A tower liquid-cooled workstation

Abstract

The utility model relates to a tower type liquid cooling work of workstation field, including the box, the side surface of box is provided with the box lid that can dismantle, the inside of cavity is provided with the water tank for storing refrigerant liquid, and the water tank is connected with the cold plate for carrying out heat dissipation to electronic component through circulation pipeline subassembly, and the inside of cold plate is opened has the refrigerant passage for circulating flow refrigerant, and the inside of medium passage is integrally provided with the gear -type radiator, and circulation pipeline subassembly is connected with the heat exchanger through the connecting pipeline, and the heat exchanger is communicated with the water tank through the back liquid pipeline, makes the refrigerant liquid that carries the heat source can along the connecting pipeline enter the heat exchanger and cool down the heat exchange, and can along the back liquid pipeline and export into the water tank, the utility model makes the gear -type radiator and refrigerant liquid carry out immersion contact, further ensure that the refrigerant liquid cools the heat source, and the heat exchanger and water tank form the refrigerant circulation through circulation pipeline subassembly connection, effectively promote the heat dissipation efficiency and the heat dissipation effect of liquid cooling system.

Description

Technical Field

[0001] This utility model relates to the field of workstations, specifically to a tower-type liquid-cooled workstation. Background Technology

[0002] Tower workstations are suitable for high-density computing, graphics rendering, artificial intelligence training, and scientific computing applications that require high-load operation. Tower liquid-cooled workstations replace traditional air-cooling solutions with liquid cooling technology, effectively solving the heat dissipation problem of core components such as CPUs and GPUs in high-power computing devices under high power consumption conditions. They have a wide range of applications, including but not limited to data centers, research institutions, film and animation production, and engineering simulation.

[0003] Existing tower liquid-cooled workstations typically employ a vertical chassis structure with an integrated liquid cooling circulation system. Heat is transferred to external radiators or cooling coils through direct or indirect contact between the coolant and the heat-generating components, and finally dissipated through fans or natural convection. A typical structure includes: liquid cooling blocks, circulation pumps, piping systems, radiators, and fans, to meet the cooling requirements of multi-GPU parallel computing.

[0004] However, traditional tower liquid-cooled workstations still have the following significant drawbacks in their heat dissipation design for high-heat-generating components such as CPUs and GPUs: existing tower workstations mostly use fans to cool the graphics card, but traditional solutions require increased circulating fan power, resulting in a significant increase in equipment noise and poor air cooling performance, affecting usability. In addition, the flow of coolant through the cold plate in the liquid cooling system of existing tower workstations is poor, and the heat exchange time of the coolant in the cold plate is insufficient, resulting in the heat generated by high-power graphics cards and other components not being dissipated in time, causing localized overheating. Long-term operation may lead to thermal aging or performance degradation of components, thereby affecting the effect and efficiency of liquid cooling. Utility Model Content

[0005] The purpose of this invention is to address the above-mentioned deficiencies by providing a tower-type liquid-cooled workstation. This addresses the technical problem in the prior art where existing tower-type workstations have poor cooling performance for locally high-heat electronic components, thus affecting the effectiveness and efficiency of liquid cooling.

[0006] The objective of this utility model is achieved through the following means:

[0007] A tower-type liquid-cooled workstation includes a housing with a removable cover on the side. The interior of the housing forms a cavity for mounting electronic components. Inside the cavity is a water tank for storing refrigerant liquid. The water tank is connected via a circulation pipe assembly to a cold plate for dissipating heat from the electronic components. The cold plate has refrigerant channels for circulating refrigerant and mounting portions for mating with and contacting the electronic components. A toothed radiator is integrated within the refrigerant channels. A pump within the water tank draws refrigerant liquid through the circulation pipe assembly into the cold plate for circulation. The circulation pipe assembly is connected to a heat exchanger via a connecting pipe. The heat exchanger is connected to the water tank via a return pipe, allowing the refrigerant liquid carrying a heat source to enter the heat exchanger for cooling and heat exchange along the connecting pipe, and then exit back into the water tank along the return pipe.

[0008] Further, as described above, the circulating pipeline assembly includes a diversion block, a water collection block, a diversion pipe, and a water collection pipe. The diversion block and the water collection block have hollow channels inside. One end of the diversion block is provided with an inlet pipe that communicates with a water pump. One end of the water collection block is connected to a heat exchanger through a connecting pipe. One end of the diversion pipe is connected to the diversion block, and the other end of the diversion pipe is connected to a cold plate. One end of the water collection pipe is connected to the water collection block, and the other end of the water collection pipe communicates with the cold plate.

[0009] By using the hollow channel design inside the distribution block and water collection block, and in conjunction with the connection between the distribution pipe, water collection pipe and the cold plate, uniform distribution and centralized recovery of coolant can be achieved. This avoids the problem of uneven flow of coolant between cold plates or insufficient local flow in traditional liquid cooling systems, thereby improving the flow effect of coolant in each cold plate, enhancing the overall heat exchange efficiency, and solving the problem of local overheating caused by poor coolant flow in traditional liquid cooling systems.

[0010] Optionally, multiple cold plates are provided, and the cold plates are connected to the distribution block and the collection block respectively through the distribution pipe and the collection pipe to complete the circulation of the refrigerant liquid.

[0011] Furthermore, as described above, the heat exchanger is installed inside the cavity, and a cooling fan is connected to the bottom of the heat exchanger.

[0012] The heat exchanger, in conjunction with the cooling fan, can efficiently cool and exchange heat in the coolant carrying heat. It can improve the heat dissipation effect while reducing fan power, enhance the cooling of the refrigerant liquid, improve the subsequent recycling of the refrigerant liquid, and ensure the cooling and heat dissipation of electronic components.

[0013] Further, as described above, the cold plate includes a base plate and a cover plate welded to the base plate. The surface of the base plate has a mounting groove that matches the cover plate. A refrigerant channel is formed on the base plate. The side of the base plate has a refrigerant inlet and a refrigerant outlet that communicate with the refrigerant channel. The back of the base plate has a recessed connecting groove. The connecting groove communicates with the refrigerant channel through an overflow port. A toothed radiator is welded to the connecting groove, forming a flow channel for refrigerant flow within the connecting groove.

[0014] The cold plate forms a refrigerant channel by welding the base plate and the cover plate together. A connecting groove and a toothed heat sink are set on the back of the base plate, allowing the coolant to flow in the flow channels of the refrigerant channel and the connecting groove. This extends the flow path of the coolant within the cold plate. The built-in toothed heat sink increases the contact area with the refrigerant liquid, allowing it to contact external electronic components through the end face of the toothed heat sink for heat conduction. Heat is then dissipated from the heat sink, thereby extending the heat exchange time, improving the heat dissipation efficiency for high-heat electronic components (such as CPUs and GPUs), avoiding localized overheating, and solving the problem of insufficient heat exchange time of the coolant in traditional liquid cooling systems.

[0015] Furthermore, as described above, the toothed radiator has several heat dissipation fins on its end face extending toward the overflow port, allowing the refrigerant liquid to flow into the flow channel and immerse the heat dissipation fins.

[0016] By having a toothed radiator in contact with the refrigerant liquid, the heat dissipated by the electronic components can be transferred to the radiator and immersed in the refrigerant liquid. Furthermore, the arrangement of the heat dissipation fins increases the immersion contact area with the refrigerant liquid, thereby improving heat dissipation efficiency.

[0017] Furthermore, as described above, the toothed radiator has a boss portion formed on it, and a mounting portion that matches the boss portion is provided on the connecting groove, so that the toothed radiator is sealed and welded to the mounting portion through the boss portion, and the heat dissipation fins of the toothed radiator extend into the connecting groove.

[0018] The fins of the toothed radiator are submerged in coolant, which increases the contact area between the coolant and the fins, improves heat exchange efficiency, and allows the heat generated by high-heat electronic components to be carried away in time, avoiding heat accumulation and solving the problem of local overheating caused by low heat exchange efficiency in traditional liquid cooling systems.

[0019] The toothed radiator is sealed and welded to the mounting part of the connecting groove through the boss part, which ensures that the coolant flows effectively in the flow channel, avoids coolant leakage or short circuit, and ensures that the coolant flows along the designed path, thereby maintaining a stable heat exchange effect and solving the problem of reduced heat dissipation efficiency caused by abnormal coolant flow path.

[0020] Furthermore, as described above, a raised flow-slowing protrusion is formed in the middle of the refrigerant channel near the overflow port. The flow-slowing protrusion can divide the refrigerant channel into an inlet end and a outlet end. A through hole communicating with the connecting groove is opened in the middle of the refrigerant channel, so that the refrigerant flows into the connecting groove through the through hole along the inlet end and enters the outlet end from the overflow port, and can be discharged through the refrigerant outlet along the outlet end.

[0021] The slow-flow bumps divide the refrigerant channel into an inlet and an outlet, and guide the coolant flow through through holes and overflow ports. This slows down the flow speed of the coolant in the cold plate, prolongs its residence time in the cold plate, and increases the heat exchange time, thereby improving the heat dissipation effect on high-heat electronic components and solving the problem of insufficient heat exchange caused by excessively fast coolant flow in traditional liquid cooling systems.

[0022] Furthermore, as described above, the refrigerant inlet and refrigerant outlet are respectively connected to a refrigerant inlet valve and a refrigerant outlet valve.

[0023] Furthermore, as described above, the refrigerant channel is U-shaped.

[0024] The U-shaped refrigerant channel extends the flow path of the coolant within the cold plate, increasing the contact area and heat exchange time with the cold plate, thereby improving the heat dissipation efficiency for high-heat electronic components.

[0025] The beneficial effects of this utility model are as follows: The mounting portion opened on the cold plate can be paired with electronic components to ensure effective contact between the cold plate and high-heat-generating electronic components, thereby improving heat conduction efficiency. The cold plate is internally equipped with a toothed heat sink. Through the combination of the toothed heat sink and the cold plate, the toothed heat sink is immersed in the refrigerant liquid, further ensuring the cooling of the heat source by the refrigerant liquid, extending the heat exchange time between the refrigerant liquid and the high-heat-generating electronic components, ensuring that the heat generated by high-power components can be removed in time, avoiding local overheating caused by insufficient heat exchange time, and reducing the risk of thermal aging or performance degradation of electronic components due to heat accumulation. The heat exchanger cools and exchanges heat with the refrigerant liquid carrying the heat source, and the cooled refrigerant liquid is returned to the water tank through the return pipe to form a complete refrigerant circulation system, effectively improving the heat dissipation efficiency and heat dissipation effect of the liquid cooling system. Attached Figure Description

[0026] Figure 1 This is a perspective view of this embodiment;

[0027] Figure 2 This is a schematic diagram of the internal structure of this embodiment;

[0028] Figure 3 This is a partial structural diagram of this embodiment;

[0029] Figure 4This is a schematic diagram of the cold plate structure in this embodiment;

[0030] Figure 5 This is a schematic diagram of the internal structure of the cold plate in this embodiment;

[0031] Figure 6 This is a schematic diagram of the connecting groove in this embodiment;

[0032] Figure 7 This is a schematic diagram of the toothed heat sink in this embodiment;

[0033] Figure 8 This is a connection diagram of the structural schematic diagram in this embodiment;

[0034] The reference numerals in the figure are as follows:

[0035] 100 - Box;

[0036] 200-water tank;

[0037] 300-Circulation piping assembly, 301-Connecting pipe, 302-Return pipe, 303-Diverter block, 304-Collection block, 305-Diverter pipe, 306-Collection pipe, 307-Self-locking quick coupling;

[0038] 400-Cold plate, 401-Base plate, 4011-Refrigerant channel, 4012-Mounting groove, 4013-Connection part, 4014-Refrigerant inlet, 4015-Refrigerant outlet, 4016-Connecting groove, 4017-Overflow port, 4018-Flow channel, 4019-Slow flow protrusion, 4020-Through hole, 4021-Flow divider protrusion, 402-Cover plate, 403-Toothed radiator, 4031-Boss part, 4032-Heat dissipation fins;

[0039] 500 - Cooling fan, 600 - Refrigerant inlet valve, 700 - Refrigerant outlet valve, 800 - Casters, 900 - Heat exchanger. Detailed Implementation

[0040] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0041] To make the technical problem to be solved, the technical solution and the beneficial effects of this utility model clearer, the following describes the solution in further detail with reference to the accompanying drawings and embodiments.

[0042] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this scheme and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0043] In this embodiment, refer to Figures 1-8 The present invention relates to a tower-type liquid-cooled workstation, comprising a housing 100, a removable cover on the side of the housing 100, and an interior cavity for mounting electronic components. Inside the cavity is a water tank 200 for storing refrigerant liquid. The water tank 200 is connected via a circulation pipe assembly 300 to four cooling plates 400 for dissipating heat from the electronic components. Each cooling plate 400 has a refrigerant channel 4011 for circulating refrigerant, and a connection portion 4 for mating and contacting the electronic components. 013, A toothed radiator 403 is integrated in the refrigerant channel 4011. A water pump (not shown) is installed in the water tank 200 to draw refrigerant liquid through the circulation pipe assembly 300 into the cold plate 400 for circulation. The circulation pipe assembly 300 is connected to a heat exchanger 900 through a connecting pipe 301. The heat exchanger 900 is connected to the water tank 200 through a return pipe 302, so that the refrigerant liquid carrying the heat source can enter the heat exchanger 900 for cooling and heat exchange along the connecting pipe 301, and can be discharged into the water tank 200 along the return pipe 302.

[0044] In this embodiment, refer to Figures 2-3 The circulating pipeline assembly 300 includes a diversion block 303, a water collection block 304, a diversion pipe 305, and a water collection pipe 306. The diversion block 303 and the water collection block 304 are provided with hollow channels inside. One end of the diversion block 303 is provided with an inlet pipe that communicates with a water pump. One end of the water collection block 304 is connected to the heat exchanger 900 through a connecting pipe 301. One end of the diversion pipe 305 is connected to the diversion block 303, and the other end of the diversion pipe is connected to the cold plate 400. One end of the water collection pipe 306 is connected to the water collection block 304, and the other end of the water collection pipe 306 is connected to the cold plate 400.

[0045] By using the hollow channel design inside the flow divider 303 and the water collection block 304, and in conjunction with the connection between the flow divider pipe 305, the water collection pipe 306 and the cold plate 400, uniform distribution and centralized recovery of coolant can be achieved. This avoids the problem of uneven flow of coolant between the cold plates 400 or insufficient local flow in traditional liquid cooling systems, thereby improving the flow effect of coolant in each cold plate 400, enhancing the overall heat exchange efficiency, and solving the problem of local overheating caused by poor coolant flow in traditional liquid cooling systems.

[0046] Optionally, multiple cold plates 400 are provided, so that the cold plates 400 are connected to the distribution block 303 and the water collection block 304 through the distribution pipe 305 and the water collection pipe 306 respectively to complete the circulation of refrigerant liquid.

[0047] Optionally, in some embodiments, the diversion block 303 is provided with multiple diversion ports, and multiple diversion pipes 305 are provided, with one end of each of the multiple diversion pipes 305 connected to the diversion block 303 through a self-locking quick connector 307.

[0048] The heat exchanger 900 is installed inside the cavity, and a cooling fan 500 is connected to the bottom of the heat exchanger 900. The heat exchanger 900 and the cooling fan 500 work together to efficiently cool and exchange heat in the coolant carrying heat. This can improve the heat dissipation effect while reducing fan power, enhance the cooling of the refrigerant liquid, improve the subsequent recycling of the refrigerant liquid, and ensure the cooling and heat dissipation of electronic components.

[0049] Reference Figures 4-6 The cold plate 400 includes a base plate 401 and a cover plate 402 welded to the base plate 401. The surface of the base plate 401 is provided with a mounting groove 4012 that matches the cover plate 402. A refrigerant channel 4011 is provided on the base plate 401. The side of the base plate 401 is provided with a refrigerant inlet 4014 and a refrigerant outlet 4015 that communicate with the refrigerant channel 4011. The back of the base plate 401 is provided with a recessed connecting groove 4016. The connecting groove 4016 and the refrigerant channel 4011 are connected through an overflow port 4017. A toothed radiator 403 is welded to the connecting groove 4016, so that a flow channel 4018 for refrigerant flow is formed in the connecting groove 4016.

[0050] The cold plate 400 is welded to the base plate 401 and the cover plate 402 to form a refrigerant channel 4011. A connecting groove 4016 and a toothed heat sink 403 are provided on the back of the base plate 401, so that the coolant flows in the flow channel 4018 of the refrigerant channel 4011 and the connecting groove 4016, which prolongs the flow path of the coolant in the cold plate 400. The built-in toothed heat sink 403 increases the contact area with the refrigerant liquid, so that the heat sink can contact the external electronic components through the end face of the toothed heat sink 403 for heat conduction. The heat is discharged from the heat sink, thereby prolonging the heat exchange time, improving the heat dissipation efficiency of high heat-generating electronic components (such as CPU and GPU), avoiding local overheating, and solving the problem of insufficient heat exchange time of coolant in traditional liquid cooling systems.

[0051] Reference Figure 7 The toothed radiator 403 has a plurality of heat dissipation fins 4032 on its end face extending toward the overflow port 4017, allowing the refrigerant liquid to flow into the flow channel 4018 and immerse the heat dissipation fins 4032. A boss 4031 is formed on the toothed radiator 403, and a mounting portion matching the boss 4031 is provided on the connecting groove 4016, allowing the toothed radiator 403 to be sealed and welded to the mounting portion via the boss 4031. The heat dissipation fins of the toothed radiator 403 extend into the connecting groove 4016.

[0052] By contacting the toothed radiator 403 with the refrigerant liquid, the heat dissipated by the electronic components can be transferred to the immersion contact with the refrigerant liquid. Furthermore, the arrangement of the heat dissipation fins 4032 enhances the immersion contact area with the refrigerant liquid, thereby improving heat dissipation efficiency.

[0053] The heat dissipation fins 4032 of the toothed radiator 403 are submerged in coolant, which increases the contact area between the coolant and the heat dissipation fins 4032, improves the heat exchange efficiency, and allows the heat generated by high-heat electronic components to be carried away in time, avoiding heat accumulation and solving the problem of local overheating caused by low heat exchange efficiency in traditional liquid cooling systems.

[0054] The toothed radiator 403 is sealed and welded to the mounting part of the connecting groove 4016 through the boss part 4031, ensuring that the coolant flows effectively in the flow channel 4018, avoiding coolant leakage or short circuit, ensuring that the coolant flows according to the design path, thereby maintaining a stable heat exchange effect and solving the problem of reduced heat dissipation efficiency caused by abnormal coolant flow path.

[0055] Reference Figure 5The refrigerant channel 4011 has a raised flow-slowing protrusion 4019 in the middle near the overflow port 4017. The flow-slowing protrusion 4019 can divide the refrigerant channel 4011 into an inlet end and a outlet end. The middle of the refrigerant channel 4011 has a through hole 4020 that communicates with the connecting groove 4016, so that the refrigerant flows into the connecting groove 4016 through the through hole 4020 along the inlet end and enters the outlet end from the overflow port 4017, and can be discharged through the refrigerant outlet 4015 along the outlet end.

[0056] The flow-slowing bump 4019 divides the refrigerant channel 4011 into an inlet end and an outlet end, and guides the flow of coolant through the through hole 4020 and the overflow port 4017, thereby slowing down the flow speed of coolant in the cold plate 400, extending its residence time in the cold plate 400, increasing the heat exchange time, and thus improving the heat dissipation effect on high-heat electronic components, solving the problem of insufficient heat exchange caused by excessively fast coolant flow in traditional liquid cooling systems.

[0057] Specifically, in this embodiment, a protruding diversion protrusion 4021 is provided at the liquid inlet end of the refrigerant channel 4011. The diversion protrusion 4021 can disperse and adjust the refrigerant flow at the liquid inlet end, so that the refrigerant is more evenly distributed at the liquid inlet end, thereby improving the uniformity of refrigerant flow, alleviating the problem of insufficient local heat dissipation caused by uneven flow in traditional flow channel layout, and further improving the overall heat dissipation efficiency.

[0058] The refrigerant inlet 4014 and refrigerant outlet 4015 are respectively connected to a refrigerant inlet valve 600 and a refrigerant outlet valve 700.

[0059] The refrigerant channel 4011 is U-shaped.

[0060] The U-shaped refrigerant channel 4011 extends the flow path of the coolant within the cold plate 400, increases the contact area and heat exchange time with the cold plate 400, and improves the heat dissipation efficiency for high-heat electronic components.

[0061] Specifically, in this embodiment, the bottom of the box 100 is provided with four casters 800, which are distributed at the four corners of the box 100.

[0062] In this embodiment, the specific flow and heat dissipation process of the refrigerant liquid is as follows:

[0063] The refrigerant liquid is placed in the water tank 200. The water pump draws the refrigerant liquid from the water tank 200 and makes it flow along the inlet pipe to the distribution block 303. The distribution block 303 guides the refrigerant liquid through the distribution port along the distribution pipe 305 to the corresponding cold plate 400. The cold plate 400 is connected to the graphics card through the connecting part 4013, so that the refrigerant liquid enters the refrigerant channel 4011. The heat generated by the graphics card can be discharged through the cold plate 400, and the heat on the cold plate 400 is cooled by the flow of the refrigerant liquid. The refrigerant liquid carries the heat source from the cold plate 400 and flows through the water collection pipe 306 into the water collection block 304. The refrigerant liquid carrying the heat source enters the heat exchanger 900 for cooling through the connecting pipe 301. The cooling fan 500 further enhances the cooling of the refrigerant liquid, so that the cooled refrigerant liquid can enter the water tank 200 along the return pipe 302, thus forming a liquid cooling system.

[0064] Specifically, as the refrigerant liquid flows along the refrigerant channel 4011 of the cold plate 400, it is blocked by the flow-slowing protrusion 4019. The refrigerant liquid enters the flow channel 4018 through the through hole 4020, immersing the heat dissipation fins 4032 of the toothed heat sink 403 for cooling. The protrusions of the toothed heat sink 403 come into contact with the chip, allowing the heat generated by the chip to be conducted to the heat dissipation fins 4032. The heat of the heat dissipation fins 4032 is then dissipated through the refrigerant liquid. The heat-carrying refrigerant liquid is discharged from the overflow port to the drain end and discharged from the refrigerant discharge valve 700. Through the combination of the toothed heat sink 403 and the cold plate 400, the toothed heat sink 403 is immersed in contact with the refrigerant liquid, further ensuring the cooling of the heat source by the refrigerant liquid, extending the heat exchange time between the refrigerant liquid and the high-heat-generating electronic components, ensuring that the heat generated by the high-power components can be carried away in time, and avoiding local overheating caused by insufficient heat exchange time.

[0065] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.

Claims

1. A tower-type liquid-cooled workstation, comprising a housing, a removable cover on the side of the housing, and an interior cavity for mounting electronic components, characterized in that: The cavity contains a water tank for storing refrigerant liquid. The water tank is connected to a cold plate for dissipating heat from electronic components via a circulation pipe assembly. The cold plate has a refrigerant channel for circulating refrigerant and a mounting part for mating and contacting electronic components. A toothed radiator is integrated within the refrigerant channel. The water tank contains a pump for drawing refrigerant liquid through the circulation pipe assembly into the cold plate for circulation. The circulation pipe assembly is connected to a heat exchanger via a connecting pipe. The heat exchanger is connected to the water tank via a return pipe, allowing the refrigerant liquid carrying the heat source to enter the heat exchanger for cooling and heat exchange along the connecting pipe and to be discharged back into the water tank along the return pipe.

2. The tower-type liquid-cooled workstation according to claim 1, characterized in that: The circulating pipeline assembly includes a diversion block, a water collection block, a diversion pipe, and a water collection pipe. The diversion block and the water collection block have hollow channels inside. One end of the diversion block is provided with an inlet pipe that communicates with a water pump. One end of the water collection block is connected to a heat exchanger through a connecting pipe. One end of the diversion pipe is connected to the diversion block, and the other end of the diversion pipe is connected to a cold plate. One end of the water collection pipe is connected to the water collection block, and the other end of the water collection pipe is connected to the cold plate.

3. The tower-type liquid-cooled workstation according to claim 1, characterized in that: The heat exchanger is installed inside the cavity and is connected to a cooling fan.

4. The tower-type liquid-cooled workstation according to claim 1, characterized in that: The cold plate includes a base plate and a cover plate welded to the base plate. The surface of the base plate has a mounting groove that matches the cover plate. A refrigerant channel is formed on the base plate. The side of the base plate has a refrigerant inlet and a refrigerant outlet that communicate with the refrigerant channel. The back of the base plate has a recessed connecting groove. The connecting groove communicates with the refrigerant channel through an overflow port. A toothed radiator is welded to the connecting groove, forming a flow channel for refrigerant flow within the connecting groove.

5. A tower-type liquid-cooled workstation according to claim 4, characterized in that: The toothed radiator has several heat dissipation fins on the end face extending towards the overflow port, allowing the refrigerant liquid to flow into the flow channel and immerse the heat dissipation fins.

6. The tower-type liquid-cooled workstation according to claim 5, characterized in that: The toothed radiator has a boss, and the connecting groove has a mounting part that matches the boss, so that the toothed radiator is sealed and welded to the mounting part through the boss, and the heat sink of the toothed radiator extends into the connecting groove.

7. A tower-type liquid-cooled workstation according to any one of claims 4-6, characterized in that: A raised, flow-slowing protrusion is formed in the middle of the refrigerant channel near the overflow port. The flow-slowing protrusion can divide the refrigerant channel into an inlet end and a outlet end. A through hole is opened in the middle of the refrigerant channel to communicate with the connecting groove, so that the refrigerant flows into the connecting groove through the through hole along the inlet end and enters the outlet end from the overflow port, and can be discharged through the refrigerant outlet along the outlet end.

8. A tower-type liquid-cooled workstation according to any one of claims 4-6, characterized in that: The refrigerant inlet and refrigerant outlet are respectively connected to a refrigerant inlet valve and a refrigerant outlet valve.

9. A tower-type liquid-cooled workstation according to any one of claims 1-4, characterized in that: The refrigerant channel is U-shaped.

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