Analog input detection device based on LVDS communication

Abstract

The utility model relates to industrial automation control and data acquisition technical field, concretely is a kind of analog quantity input detection device based on LVDS communication, including ADC acquisition unit, data isolation unit, MCU unit, communication unit, power unit and LVDS communication interface;ADC acquisition unit is used to receive and process analog input signal, and the signal output end of ADC acquisition unit is connected with the signal input end of data isolation unit;The signal output end of data isolation unit is connected with the first signal interface of MCU unit, and the second signal interface of MCU unit is connected with the first signal interface of communication unit;The second signal interface of communication unit is connected with LVDS communication interface, and LVDS communication interface is used to realize the high-speed data interaction of communication unit and external device;Power unit provides stable power for each unit.The device is strong against interference, transmission is far, easy to expand, and stable in performance, applicable to high-precision scene such as industrial automation.

Description

Technical Field

[0001] This utility model relates to the field of industrial automation control and data acquisition technology, and in particular to an analog input detection device based on LVDS communication. Background Technology

[0002] In the field of industrial automation control and data acquisition, analog input detection devices are core equipment for signal acquisition and transmission. Traditional analog input detection devices typically transmit the acquired analog signals to the main controller via ordinary voltage transmission or simple serial communication (such as RS-485). However, this method has the following inherent drawbacks in practical applications: 1. Poor anti-interference ability: The industrial environment is harsh and there is a lot of electromagnetic interference (such as motor start-stop interference, high-frequency signal interference, etc.). Analog signals are easily affected by these interferences during long-distance transmission, resulting in signal distortion and fluctuation, which seriously affects the measurement accuracy and system stability, and may even cause equipment malfunction.

[0003] 2. Limited transmission distance: Analog signals have inherent signal attenuation characteristics. As the transmission distance increases, the signal strength gradually weakens, which in turn leads to a decrease in the signal-to-noise ratio, limiting its effective transmission distance and making it difficult to meet the long-distance transmission needs in distributed industrial scenarios (such as large factory workshops, remote equipment monitoring, etc.).

[0004] 3. Complex wiring: For multi-channel analog signal acquisition scenarios, traditional devices need to lay independent signal lines for each acquisition channel, which not only increases wiring costs but also leads to complex wiring structures. In addition, crosstalk is easily generated between multiple signal lines, further introducing noise and affecting signal acquisition quality.

[0005] 4. Conflict between speed and accuracy: In industrial applications that require high precision (such as sampling accuracy of 0.1% or higher) and high sampling rate, the data transmission rate of traditional communication methods (such as RS-485) is low and difficult to match the sampling rate of high-precision ADC chips. This makes data transmission a bottleneck in system performance and fails to meet the requirements of real-time detection.

[0006] Therefore, a new technical solution is urgently needed to solve the above-mentioned technical problems. Utility Model Content

[0007] The purpose of this invention is to overcome the shortcomings of the prior art and provide an analog input detection device based on LVDS communication. This device addresses the technical problems of poor anti-interference capability, limited transmission distance, complex wiring, and the contradiction between speed and accuracy in existing technologies. By optimizing the hardware structure and communication method, it achieves high-precision acquisition, adaptive range adjustment, and high-speed, reliable transmission of analog signals.

[0008] The above objectives are achieved through the following technical solutions: An analog input detection device based on LVDS communication includes an ADC acquisition unit, a data isolation unit, an MCU unit, a communication unit, a power supply unit, and an LVDS communication interface. The ADC acquisition unit receives and processes analog input signals, and its signal output is connected to the signal input of the data isolation unit. The signal output of the data isolation unit is connected to a first signal interface of the MCU unit, and a second signal interface of the MCU unit is connected to a first signal interface of the communication unit. The second signal interface of the communication unit is connected to the LVDS communication interface, which enables high-speed data interaction between the communication unit and external devices. The power output of the power supply unit is connected to the power inputs of the ADC acquisition unit, the data isolation unit, the MCU unit, and the communication unit, providing stable power to each unit.

[0009] Furthermore, the ADC acquisition unit includes a core chip, TPAFE51736S8. The signal input pin of the TPAFE51736S8 chip is connected to the analog signal input terminal of the ADC acquisition unit, and the signal output pin of the TPAFE51736S8 chip is connected to the signal input terminal of the data isolation unit. The TPAFE51736S8 chip achieves a sampling accuracy of 0.1% for analog signals. After converting the received analog signal into a digital signal, the TPAFE51736S8 chip transmits it to the MCU unit through the data isolation unit.

[0010] Furthermore, the analog signal input terminal of the ADC acquisition unit includes an ADC_V_IN pin, an ADC_I_IN pin, and an ADC_COM pin. The ADC_V_IN pin and the ADC_I_IN pin are used to connect to external analog signals, and the ADC_COM pin is a common terminal. The external analog signals include ±10V voltage signals and 0-40mA current signals.

[0011] Furthermore, the data isolation unit is an SPI isolation unit, which includes an NSS signal line, an SCLK signal line, a MOSI signal line, and a MISO signal line; the SPI isolation unit realizes signal isolation transmission between the ADC acquisition unit and the MCU unit through the NSS signal line, the SCLK signal line, the MOSI signal line, and the MISO signal line.

[0012] Furthermore, the first signal interface of the MCU unit is an SPI interface, through which the MCU unit is connected to the data isolation unit to control the sampling timing of the ADC acquisition unit and read the digital signal converted by the ADC acquisition unit; the second signal interface of the MCU unit is an SPI bus interface, through which the MCU unit interacts with the communication unit.

[0013] Furthermore, the communication unit includes a GW1NS-4 chip, the first signal interface of the GW1NS-4 chip is connected to the second signal interface of the MCU unit, and the second signal interface of the GW1NS-4 chip is connected to the LVDS communication interface; the GW1NS-4 chip is used to receive SPI instructions from the MCU unit, drive the actuator to run, and transmit data with external devices through the LVDS communication interface.

[0014] Furthermore, the LVDS communication interface includes an LVD1 interface and an LVD2 interface, both of which include an RX pin group and a TX pin group. The RX pin group (LVD1 RX P, LVD1 RX N) and TX pin group (LVD1 TX P, LVD1 TX N) of the LVD1 interface, and the RX pin group (LVD2 RX P, LVD2 RX N) and TX pin group (LVD2 TX P, LVD2 TX N) of the LVD2 interface are respectively connected to the corresponding pins of the GW1NS-4 chip to realize signal transmission under the LVDS protocol.

[0015] Furthermore, the power supply unit includes a core chip AMS1117, which is packaged in an SOT-223-P package. The VIN pin of the AMS1117 chip is connected to the BUSVIN input +5V power supply, and the VOUT pin of the AMS1117 chip outputs a stable 3.3V voltage. The power supply unit also includes capacitors C103, C104, C105, C106, C107, C108, C109, and C110. One end of capacitors C103, C104, C105, and C106 is connected to the VIN pin of the AMS1117-3.3V chip, and the other end is grounded (GND). One end of capacitors C107, C108, C109, and C110 is connected to the VOUT pin of the AMS1117 chip, and the other end is grounded (GND).

[0016] Furthermore, it also includes a sampling input power supply, which includes an ISO +15V power supply and an ISO -15V power supply. The output terminals of the ISO +15V power supply and the ISO -15V power supply are respectively connected to the power input terminal of the ADC acquisition unit to provide operating power for the ADC acquisition unit.

[0017] Furthermore, the sampling input power supply also includes a COM terminal, which is connected to the ADC_COM pin of the ADC acquisition unit, and the ADC_COM pin and the COM terminal share a common ground.

[0018] This utility model provides an analog input detection device based on LVDS communication, which has anti-interference capabilities, suppresses external electromagnetic interference to ensure data accuracy, supports long-distance data transmission, is compatible with distributed acquisition, is easily expandable with multiple channels, simplifies wiring, integrates a dedicated chip, has a simple circuit, achieves a sampling accuracy of 0.1%, and has stable performance, meeting the high-precision requirements of multiple fields. The specific beneficial effects are as follows: 1. Excellent anti-interference capability: This device adopts LVDS differential transmission technology (implemented through LVDS communication interface). LVDS signal has differential transmission characteristics and has a natural ability to suppress external electromagnetic interference (such as motor interference and high-frequency noise in industrial sites). It can effectively avoid signal distortion and fluctuation during transmission and ensure the accuracy and reliability of data transmission in complex industrial environments.

[0019] 2. Supports long-distance transmission: LVDS signals have low transmission attenuation, making them suitable for longer transmission distances (up to tens of meters). Compared with traditional SPI direct transmission or RS-485 transmission, it is more suitable for distributed acquisition systems (such as multi-site data acquisition in large factories, remote equipment monitoring, etc.), greatly expanding the application range of the device.

[0020] 3. Easy to expand: The LVDS-based communication architecture supports multi-channel parallel transmission. When it is necessary to add acquisition channels, there is no need to lay independent long-distance signal lines for each channel. Channels can be expanded simply by using the LVDS communication interface, which simplifies the system wiring structure, reduces wiring costs, and reduces noise problems caused by signal line crosstalk.

[0021] High integration and stable performance: The device uses dedicated integrated chips (such as the TPAFE51736S8 chip for the ADC acquisition unit, the GW1NS-4 chip for the communication unit, and the AMS1117- chip for the power supply unit) to replace traditional discrete component circuits, making the circuit structure simple and reducing the number of components and failure points; at the same time, the units are connected through standardized interfaces (SPI, LVDS), which improves system compatibility and stability, and the sampling accuracy reaches 0.1%, which can meet the high-precision requirements of most industrial scenarios. Attached Figure Description

[0022] Figure 1 This is a block diagram of the overall structure of the analog input detection device based on LVDS communication described in this utility model; Figure 2 This is a schematic diagram showing the connection between the ADC acquisition unit, the data isolation unit, and the MCU unit in the analog input detection device based on LVDS communication described in this utility model. Figure 3 This is a circuit diagram of the power supply unit in the analog input detection device based on LVDS communication described in this utility model; Figure 4 This is a schematic diagram showing the connection between the communication unit and the LVDS communication interface in the analog input detection device based on LVDS communication described in this utility model. Figure 5 This is the overall layout circuit diagram of the analog input detection device based on LVDS communication described in this utility model. Detailed Implementation

[0023] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. The described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0024] like Figure 1 As shown, this solution provides an analog input detection device based on LVDS communication. The device includes an ADC acquisition unit, a data isolation unit, an MCU unit, a communication unit, a power supply unit, an LVDS communication interface, and a sampling input power supply. The units are connected to each other through specific signal interfaces or power interfaces to form a complete analog input acquisition and transmission system.

[0025] like Figure 2 As shown, the ADC acquisition unit in this device is used to receive and process external analog input signals, convert the analog signals into digital signals, and output them to the data isolation unit. Its core is the high-precision ADC chip TPAFE51736S8, which has high-precision signal conversion capabilities and a sampling accuracy of 0.1%, meeting the accuracy requirements of most industrial scenarios.

[0026] like Figure 2 and 5As shown, the ADC acquisition unit has three analog signal input terminals: ADC_V_IN, ADC_I_IN, and ADC_COM. The ADC_V_IN and ADC_I_IN pins are used to input external analog signals and can support the acquisition of ±10V voltage signals and 0-40mA current signals. The ADC_COM pin is a common terminal and shares a common ground with the COM terminal of the sampling input power supply (ADC_COM∥COM).

[0027] The signal output pins of the TPAFE51736S8 chip are connected to the signal input pins of the data isolation unit, transmitting the converted digital signal to the data isolation unit. At the same time, the power input pins of the ADC acquisition unit are connected to the sampling input power supply, which provides the operating power.

[0028] like Figure 2 and 5 As shown, the sampling input power supply in this device is used to provide a stable operating power supply for the ADC acquisition unit, ensuring the normal operation of the ADC chip.

[0029] The sampling input power supply includes ISO_+15V power supply, ISO_-15V power supply and COM terminal. The ISO_+15V power supply and ISO_-15V power supply provide positive and negative operating voltages for the ADC acquisition unit. The COM terminal is a common ground terminal and is connected to the ADC_COM pin of the ADC acquisition unit to achieve common ground and avoid grounding interference.

[0030] like Figure 2 As shown, the data isolation unit in this device is used to achieve signal isolation between the ADC acquisition unit and the MCU unit, prevent external interference from being transmitted to the MCU unit through the signal lines, and ensure the reliability of digital signal transmission.

[0031] The data isolation unit is an SPI isolation unit, which includes the NSS signal line, SCLK signal line, MOSI signal line and MISO signal line. These four signal lines constitute the core circuit of SPI communication and realize bidirectional signal isolation transmission.

[0032] The signal input terminal of the data isolation unit is connected to the signal output pin of the TPAFE51736S8 chip of the ADC acquisition unit, and the signal output terminal of the data isolation unit is connected to the first signal interface (SPI interface) of the MCU unit. The isolated digital signal is transmitted to the MCU unit through the NSS, SCLK, MOSI and MISO signal lines.

[0033] like Figure 1 and 2As shown, the MCU unit in this device serves as the control core of the device. It is responsible for controlling the sampling timing of the ADC acquisition unit (such as starting sampling, setting the sampling frequency, etc.), reading the digital signal converted by the ADC acquisition unit, and interacting with the communication unit through the SPI bus to realize data transfer and processing.

[0034] The MCU unit has two signal interfaces: a first signal interface (SPI interface) and a second signal interface (SPI bus interface). The first signal interface (SPI interface) of the MCU unit is connected to the signal output terminal of the data isolation unit and is used to receive digital signals and send sampling control commands. The second signal interface (SPI bus interface) of the MCU unit is connected to the first signal interface of the communication unit to realize bidirectional data interaction with the communication unit (such as sending the acquired digital signals to the communication unit and receiving control commands from the communication unit).

[0035] like Figure 1 As shown, the communication unit in this device serves as the hub for execution control and external communication. It is used to receive SPI instructions from the MCU unit, drive the actuator to run, and transmit data at high speed with external devices (such as host computers and monitoring systems) through the LVDS communication interface to realize remote monitoring, parameter configuration, or status feedback.

[0036] like Figure 4 As shown, the core of the communication unit is the GW1NS-4 control chip, which has SPI command reception and LVDS signal transmission functions, and can realize multi-channel LVDS communication control.

[0037] In this embodiment, the communication unit has two signal interfaces: a first signal interface (SPI interface) and a second signal interface (LVDS interface). The first signal interface (SPI interface) of the communication unit is connected to the second signal interface (SPI bus interface) of the MCU unit, receiving data and instructions from the MCU unit via the SPI bus. The second signal interface (LVDS interface) of the communication unit is connected to the LVDS communication interface, transmitting data via the LVDS protocol. Simultaneously, the power input terminal of the communication unit is connected to the power output terminal of the power supply unit, which provides a stable 3.3V voltage.

[0038] like Figure 4 and 5 As shown, the LVDS communication interface in this device is based on the LVDS protocol (Low Voltage Differential Signaling Protocol) to realize high-speed data interaction between the communication unit and external devices. It supports the issuance of control commands (such as the host computer sending parameter configuration commands to the device) and the feedback of execution status (such as the device sending collected data and equipment operating status to the host computer), meeting the industrial-grade high-reliability communication requirements.

[0039] In this embodiment, the LVDS communication interface includes an LVD1 interface and an LVD2 interface. Each interface includes an RX pin group (receive pin group) and a TX pin group (transmit pin group). Specifically, the RX pin group of the LVD1 interface includes LVD1 RX P pin and LVD1 RX N pin, and the TX pin group includes LVD1 TX P pin and LVD1 TX N pin. The RX pin group of the LVD2 interface includes LVD2 RX P pin and LVD2 RX N pin, and the TX pin group includes LVD2 TX P pin and LVD2 TX N pin.

[0040] Specifically, the RX and TX pin groups of the LVD1 and LVD2 interfaces are connected to the corresponding pins of the GW1NS-4 chip in the communication unit. For example... Figure 4 As shown, LVD1 RX P, LVD1 RX N, LVD1 TX P, and LVD1 TX N are connected to the corresponding pins of the GW1NS-4 chip, and the LVD2 interface is similar. External devices establish communication with the communication unit through the RX / TX pin group of the LVDS communication interface to realize data transmission.

[0041] like Figure 3 As shown, the power supply unit in this device provides a stable operating voltage for the core modules of the device (ADC acquisition unit, data isolation unit, MCU unit, and communication unit), ensuring the reliability of signal processing, calculation, and communication, and avoiding system failures caused by voltage fluctuations.

[0042] The core of the power supply unit is the AMS1117 chip, which provides a stable 3.3V voltage to the processor unit, communication unit, and detection module. It provides stable power to the core system modules, ensuring the reliability of signal processing, computation, and communication, and preventing system failures due to voltage fluctuations. This chip is packaged in an SOT-223-P package and features voltage regulation, converting the input BUSVIN_+5V voltage to a stable 3.3V output.

[0043] In this embodiment, the power supply unit also includes multiple filter capacitors, namely C103, C104, C105, C106, C107, C108, C109 and C110 (e.g., Figure 3 (As shown in the figure). Among them, C103, C104, C105, and C106 are input filter capacitors, one end of which is connected to the VIN pin (connected to BUSVIN_+5V) of the AMS1117-3.3V chip, and the other end is grounded, used to filter out high-frequency noise in the input voltage; C107, C108, C109, and C110 are output filter capacitors, one end of which is connected to the VOUT pin (output VCC_3V3) of the AMS1117-3.3V chip, and the other end is grounded, used to stabilize the output voltage and reduce voltage fluctuations.

[0044] Specifically, such as Figure 1-5 As shown, the VIN pin of the AMS1117-3.3V chip is connected to an external BUSVIN_+5V power supply, and the VOUT pin outputs a stable 3.3V voltage (VCC_3V3). The VCC_3V3 output terminal of the power supply unit is connected to the power input terminals of the ADC acquisition unit, data isolation unit, MCU unit, and communication unit, respectively, to provide a 3.3V operating voltage for each unit. At the same time, the ground terminal (GND) of the power supply unit is common to the ground terminals of each unit of the device, forming a unified grounding system.

[0045] The working process of this device is as follows: S1: Power supply unit startup: The BUSVIN_+5V power supply is connected to the power supply unit and outputs a 3.3V voltage (VCC_3V3) after being regulated by the AMS1117 chip, which powers the ADC acquisition unit, data isolation unit, MCU unit, and communication unit; at the same time, the ISO_+15V and ISO_-15V power supplies of the sampling input power supply power the ADC acquisition unit.

[0046] S2: Analog signal acquisition: External analog signals (±10V voltage or 0~40mA current) are input through the ADC_V_IN and ADC_I_IN pins of the ADC acquisition unit. The TPAFE51736S8 chip converts the analog signals into digital signals with a sampling accuracy of 0.1%.

[0047] S3: Signal Isolation Transmission: The digital signal output by the ADC acquisition unit is isolated by the data isolation unit (SPI isolation) and transmitted to the MCU unit through the NSS, SCLK, MOSI, and MISO signal lines.

[0048] S4: Data Processing and Transmission: The MCU unit controls the sampling timing of the ADC acquisition unit, reads the isolated digital signal, and transmits the digital signal to the communication unit via the SPI bus.

[0049] S5: Remote data transmission: The communication unit transmits digital signals to external devices (such as host computers) through the LVDS communication interface (LVD1, LVD2 interface), and at the same time receives control commands issued by external devices and feeds them back to the MCU unit through the SPI bus to realize remote monitoring and parameter configuration.

[0050] The above description is only for illustrating the embodiments of this utility model and is not intended to limit this utility model. For those skilled in the art, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An analog input detection device based on LVDS communication, characterized in that, The system includes an ADC acquisition unit, a data isolation unit, an MCU unit, a communication unit, a power supply unit, and an LVDS communication interface. The ADC acquisition unit receives and processes analog input signals, and its signal output is connected to the signal input of the data isolation unit. The signal output of the data isolation unit is connected to the first signal interface of the MCU unit, and the second signal interface of the MCU unit is connected to the first signal interface of the communication unit. The second signal interface of the communication unit is connected to the LVDS communication interface, which enables high-speed data interaction between the communication unit and external devices. The power supply unit's power output is connected to the power inputs of the ADC acquisition unit, the data isolation unit, the MCU unit, and the communication unit, providing stable power to each unit.

2. The analog input detection device based on LVDS communication according to claim 1, characterized in that, The ADC acquisition unit includes a TPAFE51736S8 chip. The signal input pin of the TPAFE51736S8 chip is connected to the analog signal input terminal of the ADC acquisition unit, and the signal output pin of the TPAFE51736S8 chip is connected to the signal input terminal of the data isolation unit.

3. An analog input detection device based on LVDS communication according to claim 1 or 2, characterized in that, The analog signal input terminals of the ADC acquisition unit include ADC_V_IN pin, ADC_I_IN pin and ADC_COM pin. The ADC_V_IN pin and ADC_I_IN pin are used to connect external analog signals, and the ADC_COM pin is a common terminal. The external analog signals include ±10V voltage signals and 0-40mA current signals.

4. The analog input detection device based on LVDS communication according to claim 1, characterized in that, The data isolation unit is an SPI isolation unit, which includes NSS signal lines, SCLK signal lines, MOSI signal lines, and MISO signal lines. The SPI isolation unit achieves signal isolation transmission between the ADC acquisition unit and the MCU unit through the NSS signal lines, SCLK signal lines, MOSI signal lines, and MISO signal lines.

5. The analog input detection device based on LVDS communication according to claim 1, characterized in that, The first signal interface of the MCU unit is an SPI interface. The MCU unit is connected to the data isolation unit through the SPI interface to control the sampling timing of the ADC acquisition unit and read the digital signal converted by the ADC acquisition unit. The second signal interface of the MCU unit is an SPI bus interface. The MCU unit interacts with the communication unit through the SPI bus interface.

6. The analog input detection device based on LVDS communication according to claim 1, characterized in that, The communication unit includes a GW1NS-4 chip. The first signal interface of the GW1NS-4 chip is connected to the second signal interface of the MCU unit, and the second signal interface of the GW1NS-4 chip is connected to the LVDS communication interface. The GW1NS-4 chip is used to receive SPI commands from the MCU unit, drive the actuator to run, and transmit data with external devices through the LVDS communication interface.

7. The analog input detection device based on LVDS communication according to claim 6, characterized in that, The LVDS communication interface includes an LVD1 interface and an LVD2 interface, both of which include an RX pin group and a TX pin group. The RX pin group and TX pin group of the LVD1 interface and the RX pin group and TX pin group of the LVD2 interface are respectively connected to the corresponding pins of the GW1NS-4 chip to realize signal transmission under the LVDS protocol.

8. The analog input detection device based on LVDS communication according to claim 1, characterized in that, The power supply unit includes an AMS1117 chip in an SOT-223-P package. The VIN pin of the AMS1117 chip is connected to the BUSVIN input of a +5V power supply, and the VOUT pin outputs a stable 3.3V voltage. The power supply unit also includes capacitors C103, C104, C105, C106, C107, C108, C109, and C110. One end of capacitors C103, C104, C105, and C106 is connected to the VIN pin of the AMS1117 chip, and the other end is grounded (GND). One end of capacitors C107, C108, C109, and C110 is connected to the VOUT pin of the AMS1117 chip, and the other end is grounded (GND).

9. The analog input detection device based on LVDS communication according to claim 1, characterized in that, It also includes a sampling input power supply, which includes an ISO +15V power supply and an ISO -15V power supply. The output terminals of the ISO +15V power supply and the ISO -15V power supply are respectively connected to the power input terminal of the ADC acquisition unit to provide operating power for the ADC acquisition unit.

10. The analog input detection device based on LVDS communication according to claim 9, characterized in that, The sampling input power supply also includes a COM terminal, which is connected to the ADC_COM pin of the ADC acquisition unit, and the ADC_COM pin and the COM terminal share a common ground.

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