Power electronics building blocks, electronic sub-modules for power electronics building blocks, and modular systems

Abstract

The present application relates to a power electronics building block, a sub-module for a power electronics building block and a modular system. The power electronics building block comprises a first sub-module and a second sub-module. The first sub-module comprises at least one semiconductor module and one or more capacitors. The second sub-module comprises one or more electronic devices for controlling the power electronics building block. The second sub-module is detachably connected to the first sub-module.

Description

Technical Field

[0001] This disclosure relates to a power electronic building block (PEBB) that can be used in a modular power converter system. The PEBB can be configured to be mounted in a rack or cabinet along with multiple other PEBBs. The PEBB can be a unit of a modular multilevel converter (MMC). Background Technology

[0002] This type of PEBB contains capacitor cells for charging and discharging capacitor cells and semiconductor switches. The PEBB is controlled by electronic devices, which are typically located within the section of the PEBB containing the semiconductor switches. In modular power converter systems, individual PEBBs can be maintained and replaced by removing them from the rack or cabinet.

[0003] US 2016 219 743 A2 discloses a modular multilevel converter that includes a capacitor bank and a power electronic module connected to the capacitor bank. Utility Model Content

[0004] Embodiments of this disclosure relate to an improved power electronics building block, submodules for the power electronics building block, and a modular system.

[0005] The Power Electronic Building Block (PEBB) includes a first submodule comprising at least one semiconductor module and one or more power capacitors; and a second submodule comprising one or more electronic devices for controlling the Power Electronic Building Block, wherein the second submodule is detachably connected to the first submodule.

[0006] This detachable connection allows for the individual replacement of the second submodule in case of failure or maintenance. As an example, the PEBB can be placed in a rack or cabinet, where the second submodule can be removed while the first submodule remains in the rack or cabinet. The second submodule in stock can be assembled with the first submodule. Furthermore, the electronics in the second submodule are kept at a distance from the semiconductor module during operation, thus protecting it in the event of a failure (e.g., a semiconductor module explosion).

[0007] The second submodule can be slidably connected to the first submodule. For example, the first submodule may include one or more rails, wherein the second submodule is configured to be coupled to the rails. The rails provide guided movement due to the assembly of the second submodule with the first submodule.

[0008] The second submodule can be connected to the side of the first submodule. This side is the side of the first submodule located between the front of the PEBB (directly accessible when the PEBB is placed in a rack or cabinet) and the back of the PEBB (opposite to the front). This side can extend along the first section where the semiconductor module is located and the second section where the power capacitor is located. The second submodule can form the side panel of the PEBB.

[0009] By placing the second submodule on the side, the first part, where the semiconductor modules in the PEBB are located, can still be accessed from the front, thus enabling separate maintenance of the first part. The first part can also be detachably connected to the second part.

[0010] One or more electronic devices in the second submodule may include at least one of a power supply, a controller, a bypass control unit, a gate unit, and a fuse board. The second submodule may include all of these components. One or more of these components may also be located in the first submodule.

[0011] The electronics of the second submodule are mounted on a support plate located on the side of the first submodule. The support plate also provides shielding and protection for the electronics during operation and in the event of a failure, protecting them from the semiconductor modules and power capacitors. The support plate may extend along the entire side of the PEBB. The support plate may be oriented as a shelf perpendicular to the rack or cabinet. The second submodule may include a cover that can be removed from the rest of the second submodule.

[0012] In addition to at least one semiconductor module, the first submodule may also include at least one of a gate driver and bypass circuitry. The first submodule may include multiple semiconductor modules. These semiconductor modules may be positioned on opposite sides of a heat sink.

[0013] The first submodule may include a box-shaped frame. Guide rails may be fixed to the frame. The first submodule may include a base plate that supports the components of the first submodule.

[0014] The second submodule may include one or more connectors for detachable connections to electronic devices. One or more of these connectors are accessible from the front of the PEBB for connection. All connectors to be removed when detaching the second submodule from the first submodule are accessible from the front for connection. As an example, the connectors may have plugs or quick-connects positioned on the front. This allows for easy and quick assembly and disassembly of the second submodule.

[0015] As an example, some detachable connectors can be attached to the outside of the PEBB, while other connectors can be attached to the first submodule of the PEBB.

[0016] According to another aspect, a submodule for a power electronics building block is disclosed. The power electronics building block includes a first submodule comprising at least one semiconductor module and one or more power capacitors, wherein the electronic submodule includes at least one electronic device for controlling the power electronics building block, and wherein the electronic submodule is configured to be detachably and slidably connected to the first submodule.

[0017] A submodule may include any of the structural and functional features of the second submodule disclosed above. A submodule may also be represented as an electronic submodule. The PEBB and the first submodule may include any of the structural and functional features of the PEBB and the first submodule disclosed above.

[0018] Submodules can be manufactured in stock. Submodules can be used to replace faulty submodules in the PEBB.

[0019] According to another approach, a modular system for power electronics building blocks includes two first sub-modules and one second sub-module. Each first sub-module contains at least one semiconductor module and one or more power capacitors. The second sub-module includes one or more electronic devices for controlling the power electronics building blocks. The two first sub-modules have different dimensions, and the second sub-module can be selectively and detachably connected to one of the two first sub-modules.

[0020] Each first submodule and second submodule can have the structural and functional features described above for the first and second submodules.

[0021] The two first submodules can have different widths but the same length and height. Specifically, the side extensions can be identical. A second submodule can be selectively connected to the side of one of the first submodules. This system allows the same electronic submodules to be used in PEBB cells of different sizes, for example, in cases where the number of capacitors in the PEBB cell differs.

[0022] In the method for assembling the first and second sub-modules of the PEBB as described above, the second sub-module is connected to the first sub-module. As an example, this connection is achieved via a guide rail of the first sub-module and a coupling element of the second sub-module, or vice versa. The second sub-module is then guided to its assembly position with the first sub-module by a sliding movement along a first direction. The second sub-module can be detachably secured in this position, for example, by a snap-fit ​​mechanism or a similar mechanism. When the second sub-module is almost or completely assembled with the first sub-module, its connector can be connected via a plug or quick-connector.

[0023] When the first submodule is located in a rack or cabinet, the second submodule can be assembled onto and removed from the first submodule. Alternatively, the second submodule can be assembled outside the rack or cabinet. In this case, the assembled PEBB can then be placed in the rack or cabinet. In case of failure, the second submodule can be removed and replaced by pulling it out in a second direction opposite to the first direction.

[0024] This disclosure includes multiple aspects and embodiments. Even if a particular feature is not explicitly mentioned herein, each feature described with respect to one aspect and embodiment is also disclosed with respect to other aspects and embodiments.

[0025] Other features, improvements, and conveniences will become apparent from the following description of exemplary embodiments in conjunction with the accompanying drawings. In the drawings, elements having the same structure and / or function may use the same reference numerals. It should be understood that the embodiments shown in the figures are merely illustrative and are not necessarily drawn to scale. Attached Figure Description

[0026] Figure 1A An embodiment of the power electronic component block is shown in the perspective view; Figure 1B Showing an open lid Figure 1A Examples of power electronic component blocks; Figure 1C Shown in front view Figure 1A Examples of power electronic component blocks; Figure 1D The front view shows the uncovered area. Figure 1A Examples of power electronic component blocks; Figure 2A An embodiment of the submodule is shown in the perspective view; Figure 2B Showing an open lid Figure 2A Submodules; Figure 2C The view from the support plate shows the uncovered section. Figure 2A Submodules; Figures 3A-3D Another embodiment with or without a cover for the power electronic building blocks is shown in different views; Figures 4A-4D Another embodiment with or without a cover for the power electronic building blocks is shown in different views; Figures 5A-5D An embodiment of a method for assembling power electronics building blocks is illustrated; Figures 6A-6C An example of a modular system of power electronic building blocks is shown in the perspective view. Detailed Implementation

[0027] Figure 1A The Power Electronics Module (PEBB) 1 is shown.

[0028] PEBB 1 can be used in modular power converter systems, where multiple PEBB 1 units are connected for higher power. As an example, PEBB 1 can be used in a modular multilevel converter (MMC) and can also be represented as an MMC unit.

[0029] Multiple PEBBs 1 in a modular system can be connected in parallel or in series. PEBBs 1 can be configured to be inserted into racks or cabinets. Specifically, PEBBs 1 can be configured to be inserted into racks or cabinets along a first direction D1 perpendicular to the front face 9, and can be removed from racks along the opposite second direction D2.

[0030] PEBB 1 includes at least one semiconductor module 2 (e.g., an IGBT half-bridge) for controlling and / or switching electrical energy. The semiconductor module 2 is located in a first portion 3 of the PEBB, which is the active portion of the PEBB 1.

[0031] PEBB1 also includes a second part 4, in which one or more capacitors 5 are provided, particularly power capacitors. Capacitor 5 is a cartridge capacitor. The cartridge capacitor can be a film capacitor. Capacitor 5 operates on a DC voltage that has been converted and returned by a switch from the input AC voltage. Power capacitor 5 can also be other types, such as cylindrical capacitors.

[0032] Part 3 and Part 4 are components of the first submodule 6 of PEBB 1. The first submodule 6 includes a frame 7 for supporting the components of Part 3 and Part 4. Frame 7 has a rectangular block geometry. Frame 7 may be a metal frame. Frame 7 includes rails 8 forming its edges. Frame 7 may have a base plate on which the components of Part 3 and / or Part 4 are placed.

[0033] PEBB 1 has a front panel 9 and an opposite rear panel 10, the front panel being accessible from the front of the rack or cabinet. A first section 3 is located on the front panel 9, and a second section 4 is located behind the first section 3 and on the rear panel 10.

[0034] PEBB 1 includes a second submodule 11 located on side 12 of PEBB 1. Side 12 is the side of PEBB 1 that connects front 9 and back 10. Side 12 is arranged perpendicular to front 9 and back 10. Side 12 is arranged perpendicular to the shelf of the rack or cabinet on which PEBB 1 is placed.

[0035] The second submodule 11 is panel-shaped. The second submodule 11 may cover the entire side of the first submodule 6 and form side 12 of PEBB 1. The second submodule 11 may also cover only a portion of the side of the first submodule 6.

[0036] The second submodule 11 is detachably connected to the first submodule 6, particularly to the side of the first submodule 6. The second submodule 11 is configured to be detached from the first submodule 6 by moving the second submodule 11 toward the second direction D2, and to be assembled with the first submodule 6 by moving it toward the first direction D1.

[0037] A guided connection between the second submodule 11 and the first submodule 6 can be achieved by interacting the guide rail of the first submodule 6 with the coupling element of the second submodule 11, and vice versa. The guide rail extends along the insertion direction and can be disposed on the side of the first submodule 6. Therefore, the second submodule 11 adopts the form of a slide-out unit electronics device.

[0038] The second submodule 11 includes at least one electronic device for controlling PEBB 1. Figure 1A In the middle, the electronic device is covered by cover 13.

[0039] Figure 1B PEBB 1 is shown, which does not have a cover 13 for the second submodule 11. The second submodule 11 includes a plurality of electronic devices 14 mounted on a support plate 15. The support plate 15 is detachably connected to the side of the first submodule 6, for example by means of guide rails and a locking mechanism for locking the first submodule 6 into place.

[0040] Electronic device 14 includes a power supply 16 for supplying power to PEBB 1, particularly to the control circuitry of PEBB 1. The power supply 16 is provided in the form of a printed circuit board assembly (PCBA).

[0041] In addition, the electronic device 14 includes a controller 17 for controlling the operation of power electronic components (particularly semiconductor module 2). The controller 17 is provided in the form of a PCBA.

[0042] In addition, the electronic device 14 also includes a bypass control unit 18 for controlling the bypass switching of the PEBB (e.g., during a failure of PEBB 1). The bypass control unit 18 can disconnect PEBB 1 from the system. The bypass control unit 18 is provided in the form of a PCBA.

[0043] In addition, the electronic device 14 includes a gate unit 19 for driving the semiconductor module 2 and a fuse board 20 for protecting the sensitive components of PEBB 1 from overcurrent.

[0044] The detachable connection between the second submodule 11 and the first submodule 6 allows the second submodule 11 to be removed independently of the first submodule 6 in the event of a failure or maintenance. The second submodule 11 can be replaced by another second submodule 11 from the inventory. This allows the second submodule 11 to be replaced separately from other components of PEBB 1, such as semiconductor module 2 and power capacitor 5. Replacement can be completed quickly, and PEBB 1 can be quickly restored to operation.

[0045] Compared to PEBBs known in the prior art, the electronic device 14 is separated from the first section 3 of PEBB 1 (i.e., the compartment where the semiconductor module 2 is located). Besides the advantage of separate maintenance, this frees up space occupied in the first section 3, expanding the design possibilities of the first section 3. For example, if a smaller capacitor is used in the second section 4, the overall width of PEBB 1 can be reduced, allowing for a reduction in the width of the second section 4.

[0046] In addition, the electronic device 14 (particularly the PCBA) is shielded from the semiconductor module 2 (i.e., the EMC (electromagnetic compatibility) source) by increasing the distance and by using a support plate 15 located between the semiconductor module 2 and the electronic device 14. Furthermore, the electronic device 14 is protected in the event of a malfunction (e.g., the semiconductor module 2 exploding). Therefore, the electronic device 14 is not placed in a high-risk area as described in Part 3.

[0047] Furthermore, the separation of electronic device 14 provides greater freedom for the development of electronic device 14, provides sufficient space for electronic device 14, and allows electronic device 14 to be replaced independently of the first submodule 6.

[0048] The overall width of PEBB 1 may increase slightly due to placing the second submodule 11 on the side 12 of PEBB 1. However, since there is available free space in the first part 3 and the width of the second part 4 can be reduced, the overall width of PEBB 1 may also be reduced. Therefore, the footprint of PEBB 1 may not increase.

[0049] By providing the electronic device 14 in a pre-assembled manner through the second submodule 11, it is possible to manufacture from stock and quickly replace it in case of failure. In addition, the wiring of the electronic device 14 can be done outside the first submodule 6 for easy connection and disconnection.

[0050] Furthermore, the second submodule 11 is connected to the side of the first submodule 6 such that if different sides of the first submodule 6 allow connection of the second submodule 11, the second submodule 11 can be selectively used with the first submodule 6 of different sizes.

[0051] The first part 3 and the second part 4 of PEBB 1 can be non-detachably connected to each other. Alternatively, the first part 3 and the second part 4 can be detachably connected to each other. In this case, the frame 6 can include a first frame component for the first part 3 and a second frame component for the second part 4, which are detachably connected to each other. This allows for maintenance and replacement of the components of the first part 3 without affecting the second part 4. As an example, the first part 3 can be removed from the second part 4 by pulling it along the second direction D2. However, in the same case, the second submodule 11 is detachably connected to the first submodule 6.

[0052] Figure 1C and Figure 1D Shown in the front view 9 Figure 1A and 1B PEBB 1 in, where, Figure 1D In the middle, the cover of the second submodule 11 has been removed.

[0053] like Figure 1C and 1D As shown, the first part 3 of the first submodule 6 includes multiple semiconductor modules 2 located on both sides of the heat sink 21. Gate drivers 22 are mounted on the semiconductor modules 2, specifically fixed to the top of the IGBT by screws. Furthermore, a bypass circuit 23a is installed in the first part 3 of the first submodule 6 to protect the semiconductor modules 2 in the event of a fault. The bypass circuit 23a is a DC bypass. The first part 3 includes another bypass circuit 23b for AC bypass. Therefore, the first part 3 may include some electronic components in addition to the semiconductor modules 2.

[0054] Figure 2A An electronic submodule 11 is shown, which can be Figures 1A to 1D The second submodule 11 shown is in a state of being disconnected from the first submodule 6. Figure 2A Submodule 11 is shown in the perspective view. Figure 2B The second submodule 11 is shown in the perspective view. Figure 2C The second submodule 11 is shown in a view taken from the uncovered support plate 15.

[0055] Figure 2A The second submodule 11 shown can be kept in stock for replacing a faulty second submodule of the PEBB.

[0056] Electronic submodule 11 can be replaced entirely or as a single component. Under no circumstances should the entire PEBB 1 or the entire first part 3 of PEBB 1 be replaced.

[0057] Figure 2CConnectors 24-30 for transmitting signals and / or power are schematically shown. Electronic devices 14 of submodule 11 are connected internally to submodule 11 via power connector 24 (solid line) and auxiliary power connector 25 (dashed line).

[0058] Multiple connectors 26-30 connect the electronic device 14 to the outside of the first submodule 6 or PEBB 1, and these connectors are detachable.

[0059] Signal connector 26 connects controller 17 to the outside of PEBB 1. As an example, signal connector 26 may be a fiber optic quick connector that connects to the tower power distribution line of the converter system.

[0060] Cable connector 27 connects gate unit 19 to local gate driver 22 in the first part 3 of PEBB 1 via a plug.

[0061] Cable connector 28 connects bypass control unit 18 to bypass circuits 23a, 23b via a plug, specifically to the AC bypass and DC bypass in the first part 3 of PEBB 1.

[0062] Cable connector 29 connects the bypass control unit 18 to the di / dt detector on the sleeve or terminal of capacitor 5.

[0063] Cable connector 30 is connected to the DC bus inside PEBB 1 via a plug.

[0064] All detachable connections 26-30, namely those to the outside of PEBB 1 and to the first submodule 6, are accessible from the front of PEBB 1 (i.e., to the left of electronic submodule 11 as shown here). This allows for easy and quick connection and disconnection of electronic submodule 11, thus facilitating replacement.

[0065] The second submodule 11 includes an interface 32 for connection to the detachable connectors 26-30. Interface 32 is located within the front cover 33 of the second submodule 11. Interface 32 is the entry point for a control cable to connect to PEBB 1, which can be connected to one or more plugs of the detachable connectors 26-30. Positioning interface 32 on the front 9 of PEBB 1 allows for easy connection by plugging and unplugging the control cable.

[0066] Figures 3A to 3D Another implementation of PEBB 1 is shown, which is similar to Figures 1A to 1D The difference in the implementation method is that the first submodule 6 has a smaller width w. Compared to Figures 1A to 1D Part 4 includes fewer capacitors 5. Height h and length l are... Figures 1A to 1D The first submodule 6 is the same.

[0067] The second submodule 11 can be connected with Figures 1A to 1D The second submodule 11 is the same as that of the first submodule 6 because the sides have the same dimensions. However, the same second submodule 11 can be used even if the dimensions are slightly different.

[0068] This demonstrates the modularity of the system, where the same electronic submodule 11 can be used for the first submodule 6 of different sizes (especially different widths).

[0069] Figures 4A to 4D Another implementation of PEBB 1 is shown, which is similar to Figures 3A to 3D The difference in the implementation method is that the first submodule 6 has a smaller width w. Compared to Figures 3A to 3D Part 4 includes fewer capacitors 5. Height h and length l are... Figures 1A to 1D The first submodule 6 is the same. For this embodiment, the same electronic submodule 11 can also be used.

[0070] Figures 5A to 5D A method for assembling an embodiment of PEBB 1 is shown.

[0071] like Figure 5A As shown, a first submodule 6 is provided, which includes a power capacitor 5 and a semiconductor module 2 located within a frame 7. The first submodule 6 can be placed in a rack or cabinet. The first submodule 6 can be as disclosed in the foregoing embodiments.

[0072] exist Figure 5B The embodiment provides a second submodule 11 containing electronic components. The second submodule 11 may be as disclosed in the foregoing embodiments.

[0073] exist Figure 5C In the first submodule 6, the second submodule 11 is connected to the guide rail 31 of the first submodule 6, and is assembled with the first submodule 6 by pushing the second submodule along the first direction D1.

[0074] exist Figure 5D In this assembly, the second submodule 11 is fully assembled with the first submodule 6 to form PEBB 1. The second submodule 11 can be detachably fixed in this position by means of a snap-fit ​​mechanism or a similar mechanism.

[0075] When the second submodule 11 is almost or completely assembled with the first submodule 6, the detachable connectors 26-30 of the second submodule 11 can be connected via a plug or quick connector. Specifically, a control cable can be inserted from the outside into interface 32 to connect to the detachable connectors 26-30. Interface 32 can be configured as a receptacle.

[0076] When the first submodule 6 is placed in a rack or cabinet, the second submodule 11 can be assembled to and removed from the first submodule 6. Alternatively, the second submodule 11 can be assembled to the first submodule 6 outside the rack or cabinet and then placed in the rack or cabinet in the assembled state. In case of failure, the second submodule 11 can be removed and replaced by pulling it out in a second direction opposite to the first direction D1.

[0077] Figures 6A to 6C An embodiment of a modular system 100 for PEBB 1 is shown in the perspective view. The modular system 100 includes a second submodule 11 and two first submodules 6a and 6b of different sizes. Specifically, the two first submodules 6a and 6b have different widths w but the same length l and height h. The first submodules 6a and 6b and the second submodule 11 can be as disclosed in the foregoing embodiments.

[0078] The second submodule 11 can be selectively and detachably connected to the first submodule 6a of the two first submodules (e.g., Figure 6B (as shown) or the second submodule 6b of the two first submodules (as shown) Figure 6C (As shown).

[0079] Figure Labels 1 Power Electronic Building Block (PEBB) 2 Semiconductor Modules 3 Part 1 4 Part Two 5 capacitors 6, 6a, 6b First Submodule 7 Framework 8 guide rails 9. Front 10. Back 11. Second Submodule (Electronic Submodule) 12 Side View 13 Covers 14 Electronic devices 15 Support Plates 16 Power Supply 17 Controller 18 Bypass Control Unit 19 gate units 20 Fuse Board 21 Radiator 22 Gate driver board Bypass circuits 23a and 23b 24. Electrical connector (internal) 25 Auxiliary power connector (internal) 26 Control connector (external to PEBB) Connectors 27, 28, 29, and 30 are connected to the first submodule. 31 guide rail 32-interface 33 Front Cover 100 Modular System D1 First (insertion) direction D2 Second (Retrieval) Direction w width h height l length

Claims

1. A power electronic building block (1), characterized in that, It includes a first submodule (6, 6a, 6b), which includes at least one semiconductor module (2) and one or more capacitors (5); and a second submodule (11), which includes one or more electronic devices (14) for controlling the power electronic building block (1), wherein the second submodule (11) is detachably connected to the first submodule (6, 6a, 6b).

2. The power electronics building block (1) as described in claim 1, characterized in that, The second submodule (11) can be slidably connected to the first submodule (6, 6a, 6b).

3. The power electronics building block (1) as described in claim 2, characterized in that, The first submodule (6, 6a, 6b) includes at least one guide rail (31) for guiding the sliding motion of the second submodule (11).

4. The power electronic building block (1) as described in any of the preceding claims, characterized in that, The semiconductor module (2) is located in the first part (3) of the power electronics building block (1), and the capacitor (5) is located in the second part (4) of the power electronics building block (1), wherein the first part (3) forms the front side (9) of the power electronics building block (1), and the second part forms the back side (10) of the power electronics building block (1). The second sub-module (11) is located on the side (12) of the power electronics building block (1), which connects the front (9) and the back (10).

5. The power electronic building block (1) as described in any one of claims 1 to 3, characterized in that, The one or more electronic devices (14) of the second submodule (11) include at least one of the following: - Power supply (16). - Controller (17) - Bypass control unit (18). - Gate unit (19), and - Fuse board (20).

6. The power electronic building block (1) as described in any one of claims 1 to 3, characterized in that, The first submodule (6, 6a, 6b) includes at least one of the following in addition to the at least one semiconductor module (2): - Gate driver (22) - Bypass circuits (23a, 23b).

7. The power electronic building block (1) as described in any one of claims 1 to 3, characterized in that, The electronic device (14) of the second submodule (11) is mounted on a support plate (15) positioned on the side of the first submodule (6, 6a, 6b).

8. The power electronic building block (1) as described in any one of claims 1 to 3, characterized in that, The second submodule (11) includes a removable cover (13) for covering the electronic device (14).

9. The power electronic building block (1) as described in any one of claims 1 to 3, characterized in that, The first submodule (6, 6a, 6b) includes a box-shaped frame (7).

10. The power electronic building block (1) as described in any one of claims 1 to 3, characterized in that, The second submodule (11) includes one or more connectors (26-30) for detachable connection to the electronic device (14), wherein the connectors (26-30) are accessible at the front (9) of the power electronics building block (1) for connection.

11. The power electronics building block (1) as described in claim 10, characterized in that, The second submodule (11) includes an interface (32) for enabling the connection of a control cable to one or more connectors (26-30), wherein the interface (32) includes a hole in the front cover (33) of the second submodule (11).

12. The power electronics building block (1) as described in claim 10, characterized in that, The connectors (26-30) connect the electronic device (14) to the first submodule (6) and / or to the outside.

13. An electronic submodule for a power electronics building block (1), characterized in that, in, The power electronics building block (1) includes a first submodule (6), which includes at least one semiconductor module (2) and one or more power capacitors (5). The electronic submodule includes at least one electronic device (14) for controlling the power electronic building block (1), wherein the electronic submodule is configured to be detachably and slidably connected to the first submodule (6).

14. A modular system (100) for power electronic building blocks (1), characterized in that, The modular system (100) includes a second submodule (11) and two first submodules (6a, 6b), wherein each first submodule (6a, 6b) includes at least one semiconductor module (2) and one or more power capacitors (5), and the two first submodules (6a, 6b) have different dimensions. Furthermore, the second submodule (11) includes one or more electronic devices (14) for controlling the power electronics building block (1). The second submodule (11) can be selectively and detachably connected to one of the two first submodules (6a, 6b) and the other.

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