A test socket for chip packaging

Abstract

The utility model relates to chip packaging technical field, and specifically discloses a kind of test seat for chip packaging, including test table and mounting seat, test table top end is fixedly installed with base, base both ends are fixedly connected with fixed strip, two fixed strips opposite face symmetrical second sliding slot are opened, and fixed strip top end one side is fixedly connected with fixed block, two fixed blocks opposite face symmetrical arc-shaped groove that is connected with second sliding slot is opened, and one mounting seat is slidably connected in two second sliding slots by four guide blocks, mounting seat top end one side is opened with three mounting slots, and one of fixed strip end side wall is fixedly provided with contact switch. Chip is carried by mounting seat, so that chip can be more conveniently realized disassembly before and after testing, and will not be detected by space limitation and be blocked by detection equipment to influence disassembly efficiency even lead to chip damage and other adverse consequences.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a test socket for chip packaging. Background Technology

[0002] A chip packaging test socket is a chip carrier device required for testing the electrical performance and function of a chip, and serves to connect the chip to the electrical circuit.

[0003] Existing test sockets, due to space limitations and fixed installation positions, can easily restrict chip installation and removal, making the process inconvenient. To address this, a new test socket for chip packaging is proposed to facilitate chip installation, removal, and testing. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a test socket for chip packaging.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A test socket for chip packaging includes a test stage and a mounting base. A base is fixedly mounted on the top of the test stage, and fixing strips are fixedly connected to both ends of the base. Two fixing strips are symmetrically formed with second sliding grooves facing each other. A fixing block is fixedly connected to one side of the top of the fixing strips. Two fixing blocks are symmetrically formed with arc-shaped grooves communicating with the second sliding grooves. A mounting base is slidably connected to the two second sliding grooves through four guide blocks. Three mounting slots are formed on one side of the top of the mounting base. A contact switch is fixedly mounted on the side wall of the end of one of the fixing strips. An embedded hole is formed on the side wall of the guide block away from the contact switch. A slot is formed on the side wall of the fixing block on the side of the embedded hole. A positioning rod is slidably connected in the slot. A locking block is fixedly connected to one side of the positioning rod.

[0006] Preferably, a back plate is fixedly connected to one side of the top of the test platform, and two vertical first sliding grooves are symmetrically opened on one side of the back plate. The two first sliding grooves are slidably connected to a horizontally set sliding plate through a first slider. Three sets of detection needles are fixedly connected to the bottom end of the sliding plate on the side away from the back plate.

[0007] Preferably, an electric telescopic rod is fixedly installed on the top side of the back plate, and the telescopic end of the electric telescopic rod is fixedly connected to the top of the sliding plate.

[0008] Preferably, the top two sides of the test platform are fixedly connected with guide rods that are slidably connected to the sides of the sliding plate. The top of the guide rods is fixedly connected to the side wall of the back plate through an extension plate. Two limiting rods are fixedly connected to the middle of the back plate through an extension plate. The middle of the limiting rods is slidably connected to the middle of the sliding plate. The bottom of the limiting rods is fixedly connected to a limiting block.

[0009] Preferably, the mounting slot has several air holes on both sides, the test bench is equipped with a fan, and the side of the mounting base away from the contact switch is connected to the air holes and the fan through several flexible air ducts.

[0010] Preferably, the bottom of the mounting slot is provided with a wire hole plug, and three ribbon cables are connected to the side of the mounting base away from the contact switch, which are respectively electrically connected to the wire hole plugs in the three mounting slots.

[0011] Preferably, a flap is rotatably connected to the middle of the base, and the bottom end of the flap is rotatably connected to the telescopic end of an electric cylinder, with the bottom of the electric cylinder rotatably connected to the top of the test bench.

[0012] Compared with the prior art, the beneficial effects of this utility model are: This invention features a mounting base that slides along a second groove to support the chip, allowing for easier chip assembly and disassembly before and after testing. This avoids the disadvantages of space constraints causing obstruction by testing equipment, which could affect assembly and disassembly efficiency or even damage the chip. The mounting base can also be positioned correctly by contacting a guide block via a contact switch when it reaches the end of the second groove. An external controller extends the telescopic end of the electric cylinder, causing a flap to rotate and push one side of the mounting base along the arc-shaped groove, raising it so that the mounting groove side faces the operator, facilitating operation. A positioning rod can be used for temporary fixation after the mounting base is tilted and raised. The combination of the electric cylinder and flap prevents the mounting base from shaking due to manual force during chip assembly and disassembly.

[0013] This invention provides power to the chip by setting up a ribbon cable and air duct, and using the stretchable ribbon cable to supply power to the wired control plug. The air vents and fan are used to cool the chip during operation, which can easily simulate actual use scenarios and ensure the reliability of test results. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of a test socket for chip packaging proposed in this utility model; Figure 2 This is a schematic diagram of the base structure of a chip packaging test socket proposed in this utility model; Figure 3 This is a schematic diagram of the mounting slot structure of a test socket for chip packaging proposed in this utility model; Figure 4 This is a schematic diagram of the second groove structure of a test socket for chip packaging proposed in this utility model; Figure 5 This utility model proposes a test socket for chip packaging. Figure 4 Enlarged view of the structure of region A in the middle; Figure 6This is a schematic diagram of the flip-plate structure of a chip packaging test socket proposed in this utility model.

[0015] In the diagram: 1. Test bench; 2. Back plate; 3. First slide groove; 4. Guide rod; 5. Sliding plate; 6. Detection needle; 7. Electric telescopic rod; 8. Base; 9. Fixing strip; 10. Second slide groove; 11. Fixing block; 12. Arc groove; 13. Mounting seat; 14. Guide block; 15. Embedded hole; 16. Mounting groove; 161. Air hole; 17. Contact switch; 18. Positioning rod; 19. Locking block; 20. Electric cylinder; 21. Flip plate; 22. Cable; 23. Air duct. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0017] Reference Figure 1-6 A test socket for chip packaging includes a test stage 1 and a mounting base 13. A base 8 is fixedly installed on the top of the test stage 1. Fixing strips 9 are fixedly connected to both ends of the base 8. The two fixing strips 9 are symmetrically provided with second sliding grooves 10. A fixing block 11 is fixedly connected to one side of the top of the fixing strips 9. The two fixing blocks 11 are symmetrically provided with arc-shaped grooves 12 that communicate with the second sliding grooves 10. A mounting base 13 is slidably connected to the two second sliding grooves 10 through four guide blocks 14. The mounting base 13 is provided with three mounting slots 16 on one side of the top of the mounting base 13. A contact switch 17 is fixedly installed on the side wall of the end of one of the fixing strips 9. An embedded hole 15 is provided on the side wall of the guide block 14 away from the contact switch 17. A slot is provided on the side wall of the fixing block 11 on the side of the embedded hole 15. A positioning rod 18 is slidably connected in the slot. A locking block 19 is fixedly connected to one side of the positioning rod 18. The chip is supported by a mounting base 13 that can slide along the second slide groove 10, which makes it easier to install and remove the chip before and after testing. This avoids the adverse consequences of the chip being blocked by the testing equipment due to space limitations, which may affect the efficiency of installation and removal or even damage the chip. The mounting base 13 can also rotate and tilt through the arc groove 12 when it slides to the end of the second slide groove 10, so that the mounting groove 16 of the mounting base 13 faces the operator, which makes it easier for the operator to operate. The positioning rod 18 can be used for temporary fixation after the mounting base 13 is tilted and raised to prevent the mounting base 13 from shaking due to manual force when installing and removing the chip.

[0018] As a technical optimization of this utility model, a back plate 2 is fixedly connected to one side of the top of the test platform 1. Two vertical first sliding grooves 3 are symmetrically opened on one side of the back plate 2. A horizontally set sliding plate 5 is slidably connected to the two first sliding grooves 3 through a first slider. Three sets of detection probes 6 are fixedly connected to the bottom end of the sliding plate 5 away from the back plate 2. The sliding plate 5 moves up and down along the first sliding grooves 3 through the first slider, which facilitates the adjustment of the distance between the sliding plate 5 and the chip, and facilitates the detection probes 6 to perform performance testing on the chip.

[0019] As a technical optimization of this utility model, an electric telescopic rod 7 is fixedly installed on the top side of one side of the back plate 2, and the telescopic end of the electric telescopic rod 7 is fixedly connected to the top of the sliding plate 5. The electric telescopic rod 7 is used to push the sliding plate 5 up and down.

[0020] As a technical optimization of this utility model, guide rods 4 are fixedly connected to both sides of the top of the test platform 1 and are slidably connected to both sides of the sliding plate 5. The top of the guide rods 4 is fixedly connected to the side wall of the back plate 2 through an extension plate. Two limiting rods are fixedly connected to the middle of the back plate 2 through an extension plate. The middle of the limiting rods is slidably connected to the middle of the sliding plate 5, and the bottom of the limiting rods is fixedly connected to a limiting block. The guide rods 4 facilitate the stable sliding of the sliding plate 5, and the presence of the limiting rods satisfies the movement of the sliding plate 5 without affecting the movement of the mounting base 13.

[0021] As a technical optimization of this utility model, several air holes 161 are provided on both sides of the mounting slot 16, and a fan is installed inside the test bench 1. The side of the mounting base 13 away from the contact switch 17 is connected to the air holes 161 and the fan through several flexible air ducts 23. The air holes 161 and the fan are used to cool the chip during operation, which facilitates the simulation of actual use scenarios and ensures the reliability of the test results.

[0022] As a technical optimization of this utility model, a wire hole plug is provided at the bottom of the mounting slot 16, and three ribbon cables 22 are connected to the side of the mounting base 13 away from the contact switch 17, which are respectively electrically connected to the wire hole plugs in the three mounting slots 16. Power is supplied to the wired control plug through the stretchable ribbon cables 22, thereby realizing the power supply of the chip.

[0023] As a technical optimization of this utility model, a flap 21 is rotatably connected to the middle of the base 8, and the end of the telescopic end of the electric cylinder 20 is rotatably connected to the bottom of the flap 21. The bottom of the electric cylinder 20 is rotatably connected to the top of the test bench 1. When the mounting seat 13 moves to the end of the second slide groove 10, the contact switch 17 contacts a guide block 14, indicating that it has moved into position. The telescopic end of the electric cylinder 20 can then be extended by the external controller, causing the flap 21 to rotate and push one side of the mounting seat 13 to rotate and lift along the arc groove 12. This facilitates subsequent chip disassembly and assembly operations and also helps maintain the stability of the mounting seat 13 during disassembly and assembly in conjunction with the positioning rod 18.

[0024] In use, the chip is first installed in the mounting slot 16. The mounting base 13 is then manually pulled, causing it to slide away from the back plate 2 along the second slide groove 10 via four guide blocks 14. When the mounting base 13 reaches the end of the second slide groove 10, one of the guide blocks 14 of the proximity contact switch 17 contacts the contact switch 17. The contact switch 17 sends a contact signal to an external controller, which then controls the extension end of the electric cylinder 20 to extend. The electric cylinder 20 then pushes the flip plate 21 to rotate, thereby pushing the mounting base 13 around the proximity contact switch 17. The two guide blocks 14 on one side rotate, causing the two guide blocks 14 near the back plate 2 to slide out of the second slide groove 10 and slide upward along the arc groove 12, causing the mounting base 13 to tilt as a whole. When the two guide blocks 14 near the back plate 2 slide to the top of the arc groove 12, the positioning rod 18 is pushed so that the end of the positioning rod 18 is inserted into the embedded hole 15, and the positioning rod 18 can be rotated so that the locking block 19 is inserted into the locking slot. At this time, the position of the mounting base 13 is fixed, and the three chips are installed into the mounting slot 16 in sequence, so that each pin of the chip is connected to the wire hole plug.

[0025] Remove the positioning rod 18, manually control the telescopic end of the electric cylinder 20 to retract, and the mounting base 13 descends along the arc groove 12 under the action of gravity and returns to the second slide groove 10. Push the mounting base 13 to slide along the second slide groove 10 to the side close to the back plate 2, and power the chip through the ribbon cable 22. Inject cold air into the air hole 161 through the fan and air duct 23 to cool the chip. Start the electric telescopic rod 7, and the telescopic end of the electric telescopic rod 7 extends to push the sliding plate 5 down along the first slide groove 3 and the guide rod 4 through the first slider. Finally, the three sets of detection needles 6 perform performance tests on the three chips respectively. After the test is completed, repeat the above operation to tilt the mounting base 13 to facilitate chip removal.

[0026] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A test socket for chip packaging, comprising a test stage (1) and a mounting base (13), characterized in that: The test bench (1) is fixedly mounted with a base (8) at the top. The base (8) is fixedly connected with two fixing strips (9) at both ends. The two fixing strips (9) are symmetrically opened with second sliding grooves (10). The top of the fixing strip (9) is fixedly connected with a fixing block (11). The two fixing blocks (11) are symmetrically opened with arc grooves (12) that communicate with the second sliding grooves (10). The two second sliding grooves (10) are slidably connected with a mounting seat (13) through four guide blocks (14). The top of the mounting seat (13) is opened with three mounting grooves (16). A contact switch (17) is fixedly installed on the side wall of the end of one of the fixing strips (9). An embedded hole (15) is opened on the side wall of the guide block (14) away from the contact switch (17). A slot is opened on the side wall of the fixing block (11) on the side of the embedded hole (15). A positioning rod (18) is slidably connected in the slot. A locking block (19) is fixedly connected on one side of the positioning rod (18).

2. The test socket for chip packaging according to claim 1, characterized in that: The test platform (1) has a back plate (2) fixedly connected to one side of the top. Two vertical first slide grooves (3) are symmetrically opened on one side of the back plate (2). The two first slide grooves (3) are slidably connected to a horizontally set sliding plate (5) through a first slider. Three sets of detection needles (6) are fixedly connected to the bottom of the sliding plate (5) away from the back plate (2).

3. A test socket for chip packaging according to claim 2, characterized in that: An electric telescopic rod (7) is fixedly installed on the top side of one side of the back plate (2), and the telescopic end of the electric telescopic rod (7) is fixedly connected to the top of the sliding plate (5).

4. A test socket for chip packaging according to claim 2, characterized in that: The test bench (1) has guide rods (4) fixedly connected to both sides of the top end and sliding plate (5). The top end of the guide rods (4) is fixedly connected to the side wall of the back plate (2) through an extension plate. The back plate (2) has two limiting rods fixedly connected to the middle through an extension plate. The middle of the limiting rods is slidably connected to the middle of the sliding plate (5). The bottom end of the limiting rods is fixedly connected to a limiting block.

5. A test socket for chip packaging according to claim 1, characterized in that: The mounting slot (16) has several air holes (161) on both sides. The test bench (1) is equipped with a fan. The mounting base (13) is connected to the air holes (161) and the fan through several soft air pipes (23) on the side away from the contact switch (17).

6. A test socket for chip packaging according to claim 1, characterized in that: The bottom of the mounting slot (16) is provided with a wire hole plug, and the mounting base (13) is connected to three ribbon cables (22) that are electrically connected to the wire hole plugs in the three mounting slots (16) respectively on the side away from the contact switch (17).

7. A test socket for chip packaging according to claim 1, characterized in that: The base (8) is rotatably connected to a flap (21) in the middle. The bottom end of the flap (21) is rotatably connected to the telescopic end of an electric cylinder (20). The bottom of the electric cylinder (20) is rotatably connected to the top of the test bench (1).

Images