Calibration device for a silicon wafer alignment system

Abstract

A kind of calibration device of silicon wafer alignment system, it is related to photolithography focusing technical field.The calibration device of silicon wafer alignment system includes pedestal, horizontal adjusting assembly, focal length adjusting assembly and standard sample plate;Horizontal adjusting assembly and focal length adjusting assembly are spaced apart on pedestal;Standard sample plate is set on the top of horizontal adjusting assembly, and the surface of standard sample plate has alignment mark;Horizontal adjusting assembly is used to drive standard sample plate to move along X axis and Y axis respectively, and drive standard sample plate to rotate around Z axis;Focal length adjusting assembly is installed with silicon wafer alignment system, for driving silicon wafer alignment system to move along Z axis;Wherein, the object side principal axis of silicon wafer alignment system is parallel with the direction of Z axis;Through the adjustment of horizontal adjusting assembly and focal length adjusting assembly, the alignment mark on the surface of standard sample plate can be imaged on the focal plane of silicon wafer alignment system.The above-mentioned device can be independent of silicon wafer workbench, and can accurately test and calibrate silicon wafer alignment system, so as to speed up product development cycle.

Description

Technical Field

[0001] This utility model relates to the field of photolithography focusing technology, and more specifically, to a calibration device for a silicon wafer alignment system. Background Technology

[0002] The silicon wafer alignment system is a key system in semiconductor lithography equipment. It uses optical imaging and image processing technology to precisely locate alignment marks on the silicon wafer and calculate their deviation from the theoretical position, thus providing a coordinate reference for subsequent process steps. To ensure the accuracy and reliability of the measurement results of the silicon wafer alignment system, rigorous testing and calibration are required before use.

[0003] Currently, the calibration of silicon wafer alignment systems is typically performed on the silicon wafer stage where they are ultimately applied. This calibration process relies on the stage's precise positioning capabilities, which involves sequentially moving different marks on the silicon wafer or standard template to the center of the silicon wafer alignment system's field of view for measurement and comparison.

[0004] However, as a complex mechatronic system, the silicon wafer stage has a long development cycle and high cost. The development progress of the silicon wafer alignment system is often faster than that of the stage, which forces delays in its testing and calibration work, thus extending the product development cycle. Utility Model Content

[0005] The purpose of this invention is to provide a calibration device for a silicon wafer alignment system, which can be used independently of the silicon wafer worktable to accurately test and calibrate the silicon wafer alignment system, thereby accelerating the product development cycle.

[0006] The embodiments of this utility model are implemented as follows: In one aspect, this utility model provides a calibration device for a silicon wafer alignment system, including a base, a horizontal adjustment component, a focal length adjustment component, and a standard template; the horizontal adjustment component and the focal length adjustment component are spaced apart on the base; the standard template is disposed on top of the horizontal adjustment component, and the surface of the standard template has alignment marks; the horizontal adjustment component is used to drive the standard template to move along the X-axis and Y-axis respectively, and to drive the standard template to rotate around the Z-axis; the focal length adjustment component is equipped with the silicon wafer alignment system and is used to drive the silicon wafer alignment system to move along the Z-axis; wherein, the object-side principal optical axis of the silicon wafer alignment system is parallel to the Z-axis direction; through the adjustment of the horizontal adjustment component and the focal length adjustment component, the alignment marks on the surface of the standard template can be imaged onto the focal plane of the silicon wafer alignment system.

[0007] Optionally, the horizontal adjustment assembly includes a first translation stage and a second translation stage stacked together, with a standard template disposed on top of the first translation stage; the first translation stage has a first fine-tuning screw extending along the Y-axis to the outside of the first translation stage, driving the first fine-tuning screw to rotate can drive the first translation stage to move along the Y-axis; the second translation stage has a second fine-tuning screw extending along the X-axis to the outside of the second translation stage, driving the second fine-tuning screw to rotate can drive the second translation stage to move along the X-axis.

[0008] Optionally, the side wall of the first translation stage has a first support frame, and the first fine adjustment screw is mounted on the first support frame; the end of the first fine adjustment screw is connected to a first fine adjustment knob; the side wall of the second translation stage has a second support frame, and the second fine adjustment screw is mounted on the second support frame; the end of the second fine adjustment screw is connected to a second fine adjustment knob.

[0009] Optionally, the side wall of the first translation stage is provided with a first limiting block, the first limiting block having a first limiting groove extending along the Y-axis; the first translation stage is provided with a first bolt corresponding to the first limiting groove, the first bolt passing through the first limiting groove; the end of the first bolt has a first positioning block, driving the first bolt to rotate, the first positioning block being able to abut against the top surface of the first limiting groove to limit the first translation stage; the side wall of the second translation stage is provided with a second limiting block, the second limiting block having a second limiting groove extending along the X-axis; the second translation stage is provided with a second bolt corresponding to the second limiting groove, the second bolt passing through the second limiting groove; the end of the second bolt has a second positioning block, driving the second bolt to rotate, the second positioning block being able to abut against the top surface of the second limiting groove to limit the second translation stage.

[0010] Optionally, the horizontal adjustment assembly also includes a third translation stage disposed at the bottom of the second translation stage. The third translation stage has a coarse adjustment screw extending along the X-axis to the outside of the third translation stage. Driving the coarse adjustment screw to rotate can drive the third translation stage to move along the X-axis.

[0011] Optionally, the horizontal adjustment assembly also includes a third support frame, which includes a base plate and two support plates respectively disposed on opposite sides of the base plate along the X-axis. The support plates are perpendicular to the base plate, and the third translation stage is slidably disposed on the base plate. A coarse adjustment screw passes through either support plate, and its end is connected to a coarse adjustment knob.

[0012] Optionally, the horizontal adjustment assembly also includes a support rod that passes through the third translation stage along the X-axis, and the opposite ends of the support rod are fixedly connected to two support plates respectively.

[0013] Optionally, the horizontal adjustment assembly also includes a rotary table and a mounting base plate disposed on the top of the first translation stage. The mounting base plate has a limiting groove in the middle, and a drive disk is rotatably disposed in the limiting groove. The rotary table is disposed on the top surface of the mounting base plate and connected to the drive disk. The rotary table is used to support the standard template. The mounting base plate has an opening in the horizontal direction, which communicates with the limiting groove. A turntable locking rod is screwed into the opening. Driving the turntable locking rod to rotate enables the end of the turntable locking rod to abut against the side wall of the drive disk, thereby limiting and fixing the rotary table.

[0014] Optionally, a driving ring is also provided in the limiting groove, the driving ring surrounds the periphery of the driving disc, and the bottom of the rotary table is connected to the driving ring; a mounting block is protruding from the side wall of the driving ring facing the opening along the extension direction of the rotary table locking rod, and the mounting block has a mounting groove for screwing the rotary table locking rod; a third fine-tuning screw is inserted in the mounting base plate, and the extension direction of the third fine-tuning screw is perpendicular to the extension direction of the rotary table locking rod; the third fine-tuning screw abuts against any side wall of the mounting block; rotating the third fine-tuning screw can drive the mounting block to move within the opening, thereby driving the ring and the rotary table to rotate.

[0015] Optionally, a fine-tuning locking rod is provided inside the mounting base plate. The fine-tuning locking rod abuts against the side of the mounting block opposite to the third fine-tuning screw. The extension direction of the fine-tuning locking rod is perpendicular to the extension direction of the turntable locking rod. Rotating the fine-tuning locking rod can make the end of the fine-tuning locking rod abut against the mounting block, and the mounting block is limited and fixed.

[0016] Optionally, the calibration device of the silicon wafer alignment system also includes an adapter plate, which is fixedly mounted on top of the leveling assembly and is used to support a standard template; at least two set screws are screwed onto the side of the adapter plate facing the standard template, and the standard template is placed on top of the set screws.

[0017] Optionally, the adapter plate is screwed with a first set screw, a second set screw, and a third set screw on the side facing the standard template, and the line connecting the first set screw and the second set screw is perpendicular to the line connecting the second set screw and the third set screw.

[0018] Optionally, the calibration device of the silicon wafer alignment system further includes a light shield, which is fixedly connected to the side wall of the adapter plate; the light shield and the adapter plate enclose a light shield cavity, and a standard template is placed in the light shield cavity; the side of the light shield cavity facing the silicon wafer alignment system has an opening, and the optical system of the silicon wafer alignment system extends into the light shield cavity through the opening so that the optical field of view of the silicon wafer alignment system is aligned with the alignment marks on the surface of the standard template.

[0019] Optionally, the focus adjustment assembly includes a support and a fourth translation stage. The support is fixedly mounted on the base, and the fourth translation stage is slidably mounted on the top of the support. The silicon wafer alignment system is connected to the fourth translation stage. A fourth fine-tuning screw is provided on the side wall of the fourth translation stage along the Z-axis. Driving the fourth fine-tuning screw to rotate can move the fourth translation stage and the silicon wafer alignment system along the Z-axis, so that the optical system of the silicon wafer alignment system can move closer to or further away from the standard template.

[0020] The beneficial effects of this utility model include: This application provides a calibration device for a silicon wafer alignment system, including a base, a horizontal adjustment component, a focal length adjustment component, and a standard template. The horizontal and focal length adjustment components are spaced apart on the base, providing stable support and preventing component shaking from affecting calibration accuracy during calibration. The horizontal and focal length adjustments do not interfere with each other and can each accurately perform adjustment actions. The standard template is placed on top of the horizontal adjustment component, and its surface has alignment marks, thus replacing the alignment marks on the actual silicon wafer and meeting the requirements for reference marks during calibration. The horizontal adjustment component is used to drive the standard template to move along the X-axis and Y-axis respectively, and to drive the standard template around the Z-axis. Rotation simulates different positions and angles of silicon wafers in real-world applications, allowing the silicon wafer alignment system to measure alignment marks at different positions and angles, thus improving the comprehensiveness and accuracy of the system's calibration. A focus adjustment component, housing the silicon wafer alignment system, drives its movement along the Z-axis, ensuring clear focus on the alignment mark image and guaranteeing high-quality mark images, thereby improving the accuracy of calibration data. The object-side principal optical axis of the silicon wafer alignment system is parallel to the Z-axis. Adjustments to the horizontal and focus adjustment components ensure that the alignment marks on the standard sample surface are imaged onto the focal plane of the silicon wafer alignment system. This calibration device constructs a complete calibration system independent of the silicon wafer stage, freeing the alignment process from dependence on the stage. Calibration can be initiated before the stage is completed, effectively solving the problem of extended product development cycles caused by delays in stage development. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 One of the structural schematic diagrams of the calibration device for the silicon wafer alignment system provided in the embodiments of this utility model; Figure 2 A second schematic diagram of the calibration device for the silicon wafer alignment system provided in this embodiment of the present invention; Figure 3 One of the structural schematic diagrams of the horizontal adjustment component provided in the embodiment of this utility model; Figure 4 This is the second schematic diagram of the structure of the horizontal adjustment component provided in the embodiment of the present utility model; Figure 5 The third schematic diagram of the structure of the horizontal adjustment component provided in the embodiment of this utility model; Figure 6 Fourth schematic diagram of the structure of the horizontal adjustment component provided in the embodiment of this utility model; Figure 7 Fifth schematic diagram of the structure of the horizontal adjustment component provided in the embodiment of this utility model; Figure 8 Sixth schematic diagram of the structure of the horizontal adjustment component provided in the embodiment of this utility model; Figure 9 A cross-sectional view of the mounting base plate provided in an embodiment of this utility model; Figure 10 An assembly diagram of the standard template and adapter plate provided for embodiments of this utility model; Figure 11 This is a schematic diagram of the focal length adjustment component provided in an embodiment of the present utility model; Figure 12 This is a magnified view of the details at point A.

[0023] Icons: 100 - Calibration device for silicon wafer alignment system; 110 - Base; 120 - Horizontal adjustment assembly; 121 - First translation stage; 121a - First substrate; 121b - First body; 1211 - First fine-tuning screw; 1211a - First fine-tuning knob; 1212 - First support frame; 1212a - First support horizontal plate; 1212b - First support vertical plate; 122 - Second translation stage; 122a - Second substrate; 122b - Second body; 122 1-Second fine-tuning screw; 1221a-Second fine-tuning knob; 1222-Second support frame; 1222a-Second support horizontal plate; 1222b-Second support vertical plate; 123-First limiting block; 1231-First limiting groove; 1232-First positioning block; 124-Second limiting block; 1241-Second limiting groove; 1242-Second positioning block; 125-Third translation stage; 125a-Baseline; 1251-Coarse-tuning screw; 1251a-Coarse-tuning knob; 126-Third support frame; 1261-Base plate; 1261a-Scale line; 1262-Support plate; 1263-Support rod; 127-Rotating table; 128-Mounting base plate; 1281-Limiting groove; 1282-Drive disc; 1283-Opening; 1284-Rotating table locking rod; 1285-Drive ring; 1286-Mounting block; 1287-Third fine-tuning screw; 1288-Fine-tuning locking rod; 1289-Boss; 130-Focus adjustment assembly; 131-Support section; 132-Fourth translation stage; 132a-Third substrate; 132b-Third body; 133-Fourth fine-tuning screw; 134-Third limiting block; 1341-Third limiting groove; 140-Standard template; 150-Adapter plate; 151-First set screw; 152-Second set screw; 153-Third set screw; 160-Light shield; 161-Opening; 200-Silicon wafer alignment system; 210-Connecting plate; a-First direction; b-Second direction. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0026] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0027] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "vertical," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0028] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0029] Please refer to Figure 1 and Figure 2 This embodiment provides a calibration device 100 for a silicon wafer alignment system, including a base 110, a horizontal adjustment component 120, a focal length adjustment component 130, and a standard template 140. The horizontal adjustment component 120 and the focal length adjustment component 130 are spaced apart on the base 110. The standard template 140 is disposed on top of the horizontal adjustment component 120, and the surface of the standard template 140 has alignment marks. The horizontal adjustment component 120 is used to drive the standard template 140 to move along the X-axis and Y-axis respectively, and to drive the standard template 140 to rotate around the Z-axis. The focal length adjustment component 130 is equipped with a silicon wafer alignment system 200 and is used to drive the silicon wafer alignment system 200 to move along the Z-axis. The object-side principal optical axis of the silicon wafer alignment system 200 is parallel to the Z-axis direction. Through the adjustment of the horizontal adjustment component 120 and the focal length adjustment component 130, the alignment marks on the surface of the standard template 140 can be imaged onto the focal plane of the silicon wafer alignment system 200.

[0030] Specifically, Figure 1 and Figure 2The calibration device 100 of the silicon wafer alignment system includes a base 110, which is preferably made of a material with a certain rigidity and strength, such as steel, so as to provide a stable platform for all subsequent adjustment actions and minimize the possibility of calibration errors caused by shaking. A horizontal adjustment assembly 120 is mounted on the base 110, and a template assembly, including a standard template 140, is placed on top of the horizontal adjustment assembly 120. The surface of the standard template 140 is provided with coarse alignment marks, fine alignment marks, and focusing marks to simulate silicon wafers in actual applications. The horizontal adjustment assembly 120 drives the standard template 140 to move along the X and Y axes respectively, and drives the standard template 140 to rotate around the Z axis. This can simulate different positions and angles of silicon wafers in actual applications, allowing the silicon wafer alignment system 200 to measure the alignment marks at different positions and angles, thereby improving the comprehensiveness and accuracy of the calibration of the silicon wafer alignment system 200.

[0031] A focal length adjustment assembly 130 is also provided on the base 110. The silicon wafer alignment system 200 is mounted on the focal length adjustment assembly 130. The focal length adjustment assembly 130 is used to drive the silicon wafer alignment system 200 to move up and down along the Z-axis to adjust the focal length of the silicon wafer alignment system 200, so as to achieve clear focus of the alignment mark image, ensure that the silicon wafer alignment system 200 can acquire high-quality mark images, and improve the accuracy of calibration data.

[0032] The silicon wafer alignment system 200 includes an optical system and an image processing unit. The optical system is used to sample the alignment marks on the surface of the standard template 140. The image processing unit is used to receive the image, identify and locate the position of the alignment marks in the image, and establish a pixel coordinate system at the center of the image. It measures the specific coordinates of the center of the alignment mark on the coordinate system, thereby measuring the deviation of the center of the alignment mark relative to the center of the image on the X and Y axes, so as to realize the testing and calibration of the silicon wafer alignment system 200.

[0033] The calibration device 100 of the silicon wafer alignment system constructs a complete calibration system independent of the silicon wafer stage, so that the calibration process of the silicon wafer alignment system 200 is free from dependence on the silicon wafer stage. The calibration work of the silicon wafer alignment system 200 can be started in advance when the silicon wafer stage is not completed, effectively solving the problem of extended product development cycle caused by the lag in stage development.

[0034] In one possible implementation of this application, such as Figure 3 and Figure 4The horizontal adjustment assembly 120 includes a first translation stage 121 and a second translation stage 122 stacked together. A standard template 140 is disposed on the top of the first translation stage 121. The first translation stage 121 has a first fine-tuning screw 1211 extending along the Y-axis to the outside of the first translation stage 121. Driving the first fine-tuning screw 1211 to rotate can drive the first translation stage 121 to move along the Y-axis. The second translation stage 122 has a second fine-tuning screw 1221 extending along the X-axis to the outside of the second translation stage 122. Driving the second fine-tuning screw 1221 to rotate can drive the second translation stage 122 to move along the X-axis.

[0035] Specifically, such as Figure 3 and Figure 4 The second translation stage 122 and the first translation stage 121 are stacked. This application does not impose any restrictions on the specific shape of the first translation stage 121 and the second translation stage 122. In order to facilitate the observation and control of the horizontal movement of the first translation stage 121 and the second translation stage 122, preferably, both the first translation stage 121 and the second translation stage 122 are rectangular block structures.

[0036] like Figure 6 As shown, the first translation stage 121 includes a first base 121a and a first body 121b. The first body 121b is slidably disposed on the first base. The first fine adjustment screw 1211 can be inserted through the first body 121b. By rotating the first fine adjustment screw 1211, the first body 121b can be moved back and forth along the Y-axis, thereby driving the standard template 140 located on the top of the first translation stage 121 to move together, so as to realize the fine adjustment of the standard template 140 along the Y-axis.

[0037] Similarly, as Figure 5 As shown, the second translation stage 122 includes a second base 122a and a second body 122b. The second body 122b is slidably disposed on the second base. The second fine adjustment screw 1221 can be inserted into the second body 122b. By rotating the second fine adjustment screw 1221, the second body 122b can be moved back and forth along the X-axis, thereby driving the first translation stage 121 located at the top of the second translation stage 122 and the standard template 140 above it to move together, so as to realize the fine adjustment of the standard template 140 along the X-axis.

[0038] In one specific embodiment of this application, the first translation stage 121 can achieve fine adjustment of the stroke along the Y-axis by 13 mm, and the second translation stage 122 can achieve fine adjustment of the stroke along the X-axis by 13 mm, with an accuracy of 1 μm.

[0039] Optionally, such as Figure 5 and Figure 6As shown, the side wall of the first translation stage 121 has a first support frame 1212, and the first fine adjustment screw 1211 is mounted on the first support frame 1212; the end of the first fine adjustment screw 1211 is connected to a first fine adjustment knob 1211a; the side wall of the second translation stage 122 has a second support frame 1222, and the second fine adjustment screw 1221 is mounted on the second support frame 1222; the end of the second fine adjustment screw 1221 is connected to a second fine adjustment knob 1221a.

[0040] Specifically, such as Figure 6 As shown, the first support frame 1212 includes a first support horizontal plate 1212a and a first support vertical plate 1212b connected together. One end of the first support horizontal plate 1212a is fixedly connected to the side edge of the first base 121a. The first support vertical plate 1212b is vertically disposed on the side of the first support horizontal plate 1212a away from the first base 121a. The first fine-tuning screw 1211 is mounted on the first support vertical plate 1212b, which improves the stability of the first fine-tuning screw 1211 when rotating it, thereby improving the fine-tuning accuracy of the first translation stage 121 along the Y-axis. The first fine-tuning knob 1211a facilitates manual operation of the rotation of the first fine-tuning screw 1211 by the operator, further improving the convenience of operation and the stability of the fine-tuning process.

[0041] Preferably, to further improve the stability of the first fine-tuning screw 1211 mounted on the first support frame 1212, a U-shaped groove is provided on the first support vertical plate 1212b for limiting the first fine-tuning screw 1211. The first fine-tuning screw 1211 can be engaged in the U-shaped groove for radial limiting. Of course, in addition to the U-shaped groove, a through hole can also be provided on the first support vertical plate 1212b, allowing the first fine-tuning screw 1211 to pass through the through hole, which also provides radial limiting. It should be noted that this application does not impose any restrictions on the specific manner in which the first fine-tuning screw 1211 is mounted on the first support frame 1212, as long as it ensures that the first fine-tuning screw 1211 stably drives the first translation stage 121 to move along the Y-axis.

[0042] Similarly, as Figure 5As shown, the second support frame 1222 includes a second support horizontal plate 1222a and a second support vertical plate 1222b connected together. One end of the second support horizontal plate 1222a is fixedly connected to the side edge of the second base 122a. The second support vertical plate 1222b is vertically disposed on the side of the second support horizontal plate 1222a away from the second base 122a. The second fine-tuning screw 1221 is mounted on the second support vertical plate 1222b, which improves the stability of the second fine-tuning screw 1221 when rotating it, thereby improving the fine-tuning accuracy of the second translation stage 122 along the Y-axis. The second fine-tuning knob 1221a facilitates manual operation of the second fine-tuning screw rotation by the operator, further improving the convenience of operation and the stability of the fine-tuning process.

[0043] Preferably, to further improve the stability of the second fine-tuning screw 1221 mounted on the second support frame 1222, a U-shaped groove is provided on the second support vertical plate 1222b for limiting the second fine-tuning screw 1221. The second fine-tuning screw 1221 can be engaged in the U-shaped groove for radial limiting. Of course, in addition to the U-shaped groove, a through hole can also be provided on the second support vertical plate 1222b, allowing the second fine-tuning screw 1221 to pass through the through hole, which also provides radial limiting. It should be noted that this application does not impose any restrictions on the specific manner in which the second fine-tuning screw 1221 is mounted on the second support frame 1222, as long as it ensures that the second fine-tuning screw 1221 stably drives the second translation stage 122 to move along the X-axis.

[0044] Optionally, such as Figure 5 and Figure 6 As shown, a first limiting block 123 is provided on the side wall of the first translation stage 121. The first limiting block 123 has a first limiting groove 1231 extending along the Y-axis. A first bolt is provided on the first translation stage 121 corresponding to the first limiting groove 1231. The first bolt passes through the first limiting groove 1231. The end of the first bolt has a first positioning block 1232. Driving the first bolt to rotate, the first positioning block 1232 can abut against the top surface of the first limiting groove 1231 to limit the first translation stage 121. The second translation stage 122 has a second limiting block 124 on its side wall, and the second limiting block 124 has a second limiting groove 1241 extending along the X-axis; the second translation stage 122 has a second bolt corresponding to the second limiting groove 1241, and the second bolt passes through the second limiting groove 1241; the end of the second bolt has a second positioning block 1242, which drives the second bolt to rotate, and the second positioning block 1242 can abut against the top surface of the second limiting groove 1241 to limit the second translation stage 122.

[0045] Specifically, such as Figure 6As shown, the first limiting block 123 has a rectangular block structure, which covers at least part of the first base 121a and the first body 121b in the vertical direction. The first limiting block 123 is fixedly connected to the side wall of the first base 121a, and the first limiting block 123 has a first limiting groove 1231 that extends and penetrates along the Y-axis. A first bolt is screwed onto the first body 121b corresponding to the first limiting groove 1231. The first bolt passes through the first limiting groove 1231. When the first body 121b slides along the top surface of the first base 121a, the first bolt can slide within the first limiting groove 1231. The end of the first bolt facing away from the first body 121b extends outward from the first limiting groove 1231, and its end is provided with a first positioning block 1232. The end face of the first positioning block 1232 facing the first bolt can abut against the first limiting block 123.

[0046] When the first translation stage 121 is fixed in position, the end face of the first positioning block 1232 abuts against the first limiting block 123 and provides a preload force to the first limiting block 123 and the first body 121b, so that the first body 121b is fixed in position relative to the first base 121a, thereby limiting and fixing the first translation stage 121; when it is necessary to drive the first translation stage 121 to move along the Y-axis, the operator drives the first bolt to rotate until the first positioning block 1232 and the first limiting block 123 no longer abut against each other. At this time, the first body 121b is no longer subject to the preload force provided by the first positioning block 1232 and can slide relative to the first base 121a through the sliding of the first fine-tuning screw 1211.

[0047] This setup allows the first translation stage 121 to be locked after its position is adjusted, preventing subsequent displacement that could lead to test calibration errors and improving the accuracy of test calibration.

[0048] Similarly, as Figure 5 As shown, the second limiting block 124 has a rectangular block structure, which covers at least part of the second base 122a and the second body 122b in the vertical direction. The second limiting block 124 is fixedly connected to the side wall of the second base 122a, and the second limiting block 124 has a second limiting groove 1241 that extends and penetrates along the X-axis. A second bolt is screwed onto the second body 122b corresponding to the second limiting groove 1241. The second bolt passes through the second limiting groove 1241. When the second body 122b slides along the top surface of the second base 122a, the second bolt can slide within the second limiting groove 1241. One end of the second bolt, away from the second body 122b, extends outward from the second limiting groove 1241, and its end is provided with a second positioning block 1242. The end face of the second positioning block 1242 facing the second bolt can abut against the second limiting block 124.

[0049] When the second translation stage 122 is fixed in position, the end face of the second positioning block 1242 abuts against the second limiting block 124 and provides preload force to the second limiting block and the second body 122b block, so that the second body 122b is fixed in position relative to the second base 122a, thereby limiting and fixing the second translation stage 122; when it is necessary to drive the second translation stage 122 to move along the X-axis, the operator drives the second bolt to rotate until the second positioning block 1242 and the second limiting block 124 no longer abut against each other. At this time, the second body 122b is no longer subject to the preload force provided by the second positioning block 1242 and can slide relative to the second base 122a through the sliding of the second fine adjustment screw 1221.

[0050] This setup allows the second translation stage 122 to be locked after its position is adjusted, preventing subsequent displacement that could lead to test calibration errors and improving the accuracy of test calibration.

[0051] In one possible implementation of this application, such as Figure 7 As shown, the horizontal adjustment assembly 120 also includes a third translation stage 125 disposed at the bottom of the second translation stage 122. The third translation stage 125 has a coarse adjustment screw 1251 extending along the X-axis to the outside of the third translation stage 125. Driving the coarse adjustment screw 1251 to rotate can drive the third translation stage 125 to move along the X-axis.

[0052] Specifically, such as Figure 7 As shown, the displacement stroke of the third translation stage 125 is greater than that of the second translation stage 122. During the calibration process of the silicon wafer alignment system 200, the third translation stage 125 is first coarsely adjusted along the X-axis by the coarse adjustment screw 1251. Since the second translation stage 122, the first translation stage 121 and the standard template 140 are all stacked on top of the third translation stage 125, they can be simultaneously driven to achieve coarse adjustment along the X-axis. After the coarse adjustment position is confirmed, the second translation stage 122 and the first translation stage 121 are then finely adjusted along the X-axis and Y-axis respectively to further improve the calibration accuracy.

[0053] In one specific embodiment of this application, the third translation stage 125 can achieve a coarse adjustment of the X-axis stroke of 100 mm.

[0054] Optionally, such as Figure 7 As shown, the horizontal adjustment assembly 120 also includes a third support frame 126. The third support frame 126 includes a base plate 1261 and two support plates 1262 respectively arranged on opposite sides of the base plate 1261 along the X-axis. The support plates 1262 are arranged perpendicularly to the base plate 1261. The third translation stage 125 is slidably arranged on the base plate 1261. The coarse adjustment screw 1251 passes through any of the support plates 1262, and its end is connected to a coarse adjustment knob 1251a.

[0055] Specifically, such as Figure 7 As shown, the third support frame 126 has an approximately U-shaped structure, and the third translation stage 125 is slidably mounted on the base plate 1261 to improve its sliding stability; preferably, as shown... Figure 7 As shown, a baseline 125a is set at the center of the bottom of the side wall of the third translation stage 125, and a scale line 1261a is set on the side wall of the base plate 1261 corresponding to the baseline 125a. When the third translation stage 125 moves, the displacement of the third translation stage 125 can be measured by the relative position of the baseline 125a and the scale line 1261a.

[0056] like Figure 7 As shown, two support plates 1262 are respectively provided on opposite sides of the base plate 1261, and the third translation stage 125 moves between the two support plates 1262. The coarse adjustment screw 1251 passes through either support plate 1262, thus providing stability to the rotation process of the coarse adjustment screw 1251, thereby improving the coarse adjustment accuracy and reducing the possibility of calibration errors caused by the vibration of the coarse adjustment screw 1251, thus improving calibration accuracy. A coarse adjustment knob 1251a is connected to the end of the coarse adjustment screw 1251, facilitating manual operation of the rotation of the coarse adjustment screw 1251 by the operator, further improving operational convenience and the stability of the fine adjustment process.

[0057] Optionally, such as Figure 7 As shown, the horizontal adjustment assembly 120 also includes a support rod 1263, which passes through the third translation stage 125 along the X-axis, and the two opposite ends of the support rod 1263 are fixedly connected to two support plates 1262 respectively.

[0058] Specifically, there are multiple support rods 1263, which are arranged side by side at intervals along the horizontal direction. For example... Figure 7 As shown, there are two support rods 1263, which are respectively located on the left and right sides of the coarse adjustment screw 1251. The opposite ends of the support rods 1263 are fixedly connected to the two support plates 1262, and the support rods 1263 are arranged parallel to the coarse adjustment screw 1251. This not only provides guidance for the displacement of the third translation stage 125, but also further reduces the possibility of calibration errors caused by the vibration of the third translation stage 125 during displacement, thereby improving the calibration accuracy.

[0059] It should be noted that, in one specific embodiment of this application, a screw hole is provided on the top of the support plate 1262 corresponding to the coarse adjustment screw rod 1251, which is used to screw on the coarse adjustment locking member. When the position of the third displacement stage is fixed, the end of the coarse adjustment locking member abuts against the side wall of the coarse adjustment screw rod 1251, at which time the coarse adjustment screw rod 1251 is fixed and limited, thereby fixing the position of the third displacement stage; when the third displacement stage needs to be displaced, the coarse adjustment locking member is rotated, so that the end of the coarse adjustment locking member separates from the side wall of the coarse adjustment screw rod 1251, at which time the coarse adjustment screw rod 1251 can rotate and drive the third displacement stage to move. With this setting, the position of the third translation stage 125 can be locked after adjustment, avoiding subsequent displacement that may cause test calibration errors, thus improving the accuracy of test calibration.

[0060] In one possible implementation of this application, such as Figure 8 As shown, the horizontal adjustment assembly 120 also includes a rotary table 127 and a mounting base plate 128 disposed on the top of the first translation stage 121. The mounting base plate 128 has a limiting groove 1281 in the middle, and a drive disk 1282 is rotatably disposed in the limiting groove 1281. The rotary table 127 is disposed on the top surface of the mounting base plate 128 and connected to the drive disk 1282. The rotary table 127 is used to support the standard template 140. The mounting base plate 128 has an opening 1283 opened in the horizontal direction, and the opening 1283 communicates with the limiting groove 1281. A turntable locking rod 1284 is screwed into the opening 1283. Driving the turntable locking rod 1284 to rotate can make the end of the turntable locking rod 1284 abut against the side wall of the drive disk 1282, and the rotary table 127 is limited and fixed.

[0061] Specifically, such as Figure 9 As shown, a limiting groove 1281 is provided in the middle of the mounting base plate 128. Preferably, the limiting groove 1281 is a circular groove. A driving disk 1282 is rotatably disposed within the limiting groove 1281. The driving disk 1282 and the inner wall of the limiting groove 1281 have a preset distance to ensure that the driving disk 1282 can rotate around the center. A rotating platform 127 is disposed on the top surface of the mounting base plate 128 and connected to the driving disk 1282. Preferably, the rotating platform 127 and the driving disk 1282 are concentric and coaxially arranged, so that the driving disk 1282 can rotate around the central axis. The rotation of the rotating platform 127 and the driving disk 1282 around the central axis can realize the coarse rotation of the standard template 140 around the Z-axis. The rotating platform can achieve 360° coarse adjustment.

[0062] like Figure 9As shown, the mounting base plate 128 has a horizontally oriented opening 1283. The opening 1283 is used to screw a turntable locking rod 1284. Since the opening 1283 is connected to the limiting groove 1281, the turntable locking rod 1284 is driven to rotate, so that its end abuts against the side wall of the drive disc 1282. At this time, the drive disc 1282 is unable to rotate along the central axis due to the preload of the turntable locking rod 1284, so the position of the turntable 127 is fixed. When it is necessary to perform coarse rotation on the turntable 127, the turntable locking rod 1284 is driven to rotate, so that the end of the turntable locking rod 1284 separates from the side wall of the drive disc 1282. At this time, the drive disc 1282 is no longer subject to the preload of the turntable locking rod 1284, and the drive disc 1282 and the turntable 127 can rotate around the central axis.

[0063] Optionally, such as Figure 9 As shown, a driving ring 1285 is also provided in the limiting groove 1281. The driving ring 1285 surrounds the periphery of the driving disc 1282, and the bottom of the rotary table 127 is connected to the driving ring 1285. A mounting block 1286 protrudes from the side wall of the driving ring 1285 facing the opening 1283 along the extension direction of the turntable locking rod 1284. The mounting block 1286 has a mounting groove for screwing the turntable locking rod 1284. A third fine-tuning screw 1287 is inserted into the mounting base plate 128. The extension direction of the third fine-tuning screw 1287 is perpendicular to the extension direction of the turntable locking rod 1284. The third fine-tuning screw 1287 abuts against any side wall of the mounting block 1286. Rotating the third fine-tuning screw 1287 can drive the mounting block 1286 to move within the opening 1283, thereby driving the ring and the rotary table 127 to rotate.

[0064] Specifically, such as Figure 9 As shown, a drive ring 1285 surrounds the periphery of a drive disk 1282, and there is a preset interval between the drive ring 1285 and the drive disk 1282, meaning that the drive ring 1285 and the drive disk 1282 can rotate independently. A mounting block 1286 protrudes from the side wall of the drive ring 1285 facing the opening 1283 along the extending direction of the turntable locking rod 1284. The opening 1283 has sufficient space in a direction perpendicular to the extension of the turntable locking rod 1284 to ensure a preset interval between the left and right side walls of the mounting block 1286 and the inner wall of the opening 1283. The mounting block 1286 has a mounting groove for screwing the turntable locking rod 1284. The mounting groove limits the radial movement of the screwed turntable locking rod 1284, thereby improving the stability and reliability of the device.

[0065] A third fine-tuning screw 1287 is installed inside the mounting base plate 128. To facilitate the assembly of the third fine-tuning screw 1287 and ensure that its placement does not affect the rotation of the rotary table 127, such as... Figure 9 As shown, a boss 1289 is provided on the side wall of the mounting base plate 128 at the position corresponding to the opening 1283. The opening 1283 extends to the outside along the boss 1289. The diameter of the boss 1289 in the direction perpendicular to the turntable locking rod 1284 is smaller than the diameter of the mounting base plate 128 in the direction perpendicular to the turntable locking rod 1284.

[0066] like Figure 9 As shown, a third fine-tuning screw 1287 is inserted into the boss 1289 of the mounting base plate 128. The third fine-tuning screw 1287 abuts against any side wall of the mounting block 1286. By rotating the third fine-tuning screw 1287, the mounting block 1286 can be moved within the opening 1283, thereby driving the drive disk 1282 to achieve fine rotation. Since the drive disk 1282 is connected to the rotary table 127, it can synchronously drive the rotary table 127 to rotate, achieving fine rotation of the rotary table 127 and the standard template 140 placed on top of the rotary table 127. The rotary table 127 can achieve ±5° fine adjustment with a fine adjustment accuracy of 10′.

[0067] Optionally, such as Figure 8 and Figure 9 As shown, a fine-tuning locking rod 1288 is inserted inside the mounting base plate 128. The fine-tuning locking rod 1288 abuts against the side of the mounting block 1286 away from the third fine-tuning screw 1287. The extension direction of the fine-tuning locking rod 1288 is perpendicular to the extension direction of the turntable locking rod 1284. Rotating the fine-tuning locking rod 1288 can make the end of the fine-tuning locking rod 1288 abut against the mounting block 1286, and the mounting block 1286 is limited and fixed.

[0068] Specifically, such as Figure 8 and 9 As shown, a fine-tuning locking rod 1288 is inserted through the boss 1289 of the mounting base plate 128. Driving the fine-tuning locking rod 1288 to rotate allows its end to abut against the side wall of the mounting block 1286 away from the third fine-tuning screw 1287. At this time, the third fine-tuning screw 1287 is unable to drive the mounting block 1286 to move radially due to the preload of the fine-tuning locking rod 1288, thus fixing the position of the driving ring 1285. When it is necessary to perform fine rotation on the rotary table 127, the fine-tuning locking rod 1288 is driven to rotate, causing its end to separate from the side wall of the mounting block 1286. At this time, the third fine-tuning screw 1287 is no longer subject to the preload of the fine-tuning locking rod 1288. By rotating the third fine-tuning screw 1287, the rotary table 127 can be finely rotated around the central axis.

[0069] In one possible implementation of this application, such as Figure 3As shown, the calibration device 100 of the silicon wafer alignment system also includes an adapter plate 150, which is fixedly disposed on the top of the horizontal adjustment assembly 120 and is used to support the standard template 140. At least two set screws are screwed onto the side of the adapter plate 150 facing the standard template 140, and the standard template 140 is placed on top of the set screws.

[0070] Specifically, such as Figure 3 As shown, the adapter plate 150 has a larger surface area than the standard template 140 to ensure the stability of supporting the standard template 140. At least two set screws are screwed onto the side of the adapter plate 150 facing the standard template 140. Rotating these set screws allows adjustment of their protrusion height from the adapter plate 150's surface. During actual calibration, adjusting the height of the set screws from the adapter plate 150's surface ensures consistent height across the standard template 140, thereby ensuring that the upper surface of the standard template 140 is parallel to the focal plane of the optical system of the silicon wafer alignment system 200, thus improving calibration accuracy.

[0071] Optionally, such as Figure 10 As shown, the adapter plate 150 facing the standard template 140 is screwed with a first set screw 151, a second set screw 152 and a third set screw 153. The line connecting the first set screw 151 and the second set screw 152 is perpendicular to the line connecting the second set screw 152 and the third set screw 153.

[0072] Specifically, the second set screw 152 is fixed in position, while the first set screw 151 and the third set screw 153 can be adjusted by rotation to change their height protruding from the surface of the adapter plate 150. For example... Figure 10 As shown, since the line connecting the first setter 151 and the second setter 152 is perpendicular to the line connecting the second setter 152 and the third setter 153, by adjusting the height of the first setter 151 protruding from the surface of the adapter plate 150, the standard template 140 can be tilted along the first direction a; by adjusting the height of the third setter 153 protruding from the surface of the adapter plate 150, the standard template 140 can be tilted along the second direction b. The first direction a and the second direction b are perpendicular to each other.

[0073] By setting the first set screw 151, the second set screw 152 and the third set screw 153, the flexibility of height adjustment at various points of the standard template 140 can be further improved.

[0074] Optionally, such as Figure 1 and Figure 2As shown, the calibration device 100 of the silicon wafer alignment system also includes a light shield 160, which is fixedly connected to the side wall of the adapter plate 150. The light shield 160 and the adapter plate 150 enclose a light shield cavity, in which a standard template 140 is placed. The side of the light shield cavity facing the silicon wafer alignment system 200 has an opening 161, through which the optical system of the silicon wafer alignment system 200 extends into the light shield cavity to align the optical field of the silicon wafer alignment system 200 with the alignment marks on the surface of the standard template 140.

[0075] Specifically, the light shield 160 is fixedly connected to the side wall of the adapter plate 150, which can shield the top and sides of the adapter plate 150 to prevent ambient light from shining on the surface of the standard sample 140 and improve the reliability of calibration.

[0076] In order to facilitate the alignment of the optical field of the silicon wafer alignment system 200 with the alignment marks on the surface of the standard template 140, the light shield 160 is provided with an opening 161 on the side facing the silicon wafer alignment system 200, and the optical system of the silicon wafer alignment system 200 extends into the light shield cavity through the opening 161.

[0077] In one possible implementation of this application, such as Figure 11 As shown, the focal length adjustment assembly 130 includes a support 131 and a fourth translation stage 132. The support 131 is fixedly mounted on the base 110, and the fourth translation stage 132 is slidably mounted on the top of the support 131. The silicon wafer alignment system 200 is connected to the fourth translation stage 132. A fourth fine adjustment screw 133 is provided on the side wall of the fourth translation stage 132 along the Z-axis. Driving the fourth fine adjustment screw 133 to rotate can drive the fourth translation stage 132 and the silicon wafer alignment system 200 to move along the Z-axis, so that the optical system of the silicon wafer alignment system 200 is closer to or further away from the standard template 140.

[0078] Specifically, such as Figure 11 As shown, the fourth translation stage 132 is disposed at the top of the support portion 131. At least one adapter plate 150 is disposed on the side of the fourth translation stage 132 facing the standard template 140. The adapter plate 150 is used to achieve a stable connection between the silicon wafer alignment system 200 and the fourth translation stage 132. To further improve the connection stability between the silicon wafer alignment system 200 and the fourth translation stage 132, such as... Figure 11 and Figure 12 As shown, a connecting plate 210 is provided on the side of the silicon wafer alignment system 200 facing the focus adjustment assembly 130. The silicon wafer alignment system 200 is fixedly connected to the adapter plate 150 through the connecting plate 210, which further improves the stability of the silicon wafer alignment system 200 moving in the vertical direction.

[0079] The fourth translation stage 132 is provided with a fourth fine-tuning screw 133 along the Z-axis on its side wall. In one specific embodiment of this application, the fourth fine-tuning screw 133 can achieve a 25mm stroke fine adjustment of the fourth translation stage 132 along the Z-axis with an accuracy of 1μm.

[0080] It should be noted that, in one possible implementation of this application, such as Figure 12 As shown, the fourth translation stage 132 includes a third base 132a and a third body 132b. A third limiting block 134 is provided on the side wall of the third base 132a, and the third limiting block 134 has a third limiting groove 1341 extending along the Z-axis. A third bolt is provided on the third body 132b corresponding to the third limiting groove 1341. The third bolt passes through the third limiting groove 1341, and when the third body 132b slides along the surface of the third base 132a, the third bolt can slide within the third limiting groove 1341. One end of the third bolt, away from the third body 132b, extends outward from the third limiting groove 1341, and its end is provided with a third positioning block. The end face of the third positioning block facing the third bolt can abut against the third limiting block 134.

[0081] When the fourth translation stage 132 is fixed in position, the end face of the third positioning block abuts against the third limiting block 134 and provides preload to the third limiting block and the third body 132b block, so that the third body 132b is fixed in position relative to the third base 132a, thereby limiting and fixing the fourth translation stage 132; when it is necessary to drive the third translation stage 125 to move along the Z-axis, the operator drives the third bolt to rotate until the third positioning block and the third limiting block 134 no longer abut against each other. At this time, the third body 132b is no longer subject to the preload provided by the third positioning block and can slide relative to the third base 132a through the sliding of the fourth fine-tuning screw 133.

[0082] During the test, first loosen the third bolt and rotate the fourth fine-tuning screw 133. Simultaneously observe the image acquired by the silicon wafer alignment system 200, paying attention to the edge of the focus mark in the image. Stop adjusting when the edge is clear and sharp, and then tighten the fourth translation stage 132 by locking the third bolt. If the edge of the mark in the image cannot be made clear, try rotating the focus adjustment knob of the lens group in the silicon wafer alignment system 200. Adjust both in conjunction to complete the focus adjustment.

[0083] This setup allows the fourth translation stage 132 to be locked after its position is adjusted, preventing subsequent displacement that could lead to test calibration errors and improving the accuracy of test calibration.

[0084] The above description is merely an optional embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

[0085] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable way without contradiction. In order to avoid unnecessary repetition, this utility model will not describe the various possible combinations separately.

Claims

1. A calibration device for a silicon wafer alignment system, characterized in that, The system includes a base (110), a horizontal adjustment assembly (120), a focal length adjustment assembly (130), and a standard template (140). The horizontal adjustment assembly (120) and the focal length adjustment assembly (130) are spaced apart on the base (110). The standard template (140) is positioned on top of the horizontal adjustment assembly (120), and its surface has alignment marks. The horizontal adjustment assembly (120) drives the standard template (140) to move along the X-axis and Y-axis, respectively. The standard template (140) is driven to rotate around the Z-axis; the focal length adjustment assembly (130) is equipped with a silicon wafer alignment system (200) for driving the silicon wafer alignment system (200) to move along the Z-axis; wherein, the object-side principal optical axis of the silicon wafer alignment system (200) is parallel to the Z-axis direction; by adjusting the horizontal adjustment assembly (120) and the focal length adjustment assembly (130), the alignment marks on the surface of the standard template (140) can be imaged onto the focal plane of the silicon wafer alignment system (200).

2. The calibration device for the silicon wafer alignment system according to claim 1, characterized in that, The horizontal adjustment assembly (120) includes a first translation stage (121) and a second translation stage (122) stacked together. The standard template (140) is disposed on the top of the first translation stage (121). The first translation stage (121) has a first fine adjustment screw (1211) extending along the Y-axis to the outside of the first translation stage (121). Driving the first fine adjustment screw (1211) to rotate can drive the first translation stage (121) to move along the Y-axis. The second translation stage (122) has a second fine adjustment screw (1221) extending along the X-axis to the outside of the second translation stage (122). Driving the second fine adjustment screw (1221) to rotate can drive the second translation stage (122) to move along the X-axis.

3. The calibration device for the silicon wafer alignment system according to claim 2, characterized in that, The first translation stage (121) has a first support frame (1212) on its side wall, and the first fine adjustment screw (1211) is mounted on the first support frame (1212); the end of the first fine adjustment screw (1211) is connected to a first fine adjustment knob (1211a); the second translation stage (122) has a second support frame (1222) on its side wall, and the second fine adjustment screw (1221) is mounted on the second support frame (1222); the end of the second fine adjustment screw (1221) is connected to a second fine adjustment knob (1221a).

4. The calibration device for the silicon wafer alignment system according to claim 2 or 3, characterized in that, The first translation stage (121) has a first limiting block (123) on its side wall. The first limiting block (123) has a first limiting groove (1231) extending along the Y-axis. The first translation stage (121) has a first bolt corresponding to the first limiting groove (1231). The first bolt passes through the first limiting groove (1231). The end of the first bolt has a first positioning block (1232) to drive the first bolt to rotate. The first positioning block (1232) can abut against the top surface of the first limiting groove (1231) to limit the first translation stage (121). The second translation stage (122) has a second limiting block (124) on its side wall. The second limiting block (124) has a second limiting groove (1241) extending along the X-axis. The second translation stage (122) has a second bolt corresponding to the second limiting groove (1241). The second bolt passes through the second limiting groove (1241). The end of the second bolt has a second positioning block (1242) to drive the second bolt to rotate. The second positioning block (1242) can abut against the top surface of the second limiting groove (1241) to limit the second translation stage (122).

5. The calibration device for the silicon wafer alignment system according to claim 2, characterized in that, The horizontal adjustment assembly (120) further includes a third translation stage (125) disposed at the bottom of the second translation stage (122). The third translation stage (125) has a coarse adjustment screw (1251) extending along the X-axis to the outside of the third translation stage (125). Driving the coarse adjustment screw (1251) to rotate can drive the third translation stage (125) to move along the X-axis.

6. The calibration device for the silicon wafer alignment system according to claim 5, characterized in that, The horizontal adjustment assembly (120) further includes a third support frame (126), which includes a base plate (1261) and two support plates (1262) respectively arranged on opposite sides of the base plate (1261) along the X-axis. The support plates (1262) are arranged perpendicularly to the base plate (1261), and the third translation stage (125) is slidably arranged on the base plate (1261). The coarse adjustment screw (1251) passes through any of the support plates (1262), and its end is connected to a coarse adjustment knob (1251a).

7. The calibration device for the silicon wafer alignment system according to claim 6, characterized in that, The horizontal adjustment assembly (120) also includes a support rod (1263), which passes through the third translation stage (125) along the X-axis, and the two ends of the support rod (1263) are respectively fixedly connected to the two support plates (1262).

8. The calibration device for the silicon wafer alignment system according to claim 2, characterized in that, The horizontal adjustment assembly (120) further includes a rotary table (127) and a mounting base plate (128) disposed on the top of the first translation stage (121). The mounting base plate (128) has a limiting groove (1281) in the middle, and a drive disc (1282) is rotatably disposed within the limiting groove (1281). The rotary table (127) is disposed on the top surface of the mounting base plate (128) and connected to the drive disc (1282). The rotary table (127) is used to support… The standard template (140) is mounted; the mounting base plate (128) has an opening (1283) opened in the horizontal direction, the opening (1283) is connected to the limiting groove (1281); a turntable locking rod (1284) is screwed into the opening (1283), driving the turntable locking rod (1284) to rotate, so that the end of the turntable locking rod (1284) abuts against the side wall of the driving disc (1282), and the rotating table (127) is limited and fixed.

9. The calibration device for the silicon wafer alignment system according to claim 8, characterized in that, A driving ring (1285) is also provided inside the limiting groove (1281). The driving ring (1285) surrounds the periphery of the driving disc (1282). The bottom of the rotary table (127) is connected to the driving ring (1285). A mounting block (1286) is provided on the side wall of the driving ring (1285) facing the opening (1283) along the extension direction of the turntable locking rod (1284). The mounting block (1286) has a screw for screwing the turntable locking rod (1284). The mounting slot of 84); a third fine adjustment screw (1287) is provided inside the mounting base plate (128), the extension direction of the third fine adjustment screw (1287) is perpendicular to the extension direction of the turntable locking rod (1284); the third fine adjustment screw (1287) abuts against any side wall of the mounting block (1286); rotating the third fine adjustment screw (1287) can drive the mounting block (1286) to move in the opening (1283) so as to drive the ring and the turntable (127) to rotate.

10. The calibration device for the silicon wafer alignment system according to claim 9, characterized in that, A fine-tuning locking rod (1288) is inserted inside the mounting base plate (128). The fine-tuning locking rod (1288) abuts against the side of the mounting block (1286) away from the third fine-tuning screw (1287). The extension direction of the fine-tuning locking rod (1288) is perpendicular to the extension direction of the turntable locking rod (1284). Rotating the fine-tuning locking rod (1288) can make the end of the fine-tuning locking rod (1288) abut against the mounting block (1286), and the mounting block (1286) is limited and fixed.

11. The calibration device for the silicon wafer alignment system according to claim 1, characterized in that, The calibration device (100) of the silicon wafer alignment system further includes an adapter plate (150), which is fixedly disposed on the top of the horizontal adjustment assembly (120) and is used to support the standard template (140); the adapter plate (150) has at least two set screws screwed on the side facing the standard template (140), and the standard template (140) is placed on top of the set screws.

12. The calibration device for the silicon wafer alignment system according to claim 11, characterized in that, The adapter plate (150) facing the standard template (140) is screwed with a first set screw (151), a second set screw (152) and a third set screw (153), and the line connecting the first set screw (151) and the second set screw (152) is perpendicular to the line connecting the second set screw (152) and the third set screw (153).

13. The calibration apparatus for the silicon wafer alignment system according to claim 11 or 12, characterized in that, The calibration device (100) of the silicon wafer alignment system further includes a light shield (160), which is fixedly connected to the side wall of the adapter plate (150); the light shield (160) and the adapter plate (150) enclose a light shield cavity, and the standard template (140) is placed in the light shield cavity; the light shield cavity has an opening (161) on the side facing the silicon wafer alignment system (200), and the optical system of the silicon wafer alignment system (200) extends into the light shield cavity through the opening (161) so that the optical field of the silicon wafer alignment system (200) is aligned with the alignment marks on the surface of the standard template (140).

14. The calibration device for the silicon wafer alignment system according to claim 1, characterized in that, The focal length adjustment assembly (130) includes a support (131) and a fourth translation stage (132). The support (131) is fixedly mounted on the base (110), and the fourth translation stage (132) is slidably mounted on the top of the support (131). The silicon wafer alignment system (200) is connected to the fourth translation stage (132). A fourth fine adjustment screw (133) is provided on the side wall of the fourth translation stage (132) along the Z-axis. Driving the fourth fine adjustment screw (133) to rotate can drive the fourth translation stage (132) and the silicon wafer alignment system (200) to move along the Z-axis, so that the optical system of the silicon wafer alignment system (200) moves closer to or further away from the standard template (140).

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