Anti-blocking device for oxygen content sampling of reflow soldering equipment

Abstract

The utility model discloses a kind of oxygen content sampling anti-blocking devices for reflow soldering equipment, including airflow transition pipe, storage box and quick-release clamp;The first end of the airflow transition pipe is used to connect with furnace, and the second end of airflow transition pipe is connected with storage box by quick-release clamp, the first end of the airflow transition pipe is equipped with multiple layers of cross flow channel, the second end of the airflow transition pipe is equipped with gas outlet pipe joint, the gas outlet pipe joint is connected with sampling pipeline, and sampling pipeline is connected with oxygen analyzer by filter.Its advantage is effectively prevent soldering paste volatile, flux residue and other small particles from depositing and accumulating in sampling pipeline, ensure that sampling pipeline is unobstructed, so as to guarantee the stable operation of gas sampling system.

Description

Technical Field

[0001] This utility model relates to the field of SMT reflow soldering equipment technology, and in particular to an oxygen content sampling and anti-clogging device for reflow soldering equipment. Background Technology

[0002] In reflow soldering, nitrogen is added to the furnace to reduce the oxygen concentration. To detect the oxygen content, the gas is output through a sampling line and then analyzed by an oxygen analyzer. However, during the gas output process, tiny particles such as solder paste volatiles and flux residues may be present. These particles easily deposit and accumulate in the sampling line, causing the line's inner diameter to narrow or even completely blockage, affecting the normal operation of the oxygen sampling system. Furthermore, traditional sampling systems lack effective anti-clogging mechanisms in their structural design, leading to increased equipment maintenance frequency, reduced production efficiency, and the risk of inaccurate sampling affecting welding quality. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide an oxygen content sampling and anti-clogging device for reflow soldering equipment, which addresses the shortcomings of the existing technology.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution.

[0005] An oxygen content sampling and anti-clogging device for reflow soldering equipment includes an airflow transition pipe, a storage box, and a quick-release clamp. The first end of the airflow transition pipe is connected to the furnace, and the second end of the airflow transition pipe is connected to the storage box via a quick-release clamp. The first end of the airflow transition pipe has multiple layers of cross-flow channels, and the second end of the airflow transition pipe has an outlet pipe connector. The outlet pipe connector is connected to a sampling pipeline, and the sampling pipeline is connected to an oxygen analyzer via a filter.

[0006] A preferred embodiment is that the airflow transition pipe has an arc-shaped structure, and the airflow transition pipe is provided with multiple layers of staggered baffles, which form multiple layers of cross flow channels.

[0007] A preferred embodiment is that the multi-layered crossflow channel is S-shaped.

[0008] A preferred embodiment is that the inner wall of the quick-release clamp is provided with a sealing ring. When the end face of the storage box is fixed to the second end of the airflow transition pipe by the quick-release clamp, the outer wall of the storage box is sealed to the outer wall of the second end of the airflow transition pipe.

[0009] This utility model provides an oxygen content sampling and anti-clogging device for reflow soldering equipment, which has at least the following beneficial effects: Gas enters the furnace from the first end of the gas flow transition pipe. Because the density of solder paste volatiles and flux residues is greater than that of nitrogen, these substances flow into the collection box after passing through multiple cross-flow channels. Nitrogen and oxygen flow towards the outlet pipe connector, and the gas flow through the outlet pipe connector is directed to the filter and oxygen analyzer. By optimizing the trajectory and sedimentation path of solder paste volatiles and flux residues, they are adsorbed on the multiple cross-flow channels and flow into the collection box. When equipment maintenance is required, the collection box can be quickly removed for cleaning and maintenance using quick-release clamps. This effectively prevents the deposition and accumulation of tiny particles such as solder paste volatiles and flux residues in the sampling pipeline, ensuring unobstructed flow and thus guaranteeing the stable operation of the gas sampling system. Simultaneously, this device reduces equipment maintenance frequency, improves production efficiency, and avoids adverse effects on soldering quality caused by inaccurate sampling.

[0010] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0011] Figure 1 This is a perspective view of the present invention connected to the furnace chamber;

[0012] Figure 2 This is the front view of this utility model;

[0013] Figure 3 This is a top view of the present invention;

[0014] Figure 4 This is the right view of the present invention;

[0015] Figure 5 This is an exploded view of this utility model. Detailed Implementation

[0016] To illustrate the ideas and objectives of this application, the following description will be provided in conjunction with the accompanying drawings and specific embodiments.

[0017] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," "left," "right," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0018] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0019] like Figures 1 to 5 As shown, an oxygen content sampling anti-clogging device for reflow soldering equipment includes an airflow transition pipe 10, a storage box 20, and a quick-release clamp 30. The first end of the airflow transition pipe 10 is connected to the furnace 40, and the second end of the airflow transition pipe 10 is connected to the storage box 20 through the quick-release clamp 30. The first end of the airflow transition pipe 10 is provided with multiple cross-flow channels 11, and the second end of the airflow transition pipe 10 is provided with an outlet pipe connector 12. The outlet pipe connector 12 is connected to a sampling pipe 13, and the sampling pipe 13 is connected to an oxygen analyzer 15 through a filter 14.

[0020] like Figures 1 to 5 As shown, gas enters the furnace 40 from the first end of the gas flow transition pipe 10. Since the density of solder paste volatiles and flux residues is greater than that of nitrogen and oxygen, these substances flow into the collection box 20 after passing through multiple cross-flow channels 11. Nitrogen and oxygen flow towards the outlet pipe connector 12, and then through the outlet pipe connector 12 to the filter 14 and oxygen analyzer 15. By optimizing the trajectory and sedimentation path of solder paste volatiles and flux residues, they are adsorbed onto the multiple cross-flow channels 11 and flow into the collection box 20. When equipment maintenance is required, the collection box 20 can be quickly removed for cleaning and maintenance using the quick-release clamp 30. This effectively prevents the deposition and accumulation of small particles such as solder paste volatiles and flux residues in the sampling pipeline 13, ensuring unobstructed flow and thus guaranteeing the stable operation of the gas sampling system. Simultaneously, this device reduces equipment maintenance frequency, improves production efficiency, and avoids adverse effects on welding quality caused by inaccurate sampling.

[0021] like Figures 1 to 5 As shown, the airflow transition pipe 10 has an arc-shaped structure, and multiple layers of staggered baffles 111 are provided inside the airflow transition pipe 10, forming multiple layers of cross-flow channels 11. Solder paste volatiles and flux residues flow into the collection box 20 after passing through the multiple layers of cross-flow channels 11, while nitrogen, oxygen, and other gas flows to the outlet pipe joint 12. The multiple layers of staggered baffles 111 are located at the arc of the airflow transition pipe 10.

[0022] like Figures 1 to 5 As shown, the multi-layer crossflow channel 11 is S-shaped. Solder paste volatiles and flux residues flow into the collection box 20 after passing through the multi-layer crossflow channel 11.

[0023] like Figures 1 to 5 As shown, the quick-release clamp 30 has a sealing ring 31 on its inner wall. When the end face of the storage box 20 is fixed to the second end of the airflow transition pipe 10 by the quick-release clamp 30, the outer wall of the storage box 20 is sealed to the outer wall of the second end of the airflow transition pipe 10. Solder paste volatiles and flux residues flow into the storage box 20 as they pass through the multi-layer crossflow channel 11, while nitrogen, oxygen, and other gases flow to the sampling pipeline 13 through the gas outlet connector 12 and finally enter the oxygen analyzer 15. The sealing ring 31 acts as a seal to ensure that the gas does not leak. When equipment maintenance is required, the storage box 20 can be quickly removed by the quick-release clamp 30 for cleaning and maintenance.

[0024] The above are specific embodiments of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.

Claims

1. An oxygen content sampling and anti-clogging device for reflow soldering equipment, characterized in that, It includes an airflow transition pipe, a storage box, and a quick-release clamp; the first end of the airflow transition pipe is used to connect to the furnace, and the second end of the airflow transition pipe is connected to the storage box through a quick-release clamp. The first end of the airflow transition pipe is provided with multiple cross-flow channels, and the second end of the airflow transition pipe is provided with an outlet pipe connector. The outlet pipe connector is connected to a sampling pipe, and the sampling pipe is connected to an oxygen analyzer through a filter.

2. The oxygen content sampling and anti-clogging device for reflow soldering equipment according to claim 1, characterized in that, The airflow transition pipe has an arc-shaped structure, and multiple layers of staggered baffles are provided inside the airflow transition pipe, forming multiple layers of cross flow channels.

3. The oxygen content sampling and anti-clogging device for reflow soldering equipment according to claim 1, characterized in that, The multi-layered crossflow channel is S-shaped.

4. The oxygen content sampling and anti-clogging device for reflow soldering equipment according to claim 1, characterized in that, The sampling pipeline is connected to the oxygen analyzer via a filter.

5. The oxygen content sampling and anti-clogging device for reflow soldering equipment according to claim 1, characterized in that, The quick-release clamp has a sealing ring on its inner wall. When the end face of the storage box is fixed to the second end of the airflow transition pipe by the quick-release clamp, the outer wall of the storage box is sealed to the outer wall of the second end of the airflow transition pipe.

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