An electrical wire distribution structure

Abstract

The application provides an electric wire distribution structure, comprising: a substrate, which comprises a plurality of layers of circuit layers; a wire part distributed on the outer wall of the substrate, which is penetrated into the substrate through a hole part, so that the wire part is electrically connected with the plurality of layers of circuit layers; wherein the wire part comprises a plurality of first segments, a plurality of second segments and a plurality of third segments, any first segment / second segment is electrically connected with the adjacent first segment / second segment, the plurality of third segments are distributed inside the substrate, and the plurality of third segments are electrically connected with the intersecting circuit layers, the third segments are embedded in the substrate, the third segments are electrically connected with the plurality of circuit layers in the substrate, and the plurality of first segments, the plurality of second segments and the plurality of third segments in the wire part are in contact with each other in the distribution structure, so that the circuit flowing on the wire part in the substrate can form a stable closed loop, and the deposition of nickel gold can be realized.

Description

Technical Field

[0001] This application belongs to the technical field of circuit boards, and particularly relates to a conductor distribution structure. Background Technology

[0002] In existing technology, conductive lines on electroplated nickel-gold plates are distributed along the four edges of the substrate. The edge conductive lines connect to the internal conductive lines along the outer edge of the substrate, thus forming a closed loop. The aforementioned distribution of conductive lines makes the difference between high and low currents on the substrate unstable and the current density distribution uneven.

[0003] There is currently no effective solution to the above problems.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this utility model and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this utility model. Utility Model Content

[0005] The purpose of this application is to provide a conductor distribution structure to solve the above problems.

[0006] This application provides a conductor distribution structure, including:

[0007] A substrate, wherein the substrate includes multiple circuit layers;

[0008] The conductive wires distributed on the outer wall of the substrate are inserted into the substrate through holes, so that the conductive wires are electrically connected to multiple circuit layers.

[0009] The conductor portion includes a plurality of first segments, a plurality of second segments, and a plurality of third segments. Each of the first segments / second segments is electrically connected to an adjacent first segment / second segment. The plurality of third segments are distributed inside the substrate, and each of the plurality of third segments is electrically connected to an intersecting line layer.

[0010] Preferably, all of the third segments are parallel to each other.

[0011] Preferably, the width of the plurality of first segments, the plurality of second segments, and the plurality of third segments in the conductor portion is 3mm.

[0012] Preferably, the substrate has conductive wire portions at its edges.

[0013] Preferably, both sides of the substrate are high-current regions, a low-current region is provided between the two high-current regions, and the third segment is provided between the low-current region and the adjacent high-current region.

[0014] Preferably, both sides of the substrate are high-current regions, a low-current region is provided between the two high-current regions, and the third segment is provided between the low-current region and the adjacent high-current region.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. This utility model embeds a third segment inside the substrate and makes the third segment conductive with multiple circuit layers in the substrate. Furthermore, several first segments, several second segments, and several third segments in the conductor section are in contact with each other in a distributed structure, so that the circuit flowing on the conductor section inside the substrate can form a stable closed loop, thereby enabling the deposition of nickel-gold.

[0017] 2. By setting multiple third segments that are parallel to each other, and the width of multiple first segments, multiple second segments, and multiple third segments is 3mm, the current conduction of the current guide in the substrate can be made more stable. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is an overall structural diagram of a conductor distribution structure provided in an embodiment of this application;

[0020] Figure 2 This is a structural diagram of the edge conductor arrangement of an electrical conductor distribution structure provided in an embodiment of this application.

[0021] In the figure: 1. Substrate; 11. Low current region; 12. High current region; 2. Conductor section; 21. Third segment. Detailed Implementation

[0022] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application.

[0023] In the description of this utility model, it should be noted that the terms "upper," "middle," "lower," "inner," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. The implementation methods of this utility model will now be described based on its overall structure.

[0024] Reference Figure 1 As shown, this application embodiment provides an electrical conductor distribution structure, including:

[0025] A substrate, wherein the substrate includes multiple circuit layers;

[0026] The conductive wires distributed on the outer wall of the substrate are inserted into the substrate through holes, so that the conductive wires are electrically connected to multiple circuit layers.

[0027] The conductor portion includes a plurality of first segments, a plurality of second segments, and a plurality of third segments. Each of the first segments / second segments is electrically connected to an adjacent first segment / second segment. The plurality of third segments are distributed inside the substrate, and each of the plurality of third segments is electrically connected to an intersecting line layer.

[0028] Based on the above structure, those skilled in the art can include multiple circuit layers in the substrate 1, and then pass the conductor portion 2 into the substrate 1, so that the multiple circuit layers in the substrate 1 can be electrically connected through the conductor portion 2.

[0029] Specifically, those skilled in the art can configure the substrate 1 to have multiple circuit layers laminated inside, with the multiple circuit layers all in contact with each other. Multiple holes are provided at both ends of the substrate 1. During the process of arranging circuits in the conductor section 1, the conductor section 2 passes through the holes and enters the internal material of the substrate 1. The conductor section 2 contacts the inner wall of the hole, thereby enabling the conductor section 2 to be electrically connected to the multiple circuit layers in the substrate 1.

[0030] Furthermore, those skilled in the art can configure the conductor portion 2 to include a plurality of first segments, a plurality of second segments, and a plurality of third segments 21. That is, those skilled in the art can configure the conductor portion 2 to be composed of a plurality of first segments, a plurality of second segments, and a plurality of third segments 21 distributed among each other.

[0031] Specifically, in the above configuration, several first segments, several second segments, and several third segments 21 in the conductor section 2 are in contact with each other in the distributed structure, and are electrically connected at the contact points, so that the conductor section 2 can be stably connected after being distributed and arranged.

[0032] Furthermore, those skilled in the art can fix the third segment 21 in the conductor portion 2 inside the substrate 1, that is, the third segment 21 is embedded inside the substrate 1, and the third segment 21 is in communication with multiple circuit layers in the substrate 1.

[0033] With the above structure, the third segment 21 can be embedded inside the substrate 1 and connected to multiple circuit layers in the substrate 1. The first segment, second segment, and third segment 21 in the conductor section 2 are in contact with each other in the distributed structure, so that the circuit flowing on the conductor section 2 inside the substrate 1 can form a stable closed loop, thereby realizing the deposition of nickel gold.

[0034] In an optional embodiment, those skilled in the art can further configure the third segment 21 in the conductor portion 2. Preferably, the plurality of said third segments 21 are all parallel to each other.

[0035] In the above embodiments, the conductive portion 2 provided on the substrate 1 by those skilled in the art includes a plurality of third segments 21. In this embodiment, those skilled in the art can provide that the plurality of third segments 21 are all parallel to each other.

[0036] With the above structure, the current flowing through the multiple parallel third segments 21 can maintain a uniform potential energy. That is, the current in any one of the multiple parallel third segments 21 can remain uniform during flow.

[0037] In summary, those skilled in the art have set multiple third segments 21 to be parallel to each other, thereby ensuring that the current flowing in the conductor portion 2 within the substrate 1 remains stable.

[0038] In the above embodiment, the conductor portion 2 is composed of a plurality of first segments, a plurality of second segments, and a plurality of third segments 21 distributed in an alternating manner. Preferably, the width of each of the plurality of first segments, second segments, and third segments in the conductor portion is 3 mm.

[0039] In this embodiment, those skilled in the art set the width of the plurality of first segments, the plurality of second segments, and the plurality of third segments to be 3mm, thereby further ensuring that the current flowing through the plurality of first segments, the plurality of second segments, and the plurality of third segments remains stable.

[0040] In summary, those skilled in the art have set multiple third segments 21 to be parallel to each other, and the widths of multiple first segments, multiple second segments, and multiple third segments are all 3mm, thereby making the current conduction of the current in the current-conducting part 2 in the substrate 1 more stable.

[0041] Preferably, conductive wire portions 2 are provided at the edges of the substrate 1. In this embodiment, those skilled in the art can provide conductive wire portions at the edges of the substrate 1, thereby further improving the rationality of the arrangement of conductive wire portions 2 on the substrate 1 and making the current conduction within the conductive wire portions 2 more stable.

[0042] In one optional embodiment, those skilled in the art can provide a high-current region 12 and a low-current region 11. Preferably, both sides of the substrate 1 are high-current regions 12, and a low-current region 11 is provided between the two high-current regions 12. The third segment 21 is provided between each low-current region 11 and the adjacent high-current region 12.

[0043] Preferably, both sides of the substrate are high-current regions, a low-current region is provided between the two high-current regions, and the third segment is provided between the low-current region and the adjacent high-current region.

[0044] Specifically, those skilled in the art can provide two high-current regions 12 on the substrate 1, with the two high-current regions 12 positioned close to opposite edges of the substrate 1, and a low-current region positioned between the two high-current regions 12. Furthermore, those skilled in the art can position a third segment 21 between the low-current region 11 and the adjacent high-current region 12.

[0045] With the above configuration, the low current region 11 and the high current region 12 on the substrate 1 can be electrically connected, thereby enabling the current on the substrate 1 to be stably conducted.

[0046] Although different specific embodiments are mentioned in this application, this application is not limited to the situations described in industry standards or embodiments. Slightly modified implementations based on certain industry standards or custom methods or embodiments can also achieve the same, equivalent, or similar, or predictable, implementation effects as the above embodiments. Embodiments applying these modified or modified data acquisition, processing, output, and judgment methods still fall within the scope of optional implementations of this application.

[0047] Although this application has been described by way of examples, those skilled in the art will know that this application has many modifications and variations without departing from the spirit of this application, and it is intended that the appended embodiments include these modifications and variations without departing from this application.

Claims

1. A conductor distribution structure, characterized in that, include: A substrate, wherein the substrate includes multiple circuit layers; The conductive wires distributed on the outer wall of the substrate are inserted into the substrate through holes, so that the conductive wires are electrically connected to multiple circuit layers. The conductor portion includes a plurality of first segments, a plurality of second segments, and a plurality of third segments. Each of the first segments / second segments is electrically connected to an adjacent first segment / second segment. The plurality of third segments are distributed inside the substrate, and each of the plurality of third segments is electrically connected to an intersecting line layer.

2. The conductor distribution structure according to claim 1, characterized in that, All of the aforementioned third paragraphs are parallel to each other.

3. The conductor distribution structure according to claim 1, characterized in that, The width of each of the multiple first segments, multiple second segments, and multiple third segments in the conductor section is 3mm.

4. The conductor distribution structure according to claim 1, characterized in that, The substrate has conductive wire portions at its edges.

5. The conductor distribution structure according to claim 1, characterized in that, Both sides of the substrate are high-current regions, and a low-current region is provided between the two high-current regions. The third segment is provided between the low-current region and the adjacent high-current region.

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