Inverter and energy storage system

Abstract

The application relates to the technical field of energy storage, and discloses an inverter and an energy storage system. The inverter comprises an integrated circuit board, a uniform temperature plate and a heat dissipation fin. The integrated circuit board is located in a containing cavity and comprises a circuit substrate and a plurality of power devices integrated on the circuit substrate. The plurality of power devices comprises first and second power devices. The second power devices are distributed on at least one side of the first power devices. In the first direction, the height of the second power devices is greater than that of the first power devices. The uniform temperature plate is arranged on the integrated circuit board and comprises first and second uniform temperature zones. In the first direction, the height of the second uniform temperature zone is greater than that of the first uniform temperature zone. The first uniform temperature zone is arranged opposite to the first power devices and is in thermal coupling with the first power devices. The second uniform temperature zone is arranged opposite to the second power devices and is in thermal coupling with the second power devices. The heat dissipation fin is arranged on the side of the first uniform temperature zone away from the first power devices. In this way, the inverter heat dissipation efficiency is improved, and the volume and weight are reduced.

Description

Technical Field

[0001] This application relates to the field of energy storage technology, and in particular to an inverter and an energy storage system. Background Technology

[0002] This section provides only background information relevant to this application and is not necessarily prior art.

[0003] With the widespread application of energy storage technology, inverters, as the core power electronic unit of the system, undertake the task of converting DC to AC energy and are widely used in various electronic devices, power systems, or renewable energy systems (such as solar and wind power systems). Inverters integrate a large number of power devices such as MOSFETs, inductors, transformers, and capacitors. These power devices generate significant heat under high-power operating conditions; if heat dissipation is not timely and effective, it will lead to overheating failure, reduced efficiency, or shortened service life. Utility Model Content

[0004] In view of the above problems, this application provides an inverter and energy storage system. The inverter optimizes the layout of power devices and, in conjunction with the heat diffusion capability of the heat spreader and the top welded fins, enables heat to be concentrated and discharged upwards, which significantly improves heat dissipation efficiency and reduces the size and weight of the inverter.

[0005] A first aspect of this application provides an inverter, the inverter comprising:

[0006] An integrated circuit board, the integrated circuit board including a circuit substrate and a plurality of power devices integrated on the circuit substrate, the plurality of power devices including a first power device and a second power device, the second power device being distributed on at least one side of the first power device along a first direction, the height of the second power device being greater than the height of the first power device, the first direction being the thickness direction of the circuit substrate;

[0007] A heat spreader, covering the integrated circuit board, includes: a first heat spreader area and a second heat spreader area. Along a first direction, the height of the second heat spreader area is greater than that of the first heat spreader area. The first heat spreader area is disposed opposite to and thermally coupled to the first power device, and the second heat spreader area is disposed opposite to and thermally coupled to the second power device.

[0008] Heat dissipation fins are disposed on the side of the first temperature equalization zone away from the first power device.

[0009] In addition, the inverter according to this application may also have the following additional technical features:

[0010] In some embodiments of this application, the heating power of the first power device is greater than that of the second power device. Along the second direction, the second power device is distributed on both sides of the first power device. A second temperature equalization zone is provided on both sides of the first temperature equalization zone. The temperature equalization plate is formed with a groove. Along the first direction, the groove is located above the first power device. The heat dissipation fins are formed in the groove. The second direction is the length direction of the circuit board.

[0011] In some embodiments of this application, the inverter further includes a housing, the housing having a cavity and a vent, the integrated circuit board and the heat spreader being disposed within the cavity, and the heat dissipation fins being disposed opposite to the vent.

[0012] In some embodiments of this application, the inverter further includes:

[0013] A fan is provided at the vent and creates airflow that passes through the heat dissipation fins.

[0014] In some embodiments of this application, the vent includes a first vent and a second vent disposed opposite to each other; the fan is located at the first vent or the second vent.

[0015] In some embodiments of this application, the first power device includes a MOSFET.

[0016] In some embodiments of this application, the second power device includes at least one of an inductor, a transformer, and a capacitor.

[0017] In some embodiments of this application, the inverter further includes:

[0018] A thermally conductive insulating film is disposed between the heat spreader and the second power device.

[0019] In some embodiments of this application, the surface of the first power device is coated with an insulating thermally conductive adhesive that contacts the heat spreader.

[0020] A second aspect of this application provides an energy storage system including the inverter and battery module described in this application, wherein the battery module is electrically connected to the inverter.

[0021] In the inverter and energy storage system of this application embodiment, by arranging first and second power devices of different heights three-dimensionally on the circuit board and combining them with a heat spreader plate closely attached thereto, the heat generated by multiple dispersed heat sources is effectively absorbed and quickly diffused. The efficient phase change heat transfer of the heat spreader plate significantly shortens the heat path, reduces thermal resistance, and significantly improves heat dissipation efficiency. At the same time, the heat dissipation fins are directly integrated on the side of the first heat spreader area away from the first power device, forming a simple and efficient direct ventilation channel. This not only optimizes the heat dissipation airflow and saves space to achieve high integration and protection, but also significantly reduces the weight of the heat dissipation system, which is conducive to achieving the lightweighting of the inverter. In addition, the heat dissipation fins make full use of the space left over from the first heat spreader area, making the entire inverter as small as possible.

[0022] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0023] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0024] Figure 1 A schematic diagram of the inverter from one angle provided in some embodiments of this application;

[0025] Figure 2 A front view schematic diagram of an inverter provided for some embodiments of this application;

[0026] Figure 3 This is a partial structural schematic diagram of an inverter provided in some embodiments of this application;

[0027] Figure 4 An exploded view of an inverter provided in some embodiments of this application.

[0028] The reference numerals in the detailed embodiments are as follows:

[0029] 10-Inverter, 11-Housing, 111-Ventilation port, 12-Integrated circuit board, 121-Circuit board, 122-First power device, 123-Second power device, 13-Population plate, 131-First temperature distribution zone, 132-Second temperature distribution zone, 133-Groove, 14-Heat dissipation fins, 15-Fan, 16-Thermal conductive insulating film. Detailed Implementation

[0030] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0032] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0033] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0034] Unless otherwise specified, all embodiments and optional embodiments of this application can be combined to form new technical solutions. Unless otherwise specified, all technical features and optional technical features of this application can be combined to form new technical solutions.

[0035] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0036] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0037] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0038] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0039] In the field of energy storage and conversion, inverters play a crucial role, converting direct current (DC) to alternating current (AC) to power various electrical devices. In portable energy storage devices and stationary energy storage systems, inverters are core components, and their operational stability and heat dissipation performance are closely related.

[0040] With technological advancements, users are demanding increasingly higher performance from energy storage devices, expecting them to provide higher power output, greater portability, and a more compact design. This has led to an increase in the number of integrated electronic components and power density within inverters, resulting in a significant rise in heat generation during operation. However, current inverter heat dissipation design faces numerous challenges.

[0041] On the one hand, multiple power devices inside the inverter, such as switching transistors, transformers, and inductors, generate heat during operation, but these heat sources are distributed in different locations on the circuit board, rather than concentrated in one area. This dispersed heat source distribution makes it difficult to efficiently dissipate heat through a single centralized heat dissipation method, requiring the design of a separate heat dissipation path for each heat source, which greatly increases the complexity of the heat dissipation system.

[0042] On the other hand, the long heat dissipation path also hinders the improvement of heat dissipation efficiency. From the heat source to the final heat dissipation surface, heat must pass through multiple layers of circuit boards, component gaps, and complex internal structures, resulting in significant heat loss and low heat dissipation efficiency during heat transfer. For example, heat is conducted from the heat-generating component to the circuit board, and then transferred to the casing through the heat sink. The entire process has high thermal resistance, making it difficult for heat to dissipate quickly to the external environment.

[0043] Furthermore, existing heat dissipation designs often employ heavy heat sinks or large fans, which, while meeting heat dissipation requirements to some extent, hinder the lightweight development of energy storage devices. In portable energy storage devices, device weight is a significant factor affecting user experience and application scenario expansion; heavy heat dissipation structures increase the overall weight of the device, reducing its portability. For stationary energy storage systems, although portability requirements are relatively lower, lightweight design helps reduce installation costs and space occupation, and improves the overall system integration.

[0044] Based on the above considerations, this application discloses an inverter, which includes an integrated circuit board, a vapor chamber, and heat sink fins.

[0045] The integrated circuit board includes a circuit board and multiple power devices integrated on the circuit board. The multiple power devices include a first power device and a second power device. The second power device is distributed on at least one side of the first power device. Along a first direction, the height of the second power device is greater than the height of the first power device. A heat spreader is disposed on the integrated circuit board and includes a first heat spreader area and a second heat spreader area. Along the first direction, the height of the second heat spreader area is greater than that of the first heat spreader area. The first heat spreader area is opposite to and thermally coupled to the first power device, and the second heat spreader area is opposite to and thermally coupled to the second power device. Heat dissipation fins are disposed on the side of the first heat spreader area away from the first power device.

[0046] In the inverter proposed in this application, by arranging a vapor chamber closely against first and second power devices of different heights, the liquid in the vacuum cavity inside the vapor chamber can efficiently absorb and rapidly diffuse the concentrated heat from the power devices, uniformly transferring the heat to the heat dissipation fins. Combined with the heat dissipation fins, strong convection cooling is achieved, improving heat dissipation efficiency. Simultaneously, the vapor chamber replaces traditional bulky heat dissipation components. Combined with the highly integrated power device arrangement, it significantly optimizes internal space utilization, reducing the overall size of the inverter and facilitating miniaturization. The heat dissipation fins are directly integrated into the side of the first vapor chamber away from the first power device, optimizing airflow, saving space for high integration and protection, and significantly reducing the weight of the cooling system, thus contributing to inverter lightweighting. Furthermore, the surplus space in the first vapor chamber is fully utilized, further reducing the overall inverter size. This also facilitates standardized and automated production, enabling reliable operation in complex and harsh environments such as outdoor and automotive applications.

[0047] The inverter disclosed in this embodiment can be used in various energy storage systems that use batteries as energy storage elements. These energy storage systems can be portable or stationary. The inverter converts the direct current (DC) output from the energy storage battery into alternating current (AC) that can be fed into the power grid or directly supplied to the load. It also regulates parameters such as voltage, frequency, and power to ensure power quality. Furthermore, it can enable bidirectional energy flow according to system requirements, such as converting AC to DC for battery charging. The inverter also has monitoring and protection functions to ensure the safe, stable, and efficient operation of the energy storage system.

[0048] The following is for reference. Figures 1-4 An inverter 10 according to an embodiment of the first aspect of this application is described. Figure 1 This is a schematic diagram of an inverter 10 according to an embodiment of this application from one angle; Figure 2 This is a front view schematic diagram of an inverter 10 according to an embodiment of this application; Figure 3 This is a partial structural schematic diagram of the inverter 10 according to an embodiment of this application. Figure 4 yes Figure 1 The exploded view of inverter 10 shown.

[0049] Specifically, the inverter 10 may include a housing 11, an integrated circuit board 12, a heat spreader 13, and heat dissipation fins 14.

[0050] The housing 11 can be a component used to protect the integrated circuit board 12. The housing 11 can form an outer shell structure of the integrated circuit board 12, which can reduce the possibility of the power devices in the integrated circuit board 12 being bumped by external devices. The housing 11 can be made of vacuum forming material. Understandably, vacuum forming material has advantages such as good plasticity, processability, lightweight and high strength, corrosion resistance and insulation. In addition, its production cost is low, thus reducing the cost of the inverter 10.

[0051] The housing 11 has a receiving cavity and a ventilation opening 111. The receiving cavity can be a hollow structure formed inside the housing 11, used to house the integrated circuit board 12, the heat spreader 13, and the heat sink fins 14. By forming the receiving cavity inside, the housing 11 protects the integrated circuit board 12, the heat spreader 13, and the heat sink fins 14, thus providing good protection and insulation. The receiving cavity is connected to the outside through the ventilation opening 111, which is used for heat dissipation inside the receiving cavity. The ventilation opening 111 can be rectangular in shape and can be located on the top or side of the housing 11. There can be one or multiple ventilation openings 111.

[0052] The shape of the housing cavity can match the overall shape of the integrated circuit board 12, the heat spreader 13, and the heat sink fins 14. This makes the overall structure of the housing 11 more coordinated and compact with the integrated circuit board 12, the heat spreader 13, and the heat sink fins 14, which helps to reduce the volume of the inverter 10 and facilitates the installation and fixation of the inverter 10. The housing 11 can be designed as a cube structure or a cylinder structure. The shape of the housing 11 can be reasonably designed and adjusted according to the actual installation needs or the support and fixation needs of the integrated circuit board 12, so that the housing 11 can better play the role of support and fixation, and the housing 11 can be installed and fixed conveniently and reliably.

[0053] The integrated circuit board 12 may include a circuit board 121 and multiple power devices. The circuit board 121 provides support and stable and reliable electrical connections for other electronic components in the integrated circuit board 12. Multiple power devices are disposed on the circuit board 121, and the circuit board 121 has multiple lines connected to the power devices. The multiple power devices can work together to convert electrical energy and ensure the normal operation of the integrated circuit board 12. The circuit board 121 can be a printed circuit board (PCB). The integrated circuit board 12 is also fixedly connected to the housing 11 through the circuit board 121.

[0054] The power device may include a first power device 122 and a second power device 123, and there may be multiple first power devices 122 and second power devices 123. The heating power of the first power device 122 is greater than that of the second power device 123. Along a first direction Z, the height of the second power device 123 may be greater than the height of the first power device 122. The first direction Z is the thickness direction of the circuit board 121 and is perpendicular to the circuit board 121. Along a second direction X, the second power device 123 may be located on at least one side of the first power device 122. The second direction X may be the length direction of the circuit board 121. That is, along the second direction X, the second power device 123 may be located on one side of the first power device 122 or on both sides of the first power device 122.

[0055] The heat generation energy consumption of the first power device 122 is higher than that of the second power device 123. In the embodiments of this application, the first power device 122 can be a MOSFET, and the second power device 123 can be an inductor, capacitor, or transformer, etc. When the second power device 123 is located on both sides of the first power device 122 along the second direction X, one side can be an inductor and capacitor, and the other side can be a transformer.

[0056] The vapor chamber (VC) 13 is a highly efficient two-phase heat dissipation element that absorbs heat from surrounding heat-generating objects to prevent these objects from experiencing a rapid temperature rise due to heat accumulation. It then conducts the absorbed heat internally to various parts for heat transfer. Those skilled in the art will understand that two-phase heat dissipation elements are a type of highly efficient heat dissipation component designed based on the principle of phase change heat transfer. Its core principle is to utilize the property of liquids absorbing / releasing a large amount of latent heat during the "liquid-gas" two-phase transition to achieve rapid heat transfer.

[0057] A heat spreader 13 is disposed on the integrated circuit board 12 and covers the first power device 122 and the second power device 123. The heat spreader 13 has a vacuum chamber inside, which is filled with a liquid such as water or ethanol, and capillary channels (such as sintered mesh or microgrooves) are formed inside the vacuum chamber. The heat spreader 13 includes a first heat spreader area 131 and a second heat spreader area 132. Along the first direction, the height of the second heat spreader area 132 is greater than that of the first heat spreader area 131. The first heat spreader area 131 is arranged opposite to and thermally coupled to the first power device 122, and the second heat spreader area 132 is arranged opposite to and thermally coupled to the second power device 123.

[0058] After the first power device 122 or the second power device 123 comes into contact with the bottom of the heat spreader 13, the heat causes the local liquid to evaporate and form steam. The steam rapidly diffuses within the vacuum cavity inside the heat spreader and transfers heat to other areas of the plate. The steam in the cooling area condenses into liquid and flows back to the evaporation area through capillary channels, forming a continuous cycle, thereby achieving rapid and large-area uniform heat transfer. This process forms a stable two-phase cycle, achieving low thermal resistance and large-area uniform heat transfer. It can be understood that compared with traditional metal blocks or heat pipes, the heat spreader 13 has higher lateral thermal conductivity and faster thermal response speed. Therefore, the heat dissipation effect can be significantly improved by setting up the heat spreader 13.

[0059] Heat dissipation fins 14 are disposed on the side of the first temperature equalization zone 132 away from the first power device 122 along the first direction Z, and the heat dissipation fins 14 can be fixed to the first temperature equalization zone 132 by welding. That is to say, the heat dissipation fins 14 are located above the first power device 122. It can be understood that the heat dissipation power of the first power device 122 is greater than that of the second power device 123. Therefore, the arrangement of the heat dissipation fins 14 in the first temperature equalization zone 132 and close to the first power device 122 can ensure that the heat dissipation path of the first power device 122 is shorter, and can absorb the heat generated by the first power device 122 more quickly, thereby improving the safety of the first power device 22.

[0060] The heat dissipation fins 14 can also be positioned directly opposite the vents 111, which can be located above or to the side of the heat dissipation fins 14. The heat dissipation fins 14 can be made of materials that easily conduct heat, such as aluminum, copper, or alloys, to increase the heat dissipation area.

[0061] The power devices generate heat during operation, which is transferred to the bottom of the heat spreader 13. The heat causes local liquid to evaporate, forming steam. The steam rapidly diffuses within the cavity, transferring heat to other areas of the heat spreader 13 and then to the heat dissipation fins 14. This concentrates the heat in the area where the heat dissipation fins 14 are located, and the heat is dissipated through convection via the vents 111. This results in a flatter and more integrated overall structure, which is beneficial for product miniaturization and standardized design.

[0062] In some embodiments of this application, optionally, along the second direction X, a plurality of second power devices 123 may be located on both sides of the first power device 122, and a second temperature equalization zone 132 is provided on both sides of the first temperature equalization zone 131. The temperature equalization plate 13 is formed with a groove 133, and along the first direction Z, the groove 133 is located above the first power device 122, and the heat dissipation fins 14 are disposed in the groove 133.

[0063] Specifically, the circuit board 121 can be divided into three regions. The first power device 122 is located in the middle region of the circuit board 121, and the second power device 123 is located in the other two side regions of the circuit board 121. Since the second power device 123 is higher than the first power device 122, the first power device 122 and the second power device 123 can jointly form a heat dissipation channel. The first heat dissipation zone 131 and the second heat dissipation zone 132 of the heat spreader 13 are respectively covered on the first power device 122 and the second power device 123, and a groove 133 is formed in the heat dissipation channel. The heat dissipation fins 14 are located within the groove 133. The vent 111 can be located on the side of the housing 11 and communicate with the groove 133.

[0064] Thus, the second power device 123 is distributed on both sides of the first power device 122, forming a double-peak layout. The heat spreader 13 is precisely embedded between the two through a precisely designed groove 133. The groove 133 is set vertically along the circuit board 121 and faces the low-profile first power device 122. The heat dissipation fins 14 are directly integrated inside the groove 133. The embedded fins in the groove 133 shorten the heat dissipation path to the millimeter level. Combined with the phase change heat transfer driven by the capillary force of the heat spreader 13, the heat dissipation efficiency of the main heat source (first power device 122) is improved by more than 30%. Moreover, the compact layout maximizes the use of Z-axis space, reduces the volume of heat dissipation components, and helps to miniaturize the whole machine. The integrated design of the groove 133 and the heat dissipation fins 14 eliminates the assembly gap of traditional heat sinks, providing reliable protection for harsh scenarios such as vehicle bumps and outdoor dust.

[0065] In some embodiments of this application, optionally, the inverter 10 further includes a fan 15, which is disposed at the vent 111. There may be one or more fans 15. The fan 15 is used to enhance heat exchange convection, thereby improving heat dissipation efficiency and preventing the power devices from overheating.

[0066] Thus, the fan 15 integrated at the vent 111 and the heat dissipation fins 14 on the back of the vapor chamber 13 work together to form a forced convection airflow channel, directly driving the cool airflow through the gaps between the fins, significantly improving heat dissipation efficiency. This not only achieves rapid and even heat dissipation through the phase change heat transfer of the vapor chamber 13, but also leverages the forced convection of the fan 15 to precisely overcome the bottlenecks of traditional natural heat dissipation. While ensuring a high protection level and compact layout, this significantly reduces the operating temperature of power devices, extends their lifespan, and promotes the lightweight development of the system.

[0067] In some embodiments of this application, optionally, the vent 111 includes a first vent and a second vent disposed opposite to each other, and the fan 15 is located at either the first vent or the second vent. The first vent and the second vent may be located on opposite sides of the housing 11 and are directly opposite the heat dissipation fins 14.

[0068] Thus, by setting the first and second vents opposite each other and integrating a fan 15 on one side, a highly efficient directional airflow is constructed in conjunction with the vapor chamber 13 and the heat sink fin 14 module. The fan 15 drives the airflow to pass through the heat sink fin 14 array from the air inlet and then be discharged unidirectionally from the air outlet, completely eliminating the airflow dead zone of the traditional side-blowing airflow. Combined with the capillary phase change heat transfer in the vapor chamber 13 for centralized thermal management of multi-height power devices, the heat is efficiently transferred from the heat source → vapor chamber 13 → heat sink fin 14 → vent 111 via an ultra-short path, solving the problems of uneven heat dissipation from dispersed heat sources and low efficiency of detour airflow.

[0069] In some embodiments of this application, optionally, the vent 111 includes a first vent and a second vent disposed opposite to each other; the fan 15 includes two fans, which are symmetrically distributed at the first vent and the second vent.

[0070] Thus, through the coordinated design of the opposing dual vents 111 and the symmetrical distributed dual fans 15, the dual fans 15 synchronously drive the airflow from the two side vents 111 through the heat dissipation fin array 14 on the back of the heat spreader 13, achieving zero dead zone airflow and uniform coverage of the entire air field; combined with the active adsorption of the three-dimensionally arranged power devices by the capillary phase change heat transfer in the heat spreader 13, a heat migration path of "heat source → phase change heat conduction of heat spreader 13 → fin convection heat transfer → bidirectional airflow out" is formed, further improving the heat dissipation efficiency.

[0071] In some embodiments, the inverter 10 further includes a thermally conductive insulating film 16 disposed between the heat spreader 13 and the second power device 123. The thermally conductive insulating film 16 has both thermal conductivity and insulation properties. The thermally conductive insulating film 16 enables heat transfer between the second power device 123 and the heat spreader 13, while preventing abnormal electrical conduction between the second power device 123 and the heat spreader 13, thus ensuring equipment safety and stable system operation.

[0072] Thus, by adding a thermally conductive insulating film 16 between the heat spreader 13 and the second power device 123, on the one hand, the thermally conductive insulating film 16 can completely isolate electrical risks and avoid potential short circuit problems of the device; on the other hand, the high thermal conductivity tightly fills the micro gap between the heat spreader 13 and the device, significantly reducing the contact thermal resistance, so that the heat of the second power device 123 can be transferred to the cavity of the heat spreader 13 more quickly to participate in the phase change cycle.

[0073] In some embodiments, the surface of the first power device 122 is coated with an insulating thermally conductive adhesive that contacts the heat spreader 13.

[0074] Thus, by coating the surface of the high-heat-density first power device 122 with insulating thermally conductive adhesive, on the one hand, its high insulation completely blocks the risk of high-voltage breakdown, solving the safety hazard of direct contact between the first power device 122 and the metal heat spreader 13; on the other hand, the adhesive tightly fills the interface gaps with an ultra-thin thickness, further improving the heat flux density carrying capacity of the first power device 122.

[0075] The second aspect of this application proposes an energy storage system including an inverter and a battery module according to the first aspect of this application, wherein the battery module is electrically connected to the inverter.

[0076] According to the energy storage system of this application, by setting up the inverter of the first aspect embodiment above, first power devices and second power devices of different heights are arranged three-dimensionally on the circuit board, and combined with the heat spreader plate set close to it, the heat generated by multiple dispersed heat sources is effectively concentrated and rapidly diffused; the efficient phase change heat transfer of the heat spreader plate greatly shortens the heat path, reduces thermal resistance, and significantly improves heat dissipation efficiency; at the same time, the heat dissipation fins are directly integrated on the back of the heat spreader plate and face the shell ventilation port, forming a simple and efficient direct ventilation channel, which not only optimizes the heat dissipation airflow and saves space to achieve high integration and protection, but also significantly reduces the weight of the heat dissipation system, which is conducive to achieving the lightweighting of the inverter.

[0077] Specifically, the energy storage system can be a portable energy storage system or a home energy storage system. For example, when the energy storage system is portable, it can be a portable photovoltaic energy storage system. The energy storage system includes the inverter described above and one or more battery modules to increase the capacity of the energy storage system. The inverter can be electrically connected to the battery modules to realize the conversion of electrical energy between direct current and alternating current.

[0078] A battery module may include multiple batteries, which are connected in series via a busbar to increase the voltage of the energy storage system. When the energy storage system includes multiple battery modules, the battery modules are connected in parallel to increase the capacity of the energy storage system. Each battery may include one or more battery cell assemblies for providing voltage and capacity. A battery cell assembly may include multiple battery cells, which are connected in series, parallel, or mixed connections via a busbar. In some embodiments, a battery cell assembly is typically formed by arranging multiple battery cells.

[0079] The description of the various embodiments above tends to emphasize the differences between the various embodiments. The similarities or similarities between them can be referred to, and for the sake of brevity, they will not be repeated here.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. An inverter, characterized in that, The inverter includes: An integrated circuit board, the integrated circuit board including a circuit substrate and a plurality of power devices integrated on the circuit substrate, the plurality of power devices including a first power device and a second power device, the second power device being distributed on at least one side of the first power device along a first direction, the height of the second power device being greater than the height of the first power device, the first direction being the thickness direction of the circuit substrate; A heat spreader, covering the integrated circuit board, includes: a first heat spreader area and a second heat spreader area. Along a first direction, the height of the second heat spreader area is greater than that of the first heat spreader area. The first heat spreader area is disposed opposite to and thermally coupled to the first power device, and the second heat spreader area is disposed opposite to and thermally coupled to the second power device. Heat dissipation fins are disposed on the side of the first temperature equalization zone away from the first power device.

2. The inverter according to claim 1, characterized in that, The heating power of the first power device is greater than that of the second power device. Along the second direction, the second power device is distributed on both sides of the first power device. A second temperature equalization zone is provided on both sides of the first temperature equalization zone. The temperature equalization plate is formed with a groove. Along the first direction, the groove is located above the first power device. The heat dissipation fins are disposed in the groove. The second direction is the length direction of the circuit board.

3. The inverter according to claim 1 or 2, characterized in that, The inverter also includes a housing, which has a cavity and a vent. The integrated circuit board and the heat spreader are both disposed in the cavity, and the heat dissipation fins are positioned opposite the vent.

4. The inverter according to claim 3, characterized in that, The inverter also includes: A fan is provided at the vent and creates airflow that passes through the heat dissipation fins.

5. The inverter according to claim 4, characterized in that, The ventilation opening includes a first ventilation opening and a second ventilation opening arranged opposite to each other; the fan is located at the first ventilation opening or the second ventilation opening.

6. The inverter according to claim 1, characterized in that, The first power device includes a MOSFET.

7. The inverter according to claim 1, characterized in that, The second power device includes at least one of an inductor, a transformer, and a capacitor.

8. The inverter according to claim 1, characterized in that, The inverter also includes: A thermally conductive insulating film is disposed between the heat spreader and the second power device.

9. The inverter according to claim 1, characterized in that, The surface of the first power device is coated with an insulating thermally conductive adhesive that comes into contact with the heat spreader.

10. An energy storage system, characterized in that, It includes the inverter and battery module as described in any one of claims 1-9, wherein the battery module is electrically connected to the inverter.

Images