An adjustable wafer inspection device

CN224667662UActive Publication Date: 2026-08-21昆山日月同芯半导体有限公司
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Patent Information

Application Number
CN202522001929.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-17
Publication Date
2026-08-21
Estimated Expiration
2035-09-17

AI Technical Summary

Technical Problem

[0005]本实用新型的目的在于提供一种可调节的晶圆片检测装置,以解决上述背景技术中提出的现有的晶圆片检测装置的拍摄组件,多采用固定安装或单一维度调节结构,操作繁琐且精度难以保证,易因焦距偏差导致缺陷漏检或参数测量误差,且现有夹持组件大多夹持范围固定,无法适配不同直径的晶圆片,更换晶圆规格时需整体更换夹持模块,增加了设备成本与操作时间的问题

Benefits of technology

可以通过升降组件配合微调组件将视觉传感器的精准定位,将其精准的对焦,防止因焦距偏差导致缺陷漏检或参数测量误差;

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an adjustable wafer detection device, including work table, the one end of work table top is placed with display, the other end fixed mounting of work table top has the lifting assembly, the side fixed mounting of lifting assembly has the shooting subassembly for visual inspection, the inside transmission of shooting subassembly is connected with fine adjustment subassembly, the side fixed mounting of work table and lifting assembly junction place has the clamping assembly, and the fixed connection of clamping assembly has locking adjustment subassembly, and one of work table top's corner fixed mounting has control panel, and the surface fixed mounting of control panel has the lifting switch, the utility model discloses an adjustable wafer detection device, can through the accurate positioning of visual sensor with lifting assembly cooperation fine adjustment subassembly, prevent because focal length deviation leads to defect and miss or parameter measurement error, and can adjust the opening and closing range of clamping block, need not to replace the clamping module to be with different diameter's wafer adaptation, reduce equipment replacement cost and operation time.
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Description

Technical Field

[0001] This utility model relates to the field of wafer inspection technology, specifically an adjustable wafer inspection device. Background Technology

[0002] Wafer inspection equipment is used to detect surface defects, geometric parameters and other characteristics of wafers to ensure that the quality and performance of wafers meet the requirements of semiconductor manufacturing. Existing wafer inspection equipment mostly uses vision sensors to photograph the appearance of the wafer after it is clamped and fixed when performing visual inspection.

[0003] However, the imaging components of existing wafer inspection devices mostly adopt fixed installation or single-dimensional adjustment structure, which is cumbersome to operate and difficult to guarantee accuracy. They are prone to missing defects or parameter measurement errors due to focal length deviation. In addition, most existing clamping components have a fixed clamping range and cannot be adapted to wafers of different diameters. When changing wafer specifications, the entire clamping module needs to be replaced, which increases equipment cost and operation time.

[0004] Therefore, there is a need to provide an adjustable wafer inspection device. Utility Model Content

[0005] The purpose of this invention is to provide an adjustable wafer inspection device to solve the problems mentioned in the background art. The imaging components of existing wafer inspection devices mostly adopt fixed installation or single-dimensional adjustment structure, which are cumbersome to operate and difficult to guarantee accuracy. They are prone to missed defects or parameter measurement errors due to focal length deviation. Moreover, most existing clamping components have a fixed clamping range and cannot be adapted to wafers of different diameters. When changing wafer specifications, the entire clamping module needs to be replaced, which increases equipment cost and operation time.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an adjustable wafer inspection device, comprising a worktable, a display placed at one end of the top of the worktable, a lifting assembly fixedly installed at the other end of the top of the worktable, a camera assembly for visual inspection fixedly installed on one side of the lifting assembly, a fine-tuning assembly internally connected to the camera assembly, a clamping assembly fixedly installed on one side of the connection between the worktable and the lifting assembly, a locking adjustment assembly fixedly connected to the clamping assembly, a control panel fixedly installed at one corner of the top of the worktable, and a lifting switch fixedly installed on the surface of the control panel.

[0007] Preferably, the lifting assembly includes a sliding seat, which is fixedly mounted on the worktable. A transmission screw is rotatably mounted inside the sliding seat. One end of the transmission screw passes through the sliding seat and is fixedly connected to an output motor. The output motor is fixedly mounted outside the sliding seat. A first transmission block is slidably mounted inside the sliding seat. The output motor drives the transmission screw to rotate, causing the first transmission block to slide stably along the sliding seat, thus replacing traditional manual height adjustment.

[0008] Preferably, the shooting assembly includes a fixing plate, which is fixedly installed on one side of the first transmission block. A fixing frame and a sliding guide rail are respectively fixedly installed at both ends of the outer side of the fixing plate. A second transmission block is slidably connected to the outside of the sliding guide rail, and a visual sensor is fixedly installed at one end of the second transmission block.

[0009] Preferably, the fine-tuning component includes a transmission rod, on the outer side of which a first thread and a second thread are provided. The first thread is threadedly connected to a second transmission block, and the second thread is threadedly connected to a fixing frame. A knob is fixedly installed at the top of the transmission rod to achieve precise positioning of the vision sensor and significantly improve the detection accuracy of micron-level defects on the wafer surface.

[0010] Preferably, the clamping assembly includes a base, which is fixedly mounted on a workbench. A slot is provided on one side of the base, and a rotating disk is rotatably mounted inside the base. Three arc-shaped slots are equidistantly provided on the rotating disk. A fixed shell is fixedly mounted on the top of the base, and three sliding slots are equidistantly provided on the fixed shell. A sliding block is slidably mounted inside the sliding slot. A sliding rod is fixedly mounted on the bottom of the sliding block. A clamping block is fixedly mounted on the top of the sliding block. A gasket is fixedly mounted on the inner side of the clamping block. The three sliding rods are slidably connected to the three arc-shaped slots respectively.

[0011] Preferably, the locking adjustment assembly includes a locking screw, which is fixedly installed on the outside of the rotating disk and slidably connected to the inside of the slot. A locking block is externally connected to the locking screw, and a handle is fixedly installed at one end of the locking screw to prevent the clamping block from loosening or shifting position due to equipment vibration during the detection process, thus ensuring detection stability.

[0012] Compared with the prior art, the beneficial effects of this utility model are: The vision sensor can be precisely positioned and focused by using the lifting component and the fine-tuning component to prevent defects from being missed or parameter measurement errors caused by focal length deviation. The clamping components allow for adjustment of the clamping block's opening and closing range, enabling adaptation to wafers of different diameters without replacing the clamping module, thus reducing equipment replacement costs and operation time. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the lifting component and the fine-tuning component of this utility model; Figure 3 This is a schematic diagram of the clamping component of this utility model; Figure 4 This is a schematic diagram of the locking and adjusting component of this utility model.

[0014] In the diagram: 1. Workbench; 2. Control panel; 3. Monitor; 4. Sliding seat; 5. Drive screw; 6. Output motor; 7. First transmission block; 8. Fixing plate; 9. Fixing frame; 10. Sliding guide rail; 11. Second transmission block; 12. Vision sensor; 13. Transmission rod; 14. First thread; 15. Second thread; 16. Knob; 17. Base; 18. Groove; 19. Rotating disk; 20. Arc groove; 21. Locking screw; 22. Locking block; 23. Handle; 24. Fixing shell; 25. Sliding groove; 26. Sliding block; 27. Sliding rod; 28. Clamping block; 29. ​​Gasket. Detailed Implementation

[0015] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0016] Please see Figure 1-4 This utility model provides an adjustable wafer inspection device, including a worktable 1, a display 3 placed at one end of the top of the worktable 1, a lifting assembly fixedly installed at the other end of the top of the worktable 1, a shooting assembly for visual inspection fixedly installed on one side of the lifting assembly, a fine-tuning assembly internally connected to the shooting assembly, a clamping assembly fixedly installed on one side of the connection between the worktable 1 and the lifting assembly, a locking adjustment assembly fixedly connected to the clamping assembly, a control panel 2 fixedly installed on one corner of the top of the worktable 1, and a lifting switch fixedly installed on the surface of the control panel 2.

[0017] Furthermore, the lifting assembly includes a sliding seat 4, which is fixedly mounted on the worktable 1. A transmission screw 5 is rotatably mounted inside the sliding seat 4. One end of the transmission screw 5 passes through the sliding seat 4 and is fixedly connected to an output motor 6. The output motor 6 is fixedly mounted outside the sliding seat 4. A first transmission block 7 is drivenly connected to the outer side of the transmission screw 5. The first transmission block 7 is slidably mounted inside the sliding seat 4. The shooting assembly includes a fixing plate 8, which is fixedly mounted on one side of the first transmission block 7. A fixing bracket 9 and a sliding guide rail 10 are fixedly mounted at both ends of the outer side of the fixing plate 8, respectively. A second transmission block 11 is slidably connected to the outer side of the sliding guide rail 10. A vision sensor 12 is fixedly mounted at one end of the second transmission block 11. The fine-tuning assembly includes a transmission rod 13. A first thread 14 and a second thread 15 are formed on the outer side of the transmission rod 13. The first thread 14 is connected to the second transmission block. 11. Threaded connection: The second thread 15 is threadedly connected to the fixed frame 9. A knob 16 is fixedly installed at the top of the transmission rod 13. Starting the output motor 6 can drive the transmission screw 5 at the output end to rotate. The first transmission block 7 slides inside the sliding seat 4. When the first transmission block 7 moves, it can drive the fixed plate 8 to move synchronously, thereby driving the vision sensor 12 fixedly connected to the second transmission block 11 to perform coarse height adjustment. The first thread 14 and the second thread 15 have the same thread direction, but have a small pitch difference. When the knob 16 is turned, the transmission rod 13 rotates, and the second thread 15 is driven inside the fixed frame 9. At the same time, the first thread 14 drives the second transmission block 11 to move along the sliding guide rail 10 to move the pitch difference between the first thread 14 and the second thread 15, thereby driving the vision sensor 12 fixedly connected to the second transmission block 11 to perform fine height adjustment.

[0018] Furthermore, the clamping assembly includes a base 17, which is fixedly mounted on the worktable 1. A slot 18 is provided on one side of the base 17. A rotating disk 19 is rotatably mounted inside the base 17. Three arc-shaped grooves 20 are equidistantly provided on the rotating disk 19. A fixed housing 24 is fixedly mounted on the top of the base 17. Three sliding grooves 25 are equidistantly provided on the fixed housing 24. A sliding block 26 is slidably mounted inside the sliding groove 25. A sliding rod 27 is fixedly mounted at the bottom of the sliding block 26. A clamping block 28 is fixedly mounted on the top of the sliding block 26. A gasket 29 is fixedly mounted on the inner side of the clamping block 28. The three sliding rods 27 are slidably connected to the three arc-shaped grooves 20 respectively. The locking adjustment assembly includes a locking screw 2. 1. The locking screw 21 is fixedly installed on the outside of the rotating disk 19. The locking screw 21 is slidably connected to the inside of the slot 18. The locking screw 21 is externally connected to the locking block 22. One end of the locking screw 21 is fixedly installed with a handle 23. Pushing the handle 23 can drive the rotating disk 19 to rotate inside the base 17. The rotating disk 19 drives three sliding rods 27 through three arc-shaped slots 20, which drive the sliding block 26 to move inside the sliding slot 25, thereby displacing the clamping block 28 on the top of the sliding block 26 to achieve adjustment. After adjustment, tighten the locking block 22 so that the locking block 22 abuts against the outer wall of the base 17 and the fixed shell 24, so that the rotating disk 19 cannot rotate and is fixed in the current position.

[0019] In this embodiment of the application, the operator first checks the overall condition of the device, then turns on the power to the control panel 2, and confirms through the display 3 whether the electronic components such as the vision sensor 12 and the output motor 6 are responding normally, ensuring that the device is in standby mode. The operator then rotates the handle 23 of the locking adjustment assembly, causing the locking block 22 to move away from the base 17 along the locking screw 21, thus releasing the lock on the rotating disk 19. Subsequently, rotating the handle 23 causes the rotating disk 19 to rotate inside the base 17, because the three arc-shaped grooves 20 on the rotating disk 19 are slidably connected to the sliding rod 27. During rotation, the sliding rod 27 drives the sliding block 26 to move outward along the sliding groove 25 of the fixed shell 24, causing the three clamping blocks 28 to open synchronously until the clamping range matches the size of the wafer to be tested. The wafer to be tested is then placed stably between the three clamping blocks 28, ensuring that the center of the wafer is roughly aligned with the center of the clamping assembly. The handle 23 is then rotated in the opposite direction, causing the rotating disk 19 to rotate in the opposite direction, causing the sliding block 26 to move the clamping blocks 28 closer to the wafer until the pads 29 on the inner side of the clamping blocks 28 are in close contact with the wafer surface. Care should be taken to avoid excessive force that could deform the wafer. Finally... The handle 23 is rotated to make the locking block 22 fit tightly against the side wall of the base 17, locking the position of the rotating disk 19 and completing the stable clamping of the wafer. According to the thickness of the wafer to be tested, the operator starts the output motor 6 through the lifting switch on the control panel 2. The output motor 6 drives the transmission screw 5 inside the sliding seat 4 to rotate. Since the transmission screw 5 is connected to the first transmission block 7 and the first transmission block 7 is slidably installed in the sliding seat 4, the rotation of the transmission screw 5 will drive the first transmission block 7 to slide up and down along the sliding seat 4, thereby driving the imaging component connected to the first transmission block 7 to rise and fall synchronously. The monitor 3 observes the distance between the vision sensor 12 and the wafer surface. When the distance approaches the preset detection height, the lifting switch is turned off, the output motor 6 is stopped, and the coarse adjustment of the detection height is completed. The operator rotates the knob 16 of the fine adjustment component, which drives the transmission rod 13 to rotate. Because the first thread 14 on the outside of the transmission rod 13 is threadedly connected to the second transmission block 11, and the second thread 15 is threadedly connected to the fixing frame 9, the rotation of the transmission rod 13 will drive the second transmission block 11 to make a small horizontal displacement along the sliding guide rail 10 of the fixing plate 8, thereby driving the vision sensor 12 to move precisely to the target detection position.The operator observes the image captured by the vision sensor 12 in real time on the display 3 until the target detection area is clearly centered in the image. Then, stops rotating knob 16 to complete the fine-tuning of the detection position. After confirming the detection position adjustment is complete, the operator activates the vision sensor 12 via the control panel 2. The vision sensor 12 captures images of the target area on the wafer and transmits the acquired image data to the display 3 in real time. The vision sensor 12, control panel 2, and display 3 form a data transmission link through built-in circuitry. The vision sensor 12, as the data acquisition end, captures images of the wafer surface through its optical lens. Its built-in image signal processing module converts the optical signals into digital electrical signals. The control panel 2, as the data transfer and control core, integrates a signal processing unit and a data transmission interface. It receives the digital signals output by the vision sensor 12 and performs signal format conversion through a preset control program. The display 3, as the data output end, receives the signals processed by the control panel 2 and restores the digital signals to a visual image for the operator to observe the wafer inspection screen.

[0020] All components are general standard parts or components known to those skilled in the art. Their structure and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods. All electrical components mentioned above should be electrically connected in accordance with the working principle described above and the sequence of operation between each electrical component. The detailed connection methods are well-known technologies in the field.

[0021] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An adjustable wafer inspection device, comprising a worktable (1), characterized in that: A display (3) is placed at one end of the top of the workbench (1), and a lifting assembly is fixedly installed at the other end of the top of the workbench (1). A shooting assembly for visual inspection is fixedly installed on one side of the lifting assembly. A fine-tuning assembly is connected to the internal transmission of the shooting assembly. A clamping assembly is fixedly installed on one side of the connection between the workbench (1) and the lifting assembly. A locking adjustment assembly is fixedly connected to the clamping assembly. A control panel (2) is fixedly installed on one corner of the top of the workbench (1). A lifting switch is fixedly installed on the surface of the control panel (2).

2. The adjustable wafer inspection device according to claim 1, characterized in that: The lifting assembly includes a sliding seat (4), which is fixedly installed on the workbench (1). A transmission screw (5) is rotatably installed inside the sliding seat (4). One end of the transmission screw (5) passes through the sliding seat (4) and is fixedly connected to an output motor (6). The output motor (6) is fixedly installed outside the sliding seat (4). A first transmission block (7) is connected to the outside of the transmission screw (5). The first transmission block (7) is slidably installed inside the sliding seat (4).

3. The adjustable wafer inspection device according to claim 2, characterized in that: The shooting assembly includes a fixed plate (8), which is fixedly installed on one side of the first transmission block (7). A fixed bracket (9) and a sliding guide rail (10) are fixedly installed at both ends of the outer side of the fixed plate (8). A second transmission block (11) is slidably connected to the outside of the sliding guide rail (10). A visual sensor (12) is fixedly installed at one end of the second transmission block (11).

4. The adjustable wafer inspection device according to claim 3, characterized in that: The fine-tuning component includes a transmission rod (13), on the outside of which a first thread (14) and a second thread (15) are provided. The first thread (14) is threadedly connected to the second transmission block (11), and the second thread (15) is threadedly connected to the fixing frame (9). A knob (16) is fixedly installed at the top of the transmission rod (13).

5. The adjustable wafer inspection device according to claim 1, characterized in that: The clamping assembly includes a base (17), which is fixedly installed on the workbench (1). A slot (18) is provided on one side of the base (17). A rotating disk (19) is rotatably installed inside the base (17). Three arc-shaped slots (20) are equidistantly provided on the rotating disk (19). A fixed shell (24) is fixedly installed on the top of the base (17). Three sliding slots (25) are equidistantly provided on the fixed shell (24). A sliding block (26) is slidably installed inside the sliding slot (25). A sliding rod (27) is fixedly installed at the bottom of the sliding block (26). A clamping block (28) is fixedly installed on the top of the sliding block (26). A gasket (29) is fixedly installed on the inner side of the clamping block (28). The three sliding rods (27) are slidably connected to the three arc-shaped slots (20) respectively.

6. The adjustable wafer inspection device according to claim 5, characterized in that: The locking adjustment assembly includes a locking screw (21), which is fixedly installed on the outside of the rotating disk (19). The locking screw (21) is slidably connected to the inside of the slot (18). A locking block (22) is connected to the outside of the locking screw (21). A handle (23) is fixedly installed at one end of the locking screw (21).