Multichannel hermetic optical module

Abstract

The utility model provides a kind of multi-channel airtight light module.The light module includes pedestal, damper, cover, optoelectronic assembly and wave division multiplexer;The damper has optical window;The lower part of the damper is sealed with the pedestal Assembly, upper part is sealed with the cover Assembly, to enclose airtight packaging cavity;The optoelectronic assembly is located in the packaging cavity, and is fixedly connected to the pedestal;The optoelectronic assembly is used for the conversion of electric signal and optical signal;The wave division multiplexer is located outside the packaging cavity;The optoelectronic assembly is optically coupled with the wave division multiplexer via the optical window connection.Such, not only can make the overall size of BOX smaller, reduce cost, but also can greatly reduce coupling lens quantity and coupling frequency.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, and specifically to a multi-channel airtight optical module. Background Technology

[0002] Common multi-channel hermetically sealed packaging uses a BOX structure, which mainly falls into two categories. One type integrates the optoelectronic chip and passive optical devices (such as wavelength division multiplexers) within the BOX. This reduces the number of optical devices and coupling operations, but the BOX is relatively large, leading to a higher overall cost for the optical module. The other type integrates the optoelectronic chip and coupling lenses within the BOX, with the light source (such as the wavelength division multiplexer) located outside the BOX. This results in a smaller BOX, but requires additional coupling lenses to connect the BOX and the wavelength division multiplexer, leading to a larger number of coupling lenses and coupling operations. Utility Model Content

[0003] To address the issues of numerous coupling lenses, multiple coupling cycles, large BOX size, and high cost, the purpose of this invention is to provide a multi-channel airtight optical module.

[0004] To achieve the above objectives, one embodiment provides a multi-channel hermetically sealed optical module. The optical module includes a base, a damming component, a cover, optoelectronic components, and a wavelength division multiplexer. The dam component has a light window; the lower part of the dam component is sealed and assembled with the base, and the upper part is sealed and assembled with the cover to enclose an airtight sealing cavity; The optoelectronic component is disposed within the encapsulation cavity and fixedly connected to the base; the optoelectronic component is used for the conversion of electrical signals and optical signals; The wavelength division multiplexer is located outside the encapsulation cavity; The optoelectronic component is optically coupled to the wavelength division multiplexer via the optical window.

[0005] In one embodiment, the optoelectronic component includes: Multiple laser chips are used to convert electrical signals into optical signals; Multiple coupling lenses, corresponding to multiple laser chips, are used to receive optical signals from the laser chips and couple the optical signals to the wavelength division multiplexer via the optical window for multiplexing.

[0006] In one embodiment, the optical module further includes an isolator, a fiber optic coupling lens, an optical fiber, and a fiber optic adapter; The isolator, fiber coupling lens and optical fiber are all located outside the encapsulation cavity. The optical signal enters the optical fiber after passing through the isolator and fiber coupling lens in sequence from the wavelength division multiplexer. The wavelength division multiplexer, isolator, fiber optic coupling lens, and fiber optic adapter are fixedly connected to the base, and the optical fiber is connected to the fiber optic adapter.

[0007] In one embodiment, the optical module further includes: A circuit board, which is disposed outside the encapsulation cavity; A circuit board, at least partially disposed within the encapsulation cavity and electrically connected to the circuit board; The optoelectronic component is electrically connected to the circuit board to receive one or more of high-frequency signals, low-frequency signals, and power signals from the circuit board.

[0008] In one embodiment, the optical module further includes a plurality of electrical pins; The electrical pin is sealed through the dam component, and its two ends are electrically connected to the circuit board and the circuit board, respectively.

[0009] In one embodiment, a boss is provided on the inner side of the dam component, and the circuit board is supported on the boss.

[0010] In one embodiment, the dam component has a through groove that extends both inside and out; The circuit board is sealed and assembled at the through slot and extends at least partially outside the package cavity. The portion of the circuit board extending outside the package cavity is electrically connected to the circuit board.

[0011] In one embodiment, the optoelectronic component further includes a thermistor and a cooler; The cooler is fixedly assembled on the base; One or more of the thermistor, the laser chip, and the coupling lens are fixedly mounted on the cooler.

[0012] In one embodiment, the base has a through slot that extends vertically and communicates with the encapsulation cavity; The circuit board is sealed and assembled at the slot, and includes a first circuit layer exposed inside the encapsulation cavity, a second circuit layer exposed outside the encapsulation cavity, and a conductive via connecting the first circuit layer and the second circuit layer. The optoelectronic component is electrically connected to the first circuit layer; The second circuit layer is electrically connected to the circuit board.

[0013] In one embodiment, the optoelectronic component further includes a thermistor and a cooler; The cooler is fixedly assembled on the base and / or the circuit board; One or more of the thermistor, the laser chip, and the coupling lens are fixedly mounted on the cooler.

[0014] Compared with the prior art, the beneficial effects of one embodiment of this utility model are as follows: by setting a separate base, dam, and cover to form an airtight BOX, the optoelectronic component is placed inside the encapsulation cavity, and the wavelength division multiplexer is placed outside the encapsulation cavity. The optoelectronic component is directly optically coupled to the wavelength division multiplexer through an optical window. In this way, not only can the overall size of the BOX be reduced, avoiding the high cost problem caused by the large size of the BOX, and achieving efficient space utilization and high integration, but the number of coupling lenses can also be greatly reduced (for example, there is no need to add a coupling lens between the optical window and the wavelength division multiplexer), and the number of coupling times during assembly can be greatly reduced. Attached Figure Description

[0015] Figure 1 A schematic diagram of the optical module of Embodiment 1 of this utility model is shown; Figure 2 The diagram shows a structural schematic of the optical module of Embodiment 1 of this utility model, wherein details are omitted. Figure 1 The cover in the middle; Figure 3 A cross-sectional view of the optical module of Embodiment 1 of this utility model is shown; Figure 4 A schematic diagram of the structure of the dam component of Embodiment 1 of this utility model is shown; Figure 5 A schematic diagram of the optical module of Embodiment 2 of this utility model is shown; Figure 6 A cross-sectional view of the optical module of Embodiment 2 of this utility model is shown; Figure 7 A schematic diagram of the structure of the dam component of Embodiment 2 of this utility model is shown; Figure 8 A schematic diagram of the optical module of Embodiment 3 of this utility model is shown; Figure 9 This diagram shows a structural schematic of the optical module of Embodiment 3 of the present invention from another angle; Figure 10 A cross-sectional view of the optical module of Embodiment 3 of this utility model is shown; Figure 11 A schematic diagram of the dam component of Embodiment 3 of this utility model is shown. Detailed Implementation

[0016] The present application will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments are only for illustrating the present invention and do not limit the scope of the present application. Any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the protection scope of the present application.

[0017] In the various figures of the present application, for the convenience of illustration, certain dimensions of structures or parts are exaggerated relative to other structures or parts. Therefore, it is only for illustrating the basic structure of the subject matter of the present application.

[0018] Spatial relative position terms used herein, such as "upper", "above", "lower", "below", etc., are for the purpose of facilitating description to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings. The spatial relative position terms can be intended to include different orientations of the device in use or operation other than the orientation shown in the figures. For example, if the device in the figure is flipped, the unit described as being "below" or "beneath" other units or features will be located "above" other units or features. Therefore, the exemplary term "below" can encompass both the upper and lower orientations. The device can be oriented in other ways (rotated 90 degrees or other orientations), and the spatially related descriptive terms used herein can be interpreted accordingly.

[0019] Embodiment 1 Refer Figures 1 to 4 , this embodiment provides an airtight optical module 100.

[0020] The optical module 100 is a multi-channel optical module. For example, the one illustrated in the figure is a 4-channel module. Of course, it is not limited thereto, and it can also be more channels, such as 8 channels.

[0021] Specifically, the optical module 100 includes a base 13, a dam member 11, and a cover 12.

[0022] Among them, the lower part of the dam member 11 is hermetically assembled with the base 13.

[0023] Specifically, for example, the lower part of the dam member 11 is hermetically assembled with the base 13 by welding (such as resistance welding) or sintering.

[0024] More specifically, the dam member 11 is generally in a frame structure or a cylindrical structure, having an upper opening and a lower opening. The four peripheral edges of the lower part of the dam member 11 enclose the lower opening of the dam member 11. When the optical module 100 is assembled, there is a circle of metal sharp corners or solder at the four peripheral edges of the lower part of the dam member 11, thereby achieving hermetic assembly with the base 13 by sintering or resistance welding.

[0025] The upper part of the dam member 11 is hermetically assembled with the cover 12.

[0026] Specifically, for example, the upper part of the dam member 11 is hermetically assembled with the cover 12 by welding (such as resistance welding or seam welding) or sintering.

[0027] More specifically, the four perimeters of the upper part of the dam component 11 form the upper opening of the dam component 11. During the assembly of the optical module 100, a ring of metal sharp corners or solder exists on the four perimeters of the upper part of the dam component 11 or the lower surface of the cover 12, thereby achieving a sealed assembly of the four perimeters of the upper part of the dam component 11 and the base 13 through sintering, resistance welding or parallel seam welding.

[0028] The lower part of the dam component 11 is sealed and assembled with the base 13 and the lower part is sealed and assembled with the cover 12, so that the dam component 11, the base 13 and the cover 12 together enclose the encapsulation cavity 10.

[0029] The optical module 100 also includes an optoelectronic component 20.

[0030] The optoelectronic component 20 is located inside the encapsulation cavity 10 and is used for the conversion of electrical signals and optical signals.

[0031] Furthermore, the optoelectronic component 20 is fixedly connected to the base 13.

[0032] Thus, during the assembly of the optical module 100, the optoelectronic component 20 and the dam component 11 are independently assembled onto the base 13, without the need for pre-integration. This not only enables small-volume hermetically sealed assembly but also improves assembly flexibility and reduces the number of coupling lenses and coupling cycles.

[0033] The optical module 100 also includes a wavelength division multiplexer 42.

[0034] The wavelength division multiplexer 42 is located outside the encapsulation cavity 10, and the optoelectronic component 20 is optically coupled to the wavelength division multiplexer 42.

[0035] Specifically, the dam component 11 has an optical window 111, through which the optoelectronic component 20 and the wavelength division multiplexer 42 are optically coupled. That is, the optical window 111 has light-transmitting properties, allowing light signals to be transmitted inside and outside the encapsulation cavity 10.

[0036] In one embodiment, the light window 111 can specifically be a glass light window, which is airtightly disposed on the main body of the dam member 11. The airtight disposal method can be, for example, solder sintering.

[0037] Thus, an airtight box is formed by setting up a separate base 13, a dam 11, and a cover 12. The optoelectronic component 20 is placed inside the encapsulation cavity 10, and the wavelength division multiplexer 42 is placed outside the encapsulation cavity 10. The optoelectronic component 20 is directly optically coupled to the wavelength division multiplexer 42 through the optical window 111. This encapsulation method not only makes the overall size of the box smaller, avoiding the high cost problem caused by a large box size, but also greatly reduces the number of coupling lenses (for example, there is no need to add a coupling lens between the optical window 111 and the wavelength division multiplexer 42), greatly reducing the number of coupling steps during assembly.

[0038] For example, based on the structural configuration of this application, during the assembly of the optical module 100, the wavelength division multiplexer 42 and the damming component 11 can be assembled onto the base 13 first; then, the optoelectronic component 20 can be installed inside the encapsulation cavity 10 through the upper opening of the damming component 11 (at this time, the encapsulation cavity 10 is not completely sealed) to achieve optical coupling between the optoelectronic component 20 and the wavelength division multiplexer 42; finally, the cover 12 is sealed and assembled onto the damming component 11 to achieve hermetically sealed assembly. It is evident that not only are the number of coupling lenses reduced, but the number of coupling operations is also reduced, while the BOX size is small and the cost is low.

[0039] In one embodiment, the optical module 100 has at least an optical transmission function. For example, the optical module 100 can be specifically configured as an optical transmission module, or it can be configured as an optical transceiver module.

[0040] The optoelectronic component 20 includes multiple laser chips 21 and multiple coupling lenses 22 corresponding to the multiple laser chips 21.

[0041] Laser chip 21 is used to convert electrical signals into optical signals.

[0042] The coupling lens 22 is used to receive optical signals from the laser chip 21 and emit the optical signals through the optical window 111 to the outside of the package cavity 10 until they are coupled to the wavelength division multiplexer 42.

[0043] The wavelength division multiplexer 42 multiplexes the received optical signal. Specifically, the wavelength division multiplexer 42 can be configured as a Z-Block structure.

[0044] As previously stated, optical module 100 is a multi-channel optical module. The number of laser chips 21 and coupling lenses 22 are consistent with the number of channels. For example, for a four-channel optical module 100, as shown in the figure, the number of laser chips 21 and coupling lenses 22 are both 4, and the wavelength division multiplexer 42 multiplexes the received four optical signals. Of course, the number of channels is not limited to this, and correspondingly, the number of laser chips 21 and coupling lenses 22 are also not limited to this.

[0045] Furthermore, the optical module 100 also includes an isolator 44, an optical fiber coupling lens 22, and an optical fiber.

[0046] The isolator 44, the fiber coupling lens 22, and the optical fiber are all located outside the encapsulation cavity 10. The optical signal enters the optical fiber after passing through the isolator 44 and the fiber coupling lens 22 in sequence from the wavelength division multiplexer 42.

[0047] Here, the wavelength division multiplexer 42, isolator 44, fiber coupling lens 22 and optical fiber are passive optical devices, and in this application they are all located outside the encapsulation cavity 10, reducing the size of the BOX hermetic packaging and reducing costs.

[0048] Of course, the optical module 100 may also include other passive optical devices, such as adding a prism 43 to the optical path between the wavelength division multiplexer 42 and the isolator 44. The specific design of these optical paths may be implemented with any technology that can be implemented in the art, and is not limited to the examples in the figure.

[0049] The wavelength division multiplexer 42, isolator 44, fiber optic coupling lens 22, and optical fiber are respectively fixedly connected to the base 13. That is, the base 13 can not only form a BOX structure with the dam 11 and the cover 12, but also serve as a support to fix and install passive optical devices such as the wavelength division multiplexer 42, isolator 44, fiber optic coupling lens 22, and optical fiber.

[0050] The wavelength division multiplexer 42, isolator 44, and fiber optic coupling lens 22 can be directly fixed to the base 13, for example, by adhesive or other means.

[0051] The optical fiber can be indirectly fixed on the base 13.

[0052] For example, the optical module 100 also includes a crimp ring 50 and an optical fiber adapter 60.

[0053] The crimp ring 50 and the fiber optic adapter 60 are fixedly connected to the base 13. The fiber optic cable is mated to the fiber optic adapter 60. More specifically, the crimp ring 50 is fixedly assembled on the base 13, and the fiber optic adapter 60 is assembled on the crimp ring 50.

[0054] Furthermore, the optical module 100 also includes a circuit board (not shown) and a circuit board 70.

[0055] The circuit board can be a printed circuit board or a combination of a printed circuit board and a flexible circuit board.

[0056] The circuit board is located outside the encapsulation cavity 10 and is used for plug-in connection with components outside the optical module 100.

[0057] At least a portion of the circuit board 70 is disposed within the encapsulation cavity 10 and is electrically connected to the circuit board.

[0058] Furthermore, the optoelectronic component 20 is electrically connected to the circuit board 70 to receive one or more of high-frequency signals, low-frequency signals, and power signals from the circuit board 70.

[0059] That is, the optoelectronic component 20 is electrically connected to the circuit board via the circuit board 70, thereby realizing one or more electrical connections such as high-frequency signal interconnection, low-frequency signal interconnection, and power supply access.

[0060] The circuit board 70 can be specifically configured as a ceramic circuit board, which includes a signal circuit 71. The optoelectronic component 20 can be electrically connected to the signal circuit 71 by any feasible method such as solder pads or bonding wires.

[0061] The following is a detailed description of the fixed position of the circuit board 70 in this embodiment and the specific structure for achieving electrical connection between it and the circuit board.

[0062] As shown in the figure, in this embodiment, the optical module 100 also includes several electrical pins 72.

[0063] Electrical pin 72 is sealed and penetrates the dam component 11.

[0064] Specifically, refer to Figure 4 The dam component 11 is provided with an electrical opening 112 that extends through both the inside and outside. The electrical pin 72 is sealed and assembled in the electrical opening 112. For example, it can be sealed and assembled in the electrical opening 112 by glass solder sintering.

[0065] The two ends of the electrical pin 72 are electrically connected to the circuit board 70 and the circuit board, respectively.

[0066] The electrical connection between the electrical pin 72 and the circuit board 70 can be achieved by any feasible method such as bonding wires or soldering.

[0067] Similarly, the electrical connection between the electrical pin 72 and the circuit board can be achieved through any feasible method such as wire bonding or soldering.

[0068] Furthermore, in this embodiment, a boss 113 is provided on the inner side of the dam component 11, and the circuit board 70 is supported on the boss 113.

[0069] Specifically, the circuit board 70 can be fixedly mounted on the boss 113 by sintering.

[0070] Signal circuit 71 is formed on the upper surface of circuit board 70.

[0071] Furthermore, the optoelectronic component 20 also includes a thermistor and a cooler 23.

[0072] Thermistor and cooler 23 are used to stabilize the operating temperature and output wavelength of laser chip 21.

[0073] In this embodiment, the cooler 23 is fixedly assembled on the base 13.

[0074] For example, a portion of the surface of the base 13 is exposed inside the encapsulation cavity 10, and the cooler 23 is fixedly mounted on this portion of the surface of the base 13.

[0075] One or more of the resistor, laser chip 21, and coupling lens 22 are fixedly mounted on the cooler 23.

[0076] In one embodiment, the electrical connection between the optoelectronic component 20 and the circuit board 70 may include: the electrical connection between the laser chip 21 and the circuit board 70, the electrical connection between the thermistor and the circuit board 70, and the electrical connection between the cooler 23 and the circuit board 70.

[0077] In one embodiment, the base 13 is configured as a heat sink with a heat dissipation function.

[0078] Furthermore, the optical module 100 may further include a housing having an inner cavity.

[0079] The circuit board, the base 13, the dam member 11, the cover 12, the wavelength division multiplexer 42, etc. are all accommodated in the inner cavity of the housing.

[0080] In summary, the beneficial effects of the optical module of this embodiment are as follows: By providing a split base 13, dam member 11, and cover 12 to form an airtight BOX, the optoelectronic component 20 is disposed in the encapsulation cavity 10, and the wavelength division multiplexer 42 is disposed outside the encapsulation cavity 10. The optoelectronic component 20 is directly optically coupled to the wavelength division multiplexer 42 through the optical window 111. This not only makes the overall size of the BOX smaller, avoiding the high cost problem caused by a large BOX volume, but also can greatly reduce the number of coupling lenses (for example, no additional coupling lens is required between the optical window 111 and the wavelength division multiplexer 42), and greatly reduce the number of coupling times during assembly.

[0081] Embodiment 2 Refer Figures 5 to 7 , this Embodiment 2 provides a multi-channel airtight optical module 100.

[0082] The difference between this Embodiment 2 and the previous Embodiment 1 is only: the fixed position of the circuit board 70 and the specific structure for achieving electrical connection between it and the circuit board. Only this difference point will be introduced below, and other technical contents are the same as those in the previous Embodiment 1 and will not be elaborated.

[0083] In the previous Embodiment 1, the electrical connection between the circuit board 70 and the circuit board is achieved through electrical pins 72.

[0084] Different from Embodiment 1, in this Embodiment 2, the dam member 11 is provided with a through groove 114 that penetrates through the inside and outside; the circuit board 70 is hermetically assembled at the through groove 114 and at least partially extends outside the encapsulation cavity 10 to be electrically connected to the circuit board.

[0085] Specifically, for example, the circuit board 70 includes a first part located inside the encapsulation cavity 10 and a second part located outside the encapsulation cavity 10, and the first part and the second part are connected at the through groove 114.

[0086] The circuit board 70 includes a signal circuit 71 that continuously extends from a first portion of the circuit board 10 to a second portion.

[0087] At the first portion, the signal circuit 71 is electrically connected to the optoelectronic component 20 by means such as pads and bonding wires, for example, any one or more of electrical connections including high-frequency signal interconnection, low-frequency signal interconnection, power supply access, etc.

[0088] At the second portion, the signal circuit 71 is electrically connected to the circuit board by means such as pads and bonding wires, for example, any one or more of electrical connections including high-frequency signal interconnection, low-frequency signal interconnection, power supply access, etc.

[0089] Furthermore, compared with Embodiment 1, in this Embodiment 2, the boss 113 of the dam member 11 and the electrical pin 72 can also be omitted.

[0090] In addition, the technical content of this Embodiment 2 is exactly the same as that of the previous Embodiment 1 and will not be elaborated here.

[0091] Embodiment 3 Refer Figures 8 to 11 , this Embodiment 3 provides a multi-channel hermetic optical module 100.

[0092] The main differences between this Embodiment 3 and the previous Embodiment 1 are: the fixed position of the circuit board 70, the specific structure for achieving electrical connection between it and the circuit board, and the fixed position of the cooler 23. Only these difference points will be introduced below, and other technical contents are the same as those of the previous Embodiment 1 and will not be elaborated again.

[0093] In the previous Embodiment 1, the electrical connection between the circuit board 70 and the circuit board is achieved through the electrical pin 72.

[0094] Different from Embodiment 1, in this Embodiment 3, the dam member 11 no longer opens the electrical opening 112 to install the electrical pin 72. Instead, a through-hole slot is opened in the base 13, and the slot communicates with the encapsulation cavity 10; the circuit board 70 is hermetically assembled at the slot.

[0095] The circuit board 70 includes a signal circuit 71, which includes a first circuit layer exposed inside the encapsulation cavity 10, a second circuit layer exposed outside the encapsulation cavity 10, and a conductive via 73 connecting the first circuit layer and the second circuit layer.

[0096] The optoelectronic component 20 is electrically connected to the first circuit layer, for example, through electrical connections such as pads and bonding wires.

[0097] The second circuit layer is electrically connected to the circuit board, for example, through electrical connections such as pads and bonding wires.

[0098] That is, in this embodiment, the upper surface of the circuit board 70 is at least partially exposed inside the encapsulation cavity 10 and a first circuit layer is formed thereon; the lower surface of the circuit board 70 is at least partially exposed outside the encapsulation cavity 10, specifically exposed on the underside of the base 13, and a second circuit layer is formed thereon.

[0099] The first circuit layer and the second circuit layer are electrically connected to the optoelectronic component 20 and the circuit board, respectively, and the two are electrically connected through conductive vias 73.

[0100] Furthermore, in the previous embodiment 1, the cooler 23 is fixedly assembled on the base 13.

[0101] In this embodiment 3, the cooler 23 is fixedly mounted on the circuit board 70. However, it is not limited to this. For example, in a variation embodiment, a portion of the surface of the base 13 is exposed inside the encapsulation cavity 10, and the cooler 23 may also be fixedly mounted on this portion of the surface of the base 13, or the cooler 23 may be fixedly mounted on both the base 13 and the circuit board 70.

[0102] Apart from the above, the technical content of this embodiment 3 is exactly the same as that of the previous embodiment 1, and will not be repeated here.

[0103] Furthermore, in a variation of this embodiment 3, the structure of the second circuit layer and the conductive via 73 can be omitted, and the electrical pin 72 exemplified in embodiment 1 can be used to electrically connect the first circuit layer (i.e., the signal circuit 71) to the external circuit board.

[0104] In summary, the advantages of this application compared to common technologies are that by setting up a separate base 13, a dam 11, and a cover 12 to form an airtight BOX, the optoelectronic component 20 is placed inside the encapsulation cavity 10, and the wavelength division multiplexer 42 is placed outside the encapsulation cavity 10. The optoelectronic component 20 is directly optically coupled to the wavelength division multiplexer 42 through the optical window 111. This not only makes the overall size of the BOX smaller, avoiding the high cost problem caused by the large size of the BOX, but also greatly reduces the number of coupling lenses (for example, there is no need to add a coupling lens between the optical window 111 and the wavelength division multiplexer 42), greatly reducing the number of coupling times during assembly.

[0105] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0106] The detailed descriptions listed above are merely specific descriptions of feasible implementation methods of this utility model and are not intended to limit the scope of protection of this utility model. All equivalent implementation methods or modifications made without departing from the spirit of this utility model should be included within the scope of protection of this utility model.

Claims

1. A multi-channel airtight optical module, characterized in that, Includes base, dam components, cover, optoelectronic components, and wavelength division multiplexer; The dam component has a light window; the lower part of the dam component is sealed and assembled with the base, and the upper part is sealed and assembled with the cover to enclose an airtight sealing cavity; The optoelectronic component is disposed within the encapsulation cavity and fixedly connected to the base; The optoelectronic component is used for the conversion of electrical signals and optical signals; The wavelength division multiplexer is located outside the encapsulation cavity; The optoelectronic component is optically coupled to the wavelength division multiplexer via the optical window.

2. The multi-channel airtight optical module according to claim 1, characterized in that, The optoelectronic component includes: Multiple laser chips are used to convert electrical signals into optical signals; Multiple coupling lenses, corresponding to multiple laser chips, are used to receive optical signals from the laser chips and couple the optical signals to the wavelength division multiplexer via the optical window for multiplexing.

3. The multi-channel airtight optical module according to claim 2, characterized in that, The optical module also includes an isolator, a fiber coupling lens, an optical fiber, and a fiber adapter; The isolator, fiber coupling lens and optical fiber are all located outside the encapsulation cavity. The optical signal enters the optical fiber after passing through the isolator and fiber coupling lens in sequence from the wavelength division multiplexer. The wavelength division multiplexer, isolator, fiber optic coupling lens, and fiber optic adapter are fixedly connected to the base, and the optical fiber is connected to the fiber optic adapter.

4. The multi-channel airtight optical module according to claim 2, characterized in that, The optical module also includes: A circuit board, which is disposed outside the encapsulation cavity; A circuit board, at least partially disposed within the encapsulation cavity and electrically connected to the circuit board; The optoelectronic component is electrically connected to the circuit board to receive one or more of high-frequency signals, low-frequency signals, and power signals from the circuit board.

5. The multi-channel hermetically sealed optical module according to claim 4, characterized in that, The optical module also includes several electrical pins; The electrical pin is sealed through the dam component, and its two ends are electrically connected to the circuit board and the circuit board, respectively.

6. The multi-channel hermetically sealed optical module according to claim 5, characterized in that, The inner side of the dam component is provided with a boss, and the circuit board is supported on the boss.

7. The multi-channel hermetically sealed optical module according to claim 4, characterized in that, The dam component has a through groove that runs through both the inside and outside; The circuit board is sealed and assembled at the through slot and extends at least partially outside the package cavity. The portion of the circuit board extending outside the package cavity is electrically connected to the circuit board.

8. The multi-channel hermetically sealed optical module according to claim 6 or 7, characterized in that, The optoelectronic component also includes a thermistor and a cooler; The cooler is fixedly assembled on the base; One or more of the thermistor, the laser chip, and the coupling lens are fixedly mounted on the cooler.

9. The multi-channel hermetically sealed optical module according to claim 4, characterized in that, The base has a through slot that runs vertically through the cavity. The circuit board is sealed and assembled at the slot, and includes a first circuit layer exposed inside the encapsulation cavity, a second circuit layer exposed outside the encapsulation cavity, and a conductive via connecting the first circuit layer and the second circuit layer. The optoelectronic component is electrically connected to the first circuit layer; The second circuit layer is electrically connected to the circuit board.

10. The multi-channel hermetically sealed optical module according to claim 9, characterized in that, The optoelectronic component also includes a thermistor and a cooler; The cooler is fixedly assembled on the base and / or the circuit board; One or more of the thermistor, the laser chip, and the coupling lens are fixedly mounted on the cooler.

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