A structure for a wearable device

Abstract

The utility model discloses a structure for wearing device, and the bearing structure includes the carrier and the flexible circuit board that is pasted on the carrier, and a plurality of recesses are formed on the side of the bearing structure at least with the flexible circuit board, a plurality of components are arranged in the recess respectively, and are connected with the flexible circuit board respectively, and the encapsulation layer at least includes a plurality of embedding parts, and the embedding part is filled in the recess respectively, and the component is wrapped respectively, and the adhesive layer is arranged on the side of the bearing structure away from the component, and the release film is pasted on the adhesive layer. The utility model forms the bearing structure that the flexible circuit board is directly arranged on the carrier, and the recess is formed on the side of the bearing structure for positioning a plurality of components, and the electric connection of a plurality of components is realized, and the assembly and the forming of the structure are convenient, and the connection stability of the flexible circuit board and the component is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of wearable device technology, and in particular to a structure for wearable devices. Background Technology

[0002] With advancements in technology and manufacturing, smart wearable devices are gradually maturing and are widely used in athlete training, fitness monitoring, and health monitoring, providing wearers with valuable data on physical functions.

[0003] In the prior art, such as the flexible packaging structure, manufacturing method, and wearable device with the structure disclosed in application number 201810151656.1, a flexible substrate, functional components, and a flexible packaging film are disclosed. Multiple grooves are provided on the surface of the flexible substrate, and the functional components are disposed in the grooves. The flexible packaging film covers the flexible substrate and the functional components. The functional components are connected by connecting lines. The manufacturing method discloses that the functional components are first disposed in the grooves, with the surface of the functional components away from the flexible substrate flush with the surface of the flexible substrate. Then, connecting lines are provided on the flexible substrate to connect the side of the functional components away from the flexible substrate. Due to the layout of the connecting lines and the flexible substrate, the assembly process is relatively complex. Utility Model Content

[0004] The purpose of this utility model is to provide a structure for wearable devices, in which a flexible circuit board is directly disposed on a carrier to form a carrier structure. The carrier structure forms a groove on one side of the flexible circuit board for positioning multiple components and realizing the electrical connection of multiple components, which facilitates the assembly and forming of the structure and ensures the connection stability between the flexible circuit board and the components.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: a structure for a wearable device, comprising: A support structure includes a support body and a flexible circuit board attached to the support body, wherein the support structure has a plurality of grooves formed on at least one side having the flexible circuit board. The components, a plurality of which are respectively disposed within the grooves and are respectively connected to the flexible circuit board, The encapsulation layer includes at least a plurality of embedded portions, each of which fills the groove and encapsulates the component. An adhesive layer is disposed on the side of the supporting structure away from the components. Release film, which is adhered to the adhesive layer.

[0006] As a further optimization, the flexible circuit board includes a polyurethane film and printed circuitry formed on the polyurethane film, the polyurethane film being bonded to the carrier.

[0007] As a further optimization, the carrier is polyurethane foam.

[0008] As a further optimization, the polyurethane foam is sprayed onto the polyurethane film.

[0009] As a further optimization, the bearing structure is formed by hot stamping, which facilitates the forming of grooves on the bearing structure.

[0010] As a further optimization, a bottom groove is formed on the side of the carrier away from the flexible circuit board, and a filling layer is provided in the bottom groove, which is connected to the adhesive layer.

[0011] As a further optimization, the components include chips, batteries, circuit boards, transmitters, sensors, and receivers.

[0012] As a further optimization, the component is snapped into the groove.

[0013] As a further optimization, the encapsulation layer also includes a cover portion that is fitted to a portion of the flexible circuit board that protrudes from the embedded portion, and a plurality of the embedded portions are integrally formed at the lower end of the cover portion.

[0014] As a further optimization, the adhesive layer is glue or double-sided tape.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The flexible circuit board is directly set on the carrier to form a carrier structure. The carrier structure forms a groove on one side of the flexible circuit board to position multiple components and realize the electrical connection of multiple components, which facilitates the assembly and forming of the structure and ensures the connection stability between the flexible circuit board and the components. 2. In one particular embodiment, the support structure is thermoformed to facilitate the formation of grooves for positioning components. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model.

[0017] Figure 2 This is a schematic diagram of the load-bearing structure of this utility model.

[0018] Figure 3 This is a schematic diagram of the structure of the flexible circuit board of this utility model, which is in the state of an extended planar shape.

[0019] Figure 4 This is a schematic diagram of another embodiment of the present invention.

[0020] Figure 5 This is a schematic diagram of the load-bearing structure in another embodiment of the present invention. Detailed Implementation

[0021] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0022] like Figure 1 and Figure 2 As shown, a structure for a wearable device includes a support structure 10, components 20, an encapsulation layer 30, an adhesive layer 40, and a release film 50. The support structure 10 includes a carrier body 11 and a flexible circuit board 12 attached to the carrier body 11. At least one side of the support structure 11 with the flexible circuit board 12 is formed with a plurality of grooves 100. A plurality of components 20 are respectively disposed in the grooves 100 and are respectively connected to the flexible circuit board 12. The encapsulation layer 30 includes at least a plurality of embedding portions 31. The plurality of embedding portions 31 are respectively filled in the grooves 200 and respectively wrap the components 20. The adhesive layer 40 is disposed on the side of the support structure 10 away from the components 20. The release film 50 is attached to the adhesive layer 40.

[0023] In this invention, the supporting structure 10 has multiple grooves 100 formed on it for placing components 20. The components 20 include, but are not limited to, chips, batteries, circuit boards, transmitters, sensors, and receivers. The structure of the grooves 100 matches the components 20, allowing at least a portion of the components 20 to engage with the grooves 100, thereby positioning multiple components 20 in their respective grooves 100. Furthermore, multiple components 20 are connected to the flexible circuit board 12 located at the upper end of the supporting structure 10, enabling electrical connections between the components 20 and encapsulating the location of each component 20. The lower end of the carrier 12 located at the lower end of the supporting structure 10 is sequentially connected to an adhesive layer 40 and a release film 50. After removing the release film 50, the adhesive layer 40 is exposed. The adhesive layer 40 can be made of materials that provide adhesive properties, such as double-sided adhesive or glue. The supporting structure 10 and the components located on the supporting structure 10 can be attached to wearable items (such as clothing) through the adhesive layer 40, thereby forming a wearable device. The structure of the groove 100 in the support structure 10 includes a base groove formed on the support body 11 and an embedding groove formed on the flexible circuit board 12. When the flexible circuit board 12 is formed on the upper end of the support body 11, the groove 100 formed by the base groove and the embedding groove realizes the accommodation and positioning of multiple components 20 on the one hand, and realizes the signal connection between the corresponding components 20 through the connection between the flexible circuit board 12 and the components 20 on the other hand. Unlike the prior art, it is not necessary to position the components 20 in the base groove on the support body 11 and then make electrical connections between the corresponding components 20 through the connecting lines. The assembly operation is more convenient and can be more accurate and stable.

[0024] In this utility model, the flexible circuit board 12 is directly disposed on the carrier 11 to form a carrier structure 10. The carrier structure 10 forms a groove 100 on one side of the flexible circuit board 12 for positioning multiple components 20 and realizing the electrical connection of multiple components 20, which facilitates the assembly and forming of the structure and can ensure the connection stability between the flexible circuit board 12 and the components 20.

[0025] Preferably, the support structure 10 can be formed by hot stamping, that is, the flexible circuit board with an extended state is attached to the support body with an extended planar upper surface, and the groove 100 that matches the component 20 is formed at the corresponding position by hot stamping, which can realize the simultaneous forming of the base groove and the embedding groove, and facilitate the processing and forming of the groove 100.

[0026] Since the above-mentioned support structure 10 is formed by hot stamping, the support body 11 can be selected as polyurethane foam. In one preparation method of the support body 11 (i.e. polyurethane foam) of this utility model, the prepolymer can be placed in a mechanical foaming machine and then processed by spraying or coating, drying, winding and other processes.

[0027] Combination Figure 3 As shown, the flexible circuit board 12 with an embedded groove includes a polyurethane film and printed circuits formed on the polyurethane film. During processing, PCB circuits are first printed on the polyurethane film 121 in an extended planar state to form printed circuits 122, thereby forming a flexible circuit board in an extended planar state. Then, polyurethane foam is coated or sprayed, so that the polyurethane foam is connected to one side of the polyurethane film of the flexible circuit board in an extended planar state. The two are then hot-pressed through a corresponding mold to form a carrier 11 with a base groove and a flexible circuit board 12 with an embedded groove. The flexible circuit board 12 is connected to the carrier 11 and forms a groove 100, which makes it easier for the flexible circuit board 12 to be formed on the carrier 11 and ensures the connection stability between the two.

[0028] like Figure 4 and Figure 5 As shown, preferably, in order to cooperate with the hot pressing of the support structure 10 and to cooperate with the deformation characteristics of the support body 11 (such as polyurethane foam) during hot pressing, a bottom groove 101 is formed on the side of the support body 11 away from the flexible circuit board 12. That is, the support body 11 forms a continuous up-and-down bending structure after hot pressing, and the groove 100 and the bottom groove 101 are arranged alternately. The groove 100 is used to position the component 20. The bottom groove 101 is provided with a filling layer 13 so that the lower end surface of the support structure 10 is a planar structure. The filling layer 13 is connected to the adhesive layer 40.

[0029] In addition, combined Figure 1 and Figure 4 As shown, the encapsulation layer 30 also includes a cover portion 32, which is attached to and covers the portion of the flexible circuit board 12 that protrudes from the embedded portion 31. Multiple embedded portions 31 are formed at the lower end of the cover portion 32. Therefore, the encapsulation layer 30 can encapsulate the component 20 and the entire flexible circuit board 12.

[0030] The specific embodiments described herein are merely illustrative examples illustrating the spirit of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this utility model or exceeding the scope defined by the appended claims.

Claims

1. A structure for a wearable device, characterized in that, include: A support structure includes a support body and a flexible circuit board attached to the support body, wherein the support structure has a plurality of grooves formed on at least one side having the flexible circuit board. The components, a plurality of which are respectively disposed within the grooves and are respectively connected to the flexible circuit board, The encapsulation layer includes at least a plurality of embedded portions, each of which fills the groove and encapsulates the component. An adhesive layer is disposed on the side of the supporting structure away from the components. Release film, which is adhered to the adhesive layer.

2. The structure for a wearable device according to claim 1, characterized in that, The flexible circuit board includes a polyurethane film and printed circuitry formed on the polyurethane film, wherein the polyurethane film is bonded to the carrier.

3. The structure for a wearable device according to claim 2, characterized in that, The carrier is polyurethane foam.

4. The structure for a wearable device according to claim 3, characterized in that, The polyurethane foam is sprayed onto the polyurethane film.

5. The structure for a wearable device according to any one of claims 1 to 4, characterized in that, The load-bearing structure is formed by hot stamping.

6. The structure for a wearable device according to claim 5, characterized in that, A bottom groove is formed on the side of the carrier away from the flexible circuit board, and a filling layer is provided in the bottom groove, which is connected to the adhesive layer.

7. The structure for a wearable device according to claim 1, characterized in that, The components include chips, batteries, circuit boards, transmitters, sensors, and receivers.

8. The structure for a wearable device according to claim 1 or 7, characterized in that, The component is snapped into the groove.

9. The structure for a wearable device according to claim 1, characterized in that, The encapsulation layer further includes a cover portion that is attached to a portion of the flexible circuit board that protrudes from the embedded portion, and a plurality of the embedded portions are formed at the lower end of the cover portion.

10. The structure for a wearable device according to claim 1, characterized in that, The adhesive layer is glue or double-sided tape.

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