PCB heat conduction via array structure with enhanced heat dissipation capability

Abstract

The utility model relates to the technical field of PCB production, and disclose a kind of PCB thermal conductive via array structure of enhanced heat dissipation capacity, including printed circuit board, the top of the printed circuit board is provided with several electronic components, the bottom of the printed circuit board is fixedly connected with thin copper plate, the inside of the printed circuit board is provided with heat dissipation structure.The PCB thermal conductive via array structure of enhanced heat dissipation capacity, by setting heat dissipation structure, when PCB normal operation, electronic component generates heat, heat is conducted to the inside of heat dissipation main hole by silica gel patch, by conductive epoxy resin fast conduction, while heat dissipation copper ring conducts a large amount of heat to the bottom of PCB, so that heat flow path is quickly downward, through thin copper plate heat dissipation, heat dissipation groove increases the contact area of thin copper plate and air, to increase heat conduction efficiency, the heat dissipation structure, can expand PCB bottom diameter and install copper ring, copper heat conduction is superior to air, optimize heat flow path downward, guarantee element normal operation.

Description

Technical Field

[0001] This utility model relates to the field of PCB manufacturing technology, specifically to a PCB thermal via array structure that enhances heat dissipation. Background Technology

[0002] PCB stands for Printed Circuit Board. PCB thermal vias (also known as "heat dissipation vias") are special via structures designed to solve the problem of localized heat accumulation on PCBs. Their core function is to quickly conduct heat from one layer of the PCB (such as the component heat-generating layer) to other layers (such as the ground layer or the heat dissipation copper layer). By increasing the heat dissipation area, efficient thermal management of the PCB is achieved, preventing component failure due to high temperatures. With the continuous production of PCBs, various heat dissipation structures have emerged, such as a PCB thermal via array structure that enhances heat dissipation capabilities.

[0003] Currently, the PCB thermal via structure on the market is generally achieved by creating holes on the PCB. These holes are densely packed without affecting the normal operation of the PCB. Although this can increase the heat dissipation area and optimize the heat flow path, ordinary heat dissipation holes are now made of equal diameter. After the PCB is in operation, heat in the middle layer tends to accumulate and cannot be dissipated to the outside. Therefore, a PCB thermal via array structure with enhanced heat dissipation capacity is proposed, which can enlarge the bottom diameter of the PCB and install a copper ring. Copper conducts heat better than air, optimizes the heat flow path downward, and ensures the normal operation of components. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a PCB thermal via array structure that enhances heat dissipation capabilities. It features the ability to enlarge the bottom diameter of the PCB and install a copper ring. Copper conducts heat better than air, optimizing the heat flow path downwards and ensuring the normal operation of components. This solves the problem that current PCB thermal via slot structures on the market have ordinary heat dissipation holes with equal diameter openings, which cause heat to easily accumulate in the middle layer of the PCB after operation and cannot be dissipated to the outside.

[0005] To achieve the above-mentioned purpose of expanding the bottom diameter of the PCB and installing a copper ring, copper has better thermal conductivity than air, optimizes the heat flow path downward, and ensures the normal operation of components, this utility model provides the following technical solution: a PCB thermal via array structure to enhance heat dissipation capacity, including a printed circuit board, a number of electronic components are arranged on the top of the printed circuit board, a thin copper plate is fixedly connected to the bottom of the printed circuit board, and a heat dissipation structure is arranged inside the printed circuit board. The heat dissipation structure includes a main heat dissipation hole, a surface-plated copper layer, an expansion opening, a silicone pad, a placement port, a heat dissipation copper ring, and auxiliary heat dissipation holes. The main heat dissipation hole is provided inside the printed circuit board. The surface-plated copper layer is provided on the top of the printed circuit board. The expansion opening is provided on the top of the printed circuit board. The silicone pad is provided on the bottom of the electronic component. The placement port is provided on the bottom of the printed circuit board. The heat dissipation copper ring is provided inside the placement port. The auxiliary heat dissipation holes are provided on the top of the printed circuit board.

[0006] Furthermore, the number of heat dissipation main holes is several, and the several heat dissipation main holes are grouped into two groups, and each of the several electronic components is provided with a group of heat dissipation main holes at its bottom.

[0007] Furthermore, the number of auxiliary heat dissipation holes is several, and the several auxiliary heat dissipation holes are evenly distributed on the top of the printed circuit board.

[0008] Furthermore, the interior of each of the aforementioned heat dissipation main holes is filled with conductive epoxy resin.

[0009] Furthermore, the bottom of the thin copper plate is provided with several heat dissipation grooves, which are staggered from several main heat dissipation holes and several auxiliary heat dissipation holes.

[0010] Furthermore, the bottom of the heat dissipation copper ring is provided with eight drainage slots, which are evenly distributed on the bottom of the heat dissipation copper ring.

[0011] Compared with the prior art, the technical solution of this application has the following beneficial effects: This enhanced heat dissipation PCB thermal via array structure utilizes a heat dissipation design. During normal PCB operation, electronic components generate heat, which is conducted to the interior of the main heat dissipation via silicone pads, reducing heat accumulation in the middle. The heat is then rapidly conducted through conductive epoxy resin, while a large amount of heat is conducted to the bottom of the PCB through a heat dissipation copper ring. This allows the heat flow path to quickly descend, where it is dissipated through a thin copper plate. The heat sink increases the contact area between the thin copper plate and the air, thereby increasing the heat conduction efficiency. This heat dissipation structure can enlarge the bottom diameter of the PCB and install a copper ring. Copper conducts heat better than air, optimizing the downward heat flow path and ensuring the normal operation of components. Attached Figure Description

[0012] Figure 1 This is a perspective view of the present utility model; Figure 2 This is a front sectional view of the present invention; Figure 3 This is an enlarged bottom view of a portion of the present invention; Figure 4 This is a bottom view of the heat dissipation copper ring of this utility model.

[0013] In the diagram: 1. Printed circuit board; 2. Electronic component; 3. Thin copper plate; 4. Heat dissipation structure; 401. Main heat dissipation hole; 402. Surface electroplated copper layer; 403. Enlarged opening; 404. Silicone patch; 405. Placement port; 406. Heat dissipation copper ring; 407. Auxiliary heat dissipation hole; 5. Conductive epoxy resin; 6. Heat dissipation groove; 7. Drain groove. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Please see Figure 1-4 In this embodiment, a PCB thermal via array structure for enhancing heat dissipation includes a printed circuit board 1, a number of electronic components 2 are disposed on the top of the printed circuit board 1, a thin copper plate 3 is fixedly connected to the bottom of the printed circuit board 1, and a heat dissipation structure 4 is disposed inside the printed circuit board 1. The heat dissipation structure 4 includes a main heat dissipation hole 401, a surface electroplated copper layer 402, an expansion opening 403, a silicone pad 404, a placement port 405, a heat dissipation copper ring 406, and auxiliary heat dissipation holes 407. The main heat dissipation hole 401 is provided inside the printed circuit board 1. The surface electroplated copper layer 402 is provided on the top of the printed circuit board 1. The expansion opening 403 is provided on the top of the printed circuit board 1. The silicone pad 404 is provided on the bottom of the electronic component 2. The placement port 405 is provided on the bottom of the printed circuit board 1. The heat dissipation copper ring 406 is provided inside the placement port 405. The auxiliary heat dissipation hole 407 is provided on the top of the printed circuit board 1.

[0016] In the implementation of the case, there are several heat dissipation main holes 401. The heat dissipation main holes 401 are grouped into two groups. Each electronic component 2 has a group of heat dissipation main holes 401 at its bottom. The heat dissipation main holes 401 are grouped and directly set at the bottom of each electronic component 2. This ensures the concentration and efficient use of heat dissipation resources. After heat is generated from the component, it can be captured and discharged by the heat dissipation main hole 401 array below in the shortest path, avoiding the temperature rise caused by the lateral diffusion of heat inside the PCB.

[0017] In the implementation of the case, there are several auxiliary heat dissipation holes 407. These auxiliary heat dissipation holes 407 are evenly distributed on the top of the printed circuit board 1. The evenly distributed auxiliary heat dissipation holes 407 are no longer limited to the area directly below the heat source. They can effectively extract the accumulated heat from other areas on the PCB board (such as dense wiring areas and the area around secondary heat sources), prevent the formation of local hot spots, and improve the temperature uniformity and thermal reliability of the entire board.

[0018] In the implementation of the case, the interior of several heat dissipation main holes 401 was filled with conductive epoxy resin 5. The interior of the unfilled heat dissipation main holes 401 was filled with air. Air is a poor conductor of heat (thermal conductivity of about 0.026 W / m·K), which severely restricts the heat conduction capacity of the heat dissipation main holes 401. After filling with conductive epoxy resin 5 with high thermal conductivity (thermal conductivity is usually 1-20 W / m·K or higher), the hollow "heat pipe" was transformed into a solid "heat conducting column", and its equivalent heat conduction capacity was improved by an order of magnitude.

[0019] In the implementation of the case, several heat dissipation grooves 6 are opened on the bottom of the thin copper plate 3. The heat dissipation grooves 6 are staggered from the main heat dissipation holes 401 and the auxiliary heat dissipation holes 407. The structure of the heat dissipation grooves 6 breaks the flat surface of the thin copper plate, which multiplies its surface area. According to the heat conduction theory, the heat dissipation area is proportional to the heat dissipation efficiency. This design significantly enhances the convection and radiation heat exchange capacity between the thin copper plate 3 and the air, and is a direct means to improve the final heat dissipation performance.

[0020] In the implementation of the case, eight drainage slots 7 are opened at the bottom of the heat dissipation copper ring 406. The eight drainage slots 7 are evenly distributed at the bottom of the heat dissipation copper ring 406. The presence of drainage slots 7 can further reduce thermal resistance and reduce the amount of copper used.

[0021] When implementing this procedure, please follow these steps: 1) When the PCB is running normally, electronic component 2 generates heat, which is conducted to the heat dissipation main hole 401 through silicone pad 404 to reduce the accumulation of heat in the middle. 2) Then, the conductive epoxy resin 5 conducts heat quickly, while the heat dissipation copper ring 406 conducts a large amount of heat to the bottom of the PCB. 3) The reheat flow path is rapidly downward, and heat is dissipated through the thin copper plate 3; 4) Finally, the heat dissipation slot 6 increases the contact area between the thin copper plate 3 and the air, thereby increasing the heat conduction efficiency.

[0022] In summary, this PCB thermal via array structure with enhanced heat dissipation capability, through the setting of heat dissipation structure 4, allows the electronic components 2 to generate heat during normal PCB operation. The heat is conducted to the interior of the heat dissipation main hole 401 through the silicone pad 404, reducing heat accumulation in the middle. The heat is then quickly conducted through the conductive epoxy resin 5, while the heat dissipation copper ring 406 conducts a large amount of heat to the bottom of the PCB, making the heat flow path quickly downward. The heat is then dissipated through the thin copper plate 3. The heat dissipation groove 6 increases the contact area between the thin copper plate 3 and the air, thereby increasing the heat conduction efficiency. This heat dissipation structure 4 can enlarge the bottom diameter of the PCB and install the copper ring. Copper conducts heat better than air, optimizing the heat flow path downward and ensuring the normal operation of the components.

[0023] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0024] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A PCB thermal via array structure for enhanced heat dissipation, comprising a printed circuit board (1), characterized in that: The top of the printed circuit board (1) is provided with several electronic components (2), the bottom of the printed circuit board (1) is fixedly connected with a thin copper plate (3), and the interior of the printed circuit board (1) is provided with a heat dissipation structure (4). The heat dissipation structure (4) includes a heat dissipation main hole (401), a surface electroplated copper layer (402), an expansion opening (403), a silicone pad (404), a placement port (405), a heat dissipation copper ring (406), and an auxiliary heat dissipation hole (407). The printed circuit board (1) has a heat dissipation main hole (401) inside. The printed circuit board (1) has a surface electroplated copper layer (402) on its top. The printed circuit board (1) has an expansion opening (403) on its top. The electronic component (2) has a silicone pad (404) on its bottom. The printed circuit board (1) has a placement port (405) on its bottom. The placement port (405) has a heat dissipation copper ring (406) inside. The printed circuit board (1) has an auxiliary heat dissipation hole (407) on its top.

2. The PCB thermal via array structure for enhanced heat dissipation according to claim 1, characterized in that: The number of the heat dissipation main holes (401) is several, and the several heat dissipation main holes (401) are arranged in pairs. The bottom of each of the several electronic components (2) is provided with a set of heat dissipation main holes (401).

3. The PCB thermal via array structure for enhanced heat dissipation according to claim 1, characterized in that: The number of auxiliary heat dissipation holes (407) is several, and the several auxiliary heat dissipation holes (407) are evenly distributed on the top of the printed circuit board (1).

4. The PCB thermal via array structure for enhanced heat dissipation according to claim 2, characterized in that: The interior of each of the heat dissipation main holes (401) is filled with conductive epoxy resin (5).

5. A PCB thermal via array structure for enhancing heat dissipation according to claim 1, characterized in that: The bottom of the thin copper plate (3) is provided with several heat dissipation grooves (6), and the several heat dissipation grooves (6) are staggered from several main heat dissipation holes (401) and several auxiliary heat dissipation holes (407).

6. The PCB thermal via array structure for enhanced heat dissipation according to claim 1, characterized in that: The bottom of the heat dissipation copper ring (406) is provided with eight drainage grooves (7), which are evenly distributed on the bottom of the heat dissipation copper ring (406).

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