Chip maintenance device

Abstract

The application relates to the technical field of servers, and in particular provides a chip maintenance device, which comprises a base and one or more cold plate placing bodies; the base is used for being placed at a preset placing position on a case where a chip is located; the cold plate placing body is arranged on the base and can rotate relative to the base; the cold plate placing body has a placing area; the placing area is used for supporting the cold plate after the cold plate is turned over in a direction away from the chip, so that the chip can be maintained without removing the whole cold plate and related cables, the maintenance efficiency and the convenience of maintenance are improved, time and labor are saved. Moreover, the angle of the cold plate placing body can be flexibly adjusted according to different systems and application scenarios, so that the cold plate with different turning degrees can be effectively supported, the maintenance device can be applied to chip maintenance of different systems and application scenarios, and the application range and the use flexibility are improved.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a chip maintenance device. Background Technology

[0002] Servers contain chips, such as Graphics Processing Units (GPUs) and Central Processing Units (CPUs). As chip power consumption continues to increase, the heat generated per unit time rises significantly, making traditional air cooling insufficient to meet the chip's high-efficiency heat dissipation requirements.

[0003] Currently, liquid cooling is the primary method for heat dissipation of chips. Leveraging the high specific heat capacity and thermal conductivity of liquids, heat is rapidly transferred from the chip to the outside environment, achieving efficient heat dissipation. Among these methods, cold plate cooling is a mainstream liquid cooling approach. It involves a cold plate in contact with the chip surface, connected to the server chassis via pipes and cables. The cold plate has internal coolant channels where the coolant circulates. Heat from the chip is transferred to the cold plate, and the coolant carries away the heat absorbed by the cold plate, ultimately achieving efficient heat dissipation for the chip.

[0004] However, during server use, the chips require regular maintenance. Current techniques for chip maintenance involve manually removing the entire cold plate and related cables from the chip before performing the maintenance. However, due to the weight of the cold plate and the need to remove numerous cables, chip maintenance is inconvenient, time-consuming, and labor-intensive. Utility Model Content

[0005] In order to solve the above-mentioned technical problems, or at least partially solve the above-mentioned technical problems, this application provides a chip maintenance device to improve the convenience and efficiency of chip maintenance.

[0006] This application provides a chip maintenance device, wherein the surface of the chip has a cold plate that exchanges heat with the chip, and the chip maintenance device includes a base and one or more cold plate holders; The base is used to place the chip at a predetermined placement position on the chassis where the chip is located; The cold plate placement body is disposed on the base and can rotate relative to the base. The cold plate placement body has a placement area for supporting the cold plate after it is flipped away from the chip.

[0007] The chip maintenance device provided in this application consists of a base and a cold plate holder. The cold plate holder is mounted on the base and can rotate relative to the base. A placement area is provided on the cold plate holder. When chip maintenance is required, the base is placed at a preset placement position on the chassis where the chip is located. Then, the cold plate is flipped onto the cold plate holder in the direction away from the chip. The cold plate is supported by the placement area. Therefore, chip maintenance can be performed without removing the entire cold plate and related pipelines and cables, which improves maintenance efficiency and convenience, and saves time and effort.

[0008] Meanwhile, since the cold plate holder can rotate relative to the base, its angle can be flexibly adjusted according to different systems and application scenarios to effectively support cold plates at different degrees of rotation. This makes the maintenance device suitable for chip maintenance in different systems and application scenarios, improving its applicability and flexibility. Moreover, by allowing the cold plate holder to rotate to a suitable angle to support the cold plate, damage to the cold plate's pipes and cables due to excessive bending can be effectively avoided, thus providing effective protection for the cables and pipes. In addition, this design also reduces the space occupied by the maintenance device when stored.

[0009] Optionally, the cold plate holder can rotate about an axis, and the cold plate holder can move axially along the axis, which is parallel to the width direction of the base.

[0010] This design allows the cold plate holder to rotate while also moving on the base, enabling flexible adjustment of its position. This means that when maintaining chips in different locations within the chassis requires no base movement, simply moving the cold plate holder axially along the axis provides support for the cold plates in different positions within the chassis. This makes the chip maintenance device suitable for chip maintenance in different systems and application scenarios, further improving its applicability and flexibility.

[0011] Optionally, the axis is the axis of the rotating shaft provided on the base, and one end of the cold plate placement body is rotatably connected to the rotating shaft.

[0012] This simple structural design not only allows for more flexible rotation of the cold plate holder but also facilitates axial movement. Furthermore, by placing the rotational connection between the cold plate holder and the shaft at one end of the cold plate holder, the rotation range of the cold plate holder is increased, further expanding its applicability.

[0013] Optionally, the chip maintenance device may further include a support component; The support member is used to position the cold plate placement body when it rotates to a preset angle.

[0014] This design further improves the stability of the cold plate placement body, which in turn enhances the stable support of the cold plate placement body for the cold plate, ensuring the normal and efficient operation of chip maintenance.

[0015] Optionally, the support member is located between the cold plate holder and the base; One end of the support member is rotatably connected to one of the cold plate placement body and the base, and the other end of the support member is used to connect to the other of the cold plate placement body and the base, and the connection position of the other end of the support member on the other of the cold plate placement body and the base is adjustable.

[0016] In this way, when it is necessary to adjust the angle of the cold plate placement body, it is only necessary to adjust the connection position of the other end of the support member on the other one of the cold plate placement body and the base to adjust the angle of the support member, thereby realizing the adjustment of the tilt angle of the cold plate placement body. At the same time, it ensures the stable support of the support member on the cold plate placement body, thereby further improving the stable support of the cold plate placement body on the cold plate.

[0017] Optionally, the other end of the support member is provided with a first connecting part, and the other of the cold plate placement body and the base is provided with at least two second connecting parts, and the at least two second connecting parts are arranged at intervals along a direction away from the rotational connection between the cold plate placement body and the base. The first connecting part can be detachably connected to the second connecting part to adjust the tilt angle of the cold plate placement body.

[0018] This design makes it easier to adjust the tilt angle of the cold plate placement and makes the cold plate placement more stable.

[0019] Optionally, the other end of the support member has a connecting flange, and the first connecting portion is disposed on the connecting flange.

[0020] By setting a connecting flange and placing the first connecting part on the connecting flange, it is not only more convenient to set the first connecting part, but also helps to improve the fit between the other end of the support and the other one of the cold plate placement body and the base, thereby improving the connection reliability.

[0021] Optionally, the first connecting part includes a connecting hole disposed on the connecting flange, and the second connecting part includes a connecting post disposed on the other of the cold plate placement body and the base, wherein the connecting post is connected to the connecting hole by a fastener.

[0022] This design is simple and easy to assemble and disassemble.

[0023] Optionally, the side of the cold plate holder facing the base has a receiving cavity, which is used to store the support member when the cold plate holder is rotated to rest against the base.

[0024] When the maintenance device is not in use, the cold plate holder can be rotated to rest against the base. At this time, the support can be located in the accommodating cavity, which not only further saves storage space, but also avoids the loss of the support to a certain extent, and makes it convenient to carry or move the maintenance device.

[0025] Optionally, the chip maintenance device further includes a locking element for locking the cold plate onto the cold plate holder.

[0026] By using locking components to constrain the cold plate, the stability of the cold plate on the cold plate placement body is further improved, preventing the cold plate from tipping over and damaging the components on the chassis or contaminating the thermal paste on the outer surface of the chip.

[0027] Optionally, the locking member is rotatably connected to the cold plate placement body. The locking member can be rotated to a first position and a second position. In the first position, the locking member is used to fix the cold plate on the placement area; in the second position, the locking member is used to release the fixation of the cold plate.

[0028] This improves the flexibility and convenience of using the locking mechanism.

[0029] Optionally, the locking element is located at one end of the cold plate holder away from the rotatable connection between the cold plate holder and the base.

[0030] This design allows for constraint on the cold plate from at least the end furthest from the chip after it has been flipped over. This not only makes operation convenient, but also ensures that when the cold plate tends to tilt towards the chip, it can effectively and promptly constrain that end of the cold plate, thus preventing it from tipping over.

[0031] Optionally, the cold plate placement body is provided with a support and positioning part, which is used to support and position the locking member when the locking member is rotated to the first position.

[0032] This design improves the stability of the locking component itself, which in turn enhances the constraint effect of the locking component on the cold plate, thereby further improving the stability of the cold plate.

[0033] Optionally, the cold plate placement body includes a supporting bottom wall and a side wall disposed on the side of the supporting bottom wall away from the base, the side wall and the supporting bottom wall together forming the placement area.

[0034] This design simplifies the structure of the cold plate holder, making manufacturing more convenient; moreover, the side walls can limit the cold plate from its periphery, further improving its stability.

[0035] Optionally, the side walls and / or the supporting bottom wall are provided with weight-reduction holes.

[0036] This design ensures effective support for the cold plate while reducing its weight, which in turn reduces the weight of the entire maintenance device. This prevents the maintenance device from becoming too heavy and causing excessive pressure on the chassis, and also makes it easier to move or transport the maintenance device.

[0037] Optionally, the base is provided with a first engaging part, which is used to match and engage with a second engaging part on the chassis to position the base at a preset placement position on the chassis.

[0038] By setting up the first and second locking parts, the stability of the base relative to the chassis is improved, which in turn improves the stability of the entire maintenance device on the chassis, ensuring effective support of the cold plate by the maintenance device and providing a guarantee for the normal and efficient operation of chip maintenance.

[0039] Optionally, the base includes a main wall and a retaining edge extending from the edge of the main wall toward a direction away from the cold plate holder; when the base is placed on the chassis, the retaining edge surrounds the periphery of the chassis; the first engaging portion is disposed on the side of the retaining edge facing the chassis.

[0040] By setting up a retaining edge, which cooperates with the outer perimeter of the chassis, the base can be positioned to a certain extent. That is, the retaining edge and the first engaging part cooperate to achieve a dual positioning effect on the base, further improving the stability of the entire maintenance device on the chassis.

[0041] Optionally, the first engaging portion includes a protrusion, and the second engaging portion includes a groove into which the protrusion extends and engages with it.

[0042] This makes it easy to connect and disconnect the base from the chassis.

[0043] Optionally, when there are multiple cold plate placement bodies, the multiple cold plate placement bodies are arranged sequentially and at intervals on the base, and the rotation axes of the multiple cold plate placement bodies are either coincident or parallel.

[0044] This configuration allows the maintenance device to not only maintain chips in different locations, but also to support multiple cold plates in different locations simultaneously, enabling one device to maintain multiple chips at the same time, thus further improving its applicability and maintenance efficiency.

[0045] It should be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further illustration of the claimed technology. Attached Figure Description

[0046] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The accompanying drawings are used to provide a further understanding of the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0047] Figure 1 This is a schematic diagram of the chassis and the motherboard, chips and cold plate located inside the chassis according to an embodiment of this application; Figure 2 for Figure 1 The corresponding exploded view of the structure; Figure 3 This is a schematic diagram of the structure of a chip maintenance device according to an embodiment of this application; Figure 4 This is a schematic diagram of the structure of the chip maintenance device according to an embodiment of this application when it is placed on the chassis; Figure 5 This is a schematic diagram of the structure when the cold plate on one of the chips is flipped to the placement area of ​​the chip maintenance device. Figure 6 for Figure 3 Enlarged view of the structure at point I in the middle; Figure 7 This is a schematic diagram of the chip maintenance device described in one embodiment of this application from another perspective; Figure 8 for Figure 7 Enlarged view of the structure at point I in the middle; Figure 9 This is a schematic diagram of the chip maintenance device according to an embodiment of this application when the cold plate placement body is rotated to abut against the base; Figure 10 This is a schematic diagram of the base of the chip maintenance device according to an embodiment of this application; Figure 11 This is a schematic diagram of the bottom structure of the base of the chip maintenance device according to an embodiment of this application; Figure 12 for Figure 11Enlarged view of the structure at point I in the middle.

[0048] Among them, 100 is the chassis; 101 is the enclosure; 102 is the second engaging part; 200 is the server motherboard; 300 is the chip; 1 is the base; 11 is the hinge; 12 is the second connecting part; 13 is the first engaging part; 14 is the main body wall; 15 is the edge; 2 is the cold plate placement body; 20 is the placement area; 21 is the supporting bottom wall; 22 is the side wall; 23 is the accommodating cavity; 24 is the supporting positioning part; 25 is the weight reduction hole; 26 is the shaft hole; 3 is the supporting component; 30 is the connecting flange; 31 is the first connecting part; 4 is the locking component; 5 is the cold plate; 50 is the shell; 51 is the cooling medium inlet pipe; 52 is the cooling medium outlet pipe; and 53 is the distributor. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this application more apparent, exemplary embodiments according to this application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments of this application. It should be understood that this application is not limited to the exemplary embodiments described herein.

[0050] It should be understood that the steps described in the method embodiments of this application may be performed in different orders and / or in parallel. Furthermore, the method embodiments may include additional steps and / or omit the steps shown. The scope of this application is not limited in this respect.

[0051] The term "comprising" and its variations as used herein are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Definitions of other terms will be given in the following description. It should be noted that the concepts of "first", "second", etc., mentioned in this application are used only to distinguish different devices, modules, or units, and are not intended to limit the order of functions performed by these devices, modules, or units or their interdependencies.

[0052] It should be noted that the terms "a" and "a plurality of" used in this application are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0053] The server is equipped with chips. The server itself can be an Artificial Intelligence (AI) server, or other types of servers. The chips can be graphics processing units (GPUs), central processing units (CPUs), or other types of chips. For example, by equipping a server with a GPU, the GPU significantly enhances the server's scientific computing, artificial intelligence, and graphics processing performance by improving parallel computing capabilities.

[0054] As chip power consumption continues to increase, the heat generated per unit time increases significantly. Currently, liquid cooling is the primary method for dissipating heat from chips. This utilizes the high specific heat capacity and thermal conductivity of liquids to rapidly transfer heat from the chip to the outside, achieving efficient heat dissipation. Cold plate cooling is a mainstream liquid cooling method. Its main principle is that a metal cold plate contacts the chip surface, absorbing heat from the chip and achieving efficient heat dissipation.

[0055] Reference Figure 1 and Figure 2 As shown, chip 300 is located inside chassis 100, and server motherboard 200 is installed inside chassis 100. Chip 300 is mounted on server motherboard 200 and electrically connected to server motherboard 200. Cold plate 5 is located on the side of chip 300 facing away from server motherboard 200, and cold plate 5 has heat exchange contact with the surface of chip 300.

[0056] The cold plate 5 has a housing 50 with a cooling medium inlet pipe 51 and a cooling medium outlet pipe 52 connected to it. The housing 50 of the cold plate 5 can be made of copper or aluminum alloy, which has good thermal conductivity. The cooling medium inlet pipe 51 and the cooling medium outlet pipe 52 are connected to an external cooling medium container via a distributor 53, which is connected to the chassis 100. The housing 50 has a coolant channel, and the cooling medium inlet pipe 51 and the cooling medium outlet pipe 52 are respectively connected to the coolant channel. The cooling medium enters the coolant channel through the cooling medium inlet pipe 51 and flows within the coolant channel. The cooling medium can be, for example, coolant, such as pure water, fluorinated liquid, or mineral oil. When the cold plate 5 comes into contact with the surface of the chip 300, the heat from the chip 300 is transferred to the cold plate and exchanges heat with the cooling medium inside the cold plate 5. The cooling medium that has absorbed heat is discharged from the cooling medium outlet pipe 52, thereby achieving heat dissipation for the chip 300.

[0057] The heat exchange contact here can be that the housing 50 of the cold plate 5 is directly attached to the chip 300, or thermal paste is applied to the surface of the chip 300, and the housing 50 of the cold plate 5 contacts the thermal paste, so that the heat of the chip 300 is transferred to the cold plate 5 through the thermal paste.

[0058] This application provides a chip maintenance device. By setting a base and one or more cold plate holders, the base can be placed on the chassis 100 where the chip 300 is located, and the cold plate holders can rotate relative to the base. A placement area is set on the cold plate holder. When chip 300 needs maintenance, the base is placed at a preset placement position on the chassis 100 where chip 300 is located, and then the cold plate 5 is flipped onto the cold plate holder in a direction away from chip 300. The cold plate 5 is supported by the placement area, so that chip 300 can be maintained without removing the entire cold plate 5 and related pipes and cables, which improves maintenance efficiency and convenience.

[0059] The chip maintenance device provided in this application will be described in detail below with reference to the accompanying drawings and specific embodiments: Reference Figures 1 to 12 As shown in the figure, this application provides a chip maintenance device, including: a base 1 and a cold plate placement body 2.

[0060] The base 1 is used to place the chip 300 at a preset placement position on the chassis 100. The cold plate placement body 2 is disposed on the base 1 and can rotate relative to the base 1. The cold plate placement body 2 has a placement area 20, which is used to support the cold plate 5 after it is flipped away from the chip 300.

[0061] For example, the chassis 100 may include a housing 101 and a detachable cover (not shown) disposed on the housing 101. The server motherboard 200, chip 300 and cold plate 5 are located inside the housing 101.

[0062] In this application embodiment, the chip 300 can be, for example, a GPU, or a CPU or other types of chip.

[0063] For example, when chip 300 needs maintenance, the cover is opened, the base 1 is placed directly on the preset placement position on the housing 101, and then the cold plate 5 is flipped away from chip 300 onto the cold plate placement body 2. The cold plate 5 is supported by the placement area 20, and chip 300 can be maintained without removing the entire cold plate and related cables.

[0064] Reference Figure 4As shown, it can be understood that the above-mentioned preset placement position can be determined according to the position of the chip 300 to be maintained. Specifically, the preset placement position of the base 1 cannot cover the chip 300. That is to say, after the base 1 is placed on the chassis 100, the projection of the base 1 on the chassis 100 does not overlap with the projection of the chip 300 on the chassis 100. This is so that after the cold plate 5 on the chip 300 to be maintained is flipped away from the chip 300, the cold plate placement body 2 can easily support the cold plate 5 and expose the chip 300 for maintenance.

[0065] For example, continue to refer to Figures 1 to 5 As shown, the cooling medium inlet pipe 51 and cooling medium outlet pipe 52 of the cold plate 5 extend from one end of the cold plate 5 and are connected to an external cooling medium container through a distributor 53. Specifically, the base 1 can be placed above the corresponding portions of the cooling medium inlet pipe 51 and cooling medium outlet pipe 52 that extend out of the cold plate 5. In this way, when the cold plate 5 is flipped away from the chip 300, the chip 300 will be exposed. Moreover, during the flipping process of the cold plate 5, the cooling medium inlet pipe 51 and cooling medium outlet pipe 52 bend to a certain extent along with the flipping of the cold plate 5, without affecting the effective connection between the cooling medium inlet pipe 51, cooling medium outlet pipe 52 and the cold plate 5, distributor 53, etc.

[0066] For example, when the cold plate 5 and the chip 300 achieve heat dissipation through direct contact, when the chip 300 needs to be maintained, the cold plate 5 only needs to be flipped away from the chip 300 onto the placement area 20. The placement area 20 supports and fixes the cold plate 5, providing maintenance space for the chip 300, so as to facilitate maintenance of the chip 300.

[0067] For example, when the cold plate 5 and the chip 300 are thermally connected by thermal paste, in order to better protect the cold plate 5 and the chip 300 when maintenance is required, the thermal paste can be heated first. After the thermal paste melts, the cold plate 5 can be flipped away from the chip 300 onto the placement area 20. This avoids the situation where the cold plate 5 or the chip 300 is damaged by directly flipping the cold plate 5 when there is thermal paste connecting the cold plate 5 and the chip 300.

[0068] It should be noted that the specific rotation angle of the cold plate 5 relative to the base 1 can be determined according to the actual needs of the scenario. For example, it can be determined according to the different rotation angles of the cold plate 5. As long as the cold plate 5 is rotated away from the chip 300 without breaking the pipes, cables, etc., and the chip 300 has enough space for maintenance, it is acceptable.

[0069] The chip maintenance device provided in this application embodiment sets up a base 1 and a cold plate placement body 2. The cold plate placement body 2 is placed on the base 1 and can rotate relative to the base 1. A placement area 20 is set on the cold plate placement body 2. When chip 300 needs to be maintained, the base 1 is placed at a preset placement position on the chassis 100 where chip 300 is located. Then, the cold plate 5 is flipped onto the cold plate placement body 2 in a direction away from chip 300. The cold plate 5 is supported by the placement area 20. Therefore, chip 300 can be maintained without removing the entire cold plate 5 and related cables, which improves maintenance efficiency and convenience, and saves time and effort.

[0070] Meanwhile, since the cold plate holder 2 can rotate relative to the base 1, its angle can be flexibly adjusted according to different systems and application scenarios to effectively support the cold plate 5 at different degrees of rotation. This makes the maintenance device applicable to chip 300 maintenance in different systems and application scenarios, improving its applicability and flexibility. Furthermore, by allowing the cold plate holder 2 to rotate to a suitable angle to support the cold plate 5, damage due to excessive bending of the cables or pipes of the cold plate 5 can be effectively prevented, thus providing effective protection for the cables or pipes. In addition, this design also reduces the space occupied by the maintenance device during storage.

[0071] In some embodiments, only one cold plate placement body 2 may be provided on the base 1, or two or more cold plate placement bodies 2 may be provided.

[0072] In some embodiments, when at least two cold plate placement bodies 2 are provided on the base 1, the at least two cold plate placement bodies 2 are sequentially spaced on the base 1, and the directions of the rotation axes of the at least two cold plate placement bodies 2 coincide or are parallel.

[0073] The term "coincident" here specifically refers to the fact that all cold plate placement bodies 2 are arranged collinearly with respect to the rotation axis of the base 1, for example, all cold plate placement bodies 2 are arranged sequentially along a straight line. The term "parallel" here specifically refers to the fact that at least two cold plate placement bodies 2 are not collinear with respect to the rotation axis of the base 1, but are parallel to each other.

[0074] By setting at least two cold plate placement bodies 2 on the base 1, the maintenance device can not only be used to maintain chips 300 in different positions, but also support multiple cold plates 5 in different positions at the same time, so that one maintenance device can maintain multiple chips 300 at the same time, which further improves the applicability and maintenance efficiency of the maintenance device.

[0075] Reference Figures 3 to 7As shown, the cold plate placement body 2 may include: a supporting bottom wall 21 and a side wall 22 disposed on the side of the supporting bottom wall 21 away from the base 1, the side wall 22 and the supporting bottom wall 21 together forming a placement area 20. For example, the side of the supporting bottom wall 21 facing away from the base 1 forms a supporting surface for supporting the cold plate 5, and the side wall 22 may extend from the two sides of the supporting surface along a direction perpendicular to the supporting bottom wall 21.

[0076] This design simplifies the structure of the cold plate placement body 2, making manufacturing more convenient; moreover, the side walls 22 can limit the cold plate 5 from at least the left and right sides, further improving the stability of the cold plate 5.

[0077] Weight reduction holes 25 can also be provided on the side wall 22 and / or the supporting bottom wall 21. While ensuring that the cold plate placement body 2 effectively supports the cold plate 5, the weight of the cold plate placement body 2 is reduced, thereby reducing the weight of the entire maintenance device. This can prevent the maintenance device from being too heavy and causing overpressure on the chassis 100, and also facilitates the movement or transport of the maintenance device.

[0078] Reference Figure 2 As shown, in some embodiments, multiple chips 300 can be disposed on the server motherboard 200, for example, the multiple chips 300 are arranged along the length or width direction of the server motherboard 200. Each chip 300 is provided with a corresponding cold plate 5 to cool the corresponding chip 300.

[0079] Reference Figure 3 As shown, in some embodiments, the cold plate holder 2 rotates about an axis, and the cold plate holder 2 can move axially along the axis, which is parallel to the width direction of the base 1. Specifically, the axial direction here can be... Figure 3 The X-direction in the middle.

[0080] This design allows the cold plate holder 2 to move on the base 1 while rotating, enabling flexible adjustment of the position of the cold plate holder 2. This allows for maintenance of chips 300 at different locations within the chassis 100 without moving the base 1; simply moving the cold plate holder 2 along the axis of the chassis 100 is sufficient to support the cold plates 5 at different locations within the chassis 100. This makes the chip maintenance device applicable to chip 300 maintenance in different systems and application scenarios, further improving its applicability and flexibility.

[0081] In some embodiments, a rotating shaft 11 is provided on the base 1, and the aforementioned axis is the axis of the rotating shaft 11. One end of the cold plate placement body 2 is rotatably connected to the rotating shaft 11.

[0082] For example, refer to Figure 7As shown, the bottom end of the cold plate placement body 2 is provided with a shaft hole 26, and the rotating shaft 11 passes through the shaft hole 26. This allows the cold plate placement body 2 to not only rotate flexibly around the rotating shaft 11 to adjust the tilt angle of the cold plate placement body 2, but also to slide along the axial direction of the rotating shaft 11 to support the cold plates at different positions, thereby enabling maintenance of the chip 300 at different positions. The structure is simple and the operation is convenient.

[0083] By rotatably connecting one end of the cold plate placement body 2 to the rotating shaft 11, the rotation angle range of the cold plate placement body 2 relative to the base 1 can be increased to a certain extent, making it suitable for effective support of the cold plate 5 in more scenarios.

[0084] Of course, in other embodiments, the rotatable connection point between the cold plate placement body 2 and the base 1 can also be set in the area between the two ends of the cold plate placement body 2, for example, the middle part of the cold plate placement body 2 is rotatably connected to the base 1.

[0085] In addition, in other implementations, the cold plate holder 2 can be positioned along the length of the base 1 (specifically, it can be...). Figure 3 The cold plate placement body 2 is moved in the Y direction to adjust its position on the length direction of the base 1, thereby flexibly adjusting the position of the cold plate placement body 2 according to the position of different models of servers and chips 300, achieving effective support for the cold plate 5 at different positions, and further improving the applicability of the maintenance device.

[0086] For example, a slide rail is provided on the base 1, extending along the length of the base 1, and a rotating shaft 11 is mounted on the slide rail. The rotating shaft 11 extends along the width of the base 1 and can slide along the extension direction of the slide rail. For example, the bottom of the rotating shaft 11 has a slider, which is slidably connected to the slide rail, allowing the rotating shaft 11 to slide relative to the slide rail. In other words, the cold plate placement body 2 is rotatably connected to the rotating shaft to adjust the rotation angle of the cold plate placement body 2. When it is necessary to adjust the position of the cold plate placement body 2 in the width direction of the base 1, the cold plate placement body 2 can be moved axially along the rotating shaft; when it is necessary to adjust the position of the cold plate placement body 2 in the length direction of the base 1, the rotating shaft 11 can be slid along the slide rail. This allows the cold plate placement body 2 to move in both the front-back and left-right directions, enabling maintenance of the chip 300 at different installation positions and further improving the applicability of the maintenance device.

[0087] In other embodiments, the base 1 may be provided with a hinge, and the cold plate placement body 2 may be rotatably connected to the hinge, allowing the hinge to move relative to the base 1.

[0088] Reference Figures 3 to 8 As shown, in some embodiments, the chip maintenance device further includes a support 3, which is used to position the cold plate placement body 2 when it is rotated to a preset angle.

[0089] This configuration further improves the stability of the cold plate placement body 2, which in turn enhances the stable support of the cold plate placement body 2 for the cold plate 5, thus ensuring the normal and efficient maintenance of the chip 300.

[0090] In some embodiments, the support member 3 is located between the cold plate holder 2 and the base 1. This provides better support.

[0091] In one feasible implementation, one end of the support member 3 is rotatably connected to the cold plate placement body 2, and the other end of the support member 3 is used to connect to the base 1, and the connection position on the base 1 is adjustable.

[0092] Reference Figure 7 As shown, for example, one end of the support member 3 is connected to the side of the cold plate placement body 2 that is away from the cold plate 5. The rotational connection position between the support member 3 and the cold plate placement body 2 can be located in the middle of the cold plate placement body 2 or close to the middle of the cold plate placement body 2, which can improve the overall support stability of the support member 3 for the cold plate placement body 2.

[0093] As set up above, when it is necessary to adjust the angle of the cold plate placement body 2, it is only necessary to adjust the connection position of the other end of the support member 3 on the base 1 to adjust the angle of the support member 3, thereby realizing the adjustment of the tilt angle of the cold plate placement body 2, while ensuring the stable support of the support member 3 on the cold plate placement body 2, thereby further improving the stable support of the cold plate placement body 2 on the cold plate 5.

[0094] Reference Figure 7 and Figure 8 As shown, one end of the support member 3 is the upper end of the support member 3, and the other end of the support member 3 is the bottom end of the support member 3. By rotating the upper end of the support member 3 to the cold plate placement body 2, the connection position of the lower end of the support member 3 to the base 1 is adjustable. This setting makes it more convenient to adjust the angle of the support member 3.

[0095] In specific implementations, in some embodiments, the other end of the support member 3 is provided with a first connecting portion 31, and the base 1 is provided with at least two second connecting portions 12. The at least two second connecting portions 12 are arranged at intervals along a direction away from the rotational connection between the cold plate placement body 2 and the base 1. (Refer to...) Figure 7 As shown, the direction away from the rotational connection between the cold plate holder 2 and the base 1 can specifically be... Figure 7 The Y direction is shown in the diagram.

[0096] The first connecting part 31 can be detachably connected to the second connecting part 12 to adjust the tilt angle of the cold plate placement body 2.

[0097] When the first connecting part 31 is connected to the second connecting part 12 at different positions, the tilt angle of the support member 3 itself will change, and the tilt angle of the cold plate placement body 2 will change accordingly. This makes it easier to adjust the tilt angle of the cold plate placement body 2 and makes the cold plate placement body 2 more stable.

[0098] Reference Figure 7 and Figure 8 As shown, the other end of the support member 3 has a connecting flange 30, and a first connecting portion 31 is disposed on the connecting flange 30. For example, the connecting flange 30 is located on the side of the support member 3 facing away from the cold plate placement body 2. Specifically, the surface where the connecting flange 30 is located intersects with the surface where the support member 3 is located. For example, when the support member 3 supports the cold plate placement body 2, the connecting flange 30 is parallel to the top surface of the base 1.

[0099] By setting the connecting flange 30, the first connecting part 31 is set on the connecting flange 30, which not only makes the setting of the first connecting part 31 more convenient, but also helps to improve the fit between the other end of the support member 3 and the base 1, thereby improving the connection reliability.

[0100] In some embodiments, the first connecting part 31 may specifically include a connecting hole provided on the connecting flange 30, and the second connecting part 12 includes a connecting post provided on the base 1, and the connecting post and the connecting hole are connected by fasteners.

[0101] In practice, the connecting column has mounting holes. During connection, the connecting flange 30 overlaps the connecting column, aligning the connecting holes with the mounting holes. Fasteners are then used to connect the two together, thus fixing the bottom of the support 3 to the base 1. The structure is simple, and assembly and disassembly are convenient. Fasteners can be screws or retaining clips, etc.

[0102] Of course, in other implementations, the first connecting part 31 can also be a card hole, and the second connecting part 12 can be a buckle that can extend into the card hole and match and engage with the card hole.

[0103] In another feasible implementation, the other end of the support member 3 can be rotatably connected to the base 1, and one end of the support member 3 can be connected to the cold plate placement body 2, with the connection position on the cold plate placement body 2 being adjustable.

[0104] Specifically, the bottom end of the support member 3 is rotatably connected to the base 1, the top end of the support member 3 is connected to the cold plate placement body 2, and the connection position on the cold plate placement body 2 is adjustable.

[0105] For example, the cold plate placement body 2 is provided with multiple connecting holes, which are arranged at intervals along the height direction of the cold plate placement body 2. The top of the support member 3 is provided with a connecting column, which is connected to the connecting holes at different height positions, thereby realizing the adjustment of the tilt angle of the support member 3, and thus realizing the adjustment of the rotation angle of the cold plate placement body 2 and the effective and stable support of the support member 3 for the cold plate placement body 2.

[0106] In other embodiments, the support member 3 can also be a support rod. When it is necessary to support the cold plate placement body 2, the support rod is placed between the cold plate placement body 2 and the base 1. The top end of the support rod abuts against the side of the cold plate placement body 2 away from the cold plate 5, and the bottom end of the support rod abuts against the top surface of the base 1.

[0107] Furthermore, a positioning recess capable of accommodating the bottom end of the support rod can be provided on the base 1 to improve the stability of the bottom end of the support rod relative to the base 1. Specifically, multiple positioning recesses can be provided, arranged sequentially along the direction away from the rotatable connection between the cold plate placement body 2 and the base 1.

[0108] Alternatively, the support member 3 may not be placed between the cold plate placement body 2 and the base 1. For example, the support member 3 may be placed between the cold plate placement body 2 and the rotating shaft 11. When the cold plate placement body 2 rotates to a preset angle, the support member 3 will position the cold plate placement body 2 to limit its continued rotation.

[0109] Combination Figure 7 and Figure 9 As shown, in some embodiments, the side of the cold plate placement body 2 facing the base 1 has a receiving cavity 23, which is used to store the support member 3 when the cold plate placement body 2 is rotated to abut against the base 1.

[0110] When the maintenance device is not in use, the cold plate holder 2 can be rotated to rest against the base 1. At this time, the support 3 can be located in the accommodating cavity 23, which not only further saves storage space, but also avoids the loss of the support 3 to a certain extent, and makes it convenient to carry or move the maintenance device.

[0111] Reference Figures 3 to 7 As shown, in some embodiments, the chip maintenance device further includes a locking member 4 for locking the cold plate 5 onto the cold plate placement body 2.

[0112] By using locking element 4 to constrain the cold plate 5, the stability of the cold plate 5 on the cold plate placement body 2 is further improved, preventing the cold plate 5 from tipping over and damaging the components on the board inside the chassis 100, or contaminating the thermal paste on the outer surface of the chip 300.

[0113] In some embodiments, the locking member 4 is rotatably connected to the cold plate placement body 2. The locking member 4 can be rotated to a first position and a second position. In the first position, the locking member 4 is used to fix the cold plate 5 on the placement area 20; in the second position, the locking member 4 is used to release the fixation of the cold plate 5. This improves the flexibility and convenience of using the locking member 4.

[0114] Continue to refer to Figures 3 to 7 As shown, the locking element 4 is located at one end of the cold plate placement area 20 away from the rotatable connection between the cold plate placement area 20 and the base 1.

[0115] This allows the cold plate 5 to be constrained at least from the end away from the chip 300 after it is flipped over. This not only makes the operation convenient, but also ensures that when the cold plate 5 tends to tilt towards the chip 300, this setting can constrain that end of the cold plate 5 in a timely and effective manner, thus preventing the cold plate 5 from tilting.

[0116] Reference Figure 3 and Figure 6 As shown, the locking element 4 can specifically be a U-shaped element. Both ends of the U-shaped element are rotatably connected to the cold plate placement body 2. The U-shaped element can be flipped downwards to the placement area 20, i.e., the locking element 4 is in the first position, constraining the cold plate 5; or it can be flipped upwards to the outer periphery of the placement area 20, i.e., the locking element 4 is in the second position, releasing the constraint on the cold plate 5. By setting the locking element 4 as a U-shaped element, the positioning effect of the locking element 4 on the cold plate 5 is improved.

[0117] Of course, in other embodiments, the locking member 4 can also be an L-shaped member, one end of which is rotatably connected to the cold plate placement body 2. The locking member 4 can be flipped up and down or left and right, both of which can achieve the constraint on or release the constraint on the cold plate 5.

[0118] In other implementations, the locking element 4 can also be located in the middle or other areas of the cold plate placement body 2.

[0119] In some embodiments, the cold plate placement body 2 is provided with a support positioning part 24, which is used to support and position the locking member 4 when the locking member 4 is rotated to the first position.

[0120] This design improves the stability of the locking component 4 itself, thereby enhancing the constraint effect of the locking component 4 on the cold plate 5, and further improving the stability of the cold plate 5.

[0121] Reference Figures 3 to 7 As shown, the support positioning part 24 can specifically be a support step provided on the side wall 22 of the cold plate placement body 2. In other implementations, the support positioning part 24 can also be a support protrusion provided on the cold plate placement body 2.

[0122] In addition, in other embodiments, the locking member 4 can also be a strap, cable tie, Velcro strap, etc., which can be used to bind the cold plate 5 to the cold plate placement body 2 after the cold plate 5 is flipped onto the placement area 20, so as to prevent the cold plate 5 from tipping over.

[0123] Reference Figure 2 , Figures 10 to 12 As shown, in some embodiments, the base 1 is provided with a first engaging part 13, which is used to match and engage with a second engaging part 102 on the chassis 100 to position the base 1 at a preset placement position on the chassis 100.

[0124] Specifically, the second engaging part 102 can be set on the edge of the housing 101.

[0125] By setting the first engaging part 13 and the second engaging part 102, the stability of the base 1 relative to the chassis 100 is improved, thereby improving the stability of the entire maintenance device on the chassis 100, ensuring the effective support of the maintenance device for the cold plate 5, and providing a guarantee for the normal and efficient maintenance of the chip 300.

[0126] In some embodiments, the base 1 may include a main body wall 14 and a retaining edge 15 extending from the edge of the main body wall 14 toward a direction away from the cold plate placement body 2. When the base 1 is placed on the chassis 100, the retaining edge 15 surrounds the periphery of the chassis 100; a first engaging portion 13 is provided on the side of the retaining edge 15 facing the chassis 100.

[0127] By setting the baffle 15, which cooperates with the outer perimeter of the chassis 100, the base 1 can be positioned to a certain extent. That is, the baffle 15 and the first engaging part 13 cooperate to achieve a dual positioning effect on the base 1, further improving the stability of the entire maintenance device on the chassis 100.

[0128] In some embodiments, refer to Figure 12 As shown, the first engaging portion 13 includes a latching protrusion, which can be, for example, an I-shaped latching protrusion. (See reference...) Figure 2 As shown, the second engaging portion 102 includes a slot provided on the chassis 100 into which a card protrusion can extend and engage. This makes it convenient to engage and disengage between the base 1 and the chassis 100.

[0129] Of course, in other implementations, the first engaging part 13 can also be a card slot, and the second engaging part 102 can be a card protrusion.

[0130] The above description is merely an embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of disclosure in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

[0131] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A chip maintenance device, wherein the surface of the chip has a cold plate in heat exchange contact with the chip, characterized in that, The chip maintenance device includes a base and one or more cold plate placement bodies; The base is used to place the chip at a predetermined placement position on the chassis where the chip is located; The cold plate placement body is disposed on the base and can rotate relative to the base. The cold plate placement body has a placement area for supporting the cold plate after it is flipped away from the chip.

2. The chip maintenance device according to claim 1, characterized in that, The cold plate holder rotates about an axis and can move axially along the axis, which is parallel to the width direction of the base.

3. The chip maintenance device according to claim 2, characterized in that, The axis is the axis of the rotating shaft provided on the base, and one end of the cold plate placement body is rotatably connected to the rotating shaft.

4. The chip maintenance device according to any one of claims 1 to 3, characterized in that, The chip maintenance device also includes a support component; The support member is used to position the cold plate placement body when it rotates to a preset angle.

5. The chip maintenance device according to claim 4, characterized in that, The support member is disposed between the cold plate placement body and the base; One end of the support member is rotatably connected to one of the cold plate placement body and the base, and the other end of the support member is used to connect to the other of the cold plate placement body and the base, and the connection position of the other end of the support member on the other of the cold plate placement body and the base is adjustable.

6. The chip maintenance device according to claim 5, characterized in that, The other end of the support member is provided with a first connecting part, and the other of the cold plate placement body and the base is provided with at least two second connecting parts, which are arranged at intervals along the direction away from the rotational connection between the cold plate placement body and the base.

7. The chip maintenance device according to claim 4, characterized in that, The side of the cold plate holder facing the base has a receiving cavity, which is used to store the support member when the cold plate holder is rotated to rest against the base.

8. The chip maintenance device according to any one of claims 1 to 3, characterized in that, The chip maintenance device also includes a locking element for locking the cold plate onto the cold plate holder.

9. The chip maintenance device according to claim 8, characterized in that, The locking member is rotatably connected to the cold plate placement body. The locking member can be rotated to a first position and a second position. In the first position, the locking member is used to fix the cold plate on the placement area; in the second position, the locking member is used to release the fixation of the cold plate.

10. The chip maintenance device according to claim 9, characterized in that, The locking element is located at one end of the cold plate placement body away from the rotatable connection point between the cold plate placement body and the base; And / or, the cold plate placement body is provided with a support and positioning part, which is used to support and position the locking member when the locking member is rotated to the first position.

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