Flexible circuit board skeleton structure

Abstract

The utility model discloses a kind of flexible circuit board skeleton structures, including flexible substrate layer, rigid reinforcing member, wiring channel and assembly positioning structure, the flexible substrate layer is main support structure, the surface of the flexible substrate layer is provided with several installation grooves, the rigid reinforcing member is embedded in the installation groove inside being opened at the center of flexible substrate layer, the thickness of the rigid reinforcing member is consistent with the thickness of flexible substrate layer;By embedding rigid reinforcing member in flexible substrate layer, while guaranteeing the flexibility of skeleton, the overall strength of skeleton is significantly improved, deformation, fracture of skeleton when frequently bending or under stress is effectively avoided, the service life of flexible circuit board is prolonged, the orderly arrangement of line is realized in main channel and branch channel of mesh distribution, signal interference is reduced, by the cooperation of buckle protrusion and positioning hole, the quick positioning and firm connection of skeleton and external component are realized, assembly precision and efficiency are improved, product quality is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of flexible circuit board technology, and in particular to a flexible circuit board skeleton structure. Background Technology

[0002] Flexible printed circuit boards (FPCs) are characterized by their flexibility, light weight, and high wiring density, and are widely used in electronic products such as smartphones, tablets, and wearable devices. The skeleton structure, as the core supporting component of the flexible printed circuit board, directly affects its overall stability, lifespan, and assembly efficiency.

[0003] Existing flexible circuit board skeletons are mostly made of a single flexible material. Although they can meet the basic flexibility requirements, they have insufficient strength and are prone to deformation or even breakage under frequent bending or high stress. The wiring space layout of existing skeletons is unreasonable, the circuit arrangement is messy, signal interference is easy to occur, and the heat dissipation performance is poor. Heat accumulation will affect the stability of circuit operation. The assembly and positioning structure of existing skeletons is simple, and misalignment is prone to occur during assembly, resulting in low assembly accuracy and affecting product quality. To address these issues, we propose a flexible circuit board skeleton structure. Summary of the Invention

[0004] To overcome the shortcomings of existing technologies, this utility model provides a flexible circuit board skeleton structure. By embedding rigid reinforcing members within the flexible substrate layer, the overall strength of the skeleton is significantly improved while ensuring its flexibility. This effectively prevents deformation and breakage of the skeleton under frequent bending or stress, extending the service life of the flexible circuit board. The mesh-distributed main and branch channels enable orderly arrangement of circuits, reducing signal interference. The use of snap-fit ​​protrusions and positioning holes enables rapid positioning and secure connection between the skeleton and external components, improving assembly accuracy and efficiency, and ensuring product quality.

[0005] To solve the above technical problems, this utility model provides the following technical solution: a flexible circuit board skeleton structure, including a flexible substrate layer, a rigid reinforcing member, wiring channels, and an assembly positioning structure. The flexible substrate layer is the main support structure, and its surface has several mounting grooves. The rigid reinforcing member is embedded in the mounting groove at the center of the flexible substrate layer. The thickness of the rigid reinforcing member is the same as the thickness of the flexible substrate layer. The wiring channels penetrate the flexible substrate layer and the rigid reinforcing member. The wiring channels are distributed in a mesh pattern. The wiring channels include main channels and branch channels. The main channels are two parallel channels. There are multiple branch channels distributed outside the two main channels. Wires are arranged inside the wiring channels. The assembly positioning structure includes a snap-fit ​​protrusion and positioning holes. The snap-fit ​​protrusion is located at the edge of the flexible substrate layer, and the positioning holes are located at the four corners of the flexible substrate layer. The flexible substrate layer is made of polyimide material.

[0006] As a preferred embodiment of this utility model, the rigid reinforcing member is made of epoxy resin board, the shape of the mounting groove opened on the surface of the flexible substrate layer is adapted to the shape of the rigid reinforcing member, and the inner wall of the mounting groove of the flexible substrate layer is coated with an adhesive layer.

[0007] As a preferred embodiment of this utility model, a heat dissipation layer is attached to the bottom end of the flexible substrate layer. The heat dissipation layer is made of graphene material and has a thickness of .-.mm.

[0008] As a preferred embodiment of this utility model, the width of the main channel is .-.mm, the width of the branch channel is .-.mm, and the inner wall of the wiring channel is provided with an insulating protective layer.

[0009] As a preferred embodiment of this utility model, the buckle protrusion is adapted to the buckle groove of the external assembly component, and the buckle surface of the buckle protrusion is provided with anti-slip texture.

[0010] As a preferred embodiment of this invention, the surface of the heat dissipation layer is provided with a plurality of heat dissipation holes.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: 1. By embedding rigid reinforcing members in the flexible substrate layer, the overall strength of the skeleton is significantly improved while ensuring the flexibility of the skeleton. This effectively avoids deformation and breakage of the skeleton when it is frequently bent or subjected to force, and extends the service life of the flexible circuit board. The mesh-distributed main channel and branch channel realize the orderly arrangement of the circuit and reduce signal interference. Through the cooperation of the buckle protrusion and the positioning hole, the skeleton and external components are quickly positioned and firmly connected, improving assembly accuracy and efficiency and ensuring product quality.

[0012] 2. By coating the inner wall of the mounting groove of the flexible substrate layer with an adhesive layer, the rigid reinforcement can be tightly bonded to the flexible substrate layer to prevent it from falling off; by attaching a heat dissipation layer made of graphene material to the bottom of the flexible substrate layer, the heat generated by the circuit operation can be quickly dissipated to ensure stable circuit operation. Attached Figure Description

[0013] Figure 1 This is a top view schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This is a side view schematic diagram of the layered structure of this utility model.

[0015] Figure 3 This is a schematic diagram of the connection structure between the rigid reinforcing member and the mounting groove of this utility model.

[0016] Figure 4 This is a partial structural diagram of the wiring channel of this utility model.

[0017] The components include: 1. Flexible substrate layer; 2. Rigid reinforcement; 3. Wiring channel; 31. Main channel; 32. Branch channel; 4. Assembly positioning structure; 41. Buckle protrusion; 42. Positioning hole; 5. Heat dissipation layer; 6. Heat dissipation hole; 7. Wire. Detailed Implementation

[0018] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the implementation are all within the protection scope of this utility model without creative effort.

[0019] For an example, please refer to... Figure 1 , Figure 2 , Figure 3 , Figure 4As shown, this utility model provides a flexible circuit board skeleton structure, including a flexible substrate layer 1, a rigid reinforcing member 2, wiring channels 3, and an assembly positioning structure 4. The flexible substrate layer 1 is the main support structure, and its surface has several mounting grooves. The rigid reinforcing member 2 is embedded in the mounting groove at the center of the flexible substrate layer 1, and the thickness of the rigid reinforcing member 2 is the same as the thickness of the flexible substrate layer 1. The wiring channels 3 penetrate the flexible substrate layer 1 and the rigid reinforcing member 2, and the wiring channels 3 are distributed in a mesh pattern. The wiring channels 3 include main channels 31 and branch channels 32. The main channels 31 are two parallel channels, and there are multiple branch channels 32 distributed on the outside of the two main channels 31. Wires 7 are arranged on the inside of the wiring channels 3. The assembly positioning structure 4 includes a snap-fit ​​protrusion 41 and positioning holes 42. The snap-fit ​​protrusion 41 is located at the edge of the flexible substrate layer 1, and the positioning holes 42 are located at the four corners of the flexible substrate layer 1. The flexible substrate layer 1 is made of polyimide material. By embedding rigid reinforcing members 2 in the flexible substrate layer 1, the overall strength of the skeleton is significantly improved while ensuring the flexibility of the skeleton. This effectively avoids deformation and breakage of the skeleton when it is frequently bent or subjected to force, and extends the service life of the flexible circuit board. The mesh-distributed main channel 31 and branch channel 32 realize the orderly arrangement of the circuit and reduce signal interference. Through the cooperation of the snap-fit ​​protrusion 41 and the positioning holes 42, the skeleton and external components are quickly positioned and firmly connected, improving assembly accuracy and efficiency and ensuring product quality.

[0020] like Figure 1 , Figure 3 As shown, the rigid reinforcing member 2 is made of epoxy resin board, and the shape of the mounting groove opened on the surface of the flexible substrate layer 1 is adapted to the shape of the rigid reinforcing member 2. The inner wall of the mounting groove of the flexible substrate layer 1 is coated with an adhesive layer. By coating the inner wall of the mounting groove of the flexible substrate layer 1 with an adhesive layer, it can be ensured that the rigid reinforcing member 2 and the flexible substrate layer 2 are tightly bonded and prevented from falling off.

[0021] like Figure 1 , Figure 2 As shown, a heat dissipation layer 5 is attached to the bottom of the flexible substrate layer 1. The heat dissipation layer 5 is made of graphene material and has a thickness of 0.02-0.1mm. By attaching the heat dissipation layer 5 made of graphene material to the bottom of the flexible substrate layer 1, the heat generated by the circuit operation can be quickly dissipated, ensuring the stable operation of the circuit.

[0022] like Figure 1 As shown, the width of the main channel 31 is 0.5-1.5mm, the width of the branch channel 32 is 0.2-0.8mm, and the inner wall of the wiring channel 3 is provided with an insulating protective layer; by providing an insulating protective layer on the inner wall of the wiring channel 3, short circuits can be prevented and the stability of the circuit operation can be improved.

[0023] like Figure 1 As shown, the buckle protrusion 41 is adapted to the buckle groove of the external assembly component, and the buckle surface of the buckle protrusion 41 is provided with anti-slip texture; by providing anti-slip texture on the buckle surface of the buckle protrusion 41, the stability of the connection can be enhanced and loosening can be avoided after assembly.

[0024] like Figure 2 As shown, a number of heat dissipation holes 6 are provided on the surface of the heat dissipation layer 5; by providing a number of heat dissipation holes 6 on the surface of the heat dissipation layer 5, the heat dissipation efficiency is accelerated.

[0025] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A flexible circuit board skeleton structure, comprising a flexible substrate layer (1), a rigid reinforcing member (2), a wiring channel (3), and an assembly positioning structure (4), characterized in that: The flexible substrate layer (1) is the main support structure. Several mounting grooves are formed on the surface of the flexible substrate layer (1). The rigid reinforcing member (2) is embedded inside the mounting groove formed at the center of the flexible substrate layer (1). The thickness of the rigid reinforcing member (2) is the same as the thickness of the flexible substrate layer (1). The wiring channel (3) penetrates the flexible substrate layer (1) and the rigid reinforcing member (2). The wiring channel (3) is generally distributed in a mesh pattern. The wiring channel (3) includes a main channel (31) and branch channels (32). The main wiring channel (3)... The channel (31) consists of two parallel channels. There are multiple branch channels (32), which are distributed on the outside of the two main channels (31). The wiring channel (3) has wires (7) arranged on the inside. The assembly positioning structure (4) includes a buckle protrusion (41) and a positioning hole (42). The buckle protrusion (41) is located at the edge of the flexible substrate layer (1), and the positioning hole (42) is located at the four corners of the flexible substrate layer (1). The flexible substrate layer (1) is made of polyimide material.

2. The flexible circuit board skeleton structure according to claim 1, characterized in that: The rigid reinforcing member (2) is made of epoxy resin board, and the shape of the mounting groove opened on the surface of the flexible substrate layer (1) is adapted to the shape of the rigid reinforcing member (2). The inner wall of the mounting groove of the flexible substrate layer (1) is coated with an adhesive layer.

3. The flexible circuit board skeleton structure according to claim 1, characterized in that: A heat dissipation layer (5) is attached to the bottom end of the flexible substrate layer (1). The heat dissipation layer (5) is made of graphene material and has a thickness of 0.02-0.1 mm.

4. The flexible circuit board skeleton structure according to claim 1, characterized in that: The width of the main channel (31) is 0.5-1.5mm, the width of the branch channel (32) is 0.2-0.8mm, and the inner wall of the wiring channel (3) is provided with an insulating protective layer.

5. The flexible circuit board skeleton structure according to claim 1, characterized in that: The buckle protrusion (41) is adapted to the buckle groove of the external assembly component, and the buckle surface of the buckle protrusion (41) is provided with anti-slip texture.

6. The flexible circuit board skeleton structure according to claim 3, characterized in that: The heat dissipation layer (5) has several heat dissipation holes (6) on its surface.

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