A circuit board processing jig integrating tin paste printing and patching

Abstract

The utility model discloses a kind of circuit board processing fixtures of tin paste printing and patching integration, including jig body, the bottom vertical of jig body has circuit board clamp, limiting installation has circuit board on the circuit board clamp, the bottom of circuit board clamp is provided with lifting device;The top of jig body is provided with turnover clamp, fixed mounting has printing plate on the turnover clamp, printing hole is provided on the printing plate corresponding to the printing area on circuit board, the turnover clamp can drive printing plate overturn to reserve patching area on the top of jig body;The utility model only needs to adopt a set of jig, tin paste printing, patching operation to circuit board can be quickly and continuously completed, circuit board does not need to be transferred between different jigs, effectively improve the processing efficiency of circuit board, also effectively avoid that circuit board itself and tin paste are hurt.

Description

Technical Field

[0001] This utility model belongs to the technical field of circuit board processing, specifically relating to a circuit board processing fixture that integrates solder paste printing and surface mount technology. Background Technology

[0002] Before mounting components onto a circuit board, a layer of solder paste is typically applied evenly to the mounting surface to ensure a secure fit. In existing technologies, solder paste application and mounting often require two different fixtures. The application fixture positions and fixes the printed circuit board and stencil, ensuring close contact between the stencil and the mounting surface. The mounting fixture positions and fixes the circuit board, ensuring the mounting surface is higher than the top of the fixture to prevent the solder paste from scraping off during mounting. This necessitates frequent use of two different fixtures and transporting the circuit board between them, significantly reducing processing efficiency. Furthermore, the frequent transport and clamping of the circuit board not only easily scrapes off the solder paste but can also damage the board.

[0003] Therefore, in view of the shortcomings of the prior art, this utility model discloses a circuit board processing fixture that integrates solder paste printing and surface mount technology. Utility Model Content

[0004] This utility model discloses a circuit board processing fixture that integrates solder paste printing and surface mount technology. Only one fixture is needed to quickly and continuously complete the solder paste printing and surface mount operations on the circuit board. There is no need to transfer the circuit board between different fixtures, which effectively improves the processing efficiency of the circuit board and also effectively avoids damage to the circuit board itself and the solder paste.

[0005] This utility model is achieved through the following technical solution:

[0006] A circuit board processing fixture integrating solder paste printing and surface mount technology (SMT) includes a fixture body, a circuit board clamp vertically mounted at the bottom of the fixture body, a circuit board mounted at the upper limit of the circuit board clamp, and a lifting device at the bottom of the circuit board clamp; a flipping fixture is provided at the top of the fixture body, a printed circuit board is fixedly mounted on the flipping fixture, and the printed circuit board has printing holes corresponding to the printing area on the circuit board; the flipping fixture can drive the printed circuit board to flip to reserve a surface mount area at the top of the fixture body.

[0007] To better realize this utility model, the flipping fixture further includes a flipping mechanism, a flipping seat, and an adsorption device. The flipping mechanism is disposed on one side of the top of the fixture body. The flipping end of the flipping mechanism is connected to one side of the flipping seat. A positioning step is provided on the top surface of the flipping seat, and an adsorption device is provided around the positioning step.

[0008] To better realize this utility model, the flipping mechanism further includes a rotating shaft, a gear, a rack, and a linear cylinder. The rotating shaft is rotatably mounted on one side of the top of the fixture body. The rotating shaft is fixedly connected to one side of the flipping seat. A gear is sleeved on the end of the rotating shaft. A rack is meshed on one side of the gear. One end of the rack is connected to the telescopic end of the linear cylinder.

[0009] To better realize this utility model, the adsorption device further includes a first pneumatic suction cup, and an installation groove is provided on the top surface of the flipping seat. The first pneumatic suction cup is clamped in the installation groove, and the first pneumatic suction cup is connected to an external air pump through a hose.

[0010] To better realize this utility model, at least one set of elastic buffer members are further provided on the bottom surface of the flip seat.

[0011] To better realize this utility model, the elastic buffer further includes a buffer pad and a spring. The spring is disposed on the bottom surface of the flip seat, and a buffer pad is disposed at the end of the spring near the circuit board.

[0012] To better realize this utility model, the lifting device further includes a lifting platform and a lifting cylinder. The lifting platform is slidably disposed at the bottom of the fixture body in a vertical direction. A circuit board clamp is installed on the top surface of the lifting platform, and a lifting cylinder is disposed at the bottom of the lifting platform.

[0013] To better realize this utility model, the lifting platform is further provided with a guide hole, and a vertical guide rod is slidably fitted in the guide hole.

[0014] To better realize this utility model, the circuit board clamp further includes a magnetic base, a limiting block, and a second pneumatic suction cup. The magnetic base is magnetically fixed to the top of the lifting device. The top of the magnetic base is provided with a circuit board slot. The bottom of the circuit board slot is provided with a second pneumatic suction cup. The side wall of the circuit board slot is provided with a limiting block.

[0015] Compared with the prior art, this utility model has the following advantages and beneficial effects:

[0016] This invention uses a circuit board clamp to clamp the circuit board in one go, and a flipping clamp to clamp the printed circuit board in one go. When solder paste printing is required, the flipping clamp drives the printed circuit board to a position parallel to the circuit board. Then, a lifting device lifts the circuit board, making the circuit board and the printed circuit board fit tightly together. Solder paste can then be printed quickly and accurately through the printing holes on the printed circuit board. After the solder paste printing is completed, the flipping clamp drives the printed circuit board to flip in the opposite direction to leave enough space for surface mount technology (SMT) on the top of the circuit board. The lifting device then lifts the circuit board again, making the top surface of the circuit board higher than the top surface of the fixture, so that SMT can be performed on the top of the circuit board, and effectively preventing the printed circuit board from scratching the solder paste and the circuit board. Attached Figure Description

[0017] Figure 1 A schematic diagram of the structure of a circuit board processing fixture;

[0018] Figure 2 This is a schematic diagram of the flipping fixture.

[0019] Figure 3 This is a schematic diagram of the lifting device.

[0020] Figure 4 This is a schematic diagram of the circuit board clamp structure;

[0021] Figure 5 A schematic diagram showing how the printed circuit board should avoid the surface mount area;

[0022] Figure 6 for Figure 1 A-direction view.

[0023] Wherein: 1-Jig body; 2-Circuit board clamp; 3-Flipping clamp; 4-Lifting device; 5-Printed board; 21-Magnetic suction seat; 22-Limiting block; 23-Second pneumatic suction cup; 31-Flipping mechanism; 32-Flipping seat; 33-Adsorption device; 34-Positioning step; 35-Elastic buffer; 41-Lifting platform; 42-Lifting cylinder; 43-Vertical guide rod; 311-Rotating shaft; 312-Gear; 313-Rack; 314-Linear cylinder. Detailed Implementation

[0024] Example 1:

[0025] This embodiment provides a circuit board processing fixture that integrates solder paste printing and surface mount technology, such as... Figure 1 and Figure 6As shown, the fixture includes a fixture body 1, a circuit board clamp 2 vertically mounted at the bottom of the fixture body 1, a circuit board mounted at the upper limit of the circuit board clamp 2, and a lifting device 4 at the bottom of the circuit board clamp 2; a flipping clamp 3 is provided at the top of the fixture body 1, a printed circuit board 5 is fixedly mounted on the flipping clamp 3, and printing holes are provided on the printed circuit board 5 corresponding to the printing area on the circuit board. The flipping clamp 3 can drive the printed circuit board 5 to flip so as to reserve a patch area at the top of the fixture body 1.

[0026] The current board to be printed is fixedly mounted on the circuit board fixture 2, while the printed circuit board 5 is fixedly mounted on the flip fixture 3. Then, the flip fixture 3 is flipped in the forward direction to rotate the printed circuit board 5 to the printing station located at the top of the fixture body 1 and parallel to the circuit board. After the printed circuit board 5 is in place, the circuit board fixture 2 is raised to a first height by the lifting device 4, so that the top of the circuit board contacts the bottom of the printed circuit board 5. At this time, solder paste can be applied to the top of the printed circuit board 5, and the solder paste is printed onto the printing area on the circuit board through the printing holes.

[0027] After the circuit board printing is completed, the flipping fixture 3 flips in the reverse direction, causing the printed circuit board 5 to rotate towards the direction of the schematic circuit board, thus freeing up the top area of ​​the fixture body 1 and reserving sufficient placement area. Then, the lifting device 4 lifts the circuit board fixture 2 to a second height, so that the top of the circuit board with solder paste is higher than the top surface of the fixture body 1, facilitating component placement on the top of the circuit board. After component placement is completed, the circuit board fixture 2 releases the circuit board, and the processed circuit board is removed by an external robotic arm or other device. Then, the external robotic arm places the next unprocessed circuit board on the circuit board fixture 2. After the circuit board fixture 2 clamps and fixes the next unprocessed circuit board, the lifting device 4 lowers the circuit board fixture 2 to its original position, and then the flipping fixture 3 flips in the forward direction to reset, entering the next processing cycle.

[0028] Example 2:

[0029] This embodiment discloses a circuit board processing fixture that integrates solder paste printing and surface mount technology (SMT), which is an optimization based on Embodiment 1, such as... Figure 1 , Figure 2 , Figure 6 As shown, the flipping fixture 3 includes a flipping mechanism 31, a flipping seat 32, and an adsorption device 33. The flipping mechanism 31 is disposed on one side of the top of the fixture body 1. The flipping end of the flipping mechanism 31 is connected to one side of the flipping seat 32. A positioning step 34 is provided on the top surface of the flipping seat 32, and an adsorption device 33 is provided around the positioning step.

[0030] The flip base 32 is provided with a slot for mounting the printing plate 5. A suction device 33 is provided at the bottom of the slot. The printing plate 5 is inserted into the slot, and then the suction device 33 holds the printing plate 5 in place, thus achieving a fixed installation of the printing plate 5 on the flip base 32. The flip mechanism 31 drives the flip base 32 to flip forward or backward, enabling rapid movement of the printing plate 5 between the printing station and the clearance station.

[0031] Furthermore, the flipping mechanism 31 includes a rotating shaft 311, a gear 312, a rack 313, and a linear cylinder 314. The rotating shaft 311 is rotatably mounted on one side of the top of the fixture body 1. The rotating shaft 311 is fixedly connected to one side of the flipping seat 32. The end of the rotating shaft 311 is fitted with a gear 312. One side of the gear 312 is meshed with a rack 313. One end of the rack 313 is connected to the telescopic end of the linear cylinder 314.

[0032] A slider is provided at the bottom of the rack 313, and the bottom of the slider is slidably connected to the linear guide rail. The end of the rack 313 away from the gear is connected to the end of the telescopic rod of the linear cylinder 314. A bearing seat is provided on one side of the top of the fixture body 1. The rotating shaft 311 is rotatably connected to the bearing seat. One side of the flipping seat 32 is directly welded to or fixedly connected to the rotating shaft 311 through a fixed bushing. A gear 312 is fitted at the end of the rotating shaft 311. The extension and retraction of the linear cylinder 314 drives the rack 313 to move linearly, which in turn drives the gear 312 and the rotating shaft 311 to rotate forward or backward, thereby driving the flipping seat 32 to flip forward or backward.

[0033] Furthermore, the adsorption device 33 includes a first pneumatic suction cup 331, and a mounting groove is provided on the top surface of the flipping base 32. The first pneumatic suction cup 331 is fitted into the mounting groove, and the first pneumatic suction cup 331 is connected to an external air pump via a hose. The first pneumatic suction cup 331 directly and quickly adsorbs the printing plate 5, thereby achieving rapid fixation of the printing plate 5 on the flipping base 32.

[0034] Furthermore, at least one set of elastic buffers 35 is provided on the bottom surface of the flip base 32. The elastic buffer 35 includes a buffer pad and a spring. The spring is provided on the bottom surface of the flip base 32, and the buffer pad is provided at the end of the spring near the circuit board. When the lifting device 4 drives the circuit board to rise, the top surface of the circuit board clamp 2 first contacts the buffer pad and compresses the spring, thereby buffering the rise of the circuit board clamp 2, ensuring that the circuit board makes smooth contact with the bottom of the printed circuit board 5, and avoiding damage to the circuit board.

[0035] The rest of this embodiment is the same as that of Embodiment 1, so it will not be described again.

[0036] Example 3:

[0037] This embodiment discloses a circuit board processing fixture that integrates solder paste printing and surface mount technology (SMT), which is an optimization based on Embodiment 1 or 2, such as... Figure 1 and Figure 3 As shown, the lifting device 4 includes a lifting platform 41 and a lifting cylinder 42. The lifting platform 41 is slidably disposed at the bottom of the fixture body 1 in a vertical direction. A circuit board clamp 2 is installed on the top surface of the lifting platform 41, and a lifting cylinder 42 is disposed at the bottom of the lifting platform 41.

[0038] Furthermore, the lifting platform 41 is provided with a guide hole, and a vertical guide rod 43 is slidably fitted into the guide hole. During the lifting process of the lifting platform 41, the sliding engagement between the guide hole and the vertical guide rod 43 guides the lifting of the lifting platform 41, ensuring that the lifting platform 41 moves smoothly in a strictly vertical direction.

[0039] The rest of this embodiment is the same as that in embodiment 1 or 2, so it will not be repeated here.

[0040] Example 4:

[0041] This embodiment discloses a circuit board processing fixture that integrates solder paste printing and surface mount technology (SMT), which is an optimization based on any one of embodiments 1-3, such as... Figure 1 and Figure 4 As shown, the circuit board clamp 2 includes a magnetic base 21, a limiting block 22, and a second pneumatic suction cup 23. The magnetic base 21 is magnetically fixed to the top of the lifting device 4. A circuit board slot is provided on the top of the magnetic base 21. A second pneumatic suction cup 23 is provided at the bottom of the circuit board slot. A limiting block 22 is provided on the side wall of the circuit board slot.

[0042] The magnetic base 21 can quickly adhere and fix the circuit board to the bottom of the fixture body 1, placing the circuit board in the circuit board slot. Simultaneously, the positioning slots on the edge of the circuit board engage with the limiting blocks 22 to define the orientation and position of the circuit board. After the circuit board is installed in the circuit board slot, the second pneumatic suction cup 23 is connected to an external air pump via a hose. Once activated, the second pneumatic suction cup 23 firmly adheres and fixes the circuit board inside the circuit board slot, achieving rapid positioning and fixation of the circuit board.

[0043] The rest of this embodiment is the same as any one of embodiments 1-3, so it will not be described again.

[0044] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Any simple modifications or equivalent changes made to the above embodiments based on the technical essence of the present utility model shall fall within the protection scope of the present utility model.

Claims

1. A circuit board processing fixture integrating solder paste printing and surface mount technology, comprising a fixture body (1), characterized in that, The bottom of the fixture body (1) has a vertical circuit board clamp (2), and the circuit board clamp (2) has a circuit board installed at the upper limit. The bottom of the circuit board clamp (2) is provided with a lifting device (4). The top of the fixture body (1) is provided with a flipping clamp (3), and a printing plate (5) is fixedly installed on the flipping clamp (3). The printing plate (5) has printing holes corresponding to the printing area on the circuit board. The flipping clamp (3) can drive the printing plate (5) to flip so as to reserve a patch area on the top of the fixture body (1).

2. The circuit board processing fixture integrating solder paste printing and surface mount technology according to claim 1, characterized in that, The flipping fixture (3) includes a flipping mechanism (31), a flipping seat (32), and an adsorption device (33). The flipping mechanism (31) is located on one side of the top of the fixture body (1). The flipping end of the flipping mechanism (31) is connected to one side of the flipping seat (32). A positioning step (34) is provided on the top surface of the flipping seat (32), and an adsorption device (33) is provided around the positioning step.

3. The circuit board processing fixture integrating solder paste printing and surface mount technology according to claim 2, characterized in that, The flipping mechanism (31) includes a rotating shaft (311), a gear (312), a rack (313), and a linear cylinder (314). The rotating shaft (311) is rotatably mounted on one side of the top of the fixture body (1). The rotating shaft (311) is fixedly connected to one side of the flipping seat (32). The end of the rotating shaft (311) is fitted with a gear (312). One side of the gear (312) is meshed with a rack (313). One end of the rack (313) is connected to the telescopic end of the linear cylinder (314).

4. The circuit board processing fixture integrating solder paste printing and surface mount technology according to claim 3, characterized in that, The adsorption device (33) includes a first pneumatic suction cup (331). The top surface of the flipping seat (32) is provided with an installation groove, in which the first pneumatic suction cup (331) is fitted. The first pneumatic suction cup (331) is connected to an external air pump through a hose.

5. The circuit board processing fixture integrating solder paste printing and surface mount technology according to claim 4, characterized in that, At least one set of elastic buffers (35) are provided on the bottom surface of the flip seat (32).

6. The circuit board processing fixture integrating solder paste printing and surface mount technology according to claim 5, characterized in that, The elastic buffer (35) includes a buffer pad and a spring. The spring is disposed on the bottom surface of the flip seat (32), and a buffer pad is disposed at the end of the spring near the circuit board.

7. A circuit board processing fixture integrating solder paste printing and surface mount technology according to any one of claims 1-6, characterized in that, The lifting device (4) includes a lifting platform (41) and a lifting cylinder (42). The lifting platform (41) is slidably disposed at the bottom of the fixture body (1) in the vertical direction. A circuit board clamp (2) is installed on the top surface of the lifting platform (41), and a lifting cylinder (42) is disposed at the bottom of the lifting platform (41).

8. The circuit board processing fixture integrating solder paste printing and surface mount technology according to claim 7, characterized in that, The lifting platform (41) is provided with a guide hole, and a vertical guide rod (43) is slidably fitted in the guide hole.

9. A circuit board processing fixture integrating solder paste printing and surface mount technology according to any one of claims 1-6, characterized in that, The circuit board clamp (2) includes a magnetic base (21), a limiting block (22), and a second pneumatic suction cup (23). The magnetic base (21) is magnetically fixed to the top of the lifting device (4). The top of the magnetic base (21) is provided with a circuit board slot. The bottom of the circuit board slot is provided with a second pneumatic suction cup (23). The side wall of the circuit board slot is provided with a limiting block (22).

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