An in-situ pressure loading and measuring device

CN224667459UActive Publication Date: 2026-08-21INST OF INTELLIGENT MFG GUANGDONG ACAD OF SCI
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Patent Information

Application Number
CN202521845616.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-28
Publication Date
2026-08-21
Estimated Expiration
2035-08-28

AI Technical Summary

Technical Problem

[0003]然而,传统的互连可靠性评估方法存在明显局限

Benefits of technology

[0024] In the bottom sample adjustable fixing module, the first and second lower crossbeams are adjusted by moving horizontally on the bottom plate slide rail via crossbeam locking blocks. The sample clamp can be adjusted in position on the crossbeams, which can adapt to and clamp samples of different sizes, thereby improving the device's compatibility with samples of different specifications.

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Abstract

The utility model discloses an in situ pressure loading and measuring device belongs to integrated circuit measurement technical field, including bottom plate, in situ device body, in situ device body sets up on bottom plate, in situ device body includes in situ box body shell, bottom sample adjustable fixed module and upper layer pressure loading and measuring module, in situ box body shell sets up on bottom plate, and bottom sample adjustable fixed module sets up in situ box body shell and is fixed on carbon fiber bottom plate area of bottom plate, and upper layer pressure loading and measuring module sets up bottom sample adjustable fixed module's top, bottom sample adjustable fixed module is used for fixing sample and adjusting sample position, and upper layer pressure loading and measuring module is used for exerting pressure to sample and measuring parameter, in situ electric cabinet, in situ electric cabinet with in situ device body electricity is connected. The device can carry out local pressure loading to chip target area, and carry out microcosmic dynamic analysis of X ray while exerting mechanical load.
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Description

Technical Field

[0001] This utility model relates to the field of integrated circuit measurement technology, specifically to an in-situ pressure loading and measurement device. Background Technology

[0002] As integrated circuit packaging technology advances towards three-dimensional stacking, high-density interconnects, and system-in-package (SiP), the dimensions of interconnect structures such as solder joints / microbumps between chips and printed circuit boards (PCBs) or substrates continue to shrink. Consequently, the mechanical loads they bear, such as impact, vibration, insertion / extraction forces, and thermomechanical fatigue stress, are becoming increasingly concentrated, posing a bottleneck to the reliability of electronic products. Accurately assessing the mechanical response and failure behavior of these micro-interconnects under real-world operating conditions is of great significance for improving product lifespan and optimizing design.

[0003] However, traditional interconnect reliability assessment methods have significant limitations. Offline destructive testing, such as micro-mechanical tensile / shear testing, requires cutting the circuit board with the chip into small samples. This process disrupts the original assembly constraints and chip-substrate interactions, leading to discrepancies between the measured mechanical properties and the actual service condition, and making it impossible to dynamically observe in-situ damage. On the other hand, board-level or system-level reliability testing, such as temperature cycling and drop impact testing, although performed in the assembled state, mainly focuses on the overall failure mode or macroscopic performance, making it difficult to accurately measure the local stress-strain distribution at specific interconnect points beneath the target chip, as well as the initiation and propagation process of microcracks.

[0004] Existing commercial equipment, such as probe stations and micro-force testers, is generally difficult to apply directly to assembled circuit boards, especially lacking the ability to effectively integrate with high-resolution in-situ observation equipment, such as X-ray micro-CT. These devices cannot achieve localized pressure loading on target areas of the chip, or perform microscopic dynamic analysis using X-rays while applying mechanical loads. Utility Model Content

[0005] The objective of this invention is to provide an in-situ pressure loading and measurement device that can apply localized pressure to a target area of ​​a chip and perform microscopic dynamic analysis using X-rays while applying mechanical load.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An in-situ pressure loading and measuring device, comprising:

[0008] Base plate;

[0009] The in-situ device body is mounted on the base plate. The in-situ device body includes an in-situ housing, a bottom adjustable sample fixing module, and an upper pressure loading and measurement module. The in-situ housing is mounted on the base plate. The bottom adjustable sample fixing module is located inside the in-situ housing and fixed to the carbon fiber base plate area of ​​the base plate. The upper pressure loading and measurement module is located above the bottom adjustable sample fixing module. The bottom adjustable sample fixing module is used to fix the sample and adjust its position, while the upper pressure loading and measurement module is used to apply pressure to the sample and measure parameters.

[0010] An in-situ electrical control box is electrically connected to the in-situ device body.

[0011] In one possible implementation, the bottom sample adjustable fixing module includes a first bottom plate slide rail, a second bottom plate slide rail, a first lower crossbeam, and a second lower crossbeam. The first bottom plate slide rail and the second bottom plate slide rail are arranged parallel to each other. The two ends of the first lower crossbeam and the second lower crossbeam are slidably connected to the first bottom plate slide rail and the second bottom plate slide rail respectively through crossbeam locking blocks. Sample locking clips are slidably provided on the first lower crossbeam and the second lower crossbeam.

[0012] In one possible implementation, the upper pressure loading and measurement module includes an upper pressure position adjustment frame and a pressure loading and measurement mechanism, wherein the pressure loading and measurement mechanism is adjustablely connected to the upper pressure position adjustment frame; the upper pressure position adjustment frame includes a first upper slide rail, a second upper slide rail, and an upper crossbeam, wherein the first upper slide rail and the second upper slide rail are arranged parallel to each other, and both ends of the upper crossbeam are detachably connected to the first upper slide rail and the second upper slide rail respectively by T-shaped locking blocks.

[0013] In one possible implementation, the pressure loading and measuring mechanism includes an electric actuator fixing block, a servo electric actuator, and a series linkage force loading and measuring mechanism. The servo electric actuator is adjustablely and fixedly connected to the linear groove of the upper crossbeam via the electric actuator fixing block. The series linkage force loading and measuring mechanism includes an electric actuator connector, a force sensor, a pressure rod, and a pressure contact. The servo electric actuator is connected to the force sensor via the electric actuator connector. The end of the force sensor away from the electric actuator connector is connected to the pressure rod. The pressure contact is located at the end of the pressure rod away from the force sensor.

[0014] In one possible implementation, the in-situ electrical control box includes an in-situ electrical control box shell, an electrical control box cover, a power interface, a communication interface, and internal electrical equipment;

[0015] The cover of the electrical control box is detachably mounted on the outer shell of the original electrical control box.

[0016] Both the power interface and the communication interface are located on the outside of the original-position electrical control box housing.

[0017] The internal electrical equipment is located inside the casing of the original electrical control box.

[0018] In one possible implementation, the internal electrical equipment includes a force sensor amplifier, a multi-channel regulated DC power converter, a main controller, a main controller communication converter, and a 485 bus communication module, all housed within the casing of the in-situ electrical control box. An external power source supplies power to the multi-channel regulated DC power converter via the power interface, and the multi-channel regulated DC power converter outputs DC power to the main controller and the force sensor amplifier, respectively. The signal generated by the force sensor is transmitted to the force sensor amplifier, amplified, and then transmitted to the main controller via the 485 bus communication module. The control signal generated by the main controller is transmitted to the servo actuator. The external device interacts with the main controller communication converter via the communication interface, and the main controller communication converter transmits signals with the main controller.

[0019] In one possible implementation, the in-situ enclosure includes four surrounding fixing plates, an in-situ cover, and a bottom sealing plate; the four surrounding fixing plates include a front side plate, a rear side plate, a left side plate, and a right side plate, which together form a frame structure; the in-situ cover is hinged to the four surrounding fixing plates; and the bottom sealing plate is fixedly connected to the bottom plate.

[0020] In one possible implementation, the outer side of the front panel is provided with a latch for fixing the box cover to the front panel in situ; the rear panel is provided with an electrical wiring through hole; the outer side of the left and right panels is provided with a slanted handle; and the bottom plate is provided with a flowing edge around its perimeter.

[0021] In one possible implementation, the in-situ chamber shell is provided with X-ray viewing windows at the top and bottom. The upper viewing window is a circular window on the in-situ chamber cover, and a thin carbon fiber plate is provided at the circular window and fixed to the in-situ chamber cover. The lower viewing window is a carbon fiber base plate area between two support plates. The chamber bottom plate sealing plate includes a carbon fiber base plate and two support plates. The carbon fiber base plate is located between the base plate and the two support plates. The applied pressure on the sample is transmitted to the chamber bottom plate sealing plate through the first and second base plate slide rails, and then to the base plate to provide support for the sample.

[0022] In one possible implementation, the T-shaped locking block has a square boss with countersunk screw holes, which mates with the T-shaped grooves on the first and second upper slide rails at any position; each countersunk screw hole is provided with a square slider, which is detachably connected to the T-shaped groove.

[0023] Compared with the prior art, the advantages of this utility model are as follows:

[0024] In the bottom sample adjustable fixing module, the first and second lower crossbeams are adjusted by moving horizontally on the bottom plate slide rail via crossbeam locking blocks. The sample clamp can be adjusted in position on the crossbeams, which can adapt to and clamp samples of different sizes, thereby improving the device's compatibility with samples of different specifications.

[0025] The upper pressure position adjustment frame can be adjusted on the upper slide rail by means of T-shaped locking blocks. Combined with the position adjustment of the pressure loading and measuring mechanism on the upper crossbeam, it can achieve adjustment at any position in the XY axis direction in the plane, so as to meet the requirements of pressure loading on specific positions of the target chip.

[0026] The in-situ enclosure has X-ray viewing windows at the top and bottom. The upper viewing window is a circular window on the in-situ enclosure cover covered with a thin carbon fiber plate, while the lower viewing window is the carbon fiber base plate area between two support plates. The carbon fiber material allows for easy X-ray penetration, reducing obstruction during X-ray imaging; at the same time, the elimination of a heavy enclosed structure reduces the demand for X-ray power and saves equipment costs.

[0027] The enclosure is surrounded by fixed plates to form a relatively closed environment. The latches on the front panel can lock the cover in place, effectively reducing the interference of X-rays on the signals of internal equipment and ensuring the stability of signal transmission of equipment such as force sensors and servo electric actuators.

[0028] The pressure loading and measurement mechanism employs a series linkage force loading and measurement system. A servo electric actuator precisely controls the loading of the pressure contacts, while a force sensor measures the force value in real time and provides feedback to adjust the actuator position, forming a closed-loop control system capable of precisely controlling the magnitude, direction, and loading rate of the load. The beam-type force sensor, through four-corner error correction, eliminates the influence of uneven force distribution on the pressure rod on the measurement, improving the accuracy of pressure measurement.

[0029] The pressure rod is made of a material that is easily penetrated by X-rays, and the pressure loading and measuring mechanisms, except for the pressure rod, are located far from the chip. The pressure contacts are replaceable to adapt to different chip sizes, further enhancing the flexibility and applicability of the equipment. This reduces obstruction during X-ray imaging, ensuring clear imaging of the chip's microstructure. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the in-situ pressure loading and measuring device in the in-situ box cover open state in an embodiment of this utility model;

[0032] Figure 2 This is a schematic diagram of the in-situ pressure loading and measuring device in the in-situ box cover closed state in an embodiment of this utility model;

[0033] Figure 3 This is a schematic diagram of the structure of the base plate in an embodiment of this utility model;

[0034] Figure 4 This is a top view of the in-situ pressure loading and measuring device with the in-situ box cover open in an embodiment of this utility model;

[0035] Figure 5 This is a schematic diagram of the upper pressure loading and measurement module in an embodiment of this utility model;

[0036] Figure 6 This is a bottom view of the upper pressure loading and measurement module in an embodiment of this utility model;

[0037] Figure 7 This is a schematic diagram of the internal structure of the in-situ electrical control box in an embodiment of this utility model.

[0038] In the attached diagram: 1. In-situ device body; 2. Base plate; 3. Electrical control box cover; 4. In-situ electrical control box; 5. In-situ box cover; 6. Circular window; 7. Communication interface; 8. Power interface; 9. First base plate slide rail; 10. First upper slide rail; 11. T-shaped locking block; 12. Upper crossbeam; 13. First lower crossbeam; 14. Sample locking clamp; 15. Crossbeam locking block; 16. Sample to be tested; 17. Force sensor; 18. Carbon fiber base plate; 19. Slanted handle; 20. Flowing edge; 21. Front side plate; 22. Rear side plate; 23. Left side plate; 24. Right side plate; 25. Electrical wiring through hole; 26. First support plate; 27. ... 28. Support plate; 29. ​​Thin carbon fiber plate; 30. Hinge; 31. Lock; 32. Second bottom plate slide rail; 33. Second upper slide rail; 34. Second lower crossbeam; 35. Chip; 36. Electric actuator fixing block; 37. Servo electric actuator; 48. Electric actuator connector; 39. Force sensor; 40. Pressure rod; 41. Pressure contact; 42. Straight groove; 43. T-shaped slide groove; 44. Square slider; 45. Square boss; 46. Force sensor amplifier; 47. In-situ electrical control box housing; 48. Multi-channel regulated DC power converter; 49. Main control communication converter; 50. Main controller; 51. 485 bus communication module. Detailed Implementation

[0039] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0040] Example:

[0041] It should be noted that the terms "comprising" and "having" and any variations thereof in the embodiments of this utility model are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to these processes, methods, products, or devices.

[0042] Figure 1 This is a schematic diagram of the in-situ pressure loading and measuring device in the in-situ box cover open state in an embodiment of this utility model; Figure 2 This is a schematic diagram of the in-situ pressure loading and measuring device in the in-situ box cover closed state in an embodiment of this utility model; Figure 3 This is a schematic diagram of the base plate in an embodiment of this utility model; see also Figures 1 to 3This invention provides an in-situ pressure loading and measurement device. This device can apply highly controllable localized pressure loads to specific chips on a circuit board in a real assembly environment. Simultaneously, the device is compatible with advanced in-situ observation methods such as SEM or X-ray micro-CT, facilitating microscopic dynamic analysis using X-rays.

[0043] The in-situ pressure loading and measuring device mainly consists of an in-situ device body 1, a base plate 2, and an in-situ electrical control box 4. The in-situ device body 1 and the in-situ electrical control box 4 are mounted and fixed on the base plate 2. The base plate 2 has movable edges 20 around its perimeter to facilitate the placement of the entire device into the moving guide rail of the X-ray machine for clamping and fixing. The electrical control box cover 3 is fixed to the in-situ electrical control box 4.

[0044] The in-situ device body 1 mainly includes an in-situ box shell, a bottom sample adjustable fixing module, and an upper pressure loading and measurement module.

[0045] The in-situ enclosure consists of four fixing plates, an in-situ cover 5, and a bottom plate. The four fixing plates include a front plate 21, a rear plate 22, a left plate 23, and a right plate 24, all fixed to the bottom plate 2. A latch 30 is installed on the outer side of the front plate, which, along with a hinge 29, can lock the in-situ cover 5 to the four fixing plates, creating a relatively enclosed environment for the in-situ device body 1 and reducing X-ray interference with internal equipment signals. The rear plate 22 has an electrical wiring through-hole 25 through which the communication cables for the force sensor 17 and the electric actuator 36 in the in-situ device body 1 are connected to the in-situ electrical control box. To facilitate the operator's movement of the entire in-situ pressure loading and measuring device, angled handles 19 are installed on the outer sides of both the left and right plates 23 and 24.

[0046] To reduce the power of X-rays used, address the issue of penetrating thick materials, and facilitate scanning of the sample 16, the in-situ chamber shell has X-ray viewing windows at the top and bottom. The upper viewing window is a circular window 6 on the chamber cover 5, which is covered and fixed by a thin carbon fiber plate 29. The lower viewing window is located in the area of ​​the carbon fiber base plate 18 between two support plates. The chamber bottom plate includes the carbon fiber base plate 18 and two support plates, namely the first support plate 26 and the second support plate 27. The carbon fiber base plate 18 is installed and fixed between the base plate 2 and the two support plates, and both support plates are fixed to the base plate 2. Then, the first base plate slide rail 9 and the second base plate slide rail 31 are respectively installed on the carbon fiber base plate 18 and locked and fixed to the first support plate 26 and the second support plate 27.

[0047] Figure 4 This is a top view of the in-situ pressure loading and measuring device with the in-situ box cover open in an embodiment of this utility model; see also Figure 4The adjustable sample fixing module at the bottom includes a first base plate slide rail 9, a second base plate slide rail 31, a first lower crossbeam 13, a second lower crossbeam 33, crossbeam locking blocks 15, and sample clamps 14. Two crossbeam locking blocks 15 are fixed to each end of the first lower crossbeam 13 and the second lower crossbeam 33, respectively, and are then locked to the first base plate slide rail 9 and the second base plate slide rail 31 by the crossbeam locking blocks 15 at both ends. The first lower crossbeam 13 or the second lower crossbeam 33, with its locking blocks 15 at both ends, can be moved horizontally on the first base plate slide rail 9 and the second base plate slide rail 31 to adjust its locking position, adapting to clamping test samples 16 of different sizes. The test sample 16 is placed between the first lower crossbeam 13 and the second lower crossbeam 33 and clamped and fixed, and is limited and locked by the sample clamps 14 locked to the first lower crossbeam 13 and the second lower crossbeam 33 respectively. The sample clamps 14 can be adjusted in position and locked on the first lower crossbeam 13 and the second lower crossbeam 33 respectively.

[0048] Figure 5 This is a schematic diagram of the upper pressure loading and measurement module in an embodiment of this utility model; Figure 6 This is a bottom view of the upper pressure loading and measurement module in an embodiment of this utility model; see also Figures 5 to 6 The upper pressure loading and measurement module includes an upper pressure position adjustment frame and a pressure loading and measurement mechanism. The upper pressure position adjustment frame includes a first upper slide rail 10, a second upper slide rail 32, a T-shaped locking block 11, and an upper crossbeam 12. The pressure loading and measurement mechanism includes an electric actuator fixing block 35, a servo electric actuator 36, and a series linkage force loading and measurement mechanism. The series linkage force loading and measurement mechanism includes an electric actuator connector 37, a force sensor 38, a pressure rod 39, and a pressure contact 40.

[0049] To simulate the in-situ pressure environment and address the issue of X-ray imaging obstruction caused by existing in-situ devices during chip contact operations, this invention employs a position-type series linkage force loading and measurement mechanism. Precise position control of the servo electric actuator 36 allows for real-time adjustment of the force applied to the chip 34 on the sample 16 by the pressure contact 40 at the end of the series linkage force loading and measurement mechanism. Simultaneously, a force sensor 38 measures the force applied to the chip 34 in real-time to adjust the position of the servo electric actuator 36, achieving closed-loop control of the precise load on the chip 34. To ensure uniform force application to the chip 34, the pressure contact 40 can be replaced with different sizes to accommodate chips 34, and its contact surface must completely cover or even exceed the area of ​​the chip 34. To ensure accurate pressure measurement, the force sensor 38 is a beam sensor. Corner error correction of the beam sensor eliminates errors caused by uneven force distribution on the pressure rod 39. By employing a position-type tandem linkage force loading and measurement mechanism, the pressure rod 39 can be extended into the X-ray field of view of the sample 16 under test for independent force loading of the chip 34. Furthermore, it is made of a material easily penetrated by X-rays. Simultaneously, the pressure loading and measurement mechanism (excluding the pressure rod 39) and the upper crossbeam 12 can be moved away from the chip 34. Moreover, the length and thickness of the pressure rod 39 can be adapted and replaced according to the chip size, thereby solving the problem of X-ray obstruction during imaging. When the tandem linkage force loading and measurement mechanism applies pressure to the chip 34, the applied pressure is transmitted to the first base plate slide rail 9 and the second base plate slide rail 31. Subsequently, this force is transmitted to the carbon fiber base plate 18 and the two support plates, with the base plate providing support. These two support plates not only enhance the support effect of the carbon fiber base plate 18 but also provide support for the chip 34. Furthermore, their placement on both sides does not interfere with X-ray imaging.

[0050] To accurately measure the local stress and strain distribution at specific interconnect points beneath the target chip, the position of the pressure loading and measuring mechanism as a whole on the upper crossbeam 12 (X-axis direction) and the positions of the two T-shaped locking blocks 11 on the first upper slide rail 10 and the second upper slide rail 32 (Y-axis direction) are adjusted to achieve arbitrary position adjustment in the XY-axis direction within the plane, thus completing the pressure loading and measurement of specific locations on the target chip. The T-shaped locking blocks 11 are designed with square bosses 44 with two countersunk screw holes, which respectively engage and fix with T-shaped grooves 42 on the first upper slide rail 10 and the second upper slide rail 32, restricting the rotational movement of the T-shaped locking blocks relative to the first upper slide rail 10 and the second upper slide rail 32. Furthermore, each countersunk screw hole is locked to the T-shaped groove 42 by a square slider 43, thereby improving the rigidity of the overall upper pressure position adjustment frame and the accuracy of the in-situ pressure output.

[0051] Figure 7This is a schematic diagram of the internal structure of the in-situ electrical control box in an embodiment of this utility model. See also... Figure 7 In order to design a lightweight, easily X-ray-penetrating in-situ pressure simulation device that integrates drive control and measurement, this utility model integrates an in-situ electrical control box 4 that integrates drive control and measurement on the in-situ pressure loading and measurement device. The in-situ electrical control box 4 only requires 220V AC power supply plus a USB communication cable to realize the simulation control of in-situ pressure.

[0052] The in-situ electrical control box 4 includes an outer casing 46, a cover 3, a power interface 8, a communication interface 7, and internal electrical equipment. The internal electrical equipment includes a force sensor amplifier 45, a multi-channel regulated DC power converter 47, a main controller 49, a main controller communication converter 48, and a 485 bus communication module 50. The cover 3 is mounted on the outer casing 46 and locked to both sides. Both the outer casing and the control box 3 are made of sheet metal with a bent design, making them lightweight and easy to process. The communication interface 7 is internally connected to the main controller communication converter 48 via a cable, enabling communication control between external devices and the main controller, or updating and downloading programs to the main controller. The external power interface 8 has a switch and a three-pin socket, providing 220V AC power to the entire in-situ electrical control box via a three-pin power cord. The power interface 8 is then internally connected to the multi-channel regulated DC power converter 47, which provides DC power to the main controller 49 and the force sensor amplifier 42. The main controller 49 communicates with the force sensor amplifier 4 via the 485 bus communication module 50 to obtain the force data collected by the force sensor 38 in real time. In addition, it drives the servo electric actuator 36 for precise position control through serial communication, thereby driving the series linkage force loading and measurement mechanism to realize the output adjustment of the pressure of the chip 34.

[0053] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0054] The above embodiments are merely illustrative of the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made based on the substance of the content of this utility model should be covered within the scope of protection of this utility model.

Claims

1. An in-situ pressure loading and measuring device, characterized in that, include: Base plate; The in-situ device body is mounted on the base plate. The in-situ device body includes an in-situ housing, a bottom adjustable sample fixing module, and an upper pressure loading and measurement module. The in-situ housing is mounted on the base plate. The bottom adjustable sample fixing module is located inside the in-situ housing and fixed to the carbon fiber base plate area of ​​the base plate. The upper pressure loading and measurement module is located above the bottom adjustable sample fixing module. The bottom adjustable sample fixing module is used to fix the sample and adjust its position, while the upper pressure loading and measurement module is used to apply pressure to the sample and measure parameters. An in-situ electrical control box is electrically connected to the in-situ device body.

2. The in-situ pressure loading and measuring device according to claim 1, characterized in that, The adjustable bottom sample fixing module includes a first bottom plate slide rail, a second bottom plate slide rail, a first lower crossbeam, and a second lower crossbeam. The first bottom plate slide rail and the second bottom plate slide rail are arranged parallel to each other. The two ends of the first lower crossbeam and the second lower crossbeam are slidably connected to the first bottom plate slide rail and the second bottom plate slide rail respectively through crossbeam locking blocks. Sample locking clips are slidably provided on the first lower crossbeam and the second lower crossbeam.

3. The in-situ pressure loading and measuring device according to claim 1, characterized in that, The upper pressure loading and measurement module includes an upper pressure position adjustment frame and a pressure loading and measurement mechanism. The pressure loading and measurement mechanism is adjustablely connected to the upper pressure position adjustment frame. The upper pressure position adjustment frame includes a first upper slide rail, a second upper slide rail, and an upper crossbeam. The first upper slide rail and the second upper slide rail are arranged parallel to each other. The two ends of the upper crossbeam are detachably connected to the first upper slide rail and the second upper slide rail respectively through T-shaped locking blocks.

4. The in-situ pressure loading and measuring device according to claim 3, characterized in that, The pressure loading and measurement mechanism includes an electric actuator fixing block, a servo electric actuator, and a series linkage force loading and measurement mechanism. The servo electric actuator is adjustablely connected to the upper crossbeam via the electric actuator fixing block. The series linkage force loading and measurement mechanism includes an electric actuator connector, a force sensor, a pressure rod, and a pressure contact. The servo electric actuator is connected to the force sensor via the electric actuator connector. The end of the force sensor away from the electric actuator connector is connected to the pressure rod. The pressure contact is located at the end of the pressure rod away from the force sensor.

5. The in-situ pressure loading and measuring device according to claim 4, characterized in that, The in-situ electrical control box includes an in-situ electrical control box shell, an electrical control box cover, a power interface, a communication interface, and internal electrical equipment; The cover of the electrical control box is detachably mounted on the outer shell of the original electrical control box. Both the power interface and the communication interface are located on the outside of the original-position electrical control box housing. The internal electrical equipment is located inside the casing of the original electrical control box.

6. The in-situ pressure loading and measuring device according to claim 5, characterized in that, The internal electrical equipment includes a force sensor amplifier, a multi-channel regulated DC power converter, a main controller, a main controller communication converter, and a 485 bus communication module, all housed within the casing of the in-situ electrical control box. An external power source supplies power to the multi-channel regulated DC power converter via the power interface, and the multi-channel regulated DC power converter outputs DC power to the main controller and the force sensor amplifier respectively. The signal generated by the force sensor is transmitted to the force sensor amplifier, amplified, and then transmitted to the main controller via the 485 bus communication module. The control signal generated by the main controller is transmitted to the servo actuator. External devices interact with the main controller communication converter via the communication interface, and the main controller communication converter transmits signals with the main controller.

7. The in-situ pressure loading and measuring device according to claim 1, characterized in that, The in-situ enclosure includes four surrounding fixing plates, an in-situ enclosure cover, and a bottom sealing plate. The four surrounding fixing plates include a front side plate, a rear side plate, a left side plate, and a right side plate, which together form a frame structure. The in-situ enclosure cover is hinged to the four surrounding fixing plates. The bottom sealing plate is fixedly connected to the bottom plate.

8. The in-situ pressure loading and measuring device according to claim 7, characterized in that, The front panel has a latch on the outer side, which is used to fix the box cover to the front panel in place; the rear panel has an electrical wiring through hole; the left and right panels have diagonal handles on the outer side; and the bottom plate has a flowing edge around its perimeter.

9. The in-situ pressure loading and measuring device according to claim 7, characterized in that, The in-situ chamber shell is provided with X-ray viewing windows at the top and bottom. The upper viewing window is a circular window on the in-situ chamber cover, and a thin carbon fiber plate is provided at the circular window and fixed to the in-situ chamber cover. The lower viewing window is the carbon fiber base plate area between two support plates. The chamber bottom plate sealing plate includes a carbon fiber base plate and two support plates. The carbon fiber base plate is located between the base plate and the two support plates. The pressure applied to the sample is transmitted to the chamber bottom plate sealing plate through the first base plate slide rail and the second base plate slide rail, and then to the base plate to provide support for the sample.

10. The in-situ pressure loading and measuring device according to claim 3, characterized in that, The T-shaped locking block has a square boss with countersunk screw holes, which can be matched with any position of the T-shaped slide groove on the first and second upper slide rails; each countersunk screw hole is provided with a square slider, which is detachably connected to the T-shaped slide groove.