Welding structure of multi-line soft board and multi-line hard board and vehicle lamp module

CN224668991UActive Publication Date: 2026-08-21CHANGZHOU XINGYU AUTOMOTIVE LIGHTING SYST CO LTD
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Patent Information

Application Number
CN202522247968.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-24
Publication Date
2026-08-21
Estimated Expiration
2035-10-24

AI Technical Summary

Technical Problem

[0004]本实用新型要解决的技术问题是:为了解决现有技术中软板和硬板焊接结构复杂、成本高的技术问题,本实用新型提供一种多线路软板与多线路硬板的连接结构以及车灯模组,简化硬板和软板的焊接结构,便于装配焊接,提高焊接精度,降低成本

Benefits of technology

1、本实用新型多线路软板与多线路硬板的焊接结构以及车灯模组,硬板和软板准确定位,确保第一焊盘和第二焊盘对齐,满足多线路软板与多线路硬板焊接,确保焊接强度符合需求,第一焊盘上可以增加通孔,从而增加上锡量和焊接可靠性。

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Abstract

The utility model discloses a kind of welding structure of multi-line soft board and multi-line hard board, comprising: soft board, the soft board has the connecting portion connected with hard board, the connecting portion has a plurality of first solder pad;Hard board, the hard board has a plurality of second solder pad corresponding with first solder pad;Carrier, the carrier is used to place and position soft board and hard board;The soft board and hard board are fixedly connected by connecting portion, and first solder pad and second solder pad are aligned, the groove of the slot body containing solder paste is formed between the first solder pad and second solder pad.A kind of car lamp module, including the connecting structure of above-mentioned multi-line soft board and multi-line hard board.The utility model multi-line soft board and the connecting structure of multi-line hard board and car lamp module, simplify the welding structure of hard board and soft board, facilitate assembly welding, improve welding precision, reduce cost.
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Description

Technical Field

[0001] This utility model relates to the field of automotive lighting module technology, and in particular to a connection structure between a multi-circuit flexible circuit board and a multi-circuit rigid circuit board, as well as an automotive lighting module. Background Technology

[0002] Existing road-board vehicle light modules use flexible circuit boards for connection. The welding methods between multiple flexible boards are thermoforming or solder wire welding. In thermoforming or solder wire welding, solder wire is generally used to solder the pads. However, the solder joints of solder wire are mostly piled up and are prone to forming cold solder joints, which affects the welding reliability between multiple flexible boards. When used in a bent state, LEDs and components are easily detached or broken.

[0003] Some automotive lighting modules use a combination of rigid and flexible circuit boards. In particular, when the rigid board is a multi-layer board and the flexible board is a double-sided board, the manufacturing process is very complex. The cost of such rigid-flex boards is also very high, making them unsuitable for mass production of automotive lighting modules. Utility Model Content

[0004] The technical problem to be solved by this utility model is: in order to solve the technical problems of complex and high cost of welding structure between flexible board and rigid board in the prior art, this utility model provides a connection structure between multi-circuit flexible board and multi-circuit rigid board and a vehicle lamp module, which simplifies the welding structure of rigid board and flexible board, facilitates assembly and welding, improves welding accuracy and reduces cost.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a welding structure of a multi-line flexible board and a multi-line rigid board, comprising: a flexible board having a connecting part for connecting to the rigid board, the connecting part having a plurality of first pads; a rigid board having a plurality of second pads corresponding to the first pads; a carrier for placing and positioning the flexible board and the rigid board; the flexible board and the rigid board are fixedly connected by the connecting part, and the first pads and the second pads are aligned, and a groove for accommodating solder paste is formed between the first pads and the second pads.

[0006] The present invention relates to a welding structure for a multi-line flexible circuit board and a multi-line rigid circuit board. First, the rigid circuit board and the flexible circuit board are connected by a connecting part, so that the first solder pad and the second solder pad correspond. After the rigid circuit board and the flexible circuit board are placed on a carrier, they are welded together. This improves the bonding accuracy of the rigid circuit board and the flexible circuit board, increases production efficiency, and reduces material costs and assembly costs.

[0007] Furthermore, in order to fix the flexible board and the rigid board first, the connecting part is tightly attached to the mating surface of the rigid board and bonded together with glue.

[0008] Furthermore, in order to improve the soldering quality, the surface area of ​​the solder paste is greater than or equal to the surface area of ​​the first solder pad.

[0009] Furthermore, to ensure the soldering effect, the solder paste is heated and cured by hot air input from external soldering equipment to solder the input pads and output pads, and the solder paste between the first pads after soldering is not connected to each other.

[0010] Furthermore, in order to achieve the soldering of rigid and flexible boards, the first pad is a pad hole, and the second pad is a protrusion corresponding to the shape of the pad hole.

[0011] Furthermore, to increase the amount of solder applied and improve soldering reliability, the first pad has multiple through-holes.

[0012] Furthermore, in order to simultaneously solder surface mount components, surface mount components are connected to the non-soldering areas of the rigid board and the flexible board.

[0013] Furthermore, in order to weld the rigid plate and the flexible plate after assembly, the carrier has a first assembly groove that matches the rigid plate and a second assembly groove that matches the flexible plate, wherein the depth of the first assembly groove is greater than the depth of the second assembly groove.

[0014] Furthermore, in order to position the rigid plate and the flexible plate, the carrier is also provided with positioning posts, and the rigid plate and the flexible plate are provided with positioning holes that cooperate with the positioning posts.

[0015] The technical solution adopted by this utility model to solve its technical problem is: a vehicle light module, including the above-mentioned connection structure of multi-circuit flexible board and multi-circuit rigid board.

[0016] Compared with the prior art, the beneficial effects of this utility model are: 1. The present invention relates to a welding structure of a multi-circuit flexible board and a multi-circuit rigid board, as well as a vehicle light module. The rigid board and the flexible board are accurately positioned to ensure that the first and second pads are aligned, which satisfies the welding requirements of the multi-circuit flexible board and the multi-circuit rigid board. The welding strength meets the requirements. Through holes can be added to the first pad to increase the amount of solder and the welding reliability.

[0017] 2. The welding structure of the multi-circuit flexible board and the multi-circuit rigid board of this utility model and the vehicle lamp module are positioned by the carrier during the welding process, so as to achieve rapid alignment of the two and prevent the flexible board and the rigid board from moving at will, which would lead to inaccurate alignment. After the flexible board and the rigid board are aligned, there will be no displacement, effectively forming a flexible-rigid bonding board.

[0018] 3. The welding structure of the multi-circuit flexible board and the multi-circuit rigid board of this utility model, as well as the vehicle lamp module, can effectively improve the bonding accuracy of the flexible board and the rigid board, achieve accurate alignment, eliminate the need for connectors and wiring harnesses, solve the problem of space constraints in the vehicle lamp structure, meet the design requirements of bending and ultra-thinness, improve production efficiency, and reduce material and assembly costs. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a schematic diagram of the welding structure of the multi-line flexible board and the multi-line rigid board of this utility model; Figure 2 This is a schematic diagram of the structure of the first and second pads; In the figure: 1. Flexible board, 11. First pad, 12. Connector, 2. Rigid board, 21. Second pad, 22. Positioning hole, 3. Carrier, 31. First mounting groove, 32. Second mounting groove. Detailed Implementation

[0021] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0022] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] like Figure 1 As shown, a welding structure of a multi-line flexible board and a multi-line rigid board includes: a flexible board 1, a rigid board 2 and a carrier 3.

[0025] The flexible circuit board 1 has a connecting portion 12 that connects to the rigid circuit board 2, and the connecting portion 12 has multiple first pads 11. The rigid circuit board 2 has multiple second pads 21 corresponding to the first pads 11. A carrier 3 is used to place and position the flexible circuit board 1 and the rigid circuit board 2. The flexible circuit board 1 and the rigid circuit board 2 are fixed together by the connecting portion 12, and the first pads 11 and the second pads 21 are aligned, forming a groove for receiving solder paste between the first pads 11 and the second pads 21. The flexible circuit board 1 and the rigid circuit board 2 are first positioned by a fixture to ensure that the first pads 11 and the second pads 21 are aligned, and then the positioned flexible circuit board 1 and the rigid circuit board 2 are mounted on the carrier 3. The carrier 3 then accurately positions the flexible circuit board 1 and the rigid circuit board 2, and solder paste can be printed between the first pads 11 and the second pads 21. Finally, the solder paste is heated to solder the rigid circuit board 2 and the flexible circuit board 1 together.

[0026] Preferably, the mating surfaces of the connecting part 12 and the rigid plate 2 are tightly adhered and bonded together with adhesive. Before connecting the rigid plate 2 and the flexible plate 1, adhesive needs to be applied to the bottom surface of the connecting part 12. Then, the connecting part 12 and the rigid plate 2 are assembled correspondingly using a clamp, and the flexible plate 1 is pressed together with the rigid plate 2 using the adhesive on its back to form a rigid-flexible bonded plate. The clamp in this embodiment is a conventional clamp, which is not related to the concept of this utility model, so the structure of the clamp will not be described in detail.

[0027] Specifically, the first pad 11 is a receiving hole for receiving solder paste. The first pad 11 is a pad hole, and the second pad 21 is a protrusion corresponding to the shape of the pad hole. The first pad 11 and the second pad 21 correspond to form a pad hole groove, and the solder paste is printed in the pad hole groove and completely fills the pad hole groove. The number and shape of the first pad 11 and the second pad 21 are determined according to the specific structure of the circuit board. The pad structure in the attached figure is for illustrative purposes only.

[0028] Preferably, the first pad 11 has multiple through holes, which can be used for solder penetration, increasing soldering reliability and reducing air bubbles, with some gas escaping from the through holes.

[0029] Preferably, the surface area of ​​the solder paste is greater than or equal to the surface area of ​​the first pad 11. The solder paste is heated and cured by hot air input from external soldering equipment to solder the input pad and the output pad. After soldering, the solder paste between the first pads 11 is not connected to each other. This can further increase the soldering area, improve the soldering effect, and ensure that the soldering strength meets the requirements.

[0030] Specifically, surface mount components are connected to the non-soldering areas of rigid board 2 and flexible board 1. The surface mount components are soldered simultaneously with rigid board 2 and flexible board 1.

[0031] Specifically, the carrier 3 has a first mounting groove 31 that matches the rigid plate 2 and a second mounting groove 32 that matches the flexible plate 1. The depth of the first mounting groove 31 is greater than the depth of the second mounting groove 32. When the rigid plate 2 and the flexible plate 1 are installed, they are placed into the carrier 3 to fix them in place, ensuring that the positions of the welded rigid plate 2 and the flexible plate 1 do not change.

[0032] Preferably, the carrier 3 also has positioning posts, and positioning holes 22 that mate with the positioning posts are formed on the rigid plate and the flexible plate. The positioning posts and positioning holes 22 can further fix the rigid plate 2 and the flexible plate 1, preventing the rigid plate 2 and the flexible plate 1 from shifting during welding, preventing the flexible plate 1 and the rigid plate 2 from moving arbitrarily, and solving the problems of inaccurate alignment and excessively long alignment time.

[0033] The specific working process of the welding structure between the multi-line flexible board and the multi-line rigid board in this embodiment is as follows: After the connecting part 12 is coated with glue, it is aligned with the rigid board 2 through the clamp. The rigid board 2 is installed on the clamp. The positioning hole 22 of the flexible board 1 matches the positioning post of the clamp. The first solder pad 11 and the second solder pad 21 are aligned one by one. The flexible board 1 and the rigid board 2 are pressed together. The combined rigid-flex PCB assembly is loaded into an SMT carrier, and solder paste is printed on the pad slots. Hot air from a reflow soldering machine heats the solder paste, completing the soldering of the rigid-flex PCB assembly. Solder paste is printed on one side of the rigid-flex PCB, and the melted solder paste then solders the flexible board 1 and rigid board 2 together. During reflow soldering, the solder paste melts and bonds the rigid-flex PCB pads together, simultaneously soldering other components on the rigid-flex PCB to the pads. The first pad 11 and the second pad 21, after accurate alignment, are soldered in a reflow oven. First, the solder paste passes through a preheating zone in the reflow oven, where the solvent and gases in the solder paste evaporate. In this embodiment, the rigid-flex PCB... Components are mounted on the board. The flux in the solder paste wets the output pads of the rigid board, the component terminals and leads. The solder paste softens and collapses, covering the pads on the rigid-flex board, isolating the component leads from oxygen. It then passes through a temperature-controlled zone, ensuring the rigid-flex board and components are fully preheated to prevent damage from a sudden entry into the reflow zone (high temperature). Next, it enters the reflow zone, where the temperature rises rapidly, melting the solder paste. The liquid solder paste wets, spreads, and forms solder joints on the output pads of the rigid board, the input pads of the flexible board, and the component terminals and leads. Finally, it enters the cooling zone, where the solder joints solidify, completing the reflow soldering process. The soldering process and related parameters are standard selections and will not be elaborated further here.

[0034] Because this soldering process only requires applying solder paste to the soldering area and completing the soldering by heating with hot air, it avoids soldering defects such as pad bridging. In the reflow soldering process, the solder paste is used only once and there is no reuse. Therefore, the soldering material is very clean and free of impurities, ensuring the quality of the solder joint.

[0035] A vehicle lighting module includes the aforementioned connection structure between a multi-wire flexible circuit board and a multi-wire rigid circuit board.

[0036] In summary, the connection structure between the multi-circuit flexible circuit board and the multi-circuit rigid circuit board, as well as the vehicle lamp module of this utility model, simplify the welding structure of the rigid and flexible circuit boards, facilitate assembly and welding, improve welding accuracy, and reduce costs.

[0037] The above description is based on the preferred embodiments of this utility model. Through the above description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined by the scope of the claims.

Claims

1. A welding structure for a multi-line flexible circuit board and a multi-line rigid circuit board, characterized in that, include: A flexible board (1) has a connection portion (12) that is connected to a rigid board (2), and the connection portion (12) has a plurality of first pads (11). Rigid board (2), the rigid board (2) has a plurality of second pads (21) corresponding to the first pads (11); The carrier (3) is used to place and position the soft board (1) and the hard board (2); The flexible board (1) and the rigid board (2) are fixedly connected by a connecting part (12) and the first pad (11) and the second pad (21) are aligned, forming a cavity for accommodating solder paste between the first pad (11) and the second pad (21).

2. The welding structure of a multi-line flexible circuit board and a multi-line rigid circuit board according to claim 1, characterized in that, The connecting part (12) is in close contact with the mating surface of the rigid plate (2) and is fixed together by adhesive.

3. The welding structure of a multi-line flexible circuit board and a multi-line rigid circuit board according to claim 2, characterized in that, The surface area of ​​the solder paste is greater than or equal to the surface area of ​​the first pad (11).

4. The welding structure of a multi-line flexible circuit board and a multi-line rigid circuit board according to claim 2, characterized in that, The solder paste is heated and cured by hot air input from external soldering equipment to solder the input pads and output pads. The solder paste between the first pads (11) after soldering is not connected to each other.

5. The welding structure of a multi-line flexible circuit board and a multi-line rigid circuit board according to claim 1, characterized in that, The first pad (11) is a pad hole, and the second pad (21) is a protrusion corresponding to the shape of the pad hole.

6. The welding structure of a multi-line flexible circuit board and a multi-line rigid circuit board according to claim 5, characterized in that, The first pad (11) has multiple through holes.

7. The welding structure of a multi-line flexible circuit board and a multi-line rigid circuit board according to claim 1, characterized in that, Surface mount components are connected to the non-soldering areas of the rigid board (2) and the flexible board (1).

8. The welding structure of a multi-line flexible circuit board and a multi-line rigid circuit board according to claim 1, characterized in that, The carrier (3) has a first mounting groove (31) that matches the rigid plate (2) and a second mounting groove (32) that matches the flexible plate, wherein the depth of the first mounting groove (31) is greater than the depth of the second mounting groove (32).

9. The connection structure between the multi-line flexible board and the multi-line rigid board (2) according to claim 8, characterized in that, The carrier (3) also has a positioning post, and the hard plate (2) and the soft plate (1) are provided with positioning holes (22) that cooperate with the positioning post.

10. A vehicle headlight module, characterized in that, The connection structure of the multi-line flexible board and the multi-line rigid board as described in any one of claims 1-9.