A multifunctional test socket

Abstract

The utility model relates to related technical field of test socket especially, a kind of multifunctional test socket, its structure is divided into upper and lower structure, including upper test socket, lower socket, upper test socket includes: the one side of Pin board is provided with cover Pin board, the one side of Pin board is provided with the two positioning pins two of cooperation cover Pin board;Top plate is set to the one side of cover Pin board, cover Pin small plate is set to the other side of top plate, and the positioning pin three of cooperation cover Pin small plate is set to top plate;The positioning pin four of cooperation cover Pin small plate is set to top plate, and there is the mounting groove of sealing ring two on top plate upper portion, the back glue on sealing ring two is used, sealing ring two is placed in the mounting groove of top plate, there are three positioning pins three on top plate, after using it with PCB positioning, top plate and PCB are fastened using countersunk head bolt four, finally two air nozzles are installed to top plate through the via of PCB;PCB board is set to the one side of cover Pin small plate;The equipment utilization and engineering flexibility are improved by the test socket.

Description

Technical Field

[0001] This utility model relates to the technical field of test sockets, and in particular to a multifunctional test socket. Background Technology

[0002] In recent years, with the development of technologies such as integrated circuits, new energy vehicles, artificial intelligence, and 5G communication, the performance of electronic devices has been rapidly improved, and the functions they offer have become increasingly diverse. Power supply chips are the heart of electronic devices' power supply; no matter how powerful the function, it relies on a stable power supply. An unstable power supply will cause electronic devices to malfunction. Common electronic devices are mainly powered by power supplies or batteries. The device system requires a stable voltage to drive the circuits, but the voltage provided by power supplies and batteries is usually unstable. Therefore, power supply chips must store the electrical energy and distribute it to the electronic system to provide a stable power supply.

[0003] Power supply chips come in a wide variety, including lithium battery charging management chips, linear and low-voltage buck regulators, DC switching regulators, AC switching regulators, DDR memory power supplies, LED driver power supplies, etc., and can be broadly categorized into linear power supplies and switching power supplies. Among them, switching power supply chips are widely used in mobile phones and communications, consumer electronics, industrial control, medical instruments, automotive and other electronic applications due to their high efficiency and flexible output voltage.

[0004] While existing electronic devices have achieved faster processing speeds and higher performance, they have also increased the energy they consume during operation. To provide higher power to electronic devices, the voltage supplied is usually increased. Utility Model Content

[0005] The purpose of this invention is to provide a multifunctional test socket to solve the problems mentioned in the background art.

[0006] The technical solution adopted in this utility model is:

[0007] A multifunctional test socket includes an upper test socket, comprising: a PCB board 3, on one side of which is a mounting pin 201; a cover pin 202 disposed on one side of the mounting pin 201, the mounting pin having a positioning pin 2 that mates with the cover pin; a top plate disposed on one side of the cover pin, the cover pin being fastened to the top plate by a countersunk head bolt 2, and after installation, the entire assembly being fixed to the PCB by a countersunk head bolt 3; and a small cover pin 202 disposed on the other side of the top plate, the top plate having a positioning pin 202 that mates with the cover pin 202. The locating pin three of the board is used to fasten the cover pin plate to the top plate by countersunk head bolts four; the top plate is provided with locating pin four that mates with the cover pin plate; the upper part of the top plate has a mounting groove for mounting a sealing ring two; using the adhesive on the back of the sealing ring two, the sealing ring two is placed in the mounting groove of the top plate; there are three locating pins three on the top plate, which are distributed in a triangle; after positioning with the PCB, the top plate and the PCB are fastened with countersunk head bolts three; finally, two air nozzles are installed on the top plate through the through holes of the PCB; the PCB board is set on one side of the cover pin plate; the lower test socket is set on the other side of the pin plate.

[0008] Optionally, the lower test socket includes: a positioning plate disposed on the other side of the pin mounting plate; a heating copper block disposed on one side of the positioning plate, the heating copper block having a positioning pin that mates with the positioning plate, and a sealing ring having an adhesive backing, the sealing ring being used to fix the heating copper block; a countersunk bolt passing through the positioning plate, allowing the positioning plate and the heating copper block to be threadedly fixed; a heating element disposed on one side of the heating copper block; a temperature sensor disposed on the outside of the heating copper block, the outside of the heating copper block having a set screw that mates with the temperature sensor, fixing it thereto; a vacuum nozzle disposed on the outside of the heating copper block, located on one side of the temperature sensor; a base plate disposed on one side of the top plate, covering the outside of the vacuum nozzle, the base plate having symmetrical springs, and the copper block being fixed by passing through the springs with a plug bolt; and a chip disposed between the positioning plate and the pin mounting plate.

[0009] Optionally, the PogoPin that contacts the chip can be mounted separately onto a component.

[0010] Optionally, the inner ring dimensions of the first and second sealing rings are relatively small.

[0011] Optionally, the chip placement structure can be a floating structure.

[0012] Optionally, a heating device and a temperature detection device using a K-type thermocouple can be added below the chip device.

[0013] Optionally, the chip placement device includes a vacuum nozzle.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] Testing of cores of other sizes can be achieved simply by replacing the positioning plate. Compared to traditional overall structural modifications, the project cycle is shortened from 2 weeks to 2 hours, and equipment utilization is increased by 90%. This enhances project flexibility and allows for rapid switching between the same test benches. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of this application;

[0018] Figure 2 This is an explosion diagram for this application;

[0019] Figure label:

[0020] 1. Lower test socket; 101. Base plate; 102. Heating copper block; 103. Positioning plate; 104. Sealing ring 1; 105. Heating element; 106. Vacuum nozzle; 107. Spring; 108. Plug bolt; 109. Positioning pin 1; 110. Countersunk bolt 1; 111. Chip; 112. Set screw; 113. Temperature sensor;

[0021] 2. Upper test socket; 201. Install pin board; 202. Cover pin board; 203. Top plate; 204. Pogo pin; 205. Cover pin small board; 206. Positioning pin two; 207. Countersunk bolt two; 208. Countersunk bolt three; 209. Countersunk bolt four; 210. Positioning pin three; 211. Positioning pin four; 212. Air nozzle; 213. Sealing ring two;

[0022] 3. PCB board. Detailed Implementation

[0023] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0025] Given that current technologies allow electronic devices to achieve faster processing speeds and higher performance, they also increase the energy they consume during operation. To provide higher power to electronic devices, the common approach is to increase the supplied voltage.

[0026] like Figure 1-2As shown, this utility model embodiment provides a multifunctional test socket, including an upper test socket 2. The upper test socket 2 includes: a pin mounting plate 201 disposed on one side of a PCB board 3; a cover pin plate 202 disposed on one side of the pin mounting plate 201, and a positioning pin 206 that mates with the cover pin plate 202 disposed on one side of the pin mounting plate 201; a top plate 203 disposed on one side of the cover pin plate 202, and the cover pin plate 202 is fastened to the top plate 203 by a countersunk head bolt 207. After installation, the entire assembly is fixed to the PCB board by a countersunk head bolt 208. 3. The cover pin plate 205 is located on the other side of the top plate 203. The top plate 203 is provided with a positioning pin 210 that matches the cover pin plate 205, and the cover pin plate 205 is fastened to the top plate 203 by a countersunk bolt 209. The top plate 203 is provided with a positioning pin 211 that matches the cover pin plate 205. The upper part of the top plate 203 has an installation groove for a sealing ring 213, which utilizes the adhesive backing of the sealing ring 213. Place the sealing ring 213 into the mounting groove of the top plate 203. There are three positioning pins 210 on the top plate 203, which are distributed in a triangle. After positioning with the PCB, use the countersunk bolts 208 to fasten the top plate 203 and the PCB. Finally, install the two air nozzles 212 through the through holes of the PCB onto the top plate 203. The PCB board 3 is set on one side of the cover pin board 205. The lower test socket 1 is set on the other side of the pin board 201. The lower test socket 1 includes: a positioning plate 103 disposed on the other side of the pin mounting plate 201; a heating copper block 102 disposed on one side of the positioning plate 103, the heating copper block 102 having a positioning pin 109 that mates with the positioning plate 103, a sealing ring 104 disposed on the heating copper block 102 with adhesive backing, the sealing ring 104 being used to fix it to the heating copper block 102; a countersunk bolt 110 passing through the positioning plate 103, thereby threading the positioning plate 103 and the heating copper block 102 together; and a heating element 105 disposed on one side of the heating copper block 102. The temperature sensor 113 is located on the outside of the heating copper block 102. The outside of the heating copper block 102 is provided with a set screw 112 that matches the temperature sensor 113 and fixes it. The vacuum nozzle 106 is located on the outside of the heating copper block 102 and is located on one side of the temperature sensor 113. The base plate 101 is located on one side of the top plate 203 and covers the outside of the vacuum nozzle 106. The base plate 101 has symmetrical springs 107, and the copper block is fixed by passing through the springs 107 with a plug bolt 108. The chip 111 is located between the positioning plate 103 and the pin mounting plate 201.

[0027] In use, first assemble the upper test socket 2. First, install the PogoPin 204 to be tested onto the mounting pin plate 201. The mounting pin plate 201 has a second positioning pin 206. Use the second positioning pin 206 to position and vertically install the cover pin plate 202 onto the mounting pin plate 201. Then, use the second countersunk bolt 207 to fix the mounting pin plate 201 and the cover pin plate 202 to the top plate 203. Next, install the other two sets of PogoPin 204 onto the top plate 203 in the same way. The top plate 203 has a third positioning pin 210. Use the third positioning pin 210 to position and install the cover pin small plate 205. Finally, use the fourth countersunk bolt 209 to fix the cover pin small plate 205. The top plate 203 has a groove for the second sealing ring 213. Use this groove and the adhesive backing of the second sealing ring 213 to fix the second sealing ring to the top plate 203. A positioning pin 211 is provided on the top plate 203. The assembled assembly is placed onto the PCB board using the positioning pin 211, and then secured with countersunk bolts 208. A clearance for the air nozzle 212 is provided on the PCB board 3, and a threaded hole for mounting the air nozzle 212 is provided on the top plate 203. The air nozzle 212 is then securely installed using this threaded hole. A positioning pin 109 is then installed on the heating copper block 102. The positioning plate 103 is placed on the heating copper block 102 using the positioning pin 109, and then secured to the heating copper block 102 using countersunk bolts 110. The heating copper block 102 has a mounting groove for a sealing ring. The back of the sealing ring 104 has adhesive, which is used to fix the sealing ring 104 to the heating copper block 102. The bottom of the heating copper block 102 has a recessed groove. The heating element 105 is placed on the heating copper block 102 and then fixed with thermal grease and high-temperature tape. A temperature sensor 113 is placed in a hole on the side of the heating copper block 102. After the temperature sensor 113 is placed, it is fixed with a set screw 112. A vacuum nozzle 106 is also threaded in a hole on the side of the heating copper block 102. The vacuum nozzle 106 is installed into the threaded hole and fixed. The spring 107 is placed on the base plate 101 and the heating copper block 102 is fixed to the base plate 101 with a bolt 108. The back of the base plate 101 has a positioning pin hole and a threaded hole. The positioning pin hole and the threaded hole are used to install it onto the sorting machine. Finally, the sorting machine uses the positioning plate 103 to position the chip 111 and place the chip 111 onto the heating copper block 102. A vacuum pump is connected to the vacuum nozzle 106, and the vacuum pump performs vacuuming to ensure that the chip 111 can be fixed on the heated copper block 102.The heated copper block 102 is heated by its heating element 105, and the temperature is monitored by a temperature sensor 113. When the required test temperature is reached, the temperature sensor 113 releases a signal, causing the heating element 105 to stop heating. The upper test socket 2 is equipped with a gas nozzle 212, which is connected to a nitrogen tank before testing. After the above steps are completed, the sorting machine places the upper test socket 2 into the lower test socket 1, and the PogoPin 204 in the upper test socket 2 contacts the chip 111 to complete the test.

[0028] Specifically, maximizing the number of pads on the PCB improves soldering reliability. Larger pads reduce thermal cycling stress, and the failure cycle can be extended by 3 times under conditions of -40℃ to 125℃. Increased pad area leads to a shorter thermal diffusion path and a lower equivalent thermal resistance.

[0029] Specifically, depending on the size of the product chip 111, when the product size change is not particularly large, only the positioning plate 103 needs to be replaced to meet the testing requirements of other sizes of chips 111. Compared with the traditional overall structural modification, the engineering cycle is shortened from 2 weeks to 2 hours, and the equipment utilization rate is increased by 90%; it can enhance engineering flexibility and allow for rapid switching on the same test bench.

[0030] Specifically, the PogoPin204 has a round tip to prevent damage to chip 111 when the sorting machine applies excessive pressure.

[0031] Furthermore, the PogoPin204, which contacts the chip 111, is installed separately on a component, and a modular component is designed to independently support the PogoPin204, achieving precise contact and signal transmission with the chip 111; it is fixed by a positioning pin or a countersunk head, supporting quick replacement of individual pins and facilitating independent maintenance.

[0032] Furthermore, the smaller inner ring dimensions of sealing rings 104 and 213 ensure greater stability during testing, guaranteeing a good seal throughout the testing process.

[0033] Furthermore, the chip 111 is placed in a floating structure, which allows the chip 111 to adaptively adjust its position within a certain range. Through elastic or mechanical floating mechanisms, the chip 111 can be precisely aligned with the target contact.

[0034] Furthermore, a heating device and a temperature detection device using a K-type thermocouple are added below the chip 111 device to accurately control the temperature and maintain the chip 111 operating temperature within the optimal range, avoiding overheating damage or low-temperature performance degradation; real-time temperature monitoring triggers over-temperature power-off (>150℃ fuse) or low-temperature alarm (<-20℃ anti-freeze).

[0035] Furthermore, the chip placement device includes a vacuum nozzle 106, which can pick up the chip 111 non-contactly to avoid scratches on the surface of the chip 111 caused by mechanical clamping; during the chip 111 bonding process, the vacuum nozzle 106 can rotate 360° to correct angular deviations.

[0036] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A multifunctional test socket, characterized in that: Includes an upper test socket (2), said upper test socket (2) comprising: PCB board (3), with a pin mounting board (201) on one side; A cover pin plate (202) is disposed on one side of the mounting pin plate (201), and a positioning pin two (206) that cooperates with the cover pin plate (202) is provided on one side of the mounting pin plate (201). The top plate (203) is set on one side of the cover pin plate (202) and is fastened by countersunk bolt two (207). The cover pin plate (202) is fastened to the top plate (203) by cross countersunk bolt two (207). After installation, the whole is fixed to the PCB board (3) by countersunk bolt three (208). A cover pin plate (205) is disposed on the other side of the top plate (203). The top plate (203) is provided with a positioning pin three (210) that cooperates with the cover pin plate (205), and the cover pin plate (205) is fastened to the top plate (203) by a countersunk bolt four (209). The top plate (203) is provided with a positioning pin four (211) that cooperates with the cover pin plate (205). The top plate (203) has an mounting groove for a second sealing ring (213) on its upper part. Using the adhesive on the back of the second sealing ring (213), the second sealing ring (213) is placed in the mounting groove of the top plate (203). There are three positioning pins (210) on the top plate (203) in a triangular distribution. After positioning with the PCB, the top plate (203) and the PCB are fastened with countersunk bolts (208). Finally, the two air nozzles (212) are installed on the top plate (203) through the through holes of the PCB. The lower test socket (1) is located on the other side of the mounting pin plate (201).

2. The multifunctional test socket according to claim 1, characterized in that, The lower test socket (1) includes: A positioning plate (103) is disposed on the other side of the mounting pin plate (201); A heating copper block (102) is disposed on one side of the positioning plate (103). The heating copper block (102) is provided with a positioning pin (109) that cooperates with the positioning plate (103). A sealing ring (104) is provided on the heating copper block (102), and its back is covered with adhesive. The adhesive of the sealing ring (104) is used to fix it to the heating copper block (102). A countersunk bolt (110) passes through the positioning plate (103), so that the positioning plate (103) and the heating copper block (102) are threadedly fixed. A heating element (105) is disposed on one side of the heating copper block (102); A temperature sensor (113) is disposed on the outside of the heating copper block (102), and a set screw (112) is provided on the outside of the heating copper block (102) to cooperate with the temperature sensor (113) and fix it. A vacuum nozzle (106) is disposed on the outside of the heated copper block (102) and located on one side of the temperature sensor (113); A base plate (101) is provided on one side of the top plate (203) and covers the outside of the vacuum nozzle (106). Springs (107) are symmetrically arranged on the base plate (101), and the copper block is fixed by passing through the springs (107) with a plug bolt (108). The chip (111) is disposed between the positioning plate (103) and the pin mounting plate (201).

3. A multifunctional test socket according to claim 2, characterized in that, The PogoPin (204) contacted by the chip (111) is individually mounted onto a component.

4. A multifunctional test socket according to claim 1, characterized in that, The chip (111) is a floating structure.

5. A multifunctional test socket according to claim 1, characterized in that, A heating device and a temperature detection device are added below the chip placement (111) device.

6. A multifunctional test socket according to claim 1, characterized in that, The chip placement (111) device includes a vacuum nozzle (106).

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