Inverter unit

Abstract

The utility model relates to an inverter unit, include: metal casing (1), this metal casing has top wall (11), side wall, intermediate partition wall (12) and by top wall, side wall and intermediate partition wall define first accommodating chamber (10a) and second accommodating chamber (10b), film capacitor module (2), first accommodating chamber (10a) are used for receiving film capacitor module, and EMC filter (3), the EMC filter is electrically connected to film capacitor module and includes busbar positive copper bar (31), busbar negative copper bar (32), magnetic ring (33) and a plurality of capacitors, wherein part capacitors in a plurality of capacitors are accommodated in first accommodating chamber (10a), magnetic ring and the rest capacitors in a plurality of capacitors are accommodated in second accommodating chamber (10b).

Description

Technical Field

[0001] This utility model relates to the field of inverter technology, and more particularly to inverter units used in automotive electronic products or in fields where filters and capacitors are required. Background Technology

[0002] An inverter unit is a fundamental component of an inverter, used to convert direct current (DC) to alternating current (AC). It typically includes core modules such as thin-film capacitor modules, power modules, and electromagnetic compatibility (EMC) filters, and can operate independently or as part of a high-power inverter system.

[0003] In current inverter units, the EMC filter, film capacitor module, and EMC shield are designed and manufactured separately, and then bolted together. This results in a large inverter unit size, and the assembly of the EMC filter and film capacitor module is not compact enough, leading to low integration and impacting the overall power density and other performance characteristics of the controller. Furthermore, there are no heat dissipation components near the X / Y capacitors of the EMC filter, preventing it from achieving ideal heat dissipation. Additional EMC shields are needed for EMC shielding; additional metal shielding components are required to shield against crosstalk between the EMC and film capacitors; and a PCB board is also needed to complete the electrical connections between the X / Y capacitors and the copper busbars. Summary of the Invention

[0004] To overcome at least one of the above problems, there is a need to provide an improved inverter unit that is not only compact and low-cost with good heat dissipation, but also avoids crosstalk between EMC filters and film capacitors.

[0005] This utility model provides an inverter unit, comprising: a metal housing having a top wall, side walls, a middle partition wall, and a first receiving chamber and a second receiving chamber defined by the top wall, the side walls, and the middle partition wall; a thin-film capacitor module, wherein the first receiving chamber is used to receive the thin-film capacitor module; and an EMC filter, wherein the EMC filter is electrically connected to the thin-film capacitor module and includes a positive busbar, a negative busbar, a magnetic ring, and a plurality of capacitors, wherein a portion of the plurality of capacitors is housed in the first receiving chamber, and the magnetic ring and the remaining capacitors are housed in the second receiving chamber.

[0006] In the above scheme, the EMC filter and the thin-film capacitor module share the same metal housing, and the magnetic ring of the EMC filter (also known as the EMC filter core) is located in different housing chambers defined by the metal housing, which not only makes the inverter unit structure compact, but also reduces mutual interference.

[0007] According to a preferred embodiment of the present invention, the metal housing is generally rectangular in shape, with sidewalls including a first and a second sidewall along its length, and a third and a fourth sidewall along its width. A groove is provided in the outer surface of the top wall. The metal housing also has a first fluid channel in the third sidewall and a second fluid channel in the fourth sidewall. The first fluid channel is in fluid communication with the groove and extends in the third sidewall to a first port at the bottom of the third sidewall. The second fluid channel is in fluid communication with the groove and extends in the fourth sidewall to a second port at the bottom of the fourth sidewall. Thus, the first fluid channel, the groove, and the second fluid channel form a cooling medium channel extending between the first and second ports. This configuration integrates the cooling medium channel into the metal housing, enabling more efficient heat dissipation for the thin-film capacitor module and EMC filter while the cooling medium flows through the metal housing.

[0008] In one embodiment of this utility model, the thin-film capacitor module includes multiple capacitor core components housed in a housing chamber, a positive copper busbar electrically connected to the positive terminals of the multiple capacitor core components, and a negative copper busbar electrically connected to the negative terminals of the multiple capacitor core components. The multiple capacitor core components are encapsulated in the housing chamber by insulating and thermally conductive epoxy resin, and the epoxy resin fills the gaps between the multiple capacitor core components.

[0009] In a preferred embodiment of this utility model, the EMC filter is arranged close to the first sidewall, and the thin-film capacitor module is arranged close to the second sidewall; wherein the positive copper busbar of the EMC filter is electrically connected to the positive copper busbar of the thin-film capacitor module by laser welding, and the negative copper busbar of the EMC filter is electrically connected to the negative copper busbar of the thin-film capacitor module by laser welding.

[0010] In a preferred embodiment of this invention, the top wall has an elongated through-hole near the groove and located between the groove and the first sidewall, allowing the positive and negative copper busbars to extend through the elongated through-hole to the outside of the top wall. For example, the elongated through-hole is preferably an elongated rectangular through-hole extending parallel to the first sidewall. By providing such an elongated through-hole in the metal housing, the positive and negative copper busbars of the thin-film capacitor module can be electrically connected to the positive and negative terminals of the power module through the top wall, significantly reducing the overall height of the product, shortening the connection path, reducing stray inductance, and improving the performance of the power module.

[0011] According to a preferred embodiment of the present invention, the second receiving chamber may be defined by an intermediate partition wall, a portion of a first side wall, a portion of a third side wall, and a portion of a top wall; and the plurality of capacitors include an X capacitor and a Y capacitor disposed against the metal housing in the first receiving chamber, and another Y capacitor disposed in the second receiving chamber. In the above configuration, the X / Y capacitors are in close contact with the metal housing, and the heat dissipation is greatly improved.

[0012] In a preferred embodiment of this invention, the EMC filter further includes a metal shield disposed above the magnetic ring. The metal shield, together with the sidewalls surrounding the second receiving chamber, is used to suppress electromagnetic interference. Specifically, the metal shield can be used to achieve crosstalk shielding.

[0013] Preferably, the metal shield can be constructed as a sheet-like component adapted to the shape of the magnetic ring, particularly the shape of its top. This sheet-like component includes a rectangular body portion and bent portions at both ends of the rectangular body portion, each bent portion having a mounting hole. The sheet-like component secures the magnetic ring to the metal housing through the engagement of the mounting holes and threaded fasteners. In other words, the metal shield can function as both a shield and a fixing component. In the above embodiment, the magnetic ring is fixed to the metal housing by the metal shield, and the metal shield simultaneously forms a shielding space with the metal housing to prevent EMC crosstalk between the EMC filter and the thin-film capacitor module caused by integration.

[0014] In one advantageous embodiment, the magnetic ring comprises a ring housing and a magnetic core housed within the ring housing. The ring housing is made of a plastic material, and the magnetic core and ring housing are integrally formed by injection molding. That is, the magnetic ring is formed by injection molding the outer surface of the magnetic core. This type of magnetic ring has simple manufacturing molds, low cost, relatively small size, and also ensures the waterproofness of the ring housing. In this invention, the plastic material can be a thermoplastic material, such as polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), nylon 66 with glass fiber reinforcement, etc.

[0015] In one embodiment of this invention, an insulating film can be provided between the inner surfaces of multiple capacitor core components and the metal casing to prevent direct contact between the thin-film capacitor module and the metal casing, thereby avoiding dielectric breakdown or increased leakage current, which would affect the safety of the inverter unit. Attached Figure Description

[0016] Referring to the accompanying drawings and reading the following detailed description, further features and advantages of this utility model will become clearer:

[0017] Figure 1 A perspective view of an inverter unit according to an embodiment of the present invention is shown from top.

[0018] Figure 2 for Figure 1 A 3D view of the inverter unit from the bottom.

[0019] Figure 3 for Figure 1 An exploded view of the inverter unit shown;

[0020] Figure 4 This is a perspective view of the metal casing from the top according to an embodiment of the present invention;

[0021] Figure 5 for Figure 4 The image shown is a three-dimensional view of the metal casing from the bottom.

[0022] Figure 6 for Figure 4 Top view of the metal casing shown;

[0023] Figure 7 for Figure 6 The XX-section view of the metal casing shown;

[0024] Figure 8 for Figure 1 The inverter unit shown is a top view, with the potting compound removed; and

[0025] Figure 9 for Figure 8 The inverter unit shown is shown in section AA. Detailed Implementation

[0026] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The descriptions of orientation used in the following description, such as "upper," "lower," "inner," and "outer," are for convenience only unless explicitly stated otherwise and are not intended to limit the technical solutions of the invention. Furthermore, terms such as "first" and "second" are used below to describe elements of this application; these terms are only used to distinguish individual elements and are not intended to limit the nature, sequence, order, or number of these elements. Additionally, it should be noted that in this specification, the same technical features are represented by the same or similar reference numerals.

[0027] The terms "top" and "bottom" are used to describe the relational positioning of the features of this utility model. These terms should be understood as referring to... Figure 1 and Figure 2 The product shown is positioned accordingly. In this utility model, the "inverter unit" is a part of the inverter and is the core unit module of the inverter. The inverter according to this application is mainly used in new energy electric vehicles, but it can also be used in photovoltaic fields and frequency converters, etc.

[0028] In this article, a "magnetic ring," also referred to as an inductor ring or ferrite bead, is a ring-shaped component made of a magnetically conductive material. Its primary function is to impede the flow of current, generating inductive reactance. This characteristic is known as inductance. By adjusting its inductance value, a magnetic ring can filter and suppress specific frequency components in a circuit, thereby reducing or eliminating noise. Different types of magnetic rings have different inductance characteristics and applicable ranges. When selecting a magnetic ring, the appropriate material should be chosen based on the circuit requirements and operating environment. For example, ferrite magnetic rings are suitable for filtering and suppression in the high-frequency range, while manganese-zinc ferrite magnetic rings are suitable for filtering and suppression in the low-frequency range.

[0029] Figure 1 and Figure 2 An embodiment of an inverter unit 100 according to the present invention is shown. In this embodiment, the inverter unit 100 includes a metal housing 1, a thin-film capacitor module 2 and an EMC filter 3 housed within a housing cavity defined by the metal housing, the EMC filter 3 being electrically connected to the thin-film capacitor module 2.

[0030] Figure 3 An exploded view of the inverter unit described above is shown. Figure 4 , Figure 5 and Figure 6 A schematic diagram of the metal casing is shown. As can be seen from the diagram, the metal casing 1 is closed at the top and open at the bottom, and has a top wall 11, a first side wall 13 and a second side wall 14 along its length, a third side wall 15 and a fourth side wall 16 along its width, an intermediate partition wall 12, and a first receiving chamber 10a and a second receiving chamber 10b defined by the top wall, the side walls, and the intermediate partition wall, respectively. The thin-film capacitor module 2 is located in the first receiving chamber 10a, and a portion of the EMC filter 3 is located in the first receiving chamber 10a, while another portion is located in the second receiving chamber 10b. Furthermore, the top wall 11 also has, for example, a rectangular groove 111.

[0031] In the above embodiments, see especially Figure 4 and Figure 7A cooling medium channel is formed in the metal housing 1. Specifically, the metal housing 1 also has a first fluid channel 151 located in the third sidewall 15 and a second fluid channel 161 located in the fourth sidewall 16. The first fluid channel is in fluid communication with the space defined by the groove and extends in the third sidewall 15 to a first port 152 located at the bottom of the third sidewall. The second fluid channel is in fluid communication with the space defined by the groove and extends in the fourth sidewall 16 to a second port 162 located at the bottom of the fourth sidewall. Thus, the first fluid channel, the gap space, and the second fluid channel form a cooling medium channel extending between the first port and the second port. The above configuration of the cooling medium channel is merely exemplary. Other fluid channel layouts formed in the sidewall of the metal housing 1 and capable of fluid communication with the space defined by the groove are also covered within the scope of this application. Due to the above configuration of the inverter unit, the thin-film capacitor module 2 and the EMC filter share the same cooling medium channel, thereby enabling better heat dissipation for the thin-film capacitor module 2 and the EMC filter 3.

[0032] According to a preferred embodiment of the present invention, see [link to previous document]. Figure 8 The EMC filter 3 is arranged near the first sidewall 13, and the thin-film capacitor module 2 is arranged near the second sidewall 14. The thin-film capacitor module 2 includes multiple capacitor cores 20, positive copper busbars 21, and negative copper busbars 22. These capacitor cores 20 are encapsulated in the receiving chamber 10 through an open bottom opening of the metal housing 1 using insulating and thermally conductive epoxy resin. The positive copper busbar 21 is electrically connected to the positive electrode of each capacitor core 20, and the negative copper busbar 22 is electrically connected to the negative electrode of each capacitor core 20. Advantageously, the top wall 11 of the metal housing 1 also has, for example, an elongated rectangular through-hole 112 (see...). Figure 4 This allows the positive copper busbar 21 and the negative copper busbar 22 to extend through the elongated through-hole to the outside of the top wall. The elongated through-hole is located near the groove 111 and between the groove and the first sidewall 13, and the elongated through-hole 112 is preferably parallel to the groove.

[0033] In one particular embodiment, the EMC filter 3 is configured to include a positive busbar copper busbar 31, a negative busbar copper busbar 32, a magnetic ring 33, and multiple capacitors (see details). Figure 3 and Figure 8 The plurality of capacitors are housed in a first receiving chamber 10a, and the magnetic ring 33 and the remaining capacitors are housed in a second receiving chamber 10b. See again. Figure 5The second receiving chamber 10b may be defined, for example, by an intermediate partition wall 12, a portion of a first side wall 13, a portion of a third side wall 15, and a portion of a top wall. The multiple capacitors of the EMC filter include, for example, one X capacitor 301 and two Y capacitors 302 disposed against the metal housing in the first receiving chamber 10a, and, for example, one Y capacitor 303 disposed in the second receiving chamber 10b. A magnetic ring 33 is disposed between the inner surface of the first side wall 13 of the metal housing and the intermediate partition wall 12. It should be understood that the number of X / Y capacitors given herein is merely exemplary, and other numbers of X and Y capacitors may be provided depending on the specific configuration of the EMC filter.

[0034] See Figure 9 Advantageously, the positive busbar 31 of the EMC filter is electrically connected to the positive busbar 21 of the thin-film capacitor module 2 via laser welding, and the negative busbar 32 of the EMC filter is electrically connected to the negative busbar 22 of the thin-film capacitor module 2 via laser welding. In this application, the negative and positive busbars of the EMC filter can first be electrically connected to the positive and negative busbars of the thin-film capacitor module via laser welding, and then laser welded to the X / Y capacitors of the EMC filter to achieve current connection between the circuits of the EMC filter and the thin-film capacitor module, while avoiding the use of printed circuit boards, thereby reducing costs.

[0035] from Figure 8 As can be seen, both the X and Y capacitors are in direct contact with the inner wall of the metal casing 1, thus achieving better heat dissipation. This configuration also allows the sidewall of the metal casing 1 to function as a shield for the EMC filter. Advantageously, the EMC filter 3 also includes a component positioned above the magnetic ring 33 (with...). Figure 2 or Figure 3 A metal shield 34 (viewed from the perspective of the view) is used to suppress electromagnetic interference. The metal shield, together with the sidewalls surrounding the second receiving chamber 10b, is used to suppress electromagnetic interference. This configuration enables crosstalk shielding, preventing crosstalk between the EMC filter and the film capacitor due to the integration of the EMC filter 3 and the film capacitor module 2 into the metal housing 1.

[0036] In one particular embodiment, the metal shield 34 can be configured to resemble the shape of the magnetic ring, especially Figure 3 The top-shaped fitting shown includes a rectangular body portion 341 and bent portions 342 located at both ends of the rectangular body portion, wherein each bent portion is provided with a mounting hole, and the fitting secures the magnetic ring to the metal housing through the mounting holes and the engagement of the threaded fasteners 343.

[0037] In this invention, the magnetic ring 33 includes a magnetic ring housing and a magnetic core housed within the magnetic ring housing. The magnetic ring housing is made of plastic material, and the magnetic core and the magnetic ring housing can be integrally formed by injection molding. For example, the magnetic ring can be formed by injection molding the magnetic ring housing onto the outer surface of the magnetic core, thereby sealing the magnetic core within the magnetic ring housing. This structure eliminates gaps between the magnetic ring housing and the magnetic core, reducing the finished size of the magnetic ring and achieving good waterproofing, thus lowering manufacturing costs.

[0038] According to a preferred embodiment of this utility model, an insulating film 8 is provided between the inner surfaces of the plurality of capacitor core components 20 and the metal casing 1. Providing an insulating film prevents direct contact between the film capacitors and the metal casing, thereby avoiding dielectric breakdown or increased leakage current, which could affect the safety of the inverter brick. For example, the insulating film can typically be made of high-voltage resistant polyester (PET), polypropylene (PP), or polyimide (PI) materials, capable of withstanding high electric field strength and preventing electrical breakdown.

[0039] Although the present invention has been disclosed above with reference to preferred embodiments, it is not limited thereto. Any combinations, changes, and modifications made by those skilled in the art without departing from the spirit and scope of the present invention should be included within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope defined in the claims.

Claims

1. An inverter unit, characterized in that, The inverter unit includes: A metal housing (1) having a top wall (11), side walls, an intermediate partition wall (12), and a first receiving chamber (10a) and a second receiving chamber (10b) defined by the top wall, the side walls and the intermediate partition wall, respectively; Thin-film capacitor module (2), the first receiving chamber (10a) for receiving the thin-film capacitor module; and EMC filter (3), the EMC filter is electrically connected to the thin film capacitor module and includes a bus positive copper bus (31), a bus negative copper bus (32), a magnetic ring (33) and a plurality of capacitors, wherein some of the plurality of capacitors are housed in the first housing chamber (10a), and the magnetic ring and the remaining capacitors of the plurality of capacitors are housed in the second housing chamber (10b).

2. The inverter unit according to claim 1, characterized in that, The metal casing (1) is constructed in a cuboid shape, and the sidewalls include a first sidewall (13) and a second sidewall (14) along its length, and a third sidewall (15) and a fourth sidewall (16) along its width. A groove (111) is provided in the outer surface of the top wall (11); and The metal housing (1) also has a first fluid channel (151) in the third sidewall and a second fluid channel (161) in the fourth sidewall, wherein the first fluid channel is in fluid communication with the groove and extends in the third sidewall (15) to a first port (152) at the bottom of the third sidewall, and the second fluid channel is in fluid communication with the groove and extends in the fourth sidewall (16) to a second port (162) at the bottom of the fourth sidewall, thereby forming a cooling medium channel extending between the first port and the second port.

3. The inverter unit according to claim 2, characterized in that, The thin-film capacitor module (2) includes a plurality of capacitor core components (20) housed in the first housing chamber (10a), a positive copper busbar (21) electrically connected to the positive electrode of the plurality of capacitor core components, and a negative copper busbar (22) electrically connected to the negative electrode of the plurality of capacitor core components. The plurality of capacitor core components are encapsulated in the first housing chamber (10a) by insulating and thermally conductive epoxy resin.

4. The inverter unit according to claim 3, characterized in that, The EMC filter (3) is arranged close to the first sidewall (13), and the thin film capacitor module (2) is arranged close to the second sidewall (14). The positive busbar (31) of the EMC filter is electrically connected to the positive busbar (21) of the thin film capacitor module (2) by laser welding, and the negative busbar (32) of the EMC filter is electrically connected to the negative busbar (22) of the thin film capacitor module (2) by laser welding.

5. The inverter unit according to claim 2, characterized in that, The top wall (11) has an elongated through hole (112) near the groove (111) and located between the groove and the first side wall (13), so that the positive copper busbar and the negative copper busbar can extend through the elongated through hole to the outside of the top wall.

6. The inverter unit according to any one of claims 2 to 5, characterized in that, The second receiving chamber (10b) is defined by the intermediate partition wall (12), a portion of the first side wall (13), a portion of the third side wall (15), and a portion of the top wall; and The plurality of capacitors of the EMC filter include an X capacitor (301) and a Y capacitor (302) disposed against the metal housing in the first receiving chamber (10a), and an additional Y capacitor disposed in the second receiving chamber (10b).

7. The inverter unit according to any one of claims 1 to 5, characterized in that, The EMC filter (3) also includes a metal shield (34) disposed above the magnetic ring (33), the metal shield and the sidewalls surrounding the second receiving chamber (10b) together for suppressing electromagnetic interference.

8. The inverter unit according to claim 7, characterized in that, The metal shield (34) is configured as a sheet-like component adapted to the shape of the magnetic ring. The sheet-like component includes a rectangular body portion (341) and bent portions (342) located at both ends of the rectangular body portion. Each bent portion is provided with a mounting hole. The sheet-like component fixes the magnetic ring to the metal housing by engaging the mounting holes with corresponding threaded fasteners (343).

9. The inverter unit according to any one of claims 1 to 5, characterized in that, The magnetic ring (33) includes a magnetic ring housing and a magnetic core housed within the magnetic ring housing. The magnetic ring housing is made of plastic material and the magnetic core is integrally formed with the magnetic ring housing by injection molding.

10. The inverter unit according to claim 3 or 4, characterized in that, An insulating film (8) is provided on the inner surface of the plurality of capacitor core components (20) and the metal casing (1).

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