Heat dissipation system, heat dissipation control system and electronic device

Abstract

The application discloses a heat dissipation system, a heat dissipation control system and electronic equipment, and relates to the technical field of heat dissipation. The heat dissipation system comprises a first heat dissipation assembly, a second heat dissipation assembly, an inlet pipe, an outlet pipe and a control valve. The first heat dissipation assembly is arranged correspondingly to a first heat generating unit to perform liquid cooling heat dissipation on the first heat generating unit. The second heat dissipation assembly is arranged correspondingly to a second heat generating unit to perform heat dissipation on the second heat generating unit. The inlet pipe and the outlet pipe are respectively connected to a first inlet and a first outlet of the first heat dissipation assembly to supply refrigerant to the first heat dissipation assembly. The auxiliary liquid cooling pipe is in contact with the second heat dissipation assembly, and two ends of the auxiliary liquid cooling pipe are respectively connected to a second outlet and a second inlet of the first heat dissipation assembly. The control valve is arranged on the auxiliary liquid cooling pipe. The heat dissipation strategy of the electronic equipment such as the ultra-high-density AI server, the switch and the storage device in the prior art has obvious defects in the heat dissipation efficiency. The technical effect of significantly improving the heat dissipation efficiency of the electronic equipment while reducing the energy consumption and the noise is achieved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation system, a heat dissipation control system, and electronic equipment. Background Technology

[0002] Currently, ultra-high-density AI servers, switches, and storage devices serve as the cornerstone of artificial intelligence technology development. Their designs highly integrate numerous high-performance computing units, such as GPU clusters and high-speed storage controllers, to meet the demands of deep learning training and large-scale data processing. However, this integrated design also presents heat dissipation challenges. The surge in heat flux density makes heat dissipation a critical factor in ensuring the performance and lifespan of electronic devices. Traditional heat dissipation technologies are mainly divided into two categories: air cooling and liquid cooling, each with its own advantages and disadvantages.

[0003] Specifically, current cooling technologies have the following significant shortcomings when addressing the cooling needs of ultra-high-density AI servers, switches, and storage devices: For ultra-high-density servers, the low thermal conductivity of air makes it inefficient at dissipating heat in concentrated high-heat areas, making it difficult to meet the cooling requirements of high-performance computing units, especially when GPU clusters and CPUs are running at full load simultaneously; although liquid cooling can provide an efficient thermal management system, its high cost and relatively fixed cooling pipe layout limit its widespread application in practical deployments. Therefore, the cooling strategies for ultra-high-density AI servers, switches, and storage devices in related technologies have significant shortcomings in terms of cooling efficiency, flexibility, cost-effectiveness, and energy efficiency optimization. Utility Model Content

[0004] This application provides a heat dissipation system, a heat dissipation control system, and an electronic device to at least solve the problem that the heat dissipation strategies of electronic devices such as ultra-high density AI servers, switches, and storage devices in the related art have significant deficiencies in heat dissipation efficiency.

[0005] This application provides a heat dissipation system, comprising: a first heat dissipation component, corresponding to a first heat-generating unit, for liquid cooling of the first heat-generating unit; a second heat dissipation component, corresponding to a second heat-generating unit, for dissipating heat from the second heat-generating unit; an inlet pipe and an outlet pipe, respectively connected to a first inlet and a first outlet of the first heat dissipation component, for supplying refrigerant to the first heat dissipation component; an auxiliary liquid cooling pipe, in contact with the second heat dissipation module, the two ends of the auxiliary liquid cooling pipe being respectively connected to a second outlet and a second inlet of the first heat dissipation component; and a control valve, disposed on the auxiliary liquid cooling pipe, for controlling the on / off state of the auxiliary liquid cooling pipe.

[0006] Furthermore, the second heat dissipation component includes a first heat dissipation unit and a second heat dissipation unit, with the first heat dissipation unit and the second heat dissipation unit being disposed correspondingly to each other, and the second heat dissipation unit being disposed toward the first heat dissipation unit and the second heat dissipation unit.

[0007] Furthermore, the first heat dissipation unit includes an air-cooled radiator that contacts the second heat-generating unit; the second heat dissipation unit includes a fan module whose air outlet is positioned toward the air-cooled radiator and the second heat-generating unit.

[0008] Furthermore, the air-cooled radiator includes a mounting plate and a plurality of heat sinks spaced apart on the mounting plate, the mounting plate being used to contact the second heat-generating unit; and / or, a fan module is located between the first heat-generating component and the air-cooled radiator.

[0009] Furthermore, the heat dissipation system includes two control valves, which are respectively located at both ends of the auxiliary liquid cooling pipe.

[0010] Furthermore, the heat dissipation system also includes a liquid supply tank and a liquid pump. The outlet and inlet of the liquid supply tank are connected to the inlet pipe and the outlet pipe, respectively. The liquid pump is installed on the connecting pipe between the outlet of the liquid supply tank and the inlet pipe to control the flow rate of the refrigerant from the liquid supply tank to the inlet pipe.

[0011] This application provides a heat dissipation control system applicable to the aforementioned heat dissipation system. The heat dissipation control system includes: a controller, which is electrically connected to a second heat dissipation unit of a second heat dissipation assembly and a control valve disposed on an auxiliary liquid cooling pipe, to control the operating state of the second heat dissipation unit and the control valve; the heat dissipation control system further includes: a first temperature sensor, which is disposed on the second heat dissipation unit and electrically connected to the controller, for detecting first real-time temperature information of the second heat dissipation unit and transmitting the first real-time temperature information to the controller, so that the controller controls the operating state of at least one of the second heat dissipation unit and the control valve according to the first real-time temperature information.

[0012] Furthermore, the heat dissipation control system also includes: a first power consumption sensor, which is disposed on the second heat-generating unit and electrically connected to the controller, for detecting first real-time power consumption information of the second heat-generating unit and transmitting the first real-time power consumption information to the controller, so that the controller controls the working state of at least one of the second heat dissipation unit and the control valve according to the first real-time power consumption information.

[0013] Furthermore, the controller is electrically connected to a liquid pump in the heat dissipation control system for controlling the flow rate of refrigerant to the inlet pipe; the heat dissipation control system further includes: a second temperature sensor, which is disposed on the first heating unit and electrically connected to the controller, for detecting second real-time temperature information of the first heating unit and transmitting the second real-time temperature information to the controller, so that the controller controls the operating state of the liquid pump according to the second real-time temperature information; and / or, a second power consumption sensor, which is disposed on the second heating unit and electrically connected to the controller, for detecting second real-time power consumption information of the second heating unit and transmitting the second real-time power consumption information to the controller, so that the controller controls the operating state of the liquid pump according to the second real-time power consumption information.

[0014] This application also provides an electronic device, including a chassis and a first heating unit and a second heating unit disposed within the chassis. The electronic device also includes the aforementioned heat dissipation system, at least partially disposed within the chassis, to dissipate heat from at least the first heating unit and the second heating unit.

[0015] This application provides a heat dissipation system, comprising: a first heat dissipation component, corresponding to a first heat-generating unit, for liquid cooling of the first heat-generating unit; a second heat dissipation component, corresponding to a second heat-generating unit, for dissipating heat from the second heat-generating unit; an inlet pipe and an outlet pipe, respectively connected to a first inlet and a first outlet of the first heat dissipation component, for supplying refrigerant to the first heat dissipation component; an auxiliary liquid cooling pipe, in contact with the second heat dissipation module, the two ends of the auxiliary liquid cooling pipe being respectively connected to a second outlet and a second inlet of the first heat dissipation component; and a control valve, disposed on the auxiliary liquid cooling pipe, for controlling the on / off state of the auxiliary liquid cooling pipe. Therefore, the heat dissipation system of this application dissipates heat from the first heat-generating unit and the second heat-generating unit respectively by using a first heat dissipation component and a second heat dissipation component. The first heat dissipation component utilizes the high thermal conductivity of the coolant to effectively reduce the heat generated by the first heat-generating unit under high load operation, avoiding local hot spot effects. The second heat dissipation component targets the second heat-generating unit and other heat-generating components to achieve efficient air cooling. The inlet and outlet pipes ensure the reciprocating circulation of the coolant. The auxiliary liquid cooling pipe can selectively assist the second heat dissipation component in heat dissipation under the adjustment of the control valve, so as to intelligently adjust the flow direction of the coolant to remove some of the heat from the second heat-generating unit and other heat-generating components under extreme loads, thereby achieving dynamic heat balance and intelligent thermal management of the server. This solves the problem that the heat dissipation strategies of ultra-high density AI servers, switches, and storage devices in related technologies have significant deficiencies in heat dissipation efficiency, achieving the technical effect of significantly improving the heat dissipation efficiency of electronic devices, reducing the operating temperature of electronic devices, reducing energy consumption and noise, and ensuring the stable operation of electronic devices. Attached Figure Description

[0016] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a heat dissipation system provided in an embodiment of this application;

[0018] Figure 2 for Figure 1 A schematic diagram of part of the heat dissipation system shown;

[0019] Figure 3 This is a schematic diagram of a heat dissipation control system provided in an embodiment of this application.

[0020] The above figures include the following reference numerals:

[0021] 1. First heat dissipation component; 2. Second heat dissipation component; 21. First heat dissipation unit; 22. Second heat dissipation unit; 4. Liquid inlet pipe; 5. Liquid outlet pipe; 6. Auxiliary liquid cooling pipe; 7. Control valve; 8. Liquid pump; 9. Controller; 10. First temperature sensor; 11. First power consumption sensor; 12. Second temperature sensor; 13. Second power consumption sensor; 100. Chassis; 200. Electronic equipment. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0023] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, where the range of similarity is within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the errors associated with the measurement of a particular quantity, i.e., the limitations of the measurement system. For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0024] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] like Figure 1 and Figure 2 As shown, this application provides a heat dissipation system, including: a first heat dissipation component 1, corresponding to a first heating unit, for liquid cooling of the first heating unit; a second heat dissipation component 2, corresponding to a second heating unit, for dissipating heat from the second heating unit; an inlet pipe 4 and an outlet pipe 5, respectively connected to a first inlet and a first outlet of the first heat dissipation component 1, for supplying refrigerant to the first heat dissipation component 1; an auxiliary liquid cooling pipe 6, in contact with the second heat dissipation component 2, with both ends of the auxiliary liquid cooling pipe 6 connected to a second outlet and a second inlet of the first heat dissipation component 1, respectively; and a control valve 7, disposed on the auxiliary liquid cooling pipe 6, for controlling the on / off state of the auxiliary liquid cooling pipe 6.

[0026] In this way, the heat dissipation system of this application dissipates heat to the first heat-generating unit and the second heat-generating unit respectively by means of the first heat dissipation component 1 and the second heat dissipation component 2. The first heat dissipation component 1 utilizes the high thermal conductivity of the coolant to effectively reduce the heat generated by the first heat-generating unit under high load operation and avoid local hot spot effect. The second heat dissipation component 2 targets the second heat-generating unit and other heat-generating components to achieve efficient air cooling. The inlet pipe 4 and the outlet pipe 5 ensure the reciprocating circulation of the coolant. The auxiliary liquid cooling pipe 6 can selectively assist the second heat dissipation component 2 in heat dissipation under the adjustment of the control valve 7, so as to remove some of the heat from the second heat-generating unit and other heat-generating components under extreme load, thereby achieving dynamic heat balance and intelligent thermal management of the server. This solves the problem that the heat dissipation strategies of ultra-high density AI servers, switches and storage devices and other electronic devices in related technologies have obvious deficiencies in heat dissipation efficiency, thereby significantly improving the heat dissipation efficiency of electronic devices, reducing the operating temperature of electronic devices, reducing energy consumption and noise, and ensuring the stable operation of electronic devices.

[0027] The first heating unit and the second heating unit, as well as the first heat dissipation component 1, the second heat dissipation component 2 and the auxiliary liquid cooling pipe 6 are all installed inside the server chassis 100. The ends of the inlet pipe 4 and the outlet pipe 5 that are away from the first heat dissipation component 1 extend outside the chassis 100. The first heating unit is a graphics processing unit (GPU) and the second heating unit is a central processing unit (CPU). Other heating components inside the chassis 100 may also include a VRM, namely a voltage regulator module, also called a "voltage regulation module" or "power management module".

[0028] like Figure 1 As shown, the second heat dissipation component 2 includes a first heat dissipation unit 21 and a second heat dissipation unit 22. The first heat dissipation unit 21 is correspondingly arranged with the second heat dissipation unit, and the air outlet of the second heat dissipation unit 22 faces the first heat dissipation unit 21 and the second heat dissipation unit.

[0029] In this application, the first heat dissipation unit 21 includes an air-cooled radiator that is in contact with the second heat-generating unit; the second heat dissipation unit 22 includes a fan module whose air outlet is directed toward the air-cooled radiator and the second heat-generating unit.

[0030] The air-cooled heatsink of this application directly contacts the second heat-generating unit, thereby increasing the heat dissipation area and improving the heat dissipation efficiency of the second heat-generating unit. The fan module, through a directional airflow channel, concentrates the cooling airflow onto the air-cooled heatsink and the second heat-generating unit, ensuring precise airflow direction, accelerating the heat dissipation speed of the air-cooled heatsink and the second heat-generating unit, improving the efficiency of air cooling, effectively reducing the temperature of the second heat-generating unit, and preventing performance degradation and hardware damage caused by overheating.

[0031] In addition, the heat dissipation system of this application can further improve the efficiency of air cooling by optimizing the layout of the second heat dissipation unit, thus solving the heat dissipation problem of the second heat-generating unit under different loads.

[0032] Specifically, the air-cooled radiator includes a mounting plate and a plurality of heat sinks spaced apart on the mounting plate, the mounting plate being used to contact the second heat-generating unit; and / or, a fan module is located between the first heat dissipation assembly 1 and the air-cooled radiator.

[0033] In the heat dissipation system of this application, the mounting plate of the air-cooled radiator is in direct contact with the second heat-generating unit. The multiple heat sinks on the plate increase the contact area between the air-cooled radiator and the air, improving the heat exchange efficiency between the air-cooled radiator and the air. The fan module is located between the first heat dissipation component 1 and the air-cooled radiator, ensuring concentrated airflow and isolation from the first heat dissipation component 1. This ensures precise airflow guidance, avoids wasted airflow, significantly improves the heat dissipation effect of the second heat-generating unit, and reduces interference with the first heat dissipation component 1, thereby improving the overall heat dissipation efficiency of the heat dissipation system. Furthermore, the heat dissipation system of this application can further improve heat exchange efficiency by optimizing the shape or material and number of heat sinks, or by adopting a more efficient fan design, to improve the air-cooling performance and solve the heat dissipation problem of the second heat-generating unit under high load.

[0034] like Figure 2 As shown, the heat dissipation system includes two control valves 7, which are respectively located at both ends of the auxiliary liquid cooling pipe 6.

[0035] In the heat dissipation system of this application, by setting two control valves 7 at both ends of the auxiliary liquid cooling pipe 6, more precise flow control is provided for the auxiliary liquid cooling pipe 6, ensuring the flow regulation of coolant in the auxiliary liquid cooling pipe 6; the control valves 7 adjust their opening to control whether coolant is introduced into the auxiliary liquid cooling pipe 6 and to control the flow rate of coolant flowing into the auxiliary liquid cooling pipe 6, realizing intelligent response to the heat dissipation needs of the second heat-generating unit, ensuring intelligent distribution of heat inside the server, and improving the flexibility and efficiency of the heat dissipation system.

[0036] The control valve 7 of the heat dissipation system in this application can be of various types, as long as it can meet the requirements of precise control of liquid flow rate and circulation status. The following are some possible options:

[0037] Solenoid valve: This is one of the most common choices. Solenoid valves can control the opening and closing of the valve by energizing or de-energizing an electromagnetic coil. They have a fast response speed and high precision, making them suitable for applications that require rapid response and precise control.

[0038] Electric ball valve: The electric ball valve controls the opening and closing of the flow path by rotating the ball driven by a motor. It has good sealing performance and a long service life and is suitable for occasions that require frequent flow adjustment.

[0039] Electric butterfly valve: Similar to electric ball valve, electric butterfly valve controls the flow of coolant by rotating the butterfly plate driven by a motor. It has a compact structure, opens and closes quickly, and is suitable for applications where flow control requirements are not particularly stringent.

[0040] Proportional valve: A proportional valve is a type of valve capable of continuous regulation. It changes its opening degree according to the magnitude of the input signal, thereby achieving fine regulation of flow rate. These valves typically offer high control accuracy and are suitable for intelligent cooling systems that require real-time adjustment of coolant flow based on temperature and power consumption.

[0041] Servo control valve: This is an advanced control valve that achieves precise control through a servo mechanism. It can not only control opening and closing, but also perform fine-tuning. It is suitable for high-end heat dissipation control systems that require a high degree of automation and precise control.

[0042] When making a specific selection, factors such as valve response speed, control accuracy, corrosion resistance, working pressure range, ease of maintenance, and operating costs should be considered.

[0043] The heat dissipation system of this application also includes a liquid supply tank and a liquid pump 8. The outlet and inlet of the liquid supply tank are connected to the liquid inlet pipe 4 and the liquid outlet pipe 5, respectively. The liquid pump 8 is installed on the connecting pipe between the outlet of the liquid supply tank and the liquid inlet pipe 4 to control the flow rate of the refrigerant flowing from the liquid supply tank to the liquid inlet pipe 4.

[0044] The cooling system of this application, by setting up a liquid supply tank and a liquid pump 8 located outside the chassis 100, ensures an adequate supply and circulation of coolant, thereby improving the stability and efficiency of the liquid cooling system. In principle, the liquid pump 8 ensures the circulation of coolant within the first heat dissipation component 1 by controlling the coolant flow rate, while the liquid supply tank provides storage and replenishment of coolant. In terms of effectiveness, the technical solution in this embodiment ensures continuous operation of the liquid cooling system, improves heat dissipation efficiency, and reduces coolant consumption.

[0045] The heat dissipation system of this application may also be equipped with a condenser, which is located on the connecting pipe between the inlet of the liquid supply tank and the outlet pipe 5, so as to cool the coolant flowing out of the outlet pipe 5 and realize the recycling of the coolant.

[0046] Specifically, the key function of the condenser is to release the heat from the coolant flowing out of the server, ensuring that the coolant returns to a lower temperature so that it can be recirculated to the first heat dissipation component 1 within the server for heat absorption, maintaining the continuous and efficient operation of the entire cooling system. The condenser is typically located on the connecting pipe between the inlet and outlet pipe 5 of the coolant supply tank. It ensures that the coolant, after absorbing heat, is cooled by the condenser before returning to the supply tank. Its internal structure includes numerous heat exchange tubes or fins, achieving efficient heat exchange through natural or forced convection with an additional fan. This rapidly dissipates heat from the coolant, achieving coolant cooling. This not only realizes the recycling of coolant, reducing cooling resource consumption and operating costs, but also significantly improves the heat dissipation efficiency under high server load conditions, offering advantages in environmental protection and energy saving. Simultaneously, the efficient heat exchange reduces energy consumption, helps maintain the coolant temperature within a stable range, avoids the impact of temperature fluctuations on the cooling system, ensures stable server operation, and extends the server's lifespan.

[0047] like Figure 3 As shown, this application provides a heat dissipation control system applicable to the aforementioned heat dissipation system. The heat dissipation control system includes: a controller 9, which is electrically connected to both the second heat dissipation unit 22 and the control valve 7 of the second heat dissipation assembly 2 to control the operating state of the second heat dissipation unit 22 and the control valve 7; and a first temperature sensor 10, which is disposed on the second heat dissipation unit and electrically connected to the controller 9 to detect first real-time temperature information of the second heat dissipation unit and transmit the first real-time temperature information to the controller 9, so that the controller 9 controls the operating state of at least one of the second heat dissipation unit 22 and the control valve 7 according to the first real-time temperature information.

[0048] The heat dissipation control system of this application realizes real-time detection of the temperature of the second heat-generating unit in the server through the combination of controller 9 and first temperature sensor 10. Controller 9 dynamically adjusts the working state of the second heat dissipation unit 22 and control valve 7 according to the first real-time temperature information fed back by the first temperature sensor 10, realizing precise heat dissipation of the second heat-generating unit, which can significantly reduce the energy consumption of the server, while improving the response speed and accuracy of the heat dissipation control system and ensuring the stable operation of the server.

[0049] Specifically, controller 9 is an intelligent DSP module. Its task is to process and analyze information from the first temperature sensor 10 and other sensors in real time. Through its built-in intelligent algorithm, it accurately identifies and judges the temperature changes and trends inside the server, thereby dynamically adjusting the working status of key components such as the second heat dissipation unit 22 and the control valve 7. This intelligent adjustment enables the heat dissipation control system to respond precisely on demand. That is, when the temperature rises, it automatically increases the speed of the second heat dissipation unit 22 or opens the control valve 7; conversely, it decreases the speed of the second heat dissipation unit 22 or closes the control valve 7, so as to ensure the stable operation of the server while maximizing energy saving. In addition, the algorithm of the intelligent DSP module can not only respond instantly, but also predict temperature change trends and perform heat dissipation pre-adjustment in advance, avoiding potential damage to server hardware caused by sudden temperature increases, ensuring the stable operation of the system and the continuous high efficiency of computing power, significantly improving the flexibility and energy efficiency of the heat dissipation control system, and providing strong technical support for the stable operation of ultra-high-density AI servers.

[0050] In the heat dissipation control system of this application, the first temperature sensor 10 is used to monitor the temperature of the second heat-generating unit. In practical applications, the first temperature sensor 10 can be implemented using various types of sensors, including but not limited to:

[0051] Thermistors: A thermistor is a resistor whose resistance changes with temperature. They are commonly used for temperature measurement and compensation. They are characterized by low cost and fast response, making them suitable for real-time temperature monitoring.

[0052] A thermocouple is a sensor that measures temperature differences. It consists of two different metal wires that generate a voltage when a temperature difference exists between their ends. Thermocouples offer advantages such as a wide temperature measurement range, high accuracy, and fast response, making them suitable for applications requiring precise temperature readings.

[0053] Non-contact infrared sensors: Infrared sensors can detect infrared radiation emitted by objects and measure temperature without physical contact. These sensors are suitable for situations where direct contact measurement is difficult, such as environments with densely packed server components, where non-contact infrared sensors can provide a flexible means of temperature monitoring.

[0054] Platinum Resistance Temperature Detector (RTD): A platinum RTD is a temperature sensor that works based on the principle that resistance changes with temperature. It has high accuracy and stability and is suitable for applications that require stable temperature monitoring over a long period of time.

[0055] Semiconductor temperature sensors: These sensors utilize the properties of semiconductor materials, such as NTC (negative temperature coefficient) or PTC (positive temperature coefficient) resistors, whose resistance changes with temperature, enabling fast and accurate temperature measurement.

[0056] Fiber optic temperature sensors: These sensors utilize the light transmission characteristics of optical fibers to detect temperature changes, determining the temperature by measuring the variations in light transmission characteristics at different temperatures. These sensors offer advantages such as resistance to electromagnetic interference and long-distance transmission, making them suitable for temperature monitoring in the complex electromagnetic environments inside servers.

[0057] When selecting a specific temperature sensor type, it is necessary to comprehensively consider measurement accuracy, response time, cost, ease of installation, and suitability for specific environmental conditions, such as electromagnetic compatibility and corrosion resistance, to ensure that the heat dissipation control system can make the most appropriate heat dissipation strategy based on real-time temperature information, thereby ensuring the stable operation and energy efficiency of the server.

[0058] like Figure 3 As shown, the heat dissipation control system includes: a first power consumption sensor 11, which is disposed on the second heat-generating unit and electrically connected to the controller 9, for detecting the first real-time power consumption information of the second heat-generating unit and transmitting the first real-time power consumption information to the controller 9, so that the controller 9 controls the working state of at least one of the second heat dissipation component 2 and the control valve 7 according to the first real-time power consumption information.

[0059] The heat dissipation control system of this application provides real-time detection of the power consumption of the second heat-generating unit by setting a first power consumption sensor 11, which provides a more comprehensive basis for heat dissipation control for the controller 9. The controller 9 intelligently adjusts the working state of the second heat dissipation unit 22 and the control valve 7 according to the first real-time power consumption information fed back by the first power consumption sensor 11 (which may also be combined with the first real-time temperature information), thereby achieving more precise heat dissipation control, further reducing the energy consumption of the server, and improving the intelligent adjustment capability of the heat dissipation control system, ensuring the stable operation of the server under high power consumption.

[0060] In the heat dissipation control system of this application, the first power consumption sensor 11 can be of various types, including but not limited to:

[0061] Current sensors: These indirectly measure power consumption by detecting the current flowing through the CPU power supply line. Common types of current sensors include Hall effect sensors, shunt resistor sensors, and current transformers.

[0062] Voltage sensor: Monitors the CPU's supply voltage and combines it with current information to calculate power consumption. Voltage sensors are often used in conjunction with current sensors for more accurate power consumption measurement.

[0063] Power factor sensor: In AC power supply systems, a power factor sensor can measure the relationship between the actual power consumption of the CPU and the apparent power (the product of voltage and current), helping to calculate the active power of the CPU more accurately.

[0064] Energy metering sensors: These sensors can directly measure the electrical energy consumed. They typically use digital interfaces to directly output power consumption values, facilitating data interaction with the controller.

[0065] Digital power sensor: A sensor that integrates current, voltage and power factor measurement functions, capable of directly outputting the CPU's real-time power consumption value. It typically has high accuracy and digital communication capabilities, facilitating information exchange with the controller of an intelligent cooling system.

[0066] Heat flow meter: It indirectly estimates power consumption by monitoring the heat flow of the CPU, and is suitable for situations where there is a clear relationship between CPU power consumption and heat flow. The heat flow meter can monitor the flow of heat energy, thereby calculating the heat released by the CPU and indirectly reflecting its power consumption.

[0067] Application-Specific Integrated Circuit (ASIC) sensors: These sensors are designed to meet the specific needs of CPUs or servers, integrating multiple measurement functions such as temperature, voltage, current, and power consumption to provide comprehensive monitoring information. These sensors typically feature high accuracy, low power consumption, and high integration, making them ideal for modern server monitoring systems.

[0068] When selecting the first power consumption sensor 11, the sensor's measurement range, accuracy, response time, communication interface type, and whether it can adapt to the internal working environment of the server (such as electromagnetic compatibility, thermal stability, and vibration resistance) should be considered to ensure that it can provide accurate and real-time power consumption data for the intelligent heat dissipation system, thereby achieving dynamic matching between chip power consumption and heat dissipation strategy, ensuring stable server operation and improving energy efficiency.

[0069] like Figure 3 As shown, the controller 9 is electrically connected to the liquid pump 8 in the heat dissipation control system, which controls the flow rate of the refrigerant to the liquid inlet pipe 4. The heat dissipation control system also includes a second temperature sensor 12, which is disposed in the first heating unit and electrically connected to the controller 9 to detect the second real-time temperature information of the first heating unit and transmit the second real-time temperature information to the controller 9 so that the controller 9 controls the working state of the liquid pump 8 according to the second real-time temperature information.

[0070] The heat dissipation control system of this application realizes real-time detection of the temperature of the first heat-generating unit through the combination of the second temperature sensor 12 and the controller 9. The controller 9 dynamically adjusts the working state of the liquid pump 8 according to the second real-time temperature information fed back by the second temperature sensor 12, so as to ensure that the liquid cooling heat dissipation requirements of the first heat-generating unit are met, which can significantly reduce the temperature of the first heat-generating unit, avoid local hot spot effect, and improve the intelligent adjustment capability of the heat dissipation control system, thus ensuring the stable operation of the server.

[0071] The second temperature sensor 12 can be selected from various types of the first temperature sensor 10 described above.

[0072] like Figure 3 As shown, the controller 9 is electrically connected to the liquid pump 8 in the heat dissipation control system, which is used to control the flow rate of the refrigerant to the liquid inlet pipe 4. The heat dissipation control system also includes a second power consumption sensor 13, which is disposed in the second heating unit and electrically connected to the controller 9, for detecting the second real-time power consumption information of the second heating unit and transmitting the second real-time power consumption information to the controller 9, so that the controller 9 controls the working state of the liquid pump 8 according to the second real-time power consumption information.

[0073] The heat dissipation control system of this application provides real-time detection of the power consumption of the first heat-generating unit by setting a second power consumption sensor 13, which provides a more comprehensive basis for heat dissipation control for the controller 9. The controller 9 intelligently adjusts the working state of the liquid pump 8 according to the second real-time power consumption information fed back by the second power consumption sensor 13 (which can also be combined with the second real-time temperature information), so as to achieve more precise liquid cooling heat dissipation control, further reduce the temperature of the first heat-generating unit, avoid local hot spot effect, and improve the intelligent adjustment capability of the heat dissipation control system, thus ensuring the stable operation of the server under high power consumption.

[0074] The second power consumption sensor 13 can be selected from various types of the first power consumption sensor 11 described above.

[0075] This application also provides an electronic device 200, including a chassis 100 and a first heating unit and a second heating unit disposed within the chassis 100. The electronic device 200 also includes the aforementioned heat dissipation system, at least partially disposed within the chassis 100, to dissipate heat from at least the first heating unit and the second heating unit.

[0076] Specifically, the electronic device 200 of this application also includes the aforementioned heat dissipation control system.

[0077] The electronic device 200 of this application integrates the aforementioned heat dissipation system, realizing efficient and intelligent heat dissipation management of the internal first and second heating units, etc. It can intelligently adjust the working state of the heat dissipation system according to the temperature and power consumption of the second and first heating units, achieve dynamic heat balance, significantly improve heat dissipation efficiency, reduce energy consumption and noise, and ensure stable operation under high load.

[0078] Specifically, the electronic device 200 of this application can be an ultra-high density AI server, with the first heat-generating unit being a graphics processing unit (GPU) and the second heat-generating unit being a central processing unit (CPU).

[0079] The working process of the electronic device 200 of this application is as follows:

[0080] When the electronic device 200 is running, the first temperature sensor 10 and the first power consumption sensor 11 monitor the first real-time temperature information and the first real-time power consumption information of the second heating unit in real time, and transmit the data to the controller 9. Simultaneously, the second temperature sensor 12 and the second power consumption sensor 13 monitor the second real-time temperature information and the second real-time power consumption information of the first heating unit, and also feed this information back to the controller 9. Based on this information, the controller 9 intelligently adjusts the rotation speed of the second heat dissipation unit 22, controls the opening and closing of the valve 7, and the flow rate of the liquid pump 8 to achieve precise heat dissipation for both the second and first heating units.

[0081] When the load on the second heat-generating unit increases, both the first real-time temperature information and the first real-time power consumption information reach the corresponding preset thresholds. The controller 9 will automatically adjust the second heat dissipation unit 22 to its maximum speed and open the control valve 7 (or simultaneously increase the flow rate of the liquid pump 8). This allows a portion of the heat transferred from the second heat-generating unit to the first heat dissipation unit 21 to pass through the coolant in the auxiliary liquid cooling pipe 6 and then be discharged outside the server after passing through the first heat dissipation component 1. When the load on the second heat-generating unit decreases, both the first real-time temperature information and the first real-time power consumption information are less than the corresponding preset thresholds. The controller 9 will then close the control valve 7 (or simultaneously reduce the flow rate of the liquid pump 8), and only the second heat dissipation unit 22 will be used for heat dissipation.

[0082] When the load on the first heating unit increases, the second real-time temperature information and the second real-time power consumption information both reach the corresponding preset thresholds. The controller 9 will then increase the flow rate of the liquid pump 8 to ensure that the liquid cooling heat dissipation requirements of the first heating unit are met. When the load on the first heating unit decreases, the second real-time temperature information and the second real-time power consumption information are both less than the corresponding preset thresholds. The controller 9 will then reduce the flow rate of the liquid pump 8 to avoid unnecessary energy consumption and noise.

[0083] The above provides a detailed description of a heat dissipation system, a heat dissipation control system, and an electronic device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat dissipation system, characterized in that, include: The first heat dissipation component (1) is configured corresponding to the first heat-generating unit to perform liquid cooling heat dissipation on the first heat-generating unit; The second heat dissipation component (2) is provided corresponding to the second heat-generating unit to dissipate heat from the second heat-generating unit; The liquid inlet pipe (4) and the liquid outlet pipe (5) are respectively connected to the first inlet and the first outlet of the first heat dissipation component (1) to supply refrigerant to the first heat dissipation component (1); An auxiliary liquid cooling pipe (6) is in contact with the second heat dissipation component (2), and the two ends of the auxiliary liquid cooling pipe (6) are respectively connected to the second outlet and the second inlet of the first heat dissipation component (1); A control valve (7) is provided on the auxiliary liquid cooling pipe (6) to control the opening and closing of the auxiliary liquid cooling pipe (6).

2. The heat dissipation system according to claim 1, characterized in that, The second heat dissipation component (2) It includes a first heat dissipation unit (21) and a second heat dissipation unit (22), wherein the first heat dissipation unit (21) The second heat dissipation unit (22) is disposed in relation to the second heat dissipation unit (21) and the second heat dissipation unit.

3. The heat dissipation system according to claim 2, characterized in that, The first heat dissipation unit (21) includes an air-cooled radiator, which is in contact with the second heat-generating unit; The second heat dissipation unit (22) includes a fan module, the air outlet of which is disposed facing the air-cooled heat sink and the second heat-generating unit.

4. The heat dissipation system according to claim 3, characterized in that, The air-cooled radiator includes a mounting plate and a plurality of heat sink fins spaced apart on the mounting plate. The mounting plate is used to contact the second heating unit; and / or, The fan module is located between the first heat dissipation component (1) and the air-cooled radiator.

5. The heat dissipation system according to claim 1, characterized in that, The heat dissipation system includes two control valves (7), which are respectively located at both ends of the auxiliary liquid cooling pipe (6).

6. The heat dissipation system according to claim 1, characterized in that, The heat dissipation system also includes a liquid supply tank and a liquid pump (8). The outlet and inlet of the liquid supply tank are connected to the liquid inlet pipe (4) and the liquid outlet pipe (5) respectively. The liquid pump (8) is installed on the connecting pipe between the outlet of the liquid supply tank and the liquid inlet pipe (4) to control the flow rate of the refrigerant from the liquid supply tank to the liquid inlet pipe (4).

7. A heat dissipation control system, characterized in that, A heat dissipation system applicable to any one of claims 1 to 6, the heat dissipation control system comprising: a controller (9), the controller (9) being electrically connected to the second heat dissipation unit (22) of the second heat dissipation assembly (2) and the control valve (7) disposed on the auxiliary liquid cooling pipe (6) to control the working state of the second heat dissipation unit (22) and the control valve (7); the heat dissipation control system further comprising: A first temperature sensor (10) is disposed on the second heating unit and electrically connected to the controller (9) for detecting the first real-time temperature information of the second heating unit and transmitting the first real-time temperature information to the controller (9) so that the controller (9) controls the working state of at least one of the second heat dissipation unit (22) and the control valve (7) according to the first real-time temperature information.

8. The heat dissipation control system according to claim 7, characterized in that, The heat dissipation control system also includes: A first power consumption sensor (11) is disposed on the second heating unit and electrically connected to the controller (9) to detect the first real-time power consumption information of the second heating unit and transmit the first real-time power consumption information to the controller (9) so that the controller (9) controls the working state of at least one of the second heat dissipation unit (22) and the control valve (7) according to the first real-time power consumption information.

9. The heat dissipation control system according to claim 7, characterized in that, The controller (9) is electrically connected to the liquid pump (8) in the heat dissipation control system, which controls the flow rate of the refrigerant to the inlet pipe (4); the heat dissipation control system further includes: A second temperature sensor (12) is disposed on the first heating unit and electrically connected to the controller (9) to detect the second real-time temperature information of the first heating unit and transmit the second real-time temperature information to the controller (9) so that the controller (9) controls the working state of the liquid pump (8) according to the second real-time temperature information; and / or, The second power consumption sensor (13) is disposed on the second heating unit and electrically connected to the controller (9) to detect the second real-time power consumption information of the second heating unit and transmit the second real-time power consumption information to the controller (9) so that the controller (9) controls the working state of the liquid pump (8) according to the second real-time power consumption information.

10. An electronic device, characterized in that, The electronic device includes a chassis (100) and a first heating unit and a second heating unit disposed within the chassis (100). The electronic device also includes a heat dissipation system according to any one of claims 1 to 6, wherein at least a portion of the heat dissipation system is disposed within the chassis (100) to dissipate heat from at least the first heating unit and the second heating unit.

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