A robot chip radiator helium detection tooling

Abstract

The application relates to the technical field of helium detection tooling equipment, in particular to a robot chip radiator helium detection tooling which comprises a pressure block and a pressure plate, the pressure block is connected with a loading plate, the loading plate is provided with a profiling groove matched with a robot chip, the loading plate is provided with a lifting plate, the pressure plate is connected with a stand, the stand is connected with a mounting plate, the mounting plate is provided with a lifting assembly used for driving the lifting plate to lift, a butt joint block used for butt joining a through hole on the robot chip is arranged below the lifting plate, the butt joint block is provided with an inverted L-shaped air hole, the air hole penetrates through the bottom and the side wall of the butt joint block, the bottom of the butt joint block is embedded with a sealing ring, the butt joint block is provided with an embedding groove for embedding the sealing ring, the sealing ring is arranged along the circumference of the air hole, and an elastic buffer assembly is arranged between the butt joint block and the lifting plate. The application has the effect of improving the problems that the clamping tooling is loose when clamping the robot chip, the pressure joint is prone to deformation, and the sealing performance is poor.

Description

Technical Field

[0001] This utility model relates to the technical field of helium testing equipment, and in particular to a helium testing fixture for a robot chip heat sink. Background Technology

[0002] High-density heterogeneous integrated chips are widely used in the manufacturing of key components such as core controllers and servo drives for high-end robots due to their powerful computing and real-time control capabilities. These chips consume hundreds of watts of power during operation and must rely on a metal heat sink substrate (usually made of copper or aluminum) for forced heat dissipation. To ensure the long-term reliability of the chips in harsh industrial environments, the chip-heat sink packaging interface must have extremely high hermeticity.

[0003] like Figure 1 The robot chip shown includes a package box containing the chip and an irregularly shaped fin structure. Through holes connecting the chip to the interior are located at both ends of the top of the package box. Currently, due to the structure of this robot chip, conventional clamping fixtures experience problems such as loose clamping, easy deformation at the crimp joint, and poor sealing when holding it. Utility Model Content

[0004] To address the issues of loose clamping, easy deformation at the crimping point, and poor sealing when using clamping fixtures to hold robot chips, this application provides a helium inspection fixture for robot chip heat sinks.

[0005] The helium detection fixture for a robot chip heat sink provided in this application adopts the following technical solution: A helium detection fixture for a robot chip heat sink includes a pressure block and pressure plates symmetrically arranged on both sides of the pressure block. A loading plate is connected to the pressure block, and the loading plate has a contoured groove adapted to the robot chip. A lifting plate is provided on the loading plate, and a column is connected to the pressure block. A mounting plate is connected to the column, and a lifting assembly for driving the lifting plate to move up and down is provided on the mounting plate. A docking block for docking with a through hole on the robot chip is provided below the lifting plate. An inverted L-shaped air hole is provided on the docking block, penetrating the bottom and side wall of the docking block. A sealing ring is embedded in the bottom of the docking block, and a groove for embedding the sealing ring is provided on the docking block. The sealing ring is arranged circumferentially along the opening of the air hole. An elastic buffer assembly is provided between the docking block and the lifting plate.

[0006] Preferably, the lifting assembly is a push cylinder, which is mounted on a mounting plate. The piston rod of the push cylinder passes through the end of the mounting plate and is connected to a connecting plate. The connecting plate is connected to the lifting plate.

[0007] Preferably, the elastic buffer assembly includes an adjusting bolt and a buffer spring. The adjusting bolt is connected between the docking block and the lifting plate. The lifting plate has a blind hole for the adjusting bolt to pass through. The docking block has a threaded hole for the adjusting bolt to connect to. The buffer spring is sleeved on the outside of the adjusting bolt. One end of the buffer spring abuts against the docking block, and the other end abuts against the lifting plate.

[0008] Preferably, a guide rod is fixedly connected to the lifting plate, the guide rod is arranged in a direction perpendicular to the lifting plate, and a guide rod is provided at each of the four corners of the lifting plate. A linear bearing is connected to the mounting plate, and the guide rod passes through the linear bearing.

[0009] In summary, this application includes the following beneficial technical effects: This utility model provides a helium testing fixture for a robot chip heat sink. Through a contoured groove on the loading plate, the fixture can precisely fit the irregular structure of the robot chip. A lifting assembly drives the lifting plate to descend, pressing the mating block onto the robot chip. During this process, an elastic buffer assembly cushions the impact force of the mating block's downward pressure, achieving a flexible clamping effect. The sealing ring at the bottom of the mating block adaptively fits around the through-hole of the robot chip, ensuring high airtightness between the mating block and the robot chip during helium testing. This effectively improves the problems of loose clamping, easy deformation at the pressing joint, and poor sealing that often occur when clamping robot chips. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of the robot chip in the background art of this application; Figure 2 This is a schematic diagram of the structure of the helium detection tooling for the robot chip heat sink in this embodiment of the application; Figure 3 This is a schematic diagram illustrating the sealing ring in an embodiment of this application.

[0011] Explanation of reference numerals in the attached drawings: 1. Pressure block; 11. Loading plate; 2. Pressure plate; 21. Column; 22. Mounting plate; 221. Linear bearing; 23. Lifting assembly; 231. Connecting plate; 3. Lifting plate; 31. Guide rod; 4. Connecting block; 41. Air hole; 42. Sealing ring; 5. Buffer elastic assembly; 51. Adjusting bolt; 52. Buffer spring. Detailed Implementation

[0012] To enable those skilled in the art to better understand the present invention, the solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0013] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation or specific orientation structure and operation, and therefore should not be construed as a limitation of this utility model; the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In addition, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0014] This application discloses a helium detection fixture for a robot chip heat sink. (Refer to...) Figure 2 and Figure 3 The robot chip heat sink helium inspection fixture includes a pressure block 1 and pressure plates 2 symmetrically arranged on both sides of the pressure block 1. A loading plate 11 is connected to the pressure block 1. The loading plate 11 has a contoured groove adapted to the robot chip. A lifting plate 3 is provided on the loading plate 11. A column 21 is connected to the pressure plate 2. A mounting plate 22 is connected to the column 21. A lifting assembly 23 for driving the lifting plate 3 to rise and fall is provided on the mounting plate 22. A docking block 4 for docking with the through hole on the robot chip is provided below the lifting plate 3. An inverted L-shaped air hole 41 is provided on the docking block 4. The air hole 41 penetrates the bottom and side wall of the docking block 4. A sealing ring 42 is embedded in the bottom of the docking block 4. A groove for the sealing ring 42 to be embedded is provided on the docking block 4. The sealing ring 42 is arranged circumferentially along the opening of the air hole 41. An elastic buffer assembly is provided between the docking block 4 and the lifting plate 3.

[0015] The lifting assembly 23 is a push cylinder, which is mounted on the mounting plate 22. The piston rod of the push cylinder passes through the end of the mounting plate 22 and is connected to the connecting plate 231. The connecting plate 231 is connected to the lifting plate 3.

[0016] The elastic buffer assembly includes an adjusting bolt 51 and a buffer spring 52. The adjusting bolt 51 is connected between the docking block 4 and the lifting plate 3. The lifting plate 3 has a blind hole for the adjusting bolt 51 to pass through. The docking block 4 has a threaded hole for the adjusting bolt 51 to connect to. The buffer spring 52 is sleeved on the outside of the adjusting bolt 51. One end of the buffer spring 52 abuts against the docking block 4, and the other end abuts against the lifting plate 3.

[0017] Adjusting the distance between the mating block 4 and the lifting plate 3 by turning the adjusting bolt 51 allows for adjustment of the pre-compression of the buffer spring 52. The pre-tightening force of the buffer spring 52 can be adjusted to match the chip. When the lifting plate 3 is pressed down, the buffer spring 52 can absorb some of the pressure, preventing the mating block 4 from applying a rigid impact to the chip through hole, and significantly reducing the risk of chip or package deformation due to overload at the crimping point.

[0018] A guide rod 31 is fixedly connected to the lifting plate 3. The guide rod 31 is set in a direction perpendicular to the lifting plate 3. There is one guide rod 31 at each of the four corners of the lifting plate 3. A linear bearing 221 is connected to the mounting plate 22. The guide rod 31 passes through the linear bearing 221.

[0019] By setting guide rod 31 and linear bearing 221, the lifting plate 3 is ensured to move strictly vertically under the drive of the push cylinder, ensuring that the docking block 4 and the chip through hole are accurately aligned coaxially, further enhancing sealing reliability and operational repeatability.

[0020] The implementation principle of the helium testing fixture for a robot chip heat sink in this application embodiment is as follows: During operation, the fixture is placed in a vacuum test chamber, and the operator places the robot chip in the contour groove of the loading plate 11. Then, the lifting plate 3 is driven to descend by the driving component. The lifting plate 3 drives the docking block 4 to press down the chip, so that the air hole 41 of the docking block 4 is connected with the through hole on the chip.

[0021] When testing for air tightness, helium gas is introduced through the air hole 41 on the docking block 4 at one end and helium gas is output through the air hole 41 on the docking block 4 at the other end. During this process, the amount of helium gas passing through is detected by an external testing instrument, and the presence of helium gas molecules is detected by a helium gas sensor in the vacuum test chamber. If helium gas molecules are present, the chip is considered defective; if not, the chip is considered qualified.

[0022] Finally, it should be noted that the above description is only a preferred embodiment of this utility model, and the protection scope of this utility model is not limited to the above embodiments. All technical solutions within the scope of this utility model's concept are within the protection scope of this utility model. It should be pointed out that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A helium detection fixture for a robot chip heat sink, characterized in that: The system includes a pressure block (1) and pressure plates (2) symmetrically arranged on both sides of the pressure block (1). A loading plate (11) is connected to the pressure block (1). The loading plate (11) has a contoured groove adapted to the robot chip. A lifting plate (3) is provided on the loading plate (11). A column (21) is connected to the pressure plate (2). A mounting plate (22) is connected to the column (21). A lifting assembly (23) for driving the lifting plate (3) to rise and fall is provided on the mounting plate (22). Below the lifting plate (3) is a docking block (4) with a through hole on the robot chip. The docking block (4) has an inverted L-shaped air hole (41) that penetrates the bottom and side wall of the docking block (4). A sealing ring (42) is embedded in the bottom of the docking block (4). The docking block (4) has a groove for the sealing ring (42) to be embedded. The sealing ring (42) is arranged around the opening of the air hole (41). An elastic buffer assembly is provided between the docking block (4) and the lifting plate (3).

2. The helium detection fixture for a robot chip heat sink according to claim 1, characterized in that: The lifting assembly (23) is a push cylinder, which is mounted on the mounting plate (22). The piston rod of the push cylinder passes through the end of the mounting plate (22) and is connected to a connecting plate (231). The connecting plate (231) is connected to the lifting plate (3).

3. The helium detection fixture for a robot chip heat sink according to claim 1, characterized in that: The elastic buffer assembly includes an adjusting bolt (51) and a buffer spring (52). The adjusting bolt (51) is connected between the docking block (4) and the lifting plate (3). The lifting plate (3) has a blind hole through which the adjusting bolt (51) passes. The docking block (4) has a threaded hole for the adjusting bolt (51) to be connected. The buffer spring (52) is sleeved on the outside of the adjusting bolt (51). One end of the buffer spring (52) abuts against the docking block (4), and the other end abuts against the lifting plate (3).

4. The helium detection fixture for a robot chip heat sink according to claim 1, characterized in that: A guide rod (31) is fixedly connected to the lifting plate (3). The guide rod (31) is arranged in a direction perpendicular to the lifting plate (3). The guide rod (31) is provided at each of the four corners of the lifting plate (3). A linear bearing (221) is connected to the mounting plate (22). The guide rod (31) passes through the linear bearing (221).

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