Wafer surface photoresist layer rapid curing device

Abstract

The utility model discloses a kind of wafer surface photoresist layer quick curing device, belong to semiconductor manufacturing equipment technical field, the device includes box, curing chamber, heating pipe, placing table and box cover, water cooling assembly and support assembly are also provided, water cooling assembly includes the water cooling plate of being located at the outer periphery of curing chamber, water pump, liquid storage tank and infusion pipeline, they jointly constitute a closed cooling liquid circulation loop, for the forced high-efficiency heat dissipation of curing chamber, support assembly includes the supporting plate fixed in the inner wall of box by screw, recessed groove compatible with the appearance of water cooling plate is opened on supporting plate, water cooling plate is installed in recessed groove by the way of clamping. The utility model solves the problem that curing temperature is unstable and yield is affected due to low heat dissipation efficiency in the prior art, has the advantages of high-efficiency heat dissipation, accurate temperature control, convenient installation and prolonging equipment life.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a device for rapid curing of photoresist layer on wafer surface. Background Technology

[0002] In the photolithography process of semiconductor chips, photoresist curing is a crucial step. It involves heating the photoresist layer coated on the wafer surface to harden it, thereby enhancing the adhesion of the photoresist and its resistance to subsequent etching processes, thus ensuring the accuracy of pattern transfer.

[0003] To improve production efficiency and shorten manufacturing cycles, the industry trend is to rapidly cure photoresist. Rapid curing means that higher temperatures need to be applied to the wafer in a shorter time, which causes the core components of the curing device, such as heating tubes and curing chambers, to generate and accumulate a large amount of heat in a short period of time.

[0004] Existing curing devices typically employ relatively simple heat dissipation methods, such as simply installing cooling fans on the device casing for air cooling. However, air has relatively low thermal conductivity. When faced with the large and concentrated heat generated by rapid curing, this method of relying solely on fans to promote air convection is inadequate, making it difficult to effectively and promptly dissipate the heat around the curing chamber. The continuous accumulation of heat leads to a core problem: the temperature of the curing chamber becomes unstable and difficult to control precisely. Excessively high temperatures or drastic temperature fluctuations can severely affect the curing effect of photoresist, resulting in uneven curing, pattern distortion, and ultimately reducing the yield of chips. At the same time, a sustained high-temperature environment will also accelerate the aging of internal electronic components and shorten the overall lifespan of the device.

[0005] Therefore, this invention proposes a device for rapid curing of photoresist layer on wafer surface to overcome the shortcomings of existing technology. Utility Model Content

[0006] In view of the problems existing in the rapid curing device for photoresist layer on wafer surface, which relies solely on air cooling for heat dissipation during rapid curing, resulting in low heat dissipation efficiency, unstable temperature in the curing chamber, and consequently affecting the curing quality of the photoresist and shortening the service life of the equipment, this utility model aims to provide a rapidly curing device for photoresist layer on wafer surface with an improved structure that can effectively solve the above problems.

[0007] This utility model provides a device for rapid curing of photoresist layer on wafer surface, including a housing, a curing chamber disposed inside the housing, a placement platform fixed inside the curing chamber, a housing cover connected to the top of the curing chamber, a heating pipe attached to the inner wall of the curing chamber, and a cooling fan installed on the housing; as well as a water cooling component and a support component.

[0008] The water-cooling assembly includes a water-cooling plate, a water pump, and a liquid storage tank located on the outer periphery of the curing chamber. The water-cooling plate has a first liquid delivery pipe for coolant circulation inside. The liquid storage tank, water pump, and water-cooling plate are connected by a second liquid delivery pipe and a third liquid delivery pipe, forming a closed forced circulation loop for coolant.

[0009] Furthermore, the support assembly includes a tray that is fixed to the inner wall of the chamber by screws. The tray has a groove whose inner contour matches the shape of the water-cooling plate. The water-cooling plate is accommodated and confined in the groove, thereby stably installing the water-cooling assembly on the outer periphery of the curing chamber and achieving efficient heat dissipation of the curing chamber.

[0010] Preferably, the trays are arranged in a ring array along the outer periphery of the curing chamber. This layout allows multiple water-cooled plates to be evenly covered on the outside of the curing chamber, ensuring that heat can be absorbed more evenly, thereby improving the overall heat dissipation uniformity.

[0011] Preferably, there are multiple water-cooled plates and multiple support plates, which are snapped into the grooves in a one-to-one correspondence. This precise correspondence between quantity and position ensures that each water-cooled plate has its own independent mounting base, which enhances the stability and modularity of the installation and facilitates the replacement of individual components.

[0012] Preferably, the support plate is detachably fixed to the inner wall of the box by screws. This connection method not only ensures the reliability of the connection, but more importantly, it facilitates subsequent maintenance. When it is necessary to repair or replace the water-cooling plate, the entire support assembly can be easily disassembled by simply unscrewing the screws.

[0013] Preferably, the lid is hinged to the top opening edge of the curing chamber. This connection method makes the opening and closing of the lid easier and more convenient, allowing operators to safely and quickly pick up and put down the wafers.

[0014] Preferably, the cooling fan is installed on the side wall of the enclosure. This position facilitates the formation of an efficient air convection path inside the enclosure, which can better cooperate with the water cooling components to maintain the overall ambient temperature inside the enclosure within a reasonable range.

[0015] Preferably, the water pump and the liquid storage tank are integrated on the external base of the tank. This integrated design makes the power and liquid storage unit of the water cooling component compact, which not only saves internal space, but also facilitates the monitoring, replenishment and maintenance of the coolant.

[0016] Furthermore, as a specific implementation of the snap-fit ​​fixation, the depth and width of the groove are matched with the cross-sectional dimensions of the water-cooling plate. This precise dimensional fit ensures that the water-cooling plate will not wobble after being inserted into the groove, achieving a tight fit, which is beneficial for the efficient conduction of heat from the curing chamber to the water-cooling plate.

[0017] This utility model has the following beneficial effects: 1. This utility model solves the problems of low heat dissipation efficiency, unstable curing temperature, and poor photoresist curing quality caused by relying solely on air cooling in the prior art by setting a water-cooling component consisting of a water-cooling plate, a water pump, and a liquid storage tank on the outer periphery of the curing chamber and coordinating with a cooling fan for heat dissipation. It achieves the technical effect of efficiently and quickly dissipating heat and accurately controlling the curing temperature, thereby improving product yield.

[0018] 2. This utility model, by designing a support component consisting of a grooved tray for installing and fixing a water-cooled plate, solves the problems of complex installation process and inaccurate positioning of similar heat dissipation components in the prior art, and achieves the technical effects of simple structure, quick and convenient installation, and convenient maintenance.

[0019] 3. This utility model rapidly dissipates the heat generated in the curing chamber through a highly efficient water-cooling component, solving the problem of overheating and aging of internal components and shortened service life caused by heat accumulation in existing rapid curing devices. This achieves the technical effect of ensuring long-term stable operation of the equipment and extending the service life of the entire machine. Attached Figure Description

[0020] Figure 1 This is a three-dimensional schematic diagram of a device for rapid curing of photoresist layer on wafer surface according to the present invention; Figure 2 This is a schematic diagram of the liquid storage tank structure of a rapid curing device for photoresist layer on wafer surface proposed in this utility model; Figure 3 This is a schematic diagram of the water-cooled component structure of a rapid curing device for photoresist layers on wafer surfaces proposed in this utility model; Figure 4 This is a schematic diagram of the support component structure of a rapid curing device for photoresist layer on wafer surface proposed in this utility model.

[0021] Legend: 1. Cabinet body; 2. Curing chamber; 3. Heating tube; 4. Placement platform; 5. Cabinet lid; 6. Cooling fan; 7. Water cooling assembly; 71. Water cooling plate; 72. First infusion tube; 73. Second infusion tube; 74. Third infusion tube; 75. Water pump; 76. Storage tank; 8. Support assembly; 81. Tray; 82. Groove; 83. Screw. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please refer to Figures 1 to 4 This utility model provides a device for rapid curing of photoresist layer on wafer surface, which aims to solve the problem that in the existing wafer photoresist curing device, the large amount of heat generated by the heating element is difficult to be effectively dissipated in a timely manner during rapid curing. Relying solely on air cooling is inefficient and can easily lead to excessively high and unstable internal temperature, thereby affecting the curing quality of the photoresist.

[0024] like Figures 1 to 4 As shown, the rapid curing device for photoresist layer on wafer surface includes a housing 1 and a curing chamber 2 disposed inside the housing 1. The housing 1 serves as the mounting base and outer shell of the entire device, while the curing chamber 2 provides a sealed space for heating and curing the photoresist layer on the wafer surface. A placement stage 4 for supporting the wafer is fixed inside the curing chamber 2, and a cover 5 is connected to the top opening of the curing chamber 2. Heating pipes 3 attached to the inner wall of the curing chamber 2 are used to heat the curing chamber 2, and a cooling fan 6 installed on the housing 1 is used to provide auxiliary heat dissipation inside the housing 1. The device also includes a water cooling assembly 7 and a support assembly 8. The water cooling assembly 7 includes water cooling components disposed around the periphery of the curing chamber 2. The system includes a cooling plate 71, a water pump 75, and a liquid storage tank 76. The cooling plate 71 has a first liquid delivery pipe 72 for cooling liquid circulation inside. The liquid storage tank 76 is connected to the inlet of the water pump 75 through a pipe. The outlet of the water pump 75 is connected to the inlet of the cooling plate 71 through a second liquid delivery pipe 73. The outlet of the cooling plate 71 is connected to the liquid inlet of the liquid storage tank 76 through a third liquid delivery pipe 74, thus forming a closed cooling liquid circulation loop. The support assembly 8 includes a support plate 81 with a groove 82. The inner contour of the groove 82 is adapted to the outer shape of the cooling plate 71 to accommodate and limit the cooling plate 71. The support plate 81 is fixedly connected to the inner wall of the housing 1 by screws 83.

[0025] To solve the above-mentioned technical problems, the core of the technical solution of this embodiment is that the rapid curing device for photoresist layer on wafer surface also includes a water cooling component 7, and a specific structural cooperation and connection relationship is formed between the support component 8, the water cooling component 7 and the housing 1. Please refer to Figure 1 , Figure 2 and Figure 3The water-cooling assembly 7 includes a water-cooling plate 71, a water pump 75, a liquid storage tank 76, and a second liquid delivery pipe 73 and a third liquid delivery pipe 74 connecting them. The water-cooling plate 71 is attached to the outer peripheral wall of the curing chamber 2, and a first liquid delivery pipe 72 for coolant circulation is provided inside it. The water pump 75 and the liquid storage tank 76 are integrated on the outer base of the housing 1. The liquid storage tank 76 is connected to the inlet of the water pump 75 through a pipe. The outlet of the water pump 75 is connected to the inlet of the water-cooling plate 71 through the second liquid delivery pipe 73. The outlet of the water-cooling plate 71 is connected to the liquid inlet of the liquid storage tank 76 through the third liquid delivery pipe 74, thereby forming a forced circulation closed cooling loop, which efficiently absorbs and transfers the heat generated in the curing chamber 2. Please refer to Figure 4 The support component 8 includes a tray 81 with a groove 82. The tray 81 is detachably fixed to the inner wall of the housing 1 by screws 83 and arranged in a ring array along the outer periphery of the curing chamber 2. In the assembled state, the inner contour of the groove 82 matches the shape of the water-cooled plate 71, and its depth and width also match the cross-sectional dimensions of the water-cooled plate 71. The water-cooled plate 71 is snapped into the groove 82 of the corresponding tray 81. There are multiple water-cooled plates 71 and trays 81, and they are set one-to-one to ensure that the water-cooled plate 71 can be stably and tightly attached to the outer wall of the curing chamber 2. At the same time, it realizes the quick installation and removal of the water-cooled plate 71, which facilitates the maintenance and repair of the equipment.

[0026] Based on the above embodiments, the present invention may further include the following preferred technical solutions: In a preferred embodiment, in order to make the temperature distribution around the curing chamber 2 more uniform and improve the heat dissipation efficiency, the trays 81 are arranged in a ring array around the outer periphery of the curing chamber 2. As another preferred embodiment, in order to ensure the stability of the installation between the water-cooled plate 71 and the support plate 81 and the accuracy of the positioning, there are multiple water-cooled plates 71 and multiple support plates 81, and they are snapped into the grooves 82 one by one. Furthermore, the depth and width of the grooves 82 are matched with the cross-sectional dimensions of the water-cooled plate 71 to achieve a tight fit. As another preferred embodiment, in order to facilitate the maintenance and replacement of the support assembly 8 or the water-cooled plate 71, the screw 83 detachably fixes the tray 81 to the inner wall of the housing 1. As another preferred embodiment, in order to facilitate the operator to pick up and put down the wafer, the cover 5 is hinged to the top opening edge of the curing chamber 2; As another preferred embodiment, in order to enhance air convection inside the housing 1 and assist in overall heat dissipation, the cooling fan 6 is installed on the side wall of the housing 1. As another preferred embodiment, in order to make the structure of the water-cooling assembly 7 more compact and to facilitate the replenishment and monitoring of the coolant, the water pump 75 and the liquid storage tank 76 are integrated on the external base of the housing 1.

[0027] The working principle of this invention, a rapid curing device for photoresist layers on wafer surfaces, is as follows: When the device is in operation, the operator first places the wafer on the placement stage 4 inside the curing chamber 2, then closes the cover 5, and starts the device. The heating tube 3 then heats the inside of the curing chamber 2, and the heat inside the curing chamber 2 cures the photoresist layer on the surface of the wafer.

[0028] During the heating and curing process, to prevent the temperature of the curing chamber 2 from becoming too high, the cooling fan 6 is activated to accelerate the airflow inside the chamber 1 for auxiliary heat dissipation. At the same time, the water cooling component 7 starts to operate, and the water pump 75 pumps the coolant in the storage tank 76 to the water cooling plate 71 through the second delivery pipe 73. Because the water cooling plate 71 is tightly attached to the outer periphery of the curing chamber 2 by the support component 8, the coolant can efficiently absorb a large amount of heat transferred from the curing chamber 2 when it circulates in the first delivery pipe 72 inside the water cooling plate 71. After absorbing the heat, the coolant is then pumped back to the storage tank 76 by the water pump 75 through the third delivery pipe 74 to cool down, completing one heat dissipation cycle.

[0029] By using the forced liquid circulation for heat dissipation of the water-cooling component 7, and in conjunction with the auxiliary air cooling of the cooling fan 6, this invention can quickly and stably dissipate the high heat generated during rapid curing. This efficient dual heat dissipation structure ensures the temperature stability of the curing chamber 2 during the curing process, avoiding problems such as poor curing effect or equipment damage caused by heat accumulation, thereby solving the technical defects of unstable curing quality caused by low heat dissipation efficiency in the prior art.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A device for rapid curing of photoresist layer on wafer surface, comprising: Box (1); A curing chamber (2) is set inside the housing (1). A placement platform (4) for carrying wafers is fixed inside the curing chamber (2), and a box cover (5) is connected to the top opening of the curing chamber (2). Heating pipe (3) attached to the inner wall of the curing chamber (2); And a cooling fan (6) installed on the enclosure (1); The device is characterized in that it further includes a water-cooling component (7) and a support component (8). The water-cooling assembly (7) includes a water-cooling plate (71), a water pump (75), and a liquid storage tank (76) disposed on the outer periphery of the curing chamber (2). The water-cooling plate (71) is provided with a first liquid delivery pipe (72) for cooling liquid circulation. The liquid storage tank (76) is connected to the inlet of the water pump (75) through a pipeline. The outlet of the water pump (75) is connected to the inlet of the water-cooling plate (71) through a second liquid delivery pipe (73). The outlet of the water-cooling plate (71) is connected to the liquid inlet of the liquid storage tank (76) through a third liquid delivery pipe (74), thereby forming a closed cooling liquid circulation loop. The support assembly (8) includes a tray (81) with a groove (82) on it. The inner contour of the groove is adapted to the shape of the water-cooled plate (71) to accommodate and limit the water-cooled plate (71). The tray (81) is fixedly connected to the inner wall of the box (1) by screws (83).

2. The device for rapid curing of photoresist layer on wafer surface according to claim 1, characterized in that, The trays (81) are arranged in a ring array along the outer periphery of the curing chamber (2).

3. The device for rapid curing of photoresist layer on wafer surface according to claim 2, characterized in that, The number of water-cooled plates (71) and the number of trays (81) are both multiple, and they are snapped into the grooves (82) one by one.

4. The device for rapid curing of photoresist layer on wafer surface according to claim 1, characterized in that, The screw (83) detachably fixes the tray (81) to the inner wall of the box (1).

5. The device for rapid curing of photoresist layer on wafer surface according to claim 1, characterized in that, The lid (5) is hinged to the top opening edge of the curing chamber (2).

6. The device for rapid curing of photoresist layer on wafer surface according to claim 1, characterized in that, The cooling fan (6) is installed on the side wall of the housing (1).

7. The device for rapid curing of photoresist layer on wafer surface according to claim 1, characterized in that, The water pump (75) and the liquid storage tank (76) are integrated on the outer base of the tank body (1).

8. The device for rapid curing of photoresist layer on wafer surface according to claim 1, characterized in that, The depth and width of the groove (82) are matched with the cross-sectional dimensions of the water-cooled plate (71).

Images