyzer also includes a collimator for adjusting the X-rays emitted by the X-ray source into a straight line. The collimator includes a cylindrical portion and a flange portion connected to the outer periphery of one end of the cylindrical portion. The other end of the cylindrical portion is further away from the X-ray source than one end of the cylindrical portion. The flange portion is mounted on the main support plate, and the cylindrical portion sequentially passes through the second through hole, the first through hole, and the penetration area, through which the X-rays pass.

16. The diffraction stress analyzer according to claim 15, characterized in that, The main support plate is also provided with a positioning recess, which is located on the surface of the main support plate opposite to the detection opening. The positioning recess is connected to the second through hole, and the flange abuts against the positioning recess.

17. The diffraction stress analyzer according to claim 15, characterized in that, The diffraction stress analyzer also includes a thermally conductive insulating component, which is disposed between the main support plate and the integrated plate, and covers the surface of the integrated plate opposite to the detection opening. The thermally conductive insulating component is provided with a third through hole for the X-ray to pass through. The cylindrical part is sequentially provided with the second through hole, the third through hole, the first through hole, and the penetration area, and the X-ray passes through the cylindrical part.

18. The diffraction stress analyzer according to claim 15, characterized in that, The collimator's cylindrical portion is provided with a lateral opening; The diffraction stress analyzer also includes a calibration system, which includes a calibration light source. The calibration light source can enter the cylindrical portion through the lateral opening or exit the cylindrical portion through the lateral opening. When the calibration light source is located inside the cylindrical portion, the calibration light source can emit calibration light along the travel path of the X-rays.

19. The diffraction stress analyzer according to claim 1, characterized in that, It also includes a power module, which is housed within the receiving cavity or disposed outside the housing, and is electrically connected to the X-ray source for supplying power to the X-ray source.

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