An NTC sealing structure, busbar connecting nickel sheet, circuit board device and temperature measuring device
Patent Information
- Application Number
- CN202521510772.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-18
- Publication Date
- 2026-08-21
- Estimated Expiration
- 2035-07-18
AI Technical Summary
[0005]基于此，针对上述现有技术提到的现有的NTC密封稳定性不够高的问题，有必要提出一种NTC密封结构、母排连接镍片、线路板器件及测温装置，能够大大提升NTC的密封性，提升防水防潮效果
[0015]根据本申请提供的一种NTC封装结构，与现有技术相比有益效果在于：NTC器件通过封装帽密封在印刷电路板上，所述NTC器件与第二独立铜箔层连接，在镍片封装帽内通过过孔连接到第一铜箔层，避免内部电路重叠。封装帽为金属材料，封装帽与印刷电路板的第二独立铜箔层通过金属焊接层密封，密封性更好，能够完全密封，且通过金属焊接层密封具有可检测性，可通过x-ray或气密性测试来检测密封性，而现有的通过胶水封装时，无法检测胶水的密封性。本申请通过金属焊接层将封装帽与印刷电路板的第二独立通过层连接，能够完全密封，密封效果更好。本实施例提供的一种NTC封装结构，能够将NTC与外界完全隔绝，杜绝潮汽影响，通过金属焊接层封装具有可检测性，从而增强产品的可靠性和使用寿命。
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Figure CN224670098U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of temperature probe electronic component packaging technology, and in particular to an NTC sealing structure, a busbar connecting nickel sheet, a circuit board device and a temperature measuring device, which can be applied to flexible printed circuit boards or rigid printed circuit boards and temperature measuring devices. Background Technology
[0002] Temperature probes are used to measure the temperature of food and have high requirements for waterproofing and moisture protection. This is especially true for NTC (Negative Temperature Coefficient Thermistor) devices. As the core component of temperature detection, the operational stability of the NTC thermistor directly affects the accuracy of temperature measurement; therefore, NTC devices must be protected against water and moisture.
[0003] Currently, CCS NTC protection uses an adhesive application method, specifically applying adhesive to cover and isolate the NTC from the outside environment within a nickel sheet with protective ears or an FR4 U-shaped frame. This protection method firstly requires high-performance adhesive, secondly requires high surface cleanliness of the FP (partial film), and thirdly, the adhesive is susceptible to the effects of high temperature and humidity environments. The existing NTC sealing method results in insufficient protective stability.
[0004] Therefore, finding a suitable NTC sealing structure is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0005] Based on this, in response to the problem of insufficient sealing stability of existing NTCs mentioned above, it is necessary to propose an NTC sealing structure, busbar connecting nickel sheet, circuit board components and temperature measuring device, which can greatly improve the sealing performance of NTCs and enhance waterproof and moisture-proof effects.
[0006] In one aspect, an NTC sealing structure is provided, including an NTC device and a package cap; The NTC device can be disposed at the package location of a printed circuit board, and the printed circuit board has a first copper foil layer and a second independent copper foil layer exposed at the package location; The encapsulation cap covers the NTC device at the encapsulation location; The NTC device is connected to a second independent copper foil layer and is connected to the first copper foil layer through a via inside the nickel foil cap; The encapsulation cap is sealed to the second independent copper foil layer of the printed circuit board via a metal solder layer.
[0007] In one embodiment, the printed circuit board includes a rigid printed circuit board and a flexible printed circuit board.
[0008] In one embodiment, the encapsulation cap is a nickel sheet cap.
[0009] In one embodiment, the encapsulation cap includes four straight folds, each having a folded encapsulation surface in contact with a second independent copper foil layer, and the nickel cap is sealed to the second independent copper foil layer via the four straight folds and a metal solder layer.
[0010] In one embodiment, the encapsulation cap includes a circumferential fold edge having a circumferential encapsulation surface in contact with a second independent copper foil layer, and the nickel cap is sealed to the second independent copper foil layer through the circumferential fold edge and the metal solder layer.
[0011] In one embodiment, the metal solder layer is a tin bonding layer.
[0012] Secondly, a busbar connecting nickel sheet is provided, including an encapsulation cap, the encapsulation cap being integrally formed with the rest of the busbar connecting nickel sheet.
[0013] Thirdly, a circuit board device is provided, including any of the NTC sealing structures described in the first aspect, wherein the circuit board device is an FPC device or a PCB device.
[0014] Fourthly, a temperature measuring device comprising any of the NTC sealing structures described in the first aspect.
[0015] According to the NTC packaging structure provided in this application, the advantages compared with the prior art are as follows: The NTC device is sealed on the printed circuit board by a packaging cap. The NTC device is connected to a second independent copper foil layer and connected to the first copper foil layer through vias within the nickel-plated packaging cap, avoiding internal circuit overlap. The packaging cap is made of metal, and the packaging cap is sealed to the second independent copper foil layer of the printed circuit board through a metal solder layer, resulting in better sealing performance and complete sealing. Furthermore, the metal solder layer sealing is detectable, and the sealing performance can be tested through X-ray or airtightness tests. In contrast, with existing adhesive-based packaging, the sealing performance of the adhesive cannot be tested. This application connects the packaging cap to the second independent through-layer of the printed circuit board through a metal solder layer, achieving complete sealing and a better sealing effect. The NTC packaging structure provided in this embodiment can completely isolate the NTC from the outside environment, eliminating the influence of moisture. The metal solder layer packaging provides detectability, thereby enhancing product reliability and service life. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is one of the partial schematic diagrams of an NTC package structure in one embodiment; Figure 2 This is a second partial schematic diagram of the NTC package structure in one embodiment; Figure 3 This is a partial schematic diagram of the NTC package structure in one embodiment; Figure 4 This is a perspective view of an NTC package structure in one embodiment; Figure label: 10. NTC device; 20. Package cap; 30. Printed circuit board. Detailed Implementation
[0018] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0019] Firstly, see Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, an NTC sealing structure is provided, including an NTC device 10 and a package cap 20; The NTC device 10 can be disposed at the encapsulation position of the printed circuit board 30, and the printed circuit board 30 has a first copper foil layer and a second independent copper foil layer exposed at the encapsulation position. The encapsulation cap 20 covers the NTC device 10 at the encapsulation location; The NTC device 10 is electrically connected to the first copper foil layer of the printed circuit board 30; The encapsulation cap 20 and the second independent copper foil layer of the printed circuit board 30 are sealed together by a metal solder layer.
[0020] Specifically, the NTC device 10 is sealed on the printed circuit board 30 by a package cap 20. The NTC device 10 is connected to a second independent copper foil layer and connected to the first copper foil layer through a via within the nickel-plated package cap. The package cap 20 is electrically connected to the second independent copper foil layer to avoid internal circuit overlap. The package cap 20 is made of metal, and the package cap 20 is sealed to the second independent copper foil layer of the printed circuit board 30 through a metal solder layer, resulting in better sealing performance and complete sealing. Furthermore, the metal solder layer seal is detectable, and its sealing performance can be tested using X-ray or airtightness testing. In contrast, existing adhesive-based encapsulation methods cannot test the sealing performance of the adhesive. This application connects the package cap 20 to the second independent through-layer of the printed circuit board 30 through a metal solder layer, achieving complete sealing and a better sealing effect. The NTC packaging structure provided in this embodiment can completely isolate the NTC from the outside environment, eliminating the influence of moisture. The metal solder layer encapsulation provides detectability, thereby enhancing product reliability and lifespan.
[0021] In one embodiment, the printed circuit board 30 includes a rigid printed circuit board 30 and a flexible printed circuit board 30.
[0022] Specifically, for example, a flexible printed circuit board (FPC) 30 is selected as the carrier, and the packaging positions are marked on its surface. A first copper foil layer and a second independent copper foil layer are exposed through an etching process. An NTC device 10 is placed at the packaging position and soldered to the second independent copper foil layer. Holes are drilled to connect it to the first copper foil layer, and the traces avoid the loop pads of the nickel-plated cap to achieve electrical connection. A nickel-plated packaging cap 20 is used to cover the NTC device 10, ensuring that the folded edge of the packaging surface is in complete contact with the second independent copper foil layer. Solder paste is applied between the folded edge of the packaging surface and the second independent copper foil layer using a solder paste printing process. Reflow soldering melts and solidifies the solder paste, forming a solder bonding layer, thus completing the sealed connection between the packaging cap 20 and the FPC.
[0023] For example, in the rigid printed circuit board 30 PCB, the second independent copper foil layer at the package location is designed as a circular exposed area.
[0024] In one embodiment, the encapsulation cap 20 is a nickel sheet cap.
[0025] Specifically, nickel metal has excellent resistance to chemical corrosion and can effectively resist moisture. It is not easily oxidized or corroded during long-term use, which can ensure the sealing and protection effect of the encapsulation cap 20 on the NTC device 10. In addition, nickel has good bonding performance with commonly used welding materials, and it is easy to form stable intermetallic compounds during the welding process, ensuring the reliability of the welding seal between the encapsulation cap 20 and the second independent copper foil layer, and reducing the risk of poor soldering or desoldering.
[0026] In one embodiment, the encapsulation cap 20 includes four straight folds, each having a folded encapsulation surface in contact with a second independent copper foil layer. The nickel cap is sealed to the second independent copper foil layer via the four straight folds and a metal solder layer.
[0027] Specifically, the four straight folds are typically symmetrically distributed on the four sides of the encapsulation cap 20. Each fold is bent perpendicularly toward the printed circuit board 30, forming a folded encapsulation surface that contacts the second independent copper foil layer. This symmetrical distribution design can evenly distribute soldering stress, avoid seal failure caused by excessive force on one side, and ensure the fit between the encapsulation cap 20 and the printed circuit board 30.
[0028] In one embodiment, the encapsulation cap 20 includes a circumferential fold edge having a circumferential encapsulation surface in contact with a second independent copper foil layer, and the nickel cap is sealed to the second independent copper foil layer through the circumferential fold edge and the metal solder layer.
[0029] Specifically, the encapsulation cap 20 includes a circumferential folded edge, which is sealed to a second independent copper foil layer.
[0030] In one embodiment, the metal solder layer is a tin bonding layer.
[0031] Specifically, stable intermetallic compounds, such as tin-nickel alloys, are easily formed during the welding process, ensuring the reliability of the welding seal between the encapsulation cap 20 and the second independent copper foil layer, reducing the risk of poor soldering or desoldering, and using tin metal to connect the second independent copper foil to the sealing cap.
[0032] Secondly, a busbar connecting nickel sheet is provided, including an encapsulation cap 20, which is integrally formed with the rest of the busbar connecting nickel sheet.
[0033] Specifically, the encapsulation cap 20 and the main body of the busbar connecting nickel sheet are made into a single unit, such as by stamping, laser cutting or chemical etching.
[0034] Thirdly, a circuit board device is provided, including any of the NTC sealing structures described in the first aspect, wherein the circuit board device is an FPC device or a PCB device.
[0035] Fourthly, a temperature measuring device comprising any of the NTC sealing structures described in the first aspect.
[0036] It should be noted that the NTC device 10 is sealed on the printed circuit board 30 by the encapsulation cap 20. The NTC device 10 is soldered to the second independent copper foil layer and connected to the first copper foil layer via a hole. The traces avoid the loop pads of the nickel cap. The encapsulation cap 20 is electrically connected to the second independent copper foil layer to avoid internal circuit overlap. The encapsulation cap 20 is made of metal, and the encapsulation cap 20 is sealed to the second independent copper foil layer of the printed circuit board 30 through a metal solder layer, resulting in better sealing performance and complete sealing. Furthermore, the metal solder layer seal is detectable, and the sealing performance can be tested via X-ray or airtightness testing. In contrast, existing adhesive-based encapsulation cannot test the sealing performance of the adhesive. This application connects the encapsulation cap 20 to the second independent copper foil layer of the printed circuit board 30 through a metal solder layer, achieving complete sealing and a better sealing effect. The NTC encapsulation structure provided by the above embodiment can completely isolate the NTC from the outside environment, eliminating the influence of moisture. The metal solder layer encapsulation provides detectability, thereby enhancing product reliability and lifespan.
[0037] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly set on the other component; when a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to the other component.
[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" or "several" means two or more, unless otherwise explicitly specified.
[0039] It should be noted that the structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.
[0040] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. An NTC sealing structure, characterized in that, Including NTC devices and their caps; The NTC device can be disposed at the package location of a printed circuit board, and the printed circuit board has a first copper foil layer and a second independent copper foil layer exposed at the package location; The encapsulation cap covers the NTC device at the encapsulation location; The NTC device is connected to a second independent copper foil layer and is connected to the first copper foil layer through a via inside the nickel foil cap; The encapsulation cap is sealed to the second independent copper foil layer of the printed circuit board via a metal solder layer.
2. The NTC sealing structure according to claim 1, characterized in that, The printed circuit board includes rigid printed circuit boards and flexible printed circuit boards.
3. The NTC sealing structure according to claim 1, characterized in that, The encapsulation cap is a nickel sheet cap.
4. The NTC sealing structure according to claim 3, characterized in that, The encapsulation cap includes four straight folds, each having a folded encapsulation surface that contacts the second independent copper foil layer. The nickel cap is sealed to the second independent copper foil layer via the four straight folds and a metal welding layer.
5. The NTC sealing structure according to claim 4, characterized in that, The encapsulation cap includes a circumferential folded edge, which has a circumferential encapsulation surface in contact with the second independent copper foil layer. The nickel cap is sealed to the second independent copper foil layer through the circumferential folded edge and the metal solder layer.
6. The NTC sealing structure according to claim 1, characterized in that, The metal welding layer is a tin bonding layer.
7. A type of busbar connecting nickel sheet, characterized in that, It includes a sealing cap, which is integrally formed with the rest of the nickel strip connected to the busbar.
8. A circuit board device, characterized in that, Includes any of the NTC sealing structures described in claims 1-5, wherein the circuit board device is an FPC device or a PCB device.
9. A temperature measuring device, characterized in that, Includes any one of the NTC sealing structures described in claims 1-5.