Anti-loose earphone PCBA mainboard
Patent Information
- Application Number
- CN202521562717.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-25
- Publication Date
- 2026-08-21
- Estimated Expiration
- 2035-07-25
AI Technical Summary
[0005]针对现有技术的不足,本实用新型的目的在于提供一种防松动式耳机PCBA主板,旨在解决现有技术通常采用螺纹连接与耳机壳体固定,然而耳机使用中难免产生晃动,比如佩戴时的肢体动作、收纳时的碰撞,这些持续的微小震动会让螺纹连接处逐渐“松脱”,加之耳机内部空间狭小,螺纹尺寸通常很小且牙距细密,一旦出现细微位移就可能导致螺帽或螺丝松动,松动后主板与其他部件的电路连接会受影响,从而出现接触不良的现象的问题
[0016]本实用新型使用时预先将耳机PCBA主板四周边部所设预设插槽对准耳机待安装部的螺槽处,接着将空心螺柱插入该螺槽,利用两者的螺纹匹配性可形成初步固定,随后在螺纹引导下空心螺柱持续下降过程中,其末端固定的连接柱会插入螺槽部底端预设的孔槽,且该孔槽的两侧设有嵌卡槽,当连接柱中部两侧活动装设的嵌卡柱经过上述两个嵌卡槽时,会根据各自一端所连接的连导架以及该部连接的复位弹簧的弹性自然对位卡入嵌卡槽中,由此即可达到对空心螺柱本身的再次固定,配合空心螺柱上部所套设的尼龙圈与预设插槽顶端形成的阻尼防松,可大幅提高整体的防松效果。
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Figure CN224670002U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of headphone PCBA motherboard, specifically relating to an anti-loosening headphone PCBA motherboard. Background Technology
[0002] PCBA is an important electronic component, serving as the support for electronic components. It refers to the entire manufacturing process of a bare PCB board through surface mount technology (SMT) or DIP (Dual In-line Package) assembly. Also known as a printed circuit board, it is called a "printed" circuit board because it is manufactured using electronic printing technology. Before the advent of printed circuit boards, the interconnection between electronic components relied on direct wire connections to form complete circuits. In headphones, PCBAs need to connect multiple main control chips, earpieces, microphones, batteries, and microphone heads, typically used to implement functions such as Bluetooth and audio amplifier control.
[0003] In modern headphone PCBA motherboards, threaded connections are typically used to secure the headphone housing during installation. However, headphone movement is inevitable during use, such as body movements while wearing them or collisions during storage. These continuous micro-vibrations can cause the threaded connections to gradually loosen. In addition, the internal space of the headphone is small, and the thread size is usually very small with fine pitch. Even a slight displacement can cause the nuts or screws to loosen. Once loosened, the circuit connection between the motherboard and other components will be affected, resulting in poor contact. Utility Model Content
[0004] (1) Technical problems to be solved
[0005] To address the shortcomings of existing technologies, the purpose of this utility model is to provide an anti-loosening headphone PCBA mainboard. This addresses the problem that existing technologies typically use threaded connections to fix the headphone shell. However, headphone movement is inevitable during use, such as body movements while wearing it or collisions during storage. These continuous, minute vibrations can cause the threaded connections to gradually loosen. Furthermore, the small internal space of the headphone and the typically small thread size with fine pitch mean that even slight displacement can cause the nuts or screws to loosen. Loosening can affect the circuit connections between the mainboard and other components, leading to poor contact.
[0006] (2) Technical solution
[0007] To solve the above-mentioned technical problems, this utility model provides an anti-loosening headphone PCBA motherboard, including a motherboard, an anti-loosening mechanism installed on the four periphery of the motherboard, and a damping mechanism provided at the bottom edge of the motherboard. The anti-loosening mechanism includes four preset slots, which are respectively located on the four periphery of the motherboard. A threaded assembly is provided in the middle of the four preset slots. The threaded assembly includes a hollow stud, and an anti-loosening component is jointly provided on the inner and outer sides of the hollow stud.
[0008] Furthermore, the threaded assembly includes a hollow stud, which passes through the center of a preset slot, and a nylon ring is fitted around the periphery of the hollow stud.
[0009] Furthermore, the nylon ring is fitted around the hollow stud, and the size of the nylon ring is slightly larger than the preset slot diameter.
[0010] Furthermore, the anti-loosening component includes a connecting frame, which is disposed on the upper section of the hollow stud. A connecting post is fixed at the bottom end of the hollow stud. A fixing block is fixed in the middle of the connecting frame, and return springs are installed on both sides of the fixing block. The ends of the two return springs are connected to connecting guides, and locking posts are fixed on the outer sides of the ends of the two connecting guides. Hand-held blocks are fixed on the same side of the upper section of the two connecting guides, and a guide rod is disposed in the middle of the hollow stud.
[0011] Furthermore, the guide rod is connected to the two connecting guide frames by a movable guide connection.
[0012] Furthermore, the vibration damping mechanism includes double-sided adhesive tape, which is attached to the bottom edge of the motherboard, and a silicone pad is attached to the other side of the double-sided adhesive tape.
[0013] Furthermore, the silicone pad is bonded to the motherboard using double-sided adhesive.
[0014] (3) Beneficial effects
[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0016] In use, the pre-set slots on the periphery of the headphone PCBA motherboard are aligned with the screw grooves of the headphone to be installed. Then, the hollow stud is inserted into the screw groove. The matching of the threads of the two can form a preliminary fixation. Subsequently, as the hollow stud continues to descend under the guidance of the threads, the connecting post fixed at its end will insert into the pre-set hole at the bottom of the screw groove. There are locking slots on both sides of the hole. When the locking posts on both sides of the middle of the connecting post pass through the above two locking slots, they will naturally align and lock into the locking slots according to the elasticity of the connecting guide and the return spring connected to each end. This achieves a second fixation of the hollow stud itself. With the damping anti-loosening formed by the nylon ring on the upper part of the hollow stud and the top of the pre-set slot, the overall anti-loosening effect can be greatly improved.
[0017] This invention features silicone pads attached to the four edges of the bottom of the motherboard using double-sided adhesive. When the motherboard vibrates due to external factors during installation, the silicone pads can directly contact the outer casing, dispersing the vibration energy through their own deformation. This reduces rigid collisions between the motherboard and the outer casing and lowers the risk of loosening of connections such as hollow studs and solder joints. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;
[0020] Figure 2 This is a schematic diagram of a three-dimensional partial structure;
[0021] Figure 3 A partial structural diagram of the anti-loosening mechanism;
[0022] Figure 4 This is a schematic diagram of the vibration damping mechanism.
[0023] The labels in the attached diagram are as follows: 1. Main board; 2. Anti-loosening mechanism; 21. Preset slot; 22. Threaded assembly; 221. Hollow stud; 222. Nylon ring; 23. Anti-loosening component; 231. Connecting bracket; 232. Connecting post; 233. Fixing block; 234. Return spring; 235. Connecting guide; 236. Hand-held block; 237. Guide rod; 238. Embedding post; 3. Vibration damping mechanism; 31. Double-sided adhesive; 32. Silicone pad. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0025] This specific embodiment is an anti-loosening headphone PCBA motherboard, the structural diagram of which is shown below. Figures 1 to 4 As shown, the system includes a motherboard 1. Anti-loosening mechanisms 2 are installed around the four periphery of the motherboard 1, and a damping mechanism 3 is provided at the bottom edge of the motherboard 1. The anti-loosening mechanism 2 includes four preset slots 21, which are distributed around the four periphery of the motherboard 1. A threaded assembly 22 is provided in the center of each of the four preset slots 21. The threaded assembly 22 includes a hollow stud 221, which passes through the center of the preset slot 21. A nylon ring 222 is fitted around the hollow stud 221. Furthermore, the nylon ring 222 is slightly larger than the diameter of the preset slot 21, and the hollow stud 221 is provided with an anti-loosening component 23 on both its inner and outer sides. The anti-loosening component 23 includes a connecting bracket 231, which is located on the upper section of the hollow stud 221. A connecting post 232 is fixedly provided at the bottom end of the hollow stud 221, and a fixing block 233 is fixedly provided in the middle of the connecting bracket 231. Return springs 234 are installed on both sides of the fixing block 233. The ends of the two return springs 234 are connected to connecting guide brackets 235, and the outer sides of the ends of the two connecting guide brackets 235 are fixed with... The device includes a retaining post 238, and two connecting guide brackets 235 with hand-held blocks 236 fixed on the same side of their upper sections. A guide rod 237 is provided in the middle of the hollow stud 221. The guide rod 237 is connected to the two connecting guide brackets 235 by a movable guide connection. In use, the preset slots 21 on the four sides of the headphone PCBA main board 1 are aligned with the screw grooves of the headphone to be installed. Then, the hollow stud 221 is inserted into the screw groove. The thread matching between the two can form a preliminary fixation. Subsequently, as the hollow stud 221 continues to descend under the thread guidance, the connecting post fixed at its end... 232 will be inserted into the pre-set hole at the bottom of the screw groove, and there are locking slots on both sides of the hole groove. When the locking pins 238 movably installed on both sides of the middle part of the connecting pin 232 pass through the above two locking slots, they will naturally align and lock into the locking slots according to the elasticity of the connecting guide 235 connected to one end and the return spring 234 connected to that part. In this way, the hollow stud 221 itself can be fixed again. With the damping anti-loosening formed by the nylon ring 222 fitted on the upper part of the hollow stud 221 and the top of the pre-set slot 21, the overall anti-loosening effect can be greatly improved.
[0026] The vibration damping mechanism 3 includes double-sided adhesive 31, which is attached to the bottom edge of the motherboard 1. A silicone pad 32 is attached to the other side of the double-sided adhesive 31. The silicone pad 32 is attached to the motherboard 1 by means of the double-sided adhesive 31. The silicone pad 32 is attached to the bottom edge of the motherboard 1 by means of the double-sided adhesive 31. When the motherboard 1 vibrates due to external factors in the installed state, the vibration energy can be dispersed by the silicone pad 32 directly contacting the shell, thereby reducing the rigid collision between the motherboard 1 and the shell and reducing the risk of loosening of the hollow studs 221, solder joints and other connection parts.
[0027] Working principle: During use, the pre-set slots 21 on the four sides of the headphone PCBA main board 1 are aligned with the screw grooves of the headphone to be installed. Then, the hollow stud 221 is inserted into the screw groove. The thread matching between the two can form a preliminary fixation. Subsequently, as the hollow stud 221 continues to descend under the thread guidance, the connecting post 232 fixed at its end will insert into the pre-set hole at the bottom of the screw groove. There are locking slots on both sides of the hole. When the locking posts 238 movably mounted on both sides of the middle of the connecting post 232 pass through the above two locking slots, they will be springed by the connecting guide 235 connected to one end and the return spring 234 connected to that part. The hollow stud 221 is naturally aligned and inserted into the slot, thereby achieving a second fixation of the hollow stud 221 itself. Combined with the damping and anti-loosening effect formed by the nylon ring 222 fitted on the upper part of the hollow stud 221 and the top of the preset slot 21, the overall anti-loosening effect can be greatly improved. Secondly, silicone pads 32 are attached to the four edges of the bottom of the motherboard 1 with double-sided tape 31. When the motherboard 1 vibrates due to external factors in the installation state, the vibration energy can be dispersed by the direct contact of the silicone pads 32 with the shell through its own deformation, reducing the rigid collision between the motherboard 1 and the shell, and reducing the risk of loosening of the hollow stud 221, solder joints and other connection parts.
[0028] All technical features in this embodiment can be freely combined according to actual needs.
[0029] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A type of anti-loosening headphone PCBA mainboard, comprising a mainboard (1), characterized in that, The motherboard (1) is provided with an anti-loosening mechanism (2) on its four periphery and a damping mechanism (3) is provided at the bottom edge of the motherboard (1). The anti-loosening mechanism (2) includes four preset slots (21) and the four preset slots (21) are respectively located on the four periphery of the motherboard (1). The center of the four preset slots (21) is provided with a thread assembly (22). The thread assembly (22) includes a hollow stud (221) and an anti-loosening component (23) is provided on the inner and outer sides of the hollow stud (221).
2. The anti-loosening headphone PCBA motherboard according to claim 1, characterized in that, The threaded assembly (22) includes a hollow stud (221), and the hollow stud (221) passes through the middle of the preset slot (21), and a nylon ring (222) is sleeved around the periphery of the hollow stud (221).
3. The anti-loosening headphone PCBA motherboard according to claim 2, characterized in that, The nylon ring (222) is fitted around the hollow stud (221), and the size of the nylon ring (222) is slightly larger than the diameter of the preset slot (21).
4. The anti-loosening headphone PCBA motherboard according to claim 1, characterized in that, The anti-loosening component (23) includes a connecting frame (231), which is located on the upper section of the hollow stud (221). A connecting post (232) is fixed at the bottom end of the hollow stud (221). A fixing block (233) is fixed in the middle of the connecting frame (231), and a return spring (234) is installed on both sides of the fixing block (233). The ends of the two return springs (234) are connected to a connecting guide (235), and a locking post (238) is fixed on the outer side of the ends of the two connecting guides (235). A hand-held block (236) is fixed on the same side of the upper section of the two connecting guides (235), and a guide rod (237) is provided in the middle of the hollow stud (221).
5. The anti-loosening headphone PCBA motherboard according to claim 4, characterized in that, The guide rod (237) is connected to the two connecting guide frames (235) by a movable guide connection.
6. The anti-loosening headphone PCBA motherboard according to claim 1, characterized in that, The vibration damping mechanism (3) includes double-sided adhesive (31), and the double-sided adhesive (31) is attached to the bottom edge of the motherboard (1), and a silicone pad (32) is attached to the other side of the double-sided adhesive (31).
7. The anti-loosening headphone PCBA motherboard according to claim 6, characterized in that, The silicone pad (32) is bonded to the motherboard (1) using double-sided tape (31).