A cover film for a PCB

Abstract

The utility model discloses a kind of cover films for PCB, including circuit board, the top of the circuit board is equipped with several gold fingers near front side, the top of the circuit board is connected with first diaphragm near front side, the left and right sides of the first diaphragm are connected with first embracing strip, the bottom of the circuit board is connected with second diaphragm near front side, the left and right sides of the first diaphragm are connected with second embracing strip, a kind of cover film for PCB of the utility model, the device is welded to the gold finger of first diaphragm and is carried out mode, avoid gold finger fracture, to guarantee the normal work of circuit board, then through first embracing strip and second reinforcing bonding strip mutual cooperation, and second diaphragm passes through second embracing strip and first reinforcing bonding strip mutual cooperation, to further fix first diaphragm, improve the protection performance of first diaphragm to gold finger, avoid gold finger fracture, to guarantee the normal work of electronic component.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a cover film for PCB. Background Technology

[0002] PCB circuit boards, also known as printed circuit boards, printed circuit boards, or printed circuit boards, typically require a cover film (also called a protective film) as a protective layer on their surface. However, in the application of flexible printed circuit boards, problems often arise during soldering, such as the gold fingers at the solder joints of the flexible printed circuit board easily breaking, causing malfunctions and resulting in losses. Utility Model Content

[0003] In order to overcome the shortcomings of the prior art, one of the objectives of this utility model is to provide a cover film for PCB.

[0004] One of the objectives of this utility model is achieved through the following technical solution: A cover film for PCB includes a circuit board. The top of the circuit board near the front side has a plurality of gold fingers. A first film is connected to the top of the circuit board near the front side. First ring strips are connected to the left and right sides of the first film. A second film is connected to the bottom of the circuit board near the front side. Second ring strips are connected to the left and right sides of the first film.

[0005] Furthermore, the width of the first diaphragm is greater than the width of the gold finger, and the width of the second diaphragm is the same as the width of the first diaphragm.

[0006] Furthermore, two first reinforcing adhesive strips are fixedly connected to the top of the first diaphragm, and the first reinforcing adhesive strips match the second circumferential strips.

[0007] Furthermore, two second reinforcing adhesive strips are fixedly connected to the bottom of the first diaphragm, and the second reinforcing adhesive strips match the first circumferential strip.

[0008] Furthermore, the two first reinforcing adhesive strips and the two second reinforcing adhesive strips are arranged symmetrically about the central axis of the circuit board.

[0009] Compared with the prior art, the beneficial effects of this utility model are: This utility model discloses a cover film for PCBs. The device uses a first film to protect the soldered gold fingers, preventing them from breaking and ensuring the normal operation of the circuit board. Then, the first film is further fixed by the interaction of a first retaining strip and a second reinforcing adhesive strip, and by the interaction of a second film with the second retaining strip and the first reinforcing adhesive strip. This improves the protective performance of the first film for the gold fingers, preventing them from breaking and thus ensuring the normal operation of electronic components. Attached Figure Description

[0010] Figure 1 This is a frontal perspective view of the present invention; Figure 2 This is a bottom-view perspective view of the present invention; Figure 3 This is a rear-view perspective view of the present invention.

[0011] The following are the labels in the diagram: 1. Circuit board; 2. Gold finger; 3. First diaphragm; 4. First retaining strip; 5. Second diaphragm; 6. Second retaining strip; 7. First reinforcing adhesive strip; 8. Second reinforcing adhesive strip. Detailed Implementation

[0012] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0013] Please see Figure 1-3 This utility model provides a technical solution: a cover film for PCBs, including a circuit board 1. Several gold fingers 2 are provided on the top of the circuit board 1 near the front side. A first film 3 is connected to the top of the circuit board 1 near the front side. First circumferential strips 4 are connected to both the left and right sides of the first film 3. A second film 5 is connected to the bottom of the circuit board 1 near the front side. Second circumferential strips 6 are connected to both the left and right sides of the first film 3. The width of the first film 3 is greater than the width of the gold fingers 2. The width of the second film 5 is the same as the width of the first film 3. Two first reinforcing adhesive strips 7 are fixedly connected to the top of the first film 3, and the first reinforcing adhesive strips 7 and the second circumferential strips 6 are matched. Two second reinforcing adhesive strips 8 are fixedly connected to the bottom of the first film 3, and the second reinforcing adhesive strips 8 are matched with the first circumferential strips 4. The two first reinforcing adhesive strips 7 and the two second reinforcing adhesive strips 8 are symmetrically arranged about the central axis of the circuit board 1.

[0014] Working principle: This utility model discloses a PCB cover film. In use, the circuit board 1 is first soldered to the electrical components via gold fingers 2. Then, the first film 3 is flipped down to cover the gold fingers 2. Next, the first retaining strip 4 is flipped down and adheres to the second reinforcing adhesive strip 8, thereby further fixing the first film 3. Then, the second film 5 is flipped up to cover the bottom of the first retaining strip 4, thereby further fixing the first retaining strip 4. Finally, the second retaining strip 6 is flipped up and adheres to the first reinforcing adhesive strip 7, thereby further fixing the second film 5.

[0015] The device uses a first diaphragm 3 to protect the soldered gold fingers 2 from breakage, thereby ensuring the normal operation of the circuit board 1. Then, the first circumferential strip 4 and the second reinforcing adhesive strip 8 work together, and the second diaphragm 5 works together with the second circumferential strip 6 and the first reinforcing adhesive strip 7 to further fix the first diaphragm 3, improve the protective performance of the first diaphragm 3 for the gold fingers 2, prevent the gold fingers 2 from breaking, and thus ensure the normal operation of the electronic components.

[0016] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0017] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0018] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0019] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0020] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0021] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A cover film for PCBs, comprising a circuit board (1), wherein a plurality of gold fingers (2) are provided on the top of the circuit board (1) near the front side, characterized in that: The circuit board (1) has a first diaphragm (3) connected to the top near the front side, and a first ring strip (4) connected to both the left and right sides of the first diaphragm (3). The circuit board (1) has a second diaphragm (5) connected to the bottom near the front side, and a second ring strip (6) connected to both the left and right sides of the first diaphragm (3).

2. The PCB cover film as described in claim 1, characterized in that: The width of the first diaphragm (3) is greater than the width of the gold finger (2), and the width of the second diaphragm (5) is the same as the width of the first diaphragm (3).

3. The PCB cover film as described in claim 1, characterized in that: The top of the first diaphragm (3) is fixedly connected with two first reinforcing adhesive strips (7), which are matched with the second circumferential strip (6).

4. A PCB cover film as described in claim 3, characterized in that: The bottom of the first diaphragm (3) is fixedly connected with two second reinforcing adhesive strips (8), which are matched with the first circumferential strip (4).

5. A PCB cover film as described in claim 4, characterized in that: The two first reinforcing adhesive strips (7) and the two second reinforcing adhesive strips (8) are arranged symmetrically about the central axis of the circuit board (1).

Images