Hot plug protection circuit and medical device

Abstract

The utility model discloses a hot plug protection circuit and medical equipment relates to hot plug protection technical field, in view of current hot plug protection scheme is not applicable to the problem of wiring harness form's board card interconnection connector, provide a kind of hot plug protection circuit. Whether the wiring harness of board card interconnection connector is completely contacted on the detection of detection module, when wiring harness is not completely contacted, output detection signal to switch module. And switch module is arranged at the protected pin of board card interconnection connector, when receiving detection signal, shut down, at this time, protected pin is disconnected, prevent signal transmission between board card through this protected pin. And since protected pin is not ground signal pin, it can be guaranteed that ground signal is contacted first when board is connected through the wiring harness of board card interconnection connector. As can be seen, the circuit can realize hot plug protection function under the scene that board is connected to board card through the wiring harness of board card interconnection connector, and the hot plug protection scene is widened.

Description

Technical Field

[0001] This utility model relates to the field of hot-swap protection technology, and in particular to a hot-swap protection circuit and medical device. Background Technology

[0002] In scenarios such as repairing battery-powered medical devices, if the corresponding board interconnect connectors are plugged and unplugged while the battery is in place, even if the device is powered off, the power signals related to battery power supply on the board may still exist, potentially damaging the relevant interface circuits on the board. Therefore, hot-swapping protection is necessary.

[0003] Currently, in scenarios requiring hot-swap protection, there is a solution that uses pins of varying lengths. The longest pin inside the board interconnect connector is used to transmit the ground signal, ensuring that the ground signal contacts first during the connection process between two boards, followed by power and other signals, thus achieving hot-swap protection. However, this solution cannot meet the needs of board-to-board connections via wire harnesses, as many wire harnesses, especially high-speed signal harnesses, are difficult to design with pins of varying lengths.

[0004] Therefore, those skilled in the art urgently need a hot-swap protection circuit to provide a hot-swap protection solution suitable for board-to-board connections via wire harnesses. Utility Model Content

[0005] The purpose of this invention is to provide a hot-swap protection circuit and medical device to solve the problem that current hot-swap protection schemes are not applicable to board-to-board connections via wire harnesses.

[0006] To solve the above-mentioned technical problems, this utility model provides a hot-swap protection circuit, including: a detection module and a switching module;

[0007] The detection module outputs a detection signal when the wiring harness of the board interconnect connector is not in complete contact.

[0008] The switch module is located in the circuit where the protected pin is located; wherein, the protected pin is any pin in the board interconnect connector except for the ground signal pin;

[0009] The controlled terminal of the switch module is connected to the output terminal of the detection module; the switch module is turned off when it receives the detection signal and turned on when it does not receive the detection signal.

[0010] In one optional embodiment, the switch module is disposed on a first board, and the detection module is disposed on a second board; the first board and the second board are connected via the board interconnect connector;

[0011] The detection module is used to output a detection signal;

[0012] The controlled terminal of the switch module is connected to the output terminal of the detection module through the detection signal pin in the board interconnect connector.

[0013] In one optional embodiment, the detection signal is a low-level signal;

[0014] The detection module includes a pull-down resistor;

[0015] The first end of the pull-down resistor is grounded, and the second end of the pull-down resistor is connected to the detection signal pin.

[0016] In one optional embodiment, it further includes: a control module;

[0017] The control module is located on the first board. The input terminal of the control module is connected to the detection signal pin, and the output terminal of the control module is connected to the controlled terminal of the switch module.

[0018] In one optional embodiment, the control module is a logic processing module, which includes multiple input terminals;

[0019] The detection signal output by the detection module is divided into multiple detection sub-signals through multiple detection signal pins in the board interconnect connector, and output to multiple input terminals of the logic processing module respectively;

[0020] When the logic processing module receives the detection sub-signal at each of the input terminals, it outputs the detection signal.

[0021] In one optional embodiment, the protected pin is a power signal pin in the board interconnect connector;

[0022] The first board is the power-enabled board among two boards connected via the board interconnect connector.

[0023] In one alternative embodiment, the switching module includes a switching transistor;

[0024] The first end of the switching transistor is connected to the output terminal of the power supply, the second end of the switching transistor is connected to the power signal pin, and the controlled end of the switching transistor is connected to the output terminal of the logic processing module.

[0025] In one optional embodiment, the detection signal is a low-level signal; the logic processing module is a NOR gate; the switching transistor is a PMOS transistor, the source of the PMOS transistor is the first terminal of the switching transistor, the drain of the PMOS transistor is the second terminal of the switching transistor, and the gate of the PMOS transistor serves as the controlled terminal of the switching transistor.

[0026] The switching module also includes an NMOS transistor;

[0027] The source of the NMOS transistor is grounded, the gate of the NMOS transistor is connected to the gate of the PMOS transistor, and the gate of the NMOS transistor is connected to the output of the NOR gate.

[0028] In one optional embodiment, there are multiple protected pins; there are multiple switch modules, each corresponding to one of the protected pins.

[0029] In one optional embodiment, the controlled terminals of each of the switch modules are connected together;

[0030] The hot-swap protection circuit also includes: a plurality of diodes corresponding one-to-one with each of the switching modules;

[0031] Specifically, for each diode: the positive terminal of the diode is connected to the controlled terminal of the corresponding switching module, and the negative terminal of the diode is connected to the controlled terminals of other switching modules.

[0032] To solve the above-mentioned technical problems, this utility model also provides a medical device, including: the hot-swap protection circuit as described above.

[0033] This invention provides a hot-swap protection circuit that uses a detection module to detect whether the wiring harness of a board interconnect connector is fully in contact. When the wiring harness is not fully in contact, a detection signal is output to a switch module. The switch module is located at the protected pin of the board interconnect connector. Upon receiving the detection signal, it turns off, disconnecting the protected pin and preventing signal transmission between boards through this protected pin. Since the protected pin is not a ground pin, it ensures that when boards are connected via the wiring harness of the board interconnect connector, the ground signal must make contact first. Only after the ground signal makes contact can the wiring harness of the board interconnect connector make full contact. At this point, the switch module receives the detection signal output by the detection module, thus turning on the circuit. The path at the protected pin is also turned on, allowing other signals in the board-to-board connection to make contact. Therefore, this circuit ensures that the ground signal makes contact first and other signals make contact later in a board-to-board wiring harness connection scenario, thereby achieving hot-swap protection.

[0034] The medical device provided by this utility model corresponds to the above-mentioned hot-swap protection circuit and has the same effect. Attached Figure Description

[0035] To more clearly illustrate the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 A schematic diagram illustrating a hot-swap protection scenario provided by an embodiment of this utility model;

[0037] Figure 2 A structural diagram of a hot-swap protection circuit provided in an embodiment of this utility model;

[0038] Figure 3 A circuit diagram of a control module and a switch module provided for an embodiment of this utility model;

[0039] Among them, 10 is the detection module, 20 is the switch module, 30 is the control module, 31 is the logic processing module, 32 is the NMOS transistor, and 40 is the diode. Detailed Implementation

[0040] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0041] The core of this utility model is to provide a hot-swap protection circuit and a medical device.

[0042] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0043] Currently, when repairing battery-powered devices (such as ultrasonic equipment), there may be operations involving plugging and unplugging the interconnect connectors of circuit boards. Even if the device is powered off, the interconnect connectors may still contain power signals or other related signals from the battery, which can easily damage the relevant interface circuits on the circuit board during this hot-plugging process. Therefore, hot-plug protection is necessary.

[0044] For example, in such Figure 1In the scenario shown, two boards are connected via a wire harness interconnect connector. The wire harness includes power (BAT+, V+) signals, ground (BAT-) signals, and other interconnect signals. During hot-swapping, the following two situations may occur:

[0045] 1. If the ground signal BAT- is contacted later, while other signals BAT+, V+, and Signal are contacted first, then... Figure 1 As shown by the directed dashed line segment, BAT+, V+, Signal, and BAT- form a loop. At this point, the transient voltage division of Signal is V. BAT / 2 (Assume the power supply voltage of power signal BAT+ is V) BAT If the MCU is a transient voltage suppressor diode (TVS), then the transient voltage division of Signal is V. BAT If this voltage divider is maintained for too long, it will damage the Zener diode or TVS diode, and may even burn out the resistor connected in series in the signal circuit.

[0046] 2. If the power signal BAT+ and the ground signal BAT- both make contact first, a large capacitor charging current will be generated instantaneously, which may cause sparking and damage the power BAT+ and ground BAT- pins in the wiring harness.

[0047] Therefore, the key to achieving hot-swap protection is to ensure that the ground signal contacts first during the board connection process, and the power and other signals contacts later.

[0048] In related technologies, some board-to-board connector interconnection schemes use a hot-plug protection method with varying pin lengths. By using the longest pin inside the board interconnect connector as the ground signal, the ground signal makes contact first, followed by power and other signals, during the connection process. However, this method cannot meet the needs of scenarios where boards are connected via wire harness interconnect connectors. Many wire harnesses (especially those used for transmitting high-speed signals) are difficult to design with varying pin lengths, leaving the hot-plugging problem unresolved in this scenario.

[0049] To address the aforementioned problems, this application provides a hot-swap protection circuit, such as... Figure 2 As shown, it includes: a detection module 10 and a switch module 20;

[0050] The detection module 10 outputs a detection signal when the wiring harness of the board interconnect connector is not in complete contact.

[0051] The switch module 20 is located in the circuit where the protected pin is located; wherein, the protected pin is any pin in the board interconnect connector except for the ground signal pin.

[0052] The controlled terminal of the switch module 20 is connected to the output terminal of the detection module 10; the switch module 20 is turned off when a detection signal is received and turned on when no detection signal is received.

[0053] It should be noted that, Figure 2 The switch module 20 shown is configured in the circuit corresponding to the power signal BAT+ pin (i.e., the pin corresponding to the power signal BAT+ is the protected pin), and the switch module 20 is configured on the first board, while the detection module 10 is configured on the second board; these are both optional implementations. This embodiment does not limit the protected pin to the pin corresponding to the power signal BAT+. All pins in the board interconnect connector, except for the ground signal (i.e., BAT-) pin, can be used as protected pins in this circuit. It is also clear that in this circuit, the switch module 20 ensures that the circuit containing the protected pin remains open before the ground signal is contacted (i.e., the controlled end of the switch module 20 receives the detection signal), and resumes conduction after the ground signal is contacted, thereby achieving the hot-plug protection purpose of ground signal contact first, followed by the signal transmitted by the protected pin.

[0054] Furthermore, this embodiment does not limit whether the switch module 20 and the detection module 10 are located on the first board or the second board. Figure 1 As explained above regarding the principle of hot-swap protection, as long as the circuit formed by other signal contacts remains open before the ground signal contacts and is restored after the ground signal contacts, the purpose of hot-swap protection can be achieved. Furthermore, the circuit formed involves both the first and second boards, so the switch module 20 can be arbitrarily selected to be located in either the circuit of the first board or the circuit of the second board to achieve the purpose of hot-swap protection. Regarding the detection module 10, as mentioned above, it outputs a detection signal when it detects that the board interconnect connector is not fully in contact. Therefore, the board on which the detection module 10 is located can be appropriately selected based on the detection method used by the detection module 10. For example, if the detection module 10 can more easily complete the above detection in the first board, then the detection module 10 is located in the first board; similarly, if the detection module 10 can more easily complete the above detection in the second board, then the detection module 10 is located in the second board; if there is no requirement to achieve detection, the detection module 10 can be located in any board.

[0055] Furthermore, this embodiment does not impose any restrictions on the specific implementation forms of the detection module 10 and the switch module 20. The detection module 10 is used to detect whether the board interconnect connector is fully contacted. This can be achieved by detecting whether all signals in the board interconnect connector are in contact (i.e., electrical detection or signal detection); it can also be achieved by using a position sensor to detect whether the board interconnect connector is properly mated (position detection); or by using other mechanical expansion, structures, or devices, when the board interconnect connector is fully mated, it will trigger a specific electrical signal change, which will serve as the basis for whether the detection module 10 outputs a detection signal (i.e., a combination of electrical detection and position detection). The switch module 20 is used to control the on / off state of the circuit. Currently, most common switches can achieve this function. However, considering that the switching state of the switch module 20 is controlled by the detection signal, if there are no other control circuits or modules, the switch module 20 can be implemented by an electronic switch. Specifically, the electronic switch can also be a switching transistor or a relay, etc. This embodiment does not impose any restrictions on this.

[0056] On the other hand, regarding the condition "the wiring harness is not fully in contact" for the detection module 10 to output the detection signal, it should be noted that "fully in contact" means that all signals in the board interconnect connector have made contact, that is, all signals including ground signals, power signals, and other signals have made contact before it is considered "fully in contact." Similarly, when the above condition is not met, it is considered "not fully in contact," which includes possible situations such as ground signals not making contact, power signals not making contact, other signals not making contact, or multiple signals not making contact. "Not fully in contact" also includes the situation of "not making contact," that is, all signals not making contact. It can be seen that "not fully in contact" covers all possibilities of power signals or other signals making contact before ground signals, so the detection module 10 can meet the hot-swap protection requirements by outputting the detection signal under this condition.

[0057] Furthermore, this embodiment does not impose any restrictions on the specific form of the detection signal generated by the detection module 10. It can be a high-level, low-level, or other level signal, or an electrical signal such as a voltage signal or a current signal, or even an analog signal, etc. The specific form of the detection signal should be determined according to the control needs of the switch module 20. As long as the switch module 20 can identify the detection signal and make a specific response (i.e., control its own conduction state), this embodiment does not limit what form of signal to be used as the detection signal. It should also be noted that the detection module 10 needs to output a detection signal when the wiring harness of the board interconnect connector is not fully in contact (i.e., the signal transmitted through the wiring harness is not fully in contact). However, when the wiring harness of the board interconnect connector is in contact (whether or not fully in contact), this embodiment does not limit the detection module 10 to not output a signal or to output another signal different from the detection signal. As long as the switch module 20 remains on when it does not receive a detection signal, the hot-plug protection requirements can be met.

[0058] As described above, the hot-swap protection circuit provided in this application generates a specific detection signal by detecting whether the interconnect connectors in the form of wire harnesses are fully contacted. The switch module 20, located in the circuit containing the protected pin, responds to the detection signal to control the on / off state of the circuit, that is, to control the on / off state of the signal transmission path of the protected signal (corresponding to the protected pin) between the two boards. Since the detection signal is generated when the wire harness of the interconnect connector is not fully contacted, and the condition of "wire harness not fully contacted" includes the case where all other signals contact the ground signal before the ground signal, controlling the transmission path of the protected signal to be turned off at this time can prevent the protected signal from contacting the ground signal before the ground signal, thereby achieving the purpose of hot-swap protection. Therefore, the hot-swap protection solution provided in this application does not require the use of long and short pin designs and is applicable to scenarios where the interconnect connectors are wire harnesses, making up for the current lack of hot-swap protection applications in wire harness scenarios.

[0059] However, it should be noted that while this circuit is applicable to wire harness scenarios, it does not mean it is only applicable to wire harness scenarios. Since this circuit implements hot-swap protection directly within the board, it does not impose any requirements on the type of board interconnect connector. Therefore, the hot-swap protection solution provided by this circuit is suitable for any type of board interconnect connector.

[0060] On the other hand, the above embodiments do not restrict which of the two boards the switch module 20 and the detection module 10 are located on. However, this embodiment provides an optional implementation scheme, such as... Figure 2 As shown:

[0061] The switch module 20 is mounted on the first board, and the detection module 10 is mounted on the second board. The first board and the second board are connected by a board interconnect connector. The detection module 10 is used to output a detection signal. The controlled end of the switch module 20 is connected to the output end of the detection module 10 through the detection signal pin in the board interconnect connector.

[0062] It is important to note that the "first board" and "second board" mentioned above do not refer to any specific one of two boards connected via a board interconnect connector. That is, assuming there are two boards, A and B, connected to each other via a board interconnect connector, board A can be considered the first board, and board B the second board; conversely, board B can also be considered the first board, in which case board A becomes the second board.

[0063] Furthermore, for the aforementioned detection signal pins, since each pin in the board interconnect connector harness has its own signal to transmit, detection signal pins generally need to be additionally configured. That is, one or more pins specifically for transmitting detection signals are added to the board interconnect connector harness. However, if in some possible application scenarios there are redundant pins in the board interconnect connector (i.e., some pins are not used to transmit useful signals between two boards), then these pins can be reused as detection signal pins in this embodiment.

[0064] It should also be noted that this embodiment does not only provide an implementation scheme for the specific placement of the split-type switch module 20 and detection module 10, but also provides another detection signal generation scheme based on this split-type placement:

[0065] As can be seen from the above embodiments, the detection module 10 needs to output a detection signal when the wire harness of the board interconnect connector is not in complete contact. Therefore, the most direct way to generate a detection signal is for the detection module 10 to directly or indirectly detect whether the wire harness is not in complete contact, and output a detection signal if so.

[0066] In this embodiment, since the detection module 10 and the switch module 20 are located on two different boards, the detection signal also needs to be transmitted from the second board to the first board through the detection signal pin in the board interconnect connector to reach the controlled end of the switch module 20. At this time, since the detection signal pin is also a pin of the board interconnect connector, if the wiring harness of the board interconnect connector is not fully in contact, the detection signal may also not be in contact, and the detection signal cannot be transmitted from the second board to the first board. In this case, the switch module 20, not receiving the detection signal, will control itself to shut down according to the above control logic, ensuring the hot-plug protection function is implemented. Therefore, the detection module 10 does not need to detect whether the wiring harness of the board interconnect connector is not fully in contact; it only needs to continuously output the detection signal. If the wiring harness of the board interconnect connector is not fully in contact, the detection signal may not reach the controlled end of the switch module 20 (the detection signal pin connected to the controlled end of the switch module 20 is floating and in a high-impedance state), but it still serves the purpose of detecting whether the wiring harness of the board interconnect connector is not fully in contact.

[0067] Therefore, the specific location arrangement scheme of the detection module 10 and the switch module 20 provided in this embodiment, by placing the detection module 10 and the switch module 20 on two different boards, and implementing the communication transmission of detection signals between them through the wiring harness of the board interconnect connector, changes the detection logic: the original active detection, which required the detection module 10 to check whether the wiring harness of the board interconnect connector was fully connected, is changed to passive detection, where the output detection signal cannot reach the controlled end of the switch module 20 when the wiring harness of the board interconnect connector is not fully connected. Based on this, no module, including the detection module 10, needs to perform any specific detection behavior; the detection module 10 only needs to continuously output detection signals, greatly reducing the implementation difficulty of the detection module 10 and this circuit.

[0068] On the other hand, although the above embodiments do not limit the specific implementation of the detection signal, considering that in the previous embodiment, the detection module 10 and the switch module 20 are designed separately, and the detection signal is also transmitted through the board interconnect connector, an additional problem arises:

[0069] Since the transmission of the detection signal is fundamental to the hot-swap protection function (the switch module 20 needs to receive the detection signal to turn off), the detection signal is highly likely to contact the ground signal before or simultaneously with the ground signal. Therefore, in board interconnection scenarios, the detection signal may also become another signal that precedes the ground signal, leading to hot-swap issues.

[0070] To address the aforementioned issues, this embodiment provides an optional implementation for the detection signal: the detection signal is a low-level signal.

[0071] In this embodiment, a low-level signal is used as the detection signal, which is equivalent to a ground signal (referred to as a detection ground signal to distinguish it from the original ground signal). Therefore, even if the detection ground signal contacts the ground signal before the ground signal, the series of problems existing in the hot-swap scenario described above will not occur, and the normal implementation of the hot-swap protection function can still be guaranteed.

[0072] Furthermore, regarding the specific implementation of the detection module 10 when a low-level signal is used as the detection signal, this embodiment also adaptively provides an optional implementation scheme. The detection module 10 includes a pull-down resistor, the first end of which is grounded, and the second end of which is connected to the detection signal pin.

[0073] It should be noted that the ground in this embodiment can be the ground in the second board. Therefore, this embodiment only requires one pull-down resistor to generate the detection signal, resulting in a simple and reliable circuit structure.

[0074] On the other hand, as can be seen from the above embodiments, the hot-swap protection circuit provided in this application mainly achieves the hot-swap protection function through the cooperation between the detection module 10 and the switch module 20. However, in practical applications, this application is not limited to including only the detection module 10 and the switch module 20 in the hot-swap protection circuit. Due to some other needs in practical applications, other requirements may be put forward for the detection module 10 or the switch module 20. For example, in the above embodiment, the detection signal is required to be low level, which puts forward new requirements for the control logic of the switch module 20: when the controlled end receives a low level signal, the switch module 20 is turned off; when the controlled end is in a high impedance state, the switch module 20 is turned on. However, it is difficult to find an electronic switch that can be directly applied to implement the switch module 20 in practical applications. Therefore, this embodiment provides an optional implementation scheme. Figure 2 As shown, the circuit also includes a control module 30.

[0075] The control module 30 is located on the first board. The input terminal of the control module 30 is connected to the detection signal pin, and the output terminal of the control module 30 is connected to the controlled terminal of the switch module 20.

[0076] In this embodiment, the control module 30 is mainly used to convert different signal states output by the detection signal pin into specific control signals required to control the switching state of the switch module 20, thereby reducing the implementation requirements of the switch module 20. For example, in the above embodiment, a low-level output from the detection signal pin requires the switch module 20 to be turned off, and a floating, high-impedance state requires the switch module 20 to be turned on. This can be converted by the conversion module to: when the detection signal pin outputs a low level, the control module 30 outputs a low level to control the switch module 20 to be turned off; when the detection signal pin is in a high-impedance state, the control module 30 outputs a high level to control the switch module 20 to be turned on. Electronic switches that control the on / off state through high and low levels are quite common and easy to select and implement. However, it should be noted that the above is only an example and is not limited to the control module 30 being used only to implement the above conversion. The conversion function of the control module 30 should be adapted to the form of the detection signal and the control logic of the switch module 20.

[0077] Furthermore, regarding the scheme of transmitting detection signals through the detection signal pins in the board interconnect connector in the above embodiments, this embodiment also provides a further implementation scheme, such as... Figure 3 As shown:

[0078] The control module 30 includes a logic processing module 31, which includes multiple input terminals.

[0079] The detection signal output by the detection module 10 is divided into multiple detection sub-signals through multiple detection signal pins in the board interconnect connector, and output to multiple input terminals of the logic processing module 31 respectively.

[0080] When the logic processing module 31 receives the detection sub-signal at each input terminal, it outputs the detection signal.

[0081] In this embodiment, a single detection signal is divided into multiple detection sub-signals to detect whether the wiring harness of the board interconnect connector is in complete contact. The logic processing module 31 then processes these multiple detection sub-signals back into a single detection signal to control the switching state of the switch module 20. It should be noted that this embodiment does not limit the specific number of detection sub-signals, but there should be at least two detection sub-signals, as shown below. Figure 3 The two signals KB_CABLE_DET1 and KB_CABLE_DET2 shown are processed by logic processing module 31 to obtain the final detection signal KB_CABLE_DET used for controlling switch module 20. Figure 3 KB_CABLE_DET_A is a signal directly output by the logic processing module 31. If, as described in the above embodiment, there are no other circuits or sub-modules in the control module 30, then KB_CABLE_DET_A = KB_CABLE_DET.

[0082] Furthermore, in this embodiment, the "detection signal" refers to the control signal used to control the on / off state of the switch module 20. As explained in the previous embodiment, when the detection signal output by the detection module 10 is not divided into multiple detection sub-signals (when the output terminal of the detection module 10 is directly or indirectly connected to the controlled terminal of the switch module 20 without other signal processing), the detection signal output by the detection module 10 can be directly used to control the on / off state of the switch module 20. In this embodiment, the detection signal output by the detection module 10 is divided into multiple detection sub-signals, and the logic processing module 31 processes these multiple detection sub-signals back into a detection signal to detect whether the wire harness is in complete contact. At this time, the detection signal output by the logic processing module 31 is used to directly control the on / off state of the switch module 20. Further, in this embodiment, the detection signal output by the detection module 10 is the source of all subsequent detection sub-signals and detection signals (i.e., the detection signal output by the logic processing module 31), and the detection signal output by the logic processing module 31 is directly used to control the on / off state of the switch module 20. Therefore, if the detection module 10 does not output a source signal, the logic processing module 31 also cannot output a signal directly used for the on / off control of the switch module. That is, the signals output by both the detection module 10 and the logic processing module 31 can be used to control the on / off state of the switch module 20; the only difference is that one controls directly and the other indirectly. In a further embodiment, the signals output by the detection module 10 and the logic processing module 31 are of the same form and can achieve the same function (i.e., the detection signal is used to control the on / off state of the switch module 20). As in the example given in the above embodiment, if the detection signal is a low-level signal, then the signals output by both the detection module 10 and the logic processing module 31 are this low-level signal. The conduction logic of the switch module 20 is: it is turned off when a low-level signal is received, and turned on when no low-level signal is received. However, the switch module 20 itself does not care who outputs this low-level signal; it only determines its on / off state based on whether the controlled end receives this low-level signal.

[0083] It should be noted that this embodiment does not limit the specific implementation form of the logic processing module 31. It can be implemented using logic gate circuits, such as AND gates and OR gates. Alternatively, it can be implemented using more advanced devices with logic processing capabilities, such as microcontroller units (MCUs) and digital signal processing (DSPs). This embodiment does not impose any restrictions on this. Furthermore, this embodiment does not limit the specific processing logic implemented by the logic processing module 31. For example, it can be logical AND processing, logical OR processing, etc., which should be determined according to the detection sub-signal and the control logic of the switching module 20.

[0084] However, it's important to note that the purpose of setting up multiple detection sub-signals in this embodiment is to achieve more accurate detection of "incomplete contact" of the wiring harness. It's easy to understand that when only one detection signal is used, there is only one detection signal pin in the board interconnect connector. In this case, the absence of contact by the detection signal necessarily indicates that the wiring harness is "incompletely contacting," but contact by the detection signal does not necessarily indicate that the wiring harness is "completely contacting." If only the detection signal is in contact, while other signals are not in contact or not fully in contact, there is still a possibility that other signals, such as power signals, may have contacted before the ground signal, leading to inaccurate detection.

[0085] However, in this embodiment, a single detection signal is divided into multiple detection sub-signals, and these sub-signals are transmitted through multiple detection signal pins to comprehensively detect whether the wire harness is in complete contact. Only when all detection sub-signals show contact is the wire harness considered to be in complete contact. This complete contact detection scheme is more accurate than the scheme described above.

[0086] In addition, in this scenario, the logic processing module 31 should perform a "logical AND" operation on the detection sub-signal. It should be noted that "logical AND" here does not mean that the logic processing module 31 is an AND gate, but rather that the logic processing module 31 only outputs the detection signal when all detection signal pins output the detection sub-signal; otherwise, it does not output the detection signal. For example, in the above embodiment, if the detection sub-signal is a low-level signal, then to implement the "logical AND" operation on the detection sub-signal (outputting "0" only when all inputs are "0"), an OR gate should be used as the logic processing module 31. Similarly, if the output detection signal needs to control the shutdown of the switch module 20 when it is high-level (outputting "1" only when all inputs are "0"), then a NOR gate can be further selected as the logic processing module 31. This embodiment does not impose any restrictions on this. For example... Figure 3 The logic processing module 31 is a NOR gate Q155 composed of two metal-oxide-semiconductor field-effect transistors (MOSFETs). When both detection signals KB_CABLE_DET1 and KB_CABLE_DET2 are low (another state is high impedance), it outputs a high-level signal KB_CABLE_DET_A to control the switch module 20 to turn off.

[0087] Based on the logic processing module 31 provided in this embodiment, it is known that the detection accuracy of considering the wiring harness of the board interconnect connector to be in complete contact only when one detection signal is in contact is low. However, the detection accuracy is guaranteed when multiple detection sub-signals are in contact. Especially for board interconnect connectors in the form of wiring harnesses, since the different detection signal pins are positioned differently, if all detection signal pins are in complete contact, it can effectively indicate that the wiring harness is in complete contact.

[0088] When there are two detection signal pins, a more accurate implementation is to use the two outermost pins of the wire harness, located on both sides. For example, in a wire harness (8 pins) with pins 0-7 arranged in a row, the detection signal pins could be pins 0 and 7.

[0089] It should also be noted that this embodiment requires the control module 30 to include the logic processing module 31, but does not require the control module 30 to include only the logic processing module 31. For example... Figure 3 As shown, the control module 30 may also include devices that perform other functions based on other needs, such as an N-type MOSFET (referred to as an NMOS transistor) Q174. It may also include other circuits or devices used in conjunction with the logic processing module 31, such as voltage divider circuits (R3897 and R3898, R3903 and R3905), current limiting resistors (R3979, R3980), etc. This embodiment does not impose any restrictions on this.

[0090] On the other hand, regarding the aforementioned protected pins (i.e., the protected signals that need to be contacted after the ground signal), that is, other signal pins in the board interconnect connector harness that are expected to be contacted after the ground signal in practical applications, this embodiment does not limit which signal pins in the board interconnect connector harness are specifically protected pins. Furthermore, as explained in the hot-swap protection background section above, the implementation of the hot-swap protection function should ensure that all signals in the harness, except for the ground signal, are contacted after the ground signal (except when this signal itself is always a low-level signal equivalent to the ground signal, such as the low-level detection signal provided in the above embodiment). Therefore, in an optional implementation, all signals in the harness except for the ground signal can be considered protected signals, and all their corresponding signal pins can be considered protected pins.

[0091] However, it is easy to see that the more protected pins there are, the more switch modules 20 are required, or the more complex the structure of the switch modules 20 becomes, which is not conducive to implementation. Therefore, this embodiment provides an optional implementation scheme, such as... Figure 2 As shown:

[0092] The protected pins are the power signal pins in the board interconnect connector. The first board is the powered board among the two boards connected via the board interconnect connector.

[0093] It is readily apparent that almost all components on the board require power (i.e., a power signal) to function properly. Correspondingly, other non-ground signals (non-low-level signals) also require a power signal before they can be generated and output. Therefore, it is easy to deduce that as long as the power signal in the control board interconnect connector contacts later than the ground signal, all other signals that require power to generate will also contact later than the ground signal, thus achieving hot-swap protection. Furthermore, in this embodiment, by only setting the power signal switch module 20 to achieve the above protection, the requirements for the number and structural complexity of the switch modules 20 are lower, making it easier to implement.

[0094] It should also be noted that the above embodiments provide an implementation scheme in which the switch module 20 and the detection module 10 are set on different boards, but no restrictions are made on which specific boards the first board and the second board are. In this embodiment, the first board is the board that provides power (such as the board with a built-in battery). The advantage of setting the switch module 20 on the first board is that when the switch module 20 is turned off, it can not only prevent the power signal loop from being connected to avoid the power signal contacting the ground signal first, but also ensure that the power signal cannot be output from the first board. That is, the power signal pins in the board interconnect connector harness are de-energized, further ensuring the safety during hot-plugging.

[0095] Furthermore, based on the above embodiments, this embodiment also provides an optional implementation scheme for the switch module 20, such as... Figure 3 As shown: Switching module 20 includes a switching transistor (such as...) Figure 3 (Q172 and Q173 in the text).

[0096] The first terminal of the switching transistor is connected to the output terminal of the power supply (e.g., Figure 3 Switch Q172 corresponds to the system power supply SYS_PWR, and switch Q173 corresponds to the input power supply VIN. The second terminal of the switch is connected to the power signal pin (e.g., Figure 3 The system power signal pin SYS_PWR_KB and the input power signal pin VIN_KB are connected, and the controlled terminal of the switching transistor is connected to the output terminal of the logic processing module 31.

[0097] It should be noted that the aforementioned switching transistor can be a common switching transistor such as a MOSFET or a bipolar transistor. This embodiment does not limit this; the appropriate type of switching transistor can be selected according to actual needs. Furthermore, it should be noted that although this embodiment uses a switching transistor to meet the control requirements of the switching module 20 in controlling the on / off state of the circuit, it is not limited to the switching module 20 containing only switching transistors. Figure 3 As shown, the switching module 20 may also include other circuits that work in conjunction with the switching transistor, such as a resistor-capacitor (RC) charging and discharging circuit.

[0098] Furthermore, this embodiment, combining the above embodiments' detection signal being low-level, control module 30 including logic processing module 31, and switch module 20 including switching transistor, also provides an optional implementation scheme for the functional implementation of switch module 20. For example... Figure 3 As shown:

[0099] Logic processing module 31 is a NOR gate (such as...) Figure 3 The NOR gate Q155 consists of two MOSFETs.

[0100] The switching transistor is a PMOS transistor (e.g.) Figure 3 In the PMOS transistor (Q172 and Q173), the source of the PMOS transistor is the first terminal of the switching transistor, the drain of the PMOS transistor is the second terminal of the switching transistor, and the gate of the PMOS transistor is the controlled terminal of the switching transistor.

[0101] The control module 30 also includes an NMOS transistor 32 (such as...). Figure 3 (Q174 in the diagram); the source of NMOS transistor 32 is grounded, the gate of NMOS transistor 32 is connected to the gate of PMOS transistor, and the gate of NMOS transistor 32 is connected to the output of NOR gate.

[0102] Depend on Figure 3 It is known that when the switching transistor is a PMOS transistor and its source and drain are connected in series in the power supply signal loop, the PMOS transistor is turned off when its gate is connected to a high level (voltage higher than the threshold voltage) and turned on when its gate is connected to a low level (voltage lower than the threshold voltage). However, since the logic processing module 31 is a NOR gate, it outputs a high-level signal when it receives a detection signal (low-level signal) at all its inputs. This does not conform to the conduction logic of the PMOS transistor and the switching module 20. Therefore, in this embodiment, an NMOS transistor 32 is added between the logic processing module 31 and the PMOS transistor for inverting the level logic, i.e., as shown in the figure. Figure 3 As shown:

[0103] When both detection signals KB_CABLE_DET1 and KB_CABLE_DET2 are low, after processing by the NOR gate Q155, the output signal KB_CABLE_DET_A is high. At this time, the gate of NMOS transistor 32 is connected to a high-level signal and is turned on. KB_CABLE_DET is grounded and the voltage is pulled low, which is equivalent to the output signal KB_CABLE_DET being low. Since the control signal is low, the PMOS transistor is turned off, ensuring that the power output is cut off and preventing the power signal from contacting the ground signal before the ground signal.

[0104] Similarly, when the interconnect connector harness is fully connected (i.e., the ground signal is connected first), if either of the two detection signals KB_CABLE_DET1 and KB_CABLE_DET2 is in a high-impedance state, after processing by the NOR gate Q155, the output signal KB_CABLE_DET_A is low. At this time, the gate of NMOS transistor 32 is connected to a high-level signal and is cut off. KB_CABLE_DET is not grounded but is pulled up through the system power supply SYS_PWR (actually, the system power supply SYS_PWR charges capacitor C4796, making the voltage at KB_CABLE_DET high), which is equivalent to the control signal KB_CABLE_DET being high. At this time, the PMOS transistor is turned on, the power output is restored, and the power signal can be successfully output to another board through the interconnect connector.

[0105] It should be noted that the specific circuit structure of the control module 30 and switch module 20 provided in this embodiment is only one possible implementation. Even if the conditions remain unchanged, such as the switch module 20 using a switching transistor, the control module 30 including a logic processing module 31, and the detection signal being low-level, there is another optional implementation to achieve the above-mentioned hot-plug protection function: the logic processing module 31 is an OR gate, the switching transistor is still a PMOS transistor, but in this case, the control module 30 does not need to include an NMOS transistor 32. However, this solution may have insufficient driving capability, that is, the high-level signal output by the logic processing module 31 may not be enough to drive the PMOS transistor to turn off. Furthermore, the solution provided in this embodiment indirectly controls the voltage at the gate of the PMOS transistor by charging the RC charging and discharging circuit with the power supply signal corresponding to each PMOS transistor and discharging the RC charging and discharging circuit with the NMOS transistor 32. The signal KB_CABLE_DET indirectly, rather than directly, controls the conduction and turn-off of the PMOS transistor, thus ensuring better driving capability and safety.

[0106] Therefore, the specific implementation scheme provided above in this embodiment is a feasible, simple and reliable switch control scheme that ensures that the power signal output path can be controlled to be turned on and off according to the detection signal, and that the power signal is contacted later than the ground signal, thereby realizing the hot-swap protection function.

[0107] On the other hand, it should be noted that in practical applications, there may not be a single power signal in a single board interconnect connector harness. The above embodiments also do not limit the number of power signals protected to only one. For example... Figure 3 As shown, the protected signals include two power signals: the system power supply SYS_PWR and the input power supply VIN. At this time, multiple signal loops need to be controlled by the switching module 20 to turn on and off, placing higher demands on the switching module 20. Therefore, this embodiment also provides an optional implementation scheme, such as... Figure 3 As shown:

[0108] There are multiple protected pins, and multiple switch modules 20, each corresponding to one of the protected pins.

[0109] In this embodiment, there are multiple protected pins, meaning there are multiple protected signals. Multiple switch modules 20 control the on / off state of the circuit containing each protected pin, ensuring that each protected signal contacts the ground signal later, thus achieving reliable hot-swap protection. Furthermore, the switch module 20 implementation provided in this embodiment places lower demands on the switch module 20 compared to controlling the on / off state of multiple signal circuits with a single switch module 20. Especially when multiple protected signals are power signals, if two power signals are interconnected, there is a risk of current flowing back from one power source to another, posing a serious safety hazard. This embodiment, by independently controlling the on / off state of multiple switch modules 20, effectively avoids this safety hazard.

[0110] Furthermore, also addressing the potential current reverse flow problem in the circuit between the two power signals when the protected signal is a power signal, this embodiment provides a further implementation scheme, such as... Figure 3 As shown: the controlled terminals of each switch module 20 are connected together.

[0111] The hot-swap protection circuit also includes multiple diodes 40 that correspond one-to-one with each switch module 20.

[0112] Specifically, for each diode 40: the positive terminal of diode 40 is connected to the controlled terminal of the corresponding switch module 20, and the negative terminal of diode 40 is connected to the controlled terminal of the other switch module 20.

[0113] As can be seen from the above embodiments, when there are multiple protected pins, the on / off state of the circuit containing each protected pin can be controlled by multiple switch modules 20. However, regardless of the number of switch modules 20, the conduction control is based on a unified detection signal (or a control signal processed by the logic processing module 31). Therefore, as Figure 3As shown, a convenient control scheme (compared to schemes that divide the detection signal into multiple independent control signals through a splitter or isolation module) is as follows: the controlled terminals of each switch module 20 are connected together.

[0114] However, a new problem arises at this point: the interconnection of the controlled terminals of the switching modules 20 also provides the possibility of interconnecting the power signals controlled by each switching module 20. Especially in Figure 3 In this configuration, when the switching of the PMOS transistors in each switching module 20 is indirectly controlled by charging the RC charging and discharging circuits (such as R3899 and C4796, R3904 and C4797) with the corresponding power supply signals and discharging the RC charging and discharging circuits with the NMOS transistor 32, capacitors C4796 and C4797 are directly connected. Since capacitors C4796 and C4797 are charged by power supplies SYS_PWR and VIN respectively, they can be charged to the same voltage level as the output voltage of power supplies SYS_PWR and VIN. This poses a safety hazard of current from one power supply flowing back to the other.

[0115] Based on this, this embodiment sets a diode 40 at the controlled terminal of the switch module 20. The positive terminal of the diode 40 faces inward and is connected to the controlled terminal of the corresponding switch module 20, while the negative terminal of the diode 40 faces outward and is connected to other switch modules 20 (i.e., indirectly connected through diodes 40 set at the controlled terminals of other switch modules 20) to receive the detection signal. When the detection signal is low, the diode 40 will not affect the flow of the detection signal to the controlled terminal of the switch module 20 to control its turn-off. However, it can ensure that the power signal controlled by the switch module 20 will not flow back to other switch modules 20, thereby avoiding the safety hazards caused by current backflow between power supplies.

[0116] More specifically, such as Figure 3 As shown, based on the diode 40 provided in this embodiment; when the NMOS transistor 32 is turned on, the PMOS transistor in each switching module 20 is still equivalent to grounded, the RC charging and discharging circuit discharges, and the current flows in from the positive terminal of the diode 40 and flows out from the negative terminal of the diode 40 until it is released through the grounding of the NMOS transistor 32; when the voltage across the capacitor is lower than the threshold voltage of the PMOS transistor, the PMOS transistor is turned on, and the power signal output is restored; however, this current will be blocked by the diode 40 set at the controlled terminal of other switching modules 20, and will not flow into the capacitor in other switching modules 20 or the protected power supply, thus avoiding the above-mentioned safety hazards.

[0117] In the above embodiments, a hot-swap protection circuit has been described in detail. This application also provides an embodiment corresponding to a medical device. The medical device provided in this embodiment includes the hot-swap protection circuit provided in any of the above embodiments.

[0118] It should be noted that the medical device provided in this embodiment is the same as the aforementioned device that includes a built-in power source such as a battery. Inside the medical device, there is a board containing a power source (such as a battery), which connects to other boards via board interconnect connectors (which can be in the form of wire harnesses). The board containing the power source is the one described in the above embodiment. Figure 1 and Figure 2 The first board in the circuit is the second board, and the other boards are the second boards.

[0119] Since the embodiments for the medical device section correspond to those for the hot-swap protection circuit section, please refer to the description of the embodiments for the hot-swap protection circuit section for the medical device section embodiments, which will not be repeated here. As can be seen from the above embodiments for the hot-swap protection circuit section, even if the interconnecting connectors of the two boards using this circuit are in the form of wire harnesses, hot-swap protection can still be achieved. This prevents damage to the related interface circuits on the boards due to hot-swapping during medical device maintenance, ensuring the reliability and safety of the medical device.

[0120] The above provides a detailed description of a hot-swap protection circuit and medical device provided by this utility model. The various embodiments in the specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the medical device disclosed in the embodiments, since it corresponds to the hot-swap protection circuit disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the description of the hot-swap protection circuit. It should be noted that those skilled in the art can make several improvements and modifications to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the protection scope of this utility model.

[0121] It should also be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A hot-swap protection circuit, characterized in that, include: Detection module (10) and switch module (20); The detection module (10) outputs a detection signal when the wire harness of the board interconnect connector is not in complete contact; The switch module (20) is located in the circuit where the protected pin is located; wherein, the protected pin is any pin in the board interconnect connector except for the ground signal pin; The controlled terminal of the switch module (20) is connected to the output terminal of the detection module (10); the switch module (20) is turned off when it receives the detection signal and turned on when it does not receive the detection signal.

2. The hot-swap protection circuit according to claim 1, characterized in that, The switch module (20) is disposed on the first board, and the detection module (10) is disposed on the second board; the first board and the second board are connected through the board interconnect connector; The detection module (10) is used to output a detection signal; The controlled end of the switch module (20) is connected to the output end of the detection module (10) through the detection signal pin in the board interconnect connector.

3. The hot-swap protection circuit according to claim 2, characterized in that, The detection signal is a low-level signal; The detection module (10) includes a pull-down resistor; The first end of the pull-down resistor is grounded, and the second end of the pull-down resistor is connected to the detection signal pin.

4. The hot-swap protection circuit according to claim 2, characterized in that, Also includes: Control module (30); The control module (30) is located on the first board. The input terminal of the control module (30) is connected to the detection signal pin, and the output terminal of the control module (30) is connected to the controlled terminal of the switch module (20).

5. The hot-swap protection circuit according to claim 4, characterized in that, The control module (30) includes: a logic processing module (31), which includes multiple input terminals; The detection signal output by the detection module (10) is divided into multiple detection sub-signals through multiple detection signal pins in the board interconnect connector, and output to multiple input terminals of the logic processing module (31) respectively; When the logic processing module (31) receives the detection sub-signal at each of the input terminals, it outputs the detection signal.

6. The hot-swap protection circuit according to claim 5, characterized in that, The protected pin is the power signal pin in the board interconnect connector; The first board is the power-enabled board among two boards connected via the board interconnect connector.

7. The hot-swap protection circuit according to claim 6, characterized in that, The switching module (20) includes a switching transistor; The first end of the switching transistor is connected to the output terminal of the power supply, the second end of the switching transistor is connected to the power signal pin, and the controlled end of the switching transistor is connected to the output terminal of the logic processing module.

8. The hot-swap protection circuit according to claim 7, characterized in that, The detection signal is a low-level signal; the logic processing module (31) is a NOR gate; the switching transistor is a PMOS transistor, the source of the PMOS transistor is the first terminal of the switching transistor, the drain of the PMOS transistor is the second terminal of the switching transistor, and the gate of the PMOS transistor is the controlled terminal of the switching transistor. The control module (30) also includes an NMOS transistor (32); The source of the NMOS transistor (32) is grounded, the gate of the NMOS transistor (32) is connected to the gate of the PMOS transistor, and the gate of the NMOS transistor (32) is connected to the output of the NOR gate.

9. The hot-swap protection circuit according to any one of claims 1 to 8, characterized in that, There are multiple protected pins; there are multiple switch modules (20), and each of them corresponds to one of the protected pins.

10. The hot-swap protection circuit according to claim 9, characterized in that, The controlled terminals of each of the aforementioned switch modules (20) are connected together; The hot-swap protection circuit also includes a plurality of diodes (40) corresponding one-to-one with each of the switch modules (20). For each of the diodes (40): the positive terminal of the diode (40) is connected to the controlled terminal of the corresponding switch module (20), and the negative terminal of the diode (40) is connected to the controlled terminals of the other switch modules (20).

11. A medical device, characterized in that, include: The hot-swap protection circuit as described in any one of claims 1 to 10.

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