A GPU cold plate sleeve

Abstract

The utility model relates to GPU heat dissipation technical field especially relates to a kind of GPU cold plate sleeve, including substrate and the GPU chip of being set on substrate, symmetric diagonal distribution substrate is provided with the flow passage one and flow passage two for guiding the directional flow of coolant, symmetric diagonal distribution flow passage one, flow passage two are respectively fixedly installed with the import interface and export interface for external liquid cooling pipe way.The utility model is by being provided with flow passage one and flow passage two, and combining the microchannel in the inside of substrate, constitute a complex coolant circulation path, can increase the contact area and heat exchange time of coolant and GPU chip, to quickly, efficiently carry away the huge heat generated when GPU runs, ensure that chip can also maintain stable working temperature under high load;Threaded rod, nut and cooperate buffer gasket and spring pressing piece structure, help to improve the firmness of substrate installation, while it can effectively buffer and absorb the vibration and stress that substrate can generate in transportation or operation.

Description

Technical Field

[0001] This utility model relates to the field of GPU heat dissipation technology, and in particular to a GPU cold plate sleeve. Background Technology

[0002] GPU cooler is a customized cooling accessory that fits the GPU core and is used to conduct heat to assist in heat dissipation.

[0003] Under current conditions, a common approach is to use a liquid cooling structure for graphics cards, such as the one disclosed in CN217404811U. This structure includes a liquid cooling plate, which comprises a cold head and a base plate, with the base plate connected to the graphics card. This reduces design and manufacturing costs and improves development efficiency, making it suitable for practical use. However, this liquid cooling structure relies solely on a single liquid cooling cavity for heat dissipation. The coolant flow path is simple, the contact area with the graphics card is limited, and the heat exchange time is short. This makes it difficult to handle the enormous heat generated by a high-load graphics card, potentially leading to overheating, frequency reduction, performance degradation, or even hardware damage. Furthermore, since the cold head is fixed to the base plate with bolts, the graphics card is susceptible to vibration and stress during transportation or operation, which can cause poor contact between the cold head and the chip, loosening, or even detachment, affecting heat dissipation and increasing the risk of hardware failure. Utility Model Content

[0004] The purpose of this invention is to solve the problems of insufficient heat dissipation efficiency of GPUs under high load and poor contact caused by vibration during transportation and operation in the prior art, and to propose a GPU cold plate sleeve.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A GPU cooling plate includes a substrate and a GPU chip disposed on the substrate. The substrate has a first flow channel and a second flow channel for guiding the directional flow of coolant. The first flow channel and the second flow channel are respectively fixedly installed with an inlet interface and an outlet interface for connecting external liquid cooling pipelines. The substrate has two threaded holes for connecting external devices. The substrate has a threaded rod with a spline groove at the upper end. A matching nut is threadedly connected to the threaded rod.

[0006] Preferably, the inlet port is vertically located at the upper end of the first flow channel, and the outlet port is horizontally located on one side of the second flow channel. Both the inlet port and the outlet port are fitted with anti-slip rings, and the anti-slip rings are tapered structures that are narrow at the top and wide at the bottom.

[0007] Preferably, the GPU chip and the substrate are tightly bonded together using a high-frequency induction welding process.

[0008] Preferably, a buffer pad for dispersing the fastening pressure is provided between the nut and the base plate, and the buffer pad is composed of an annular limiting piece and buffer straight pieces that are distributed circumferentially and extend inward.

[0009] Preferably, a spring for damping the substrate is sleeved on the threaded rod, and an annular pressure plate that moves against the substrate is welded to the lower end of the spring, and an abutment frame that moves against the top end of the threaded rod is welded to the upper end of the spring.

[0010] Preferably, the substrate has microchannels that are connected to flow channel one and flow channel two and are used for heat dissipation of the GPU chip, and the microchannels are arranged densely and evenly in a serpentine pattern inside the substrate.

[0011] Compared with the prior art, the present invention has the following advantages: 1. This utility model, by setting up flow channel one and flow channel two, and combining them with the microchannels inside the substrate, forms a complex coolant circulation path, which can increase the contact area and heat exchange time between the coolant and the GPU chip, thereby quickly and efficiently removing the huge amount of heat generated during GPU operation, ensuring that the chip can maintain a stable operating temperature even under high load.

[0012] 2. This utility model, through the use of threaded rods, nuts, and a combination of buffer pads and spring pressure plates, helps to improve the firmness of substrate installation. At the same time, it can effectively buffer and absorb the vibration and stress that may be generated during the transportation or operation of the substrate, preventing chip damage or poor contact caused by stress concentration or vibration, and helping to improve the safety and durability of the entire heat dissipation system. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of a GPU cold plate sleeve proposed in this utility model; Figure 2 This is a schematic diagram of the GPU chip in a GPU cold plate sleeve proposed in this utility model. Figure 3 This is a side view of the substrate of a GPU cold plate sleeve proposed in this utility model; Figure 4 This is a top view of the substrate of a GPU cold plate sleeve proposed in this utility model; Figure 5 This is an enlarged schematic diagram of part A of the GPU cold plate sleeve proposed in this utility model.

[0014] In the diagram: 1. Substrate; 2. Flow channel one; 3. Inlet interface; 4. Flow channel two; 5. Outlet interface; 6. GPU chip; 7. Threaded hole; 8. Threaded rod; 9. Spline groove; 10. Nut; 11. Buffer pad; 12. Spring; 13. Abutment frame; 14. Ring pressure plate. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0016] Reference Figures 1-5 A GPU cooling plate includes a substrate 1 and a GPU chip 6 disposed on the substrate 1. The substrate 1 is integrally formed from aluminum alloy with high thermal conductivity. The substrate 1 is provided with flow channels 1 2 and 2 4 for guiding the directional flow of coolant. Flow channels 1 2 and 2 4 are both formed on the surface of the substrate 1 by CNC machining, are symmetrically distributed diagonally and are connected to the internal cavity of the substrate 1. The inner wall of the flow channels is anodized to enhance corrosion resistance and reduce coolant flow resistance.

[0017] The inlet interface 3 and outlet interface 5 for external liquid cooling pipelines are fixedly installed on the flow channel 1 2 and flow channel 2 4 respectively. Two threaded holes 7 for external equipment are opened on the substrate 1. The two threaded holes 7 are symmetrically distributed on both sides of the edge of the substrate 1, and the hole diameter is precisely matched with the mounting hole of the external equipment.

[0018] A threaded rod 8 is provided on the substrate 1. The threaded rod 8 is made of high-strength alloy material. Its lower end passes through the preset mounting position of the substrate 1 and extends to the bottom of the substrate 1. A spline groove 9 is provided at the upper end of the threaded rod 8. The spline groove 9 is a regular hexagonal structure that is compatible with special fastening tools. It is easy to use tools to insert into the groove for precise fastening operations. A matching nut 10 is threadedly connected to the threaded rod 8.

[0019] The inlet port 3 is vertically located at the upper end of the first flow channel 2, and the outlet port 5 is horizontally located on one side of the second flow channel 4. Both the inlet port 3 and the outlet port 5 are fitted with anti-slip rings, which are tapered structures that are narrow at the top and wide at the bottom. The anti-slip rings can increase the friction with the external liquid cooling pipeline, prevent the pipeline from falling off, and at the same time help improve the sealing of the connection.

[0020] The GPU chip 6 and the substrate 1 are tightly bonded together by a high-frequency induction welding process. The high-frequency induction welding process ensures that heat is transferred without gaps and avoids heat conduction dead zones.

[0021] A buffer pad 11 is provided between the nut 10 and the substrate 1 to disperse the tightening pressure. The buffer pad 11 is composed of an annular limiting piece and buffer straight pieces that are distributed circumferentially and extend inward. The annular limiting piece is attached to the surface of the substrate 1, and the buffer straight pieces are made of elastic metal material, which can generate elastic deformation during the tightening process, effectively relieving the local pressure of the nut 10 on the substrate 1 and preventing the substrate 1 from deforming due to pressure concentration.

[0022] A spring 12 for damping the substrate 1 is sleeved on the threaded rod 8, and an annular pressure plate 14 that moves against the substrate 1 is welded to the lower end of the spring 12. The annular pressure plate 14 is made of wear-resistant rubber material wrapped around the metal substrate, which not only enhances the fit with the substrate 1, but also avoids wear on the surface of the substrate 1.

[0023] The upper end of the spring 12 is welded with a contact frame 13 that moves against the top end of the threaded rod 8. The contact frame 13 has a U-shaped structure, and the contact surface with the top end of the threaded rod 8 is polished to reduce relative friction.

[0024] The substrate 1 has microchannels that are connected to flow channels 1 and 2 and are used for heat dissipation of the GPU chip 6. The microchannels are densely and evenly arranged in a serpentine pattern inside the substrate 1. The microchannels start from the outlet of flow channel 1 and extend in a continuous S-shaped curve towards the inlet of flow channel 2. The spacing between adjacent channels is kept consistent to ensure the heat dissipation uniformity of each area of ​​the GPU chip 6 and avoid local overheating.

[0025] It should be noted that the specific model and specifications of the GPU chip 6 need to be selected and determined based on the actual specifications of the device. The specific selection and calculation method adopts existing technology in this field, so it will not be elaborated here.

[0026] The functional principle of this utility model can be explained through the following operational methods: Coolant is injected into flow channel 2 through inlet interface 3. Flow channel 2 guides the coolant to the microchannel inside substrate 1. The microchannel is in close contact with GPU chip 6. The heat generated by GPU chip 6 during operation is transferred to the coolant in the microchannel. After absorbing heat, the coolant flows into the flow channel 2 4 through the microchannel. During this process, the microchannel extends the contact time between the coolant and the GPU chip 6 through a complex path, fully removing heat. The heated coolant is finally discharged through the outlet interface 5, completing the heat dissipation cycle. During the installation of substrate 1, threaded rod 8 passes through the preset installation position of substrate 1 and is fastened by inserting a tool into spline groove 9, so that substrate 1 fits with external equipment. Buffer pad 11 between nut 10 and substrate 1 relieves the fastening pressure. When the cold plate sleeve vibrates during transportation or operation, the spring 12 on the threaded rod 8 undergoes elastic deformation. The annular pressure plate 14 at the lower end of the spring 12 moves against the substrate 1, and the contact bracket 13 at the upper end fits against the top end of the threaded rod 8. The expansion and contraction of the spring 12 buffers the vibration stress, preventing the GPU chip 6 from having poor contact or being damaged due to vibration.

[0027] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A GPU cold plate set, comprising a substrate (1) and a GPU chip (6) arranged on the substrate (1), characterized in that, The substrate (1) is provided with a flow channel 1 (2) and a flow channel 2 (4) for guiding the directional flow of coolant. The flow channel 1 (2) and the flow channel 2 (4) are respectively fixedly installed with an inlet interface (3) and an outlet interface (5) for connecting external liquid cooling pipelines. The substrate (1) has two threaded holes (7) for connecting external equipment. The substrate (1) is provided with a threaded rod (8). The upper end of the threaded rod (8) is provided with a spline groove (9). The threaded rod (8) is threaded with a matching nut (10).

2. The GPU cold plate sleeve of claim 1, wherein, The inlet interface (3) is vertically located at the upper end of the first flow channel (2), and the outlet interface (5) is horizontally located on one side of the second flow channel (4). Both the inlet interface (3) and the outlet interface (5) are fitted with anti-slip rings, and the anti-slip rings are tapered structures that are narrow at the top and wide at the bottom.

3. A GPU cold plate sleeve according to claim 1, characterized in that, The GPU chip (6) and the substrate (1) are tightly bonded together by a high-frequency induction welding process.

4. A GPU cold plate sleeve according to claim 1, characterized in that, A buffer pad (11) for dispersing the fastening pressure is provided between the nut (10) and the base plate (1), and the buffer pad (11) is composed of an annular limiting piece and buffer straight pieces that are distributed circumferentially and extend inward.

5. A GPU cold plate sleeve according to claim 1, characterized in that, The threaded rod (8) is fitted with a spring (12) for damping the substrate (1), and the lower end of the spring (12) is welded with an annular pressure plate (14) that moves against the substrate (1), and the upper end of the spring (12) is welded with an abutment frame (13) that moves against the top end of the threaded rod (8).

6. A GPU cold plate sleeve according to claim 1, characterized in that, The substrate (1) has microchannels that are connected to flow channel one (2) and flow channel two (4) and are used for heat dissipation of GPU chip (6). The microchannels are arranged in a dense and uniform serpentine pattern inside the substrate (1).

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