Modular power supply

Abstract

The utility model relates to the technical field of power supply especially is related to a kind of modular power supply, including power module;Shell, the power module is installed in the shell, interface is provided on the shell;Radiator plate, with the shell fixed connection, radiator plate is provided with radiating fin, and first radiating passage is formed between adjacent radiating fins;Fan, with the radiator plate fixed connection, the fan forms second radiating passage, and part or all first radiating passage is communicated with second radiating passage.The utility model provides a kind of modular power supply with more optimized heat dissipation structure and arrangement, changes airflow path, and the static pressure utilization rate of fan is very high, makes airflow velocity high, direction concentrated, and penetrating power is strong, can play the high-efficiency heat dissipation effect to modular power supply.

Description

Technical Field

[0001] This utility model relates to the technical field of power supplies, and in particular to a modular power supply. Background Technology

[0002] Modular power supplies integrate power supplies into a single system in modular form. This type of power supply typically includes multiple modules, such as DC-DC converters, AC-DC converters, filters, and control circuits. These modules are designed to operate independently or work together to adapt to different power requirements and application scenarios.

[0003] Modular power supplies contain numerous electrical components, generating continuous heat during operation. This heat accumulation affects the power supply's performance and lifespan, making heat dissipation a critical concern. Existing technologies utilize fans and heat sinks as cooling structures for modular power supplies. However, the fan's installation location and the airflow path formed by the interaction between the fan and the heat sinks directly impact the cooling efficiency. Therefore, optimizing the cooling structure and continuously improving the cooling efficiency of modular power supplies are essential technical challenges requiring further research in this field. Utility Model Content

[0004] In order to improve the heat dissipation problem of current modular power supplies, the purpose of this utility model is to provide a more optimized heat dissipation structure for modular power supplies, which can improve the heat dissipation efficiency of current modular power supplies.

[0005] To achieve the objectives of this utility model, a modular power supply is provided, employing the following technical solution:

[0006] A modular power supply includes: a power module; a housing, in which the power module is installed, and an interface is provided on the housing; a heat sink fixedly connected to the housing, the heat sink having heat dissipation fins, with a first heat dissipation channel formed between adjacent heat dissipation fins; and a fan fixedly connected to the heat sink, the fan forming a second heat dissipation channel, with part or all of the first heat dissipation channel communicating with the second heat dissipation channel.

[0007] By adopting the above technical solution, when the fan is running, the hot airflow generated by the power module is pushed or pulled through the first heat dissipation channel formed by the dense heat dissipation fins under the direct action of the fan. The airflow path is strictly limited within the first and second heat dissipation channels, resulting in very high utilization of the fan's static pressure. This leads to high airflow velocity, concentrated direction, and strong penetration, enabling efficient heat dissipation for the modular power supply. When a blowing fan is used, the airflow is pushed from the second heat dissipation channel into the first heat dissipation channel; when an exhaust fan is used, the airflow is pulled from the first heat dissipation channel into the second heat dissipation channel. In this application, an exhaust fan is preferred, with the fan's suction force applied at the connection between the first and second heat dissipation channels.

[0008] The implementation can include any or all of the following features.

[0009] In one embodiment, the heat dissipation fins are provided with contour-following positions according to the shape of the fan, the contour-following positions extending from the bottom end of the heat dissipation fins to the top end of the heat dissipation fins, and the fan is installed in the contour-following positions.

[0010] By adopting the above technical solution, the fan is embedded in the heat sink fins. The fan breaks the continuous heat sink fins and connects the first heat sink channel directly to the second heat sink channel formed by the fan from the broken part of the heat sink fins. This connection method makes it easy for the first channel to connect with the second channel through the shortest path, which helps to improve heat dissipation efficiency.

[0011] In one embodiment, the contour-following position is located away from the interface, and the first heat dissipation channel close to the interface is not connected to the contour-following position.

[0012] For exhaust fans, the extracted hot airflow is uniformly discharged from the bottom of the fan upwards, resulting in a relatively high temperature in the space at the bottom of the fan. The above technical solution can guide the hot airflow extracted by the fan away from the interface area, so that the interface area can mainly rely on the heat sink fins for heat dissipation, thereby reducing secondary thermal damage to the heat-sensitive electronic components at the interface area.

[0013] In one embodiment, the heat dissipation fins include an expansion portion and a contraction portion, the expansion portion and the contraction portion are spaced apart, the expansion portions of adjacent heat dissipation fins are aligned, and the contraction portions of adjacent heat dissipation fins are aligned.

[0014] Through the above technical solution, compared with conventional corrugated fins, the fins of this application can form a violent airflow contraction and expansion channel. When the airflow passes between the expansion and contraction parts of the heat dissipation fins, the pressure changes continuously, which enhances the disturbance effect on the airflow on the fin surface, efficiently and frequently destroys the thermal boundary layer on the fin surface, continuously stirs the cold air into the fin surface, and carries away the hot airflow, thereby enhancing the heat dissipation efficiency.

[0015] In one embodiment, the upper surface of the fan is lower than the upper surface of the heat dissipation fins, and a fan cover is provided on the outer surface of the upper surface of the fan.

[0016] The above technical solutions make the structure of this modular power supply more compact and improve its aesthetic appearance.

[0017] In one embodiment, the housing includes a bottom plate and a side plate, the bottom plate being sealed to the end of the side plate away from the heat sink, and the end of the side plate facing the heat sink being connected to the heat sink.

[0018] The above technical solution makes the end of the housing with the power module facing the heat sink open, and the heat sink acts as the top cover of the housing, reducing the solid structure between the housing and the heat sink and improving the heat exchange efficiency.

[0019] In one embodiment, a first connecting portion is fixed to the end face of the side plate facing the heat sink, the first connecting portion is disposed along the inner periphery of the side plate, and a first sealing strip is installed between the upper end face of the first connecting portion and the lower end face of the heat sink.

[0020] In one embodiment, a second connecting portion is fixed to the end face of the side plate opposite to the heat sink plate. The second connecting portion is disposed along the inner periphery of the side plate, and a second sealing strip is installed between the lower end face of the second connecting portion and the upper end face of the bottom plate.

[0021] In one embodiment, a first connecting hole is provided on the first connecting part and the first sealing strip, and a second connecting hole is provided on the outer periphery of the lower end face of the heat sink. The second connecting hole is a blind hole, and the first connecting hole and the second connecting hole are aligned.

[0022] In one embodiment, a second connecting portion is fixed to the outer periphery of the side plate, and a third connecting portion is fixed to the outer periphery of the side plate, wherein the third connecting portion is provided with a third connecting hole.

[0023] In summary, this utility model provides a modular power supply with the following beneficial effects:

[0024] First, the positional relationship between the fan and the heat sink fins has been optimized, so that the fan is embedded in the heat sink fins of the array. The first heat dissipation channel formed by the heat sink fins and the second heat dissipation channel formed by the fan can be directly connected with the shortest path, so that the airflow path is strictly limited in the first and second heat dissipation channels. The static pressure utilization rate of the fan is very high, and the airflow velocity is high, the direction is concentrated, and the penetration is strong, which can play an efficient heat dissipation role for modular power supplies.

[0025] Secondly, the positional relationship between the fan and the interface has been optimized, guiding the hot airflow drawn by the exhaust fan away from the interface area, thereby reducing secondary thermal damage to heat-sensitive electronic components at the interface.

[0026] Third, the shape of the heat dissipation fins has been optimized, enabling the formation of intense airflow contraction and expansion channels between the fins. This forces the airflow flowing through the first heat dissipation channel to undergo continuous pressure changes, enhancing the disturbance effect on the airflow on the fin surface and efficiently and frequently disrupting the thermal boundary layer on the fin surface, thereby improving heat dissipation efficiency. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the modular power supply of this utility model;

[0028] Figure 2 This diagram shows the structure of the modular power supply of this utility model without the fan cover installed.

[0029] Figure 3 for Figure 1 A magnified structural diagram of part A in the middle;

[0030] Figure 4 This is a schematic diagram of the longitudinal section structure of the modular power supply of this utility model;

[0031] Figure 5 This is an exploded structural diagram of the modular power supply housing of this utility model;

[0032] Explanation of reference numerals in the attached figures:

[0033] 1. Shell;

[0034] 11. Interface;

[0035] 12. Side plate; 121. First connecting part; 1211. First connecting hole; 122. Second connecting part; 123. Third connecting part; 1231. Third connecting hole; 124. First sealing strip; 125. Second sealing strip;

[0036] 13. Base plate;

[0037] 2. Power supply module;

[0038] 3. Heat sink;

[0039] 31. Heat dissipation fins; 311. First heat dissipation channel; 312. Expansion section; 313. Contraction section; 314. Shape-following position;

[0040] 32. Fan; 321. Support;

[0041] 33. Baffle;

[0042] 4. Wind shield;

[0043] 41. Fixing plate. Detailed Implementation

[0044] To make the objectives and technical solutions of the present utility model clearer, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of the present utility model without creative effort are within the scope of protection of the present utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, back, bottom, and top, are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the present utility model.

[0045] In the heat dissipation structure of a modular power supply, the installation position relationship between the fan and the heat dissipation fins, the airflow channel formed by the interaction between the fan airflow and the heat dissipation fins, and the shape of the heat dissipation fins have a direct impact on the heat dissipation efficiency of the modular power supply. In order to improve the heat dissipation efficiency of the current modular power supply, this utility model optimizes the heat dissipation structure of the modular power supply.

[0046] This utility model discloses a modular power supply, as shown in the following embodiment. Figure 1 It includes a housing 1, and a power module 2 is installed inside the housing 1 (see...). Figure 4 The housing 1 has an interface 11 on one side, which is electrically connected to the power module 2 inside the housing 1. A heat sink 3 is fixedly connected to the upper end of the housing 1. The heat sink 3 has an array of heat dissipation fins 31, and a fan 32 is embedded in the heat dissipation fins 31. The fan 32 is electrically connected to the power module 2 inside the housing 1. The fan 32 is covered by a fan shroud 4, which is fixedly connected to the heat sink 3. The heat sink 3, heat dissipation fins 31, and fan 32 together form the main heat dissipation structure of the modular power supply.

[0047] Specifically, refer to Figure 1 The lower end face of the heat sink 3 is fixedly connected to the upper end of the housing 1. Multiple heat sink fins 31 are arrayed and fixed on the upper end face of the heat sink 3. The heat sink fins 31 can be integrally formed with the heat sink 3, completely covering the upper end face of the heat sink 3. A first heat dissipation channel 311 is formed between two adjacent heat sink fins 31. The array direction of the heat sink fins 31 can be, but is not limited to, along the length direction of the heat sink 3. For example, the heat sink fins 31 can also be arrayed along the width direction of the heat sink 3.

[0048] Reference Figure 2A contoured section 314 is provided in the heat dissipation fins 31, extending from the bottom to the top of the heat dissipation fins 31, completely breaking the continuous heat dissipation fins 31. A fan 32 is installed within the contoured section 314, with the air inlet and outlet of the fan 32 forming a second heat dissipation channel. The upper surface of the fan 32 is lower than the upper surface of the heat dissipation fins 31, allowing the fan 32 to be embedded in the heat dissipation fins 31. The first heat dissipation channel 311 formed by the heat dissipation fins 31 extends to the contoured section 314 and directly connects with the second channel formed by the fan 32, strictly confining the airflow within the first and second channels. The connection between the first and second channels is achieved via the shortest path, which helps improve the utilization rate of the static pressure of the fan 32, thereby improving heat dissipation efficiency.

[0049] Reference Figure 2 Two contoured positions 314 are provided along the length of the heat sink 3, and the two contoured positions 314 are symmetrically arranged. Each contoured position 314 is provided with a fan 32. The bottom of the fan 32 is fixed with a support 321, and the support 321 is fixedly connected to the upper end face of the heat sink 3. The fan 32 can be a suction type or a blowing type. In this embodiment, a suction type fan 32 is used. The end of the contoured position 314 away from the interface 11 extends through the outermost heat dissipation fin 31 of the heat sink 3. The contoured position 314 does not extend to the heat dissipation fin 31 near the interface 11, so that the multiple heat dissipation fins 31 near the interface 11 are continuous straight lines. This arrangement of the contoured position 314 away from the interface 11 allows the heat accumulated near the bottom of the suction type fan 32 to be discharged away from the interface 11, reducing secondary thermal damage to the heat-sensitive electronic components of the interface 11.

[0050] Reference Figure 1 A baffle 33 is fixed on each side of the heat sink 3 along its length. The upper surface of the baffle 33 is flush with the upper surface of the heat sink fins 31. All the heat sink fins 31 are positioned between the two baffles 33, which protect the heat sink fins 31. A fan shroud 4 is positioned above the fan 32 and covers a portion of the heat sink fins 31 around the fan 32. Fixing plates 41 extend outward from the four corners and the center of the fan shroud 4 and are fixedly connected to the baffles 33. In addition to its dustproof function, the fan shroud 4, together with the baffles 33, strengthens the protection of the heat sink fins 31, helps reduce the deformation of the heat sink fins 31, and maintains the stability of the first heat dissipation channel 311 structure.

[0051] Reference Figure 3The heat dissipation fins 31 include expansion portions 312 and contraction portions 313, which are spaced apart. The outer contour of the expansion portion 312 is arc-shaped. Each heat dissipation fin 31 has at least two expansion portions 312 and two contraction portions 313. The expansion portion 312 of one heat dissipation fin 31 is aligned with the expansion portion 312 of the adjacent heat dissipation fin 31, and the contraction portion 313 of one heat dissipation fin 31 is aligned with the contraction portion 313 of the adjacent heat dissipation fin 31. When airflow passes through the first heat dissipation channel 311, the continuous expansion portions 312 and contraction portions 313 cause the airflow pressure to continuously increase and decrease, strongly disturbing the airflow within the first heat dissipation channel 311 and improving heat dissipation efficiency.

[0052] Reference Figure 4 The housing 1 includes a bottom plate 13 and a side plate 12. A heat sink 3 is connected to the upper end of the side plate 12 and acts as a cover plate for the housing 1. The power module 2 inside the housing 1 is fixedly connected to the lower end of the heat sink 3. The heat generated by the power module 2 is directly dissipated through the heat sink 3. The bottom plate 13 is connected to the bottom end of the side plate 12.

[0053] Reference Figure 5 A first connecting part 121 is fixed to the end face of the side plate 12 facing the heat sink 3. The first connecting part 121 is arranged along the inner periphery of the side plate 12 and can be integrally formed with the side plate 12. A first sealing strip 124 is installed between the upper end face of the first connecting part 121 and the lower end face of the heat sink 3. A first connecting hole 1211 is provided on the first connecting part 121 and the first sealing strip 124. A second connecting hole (not shown in the figure) is provided on the outer periphery of the lower end face of the heat sink 3. The second connecting hole is a blind hole. The first connecting hole 1211 and the second connecting hole are aligned. Before the base plate 13 is installed, fasteners, such as screws, are installed from one side of the housing 1 into the first connecting hole 1211 and the second connecting hole to achieve a fixed connection between the housing 1 and the heat sink 3. A second connecting part 122 is fixed to the end face of the side plate 12 opposite to the heat sink 3. The second connecting part 122 is arranged along the inner periphery of the side plate 12 and can be integrally formed with the side plate 12. A second sealing strip 125 is installed between the lower end face of the second connecting part 122 and the upper end face of the base plate 13. The second connecting part 122, the second sealing strip 125 and the base plate 13 can be fixedly connected in sequence by screws and connecting holes. The first sealing strip 124 and the second sealing strip 125 provide a seal for the housing 1 and the housing 1 and the heat sink 3, improving the overall waterproof performance of the modular power supply.

[0054] Reference Figure 5 A third connecting part 123 is fixed on the outer periphery near the bottom of the side plate 12. The third connecting part 123 can be integrally formed with the side plate 12. The third connecting part 123 has a third connecting hole 1231. The third connecting part 123 and the third connecting hole 1231 are used to realize the connection and fixation between the modular power supply and other structures.

[0055] The implementation principle of this utility model's modular power supply is as follows: An exhaust fan 32 is used. Under the suction force of the fan 32, the hot airflow generated inside the housing 1 is drawn into multiple first heat dissipation channels 311 formed by multiple heat dissipation fins 31. After entering the contour position 314 along the first heat dissipation channels 311, the airflow is uniformly discharged from the second heat dissipation channel formed by the fan 32. The hot airflow path is strictly limited within the first and second heat dissipation channels 311 and 311, resulting in very high utilization of the suction force of the fan 32. This leads to high airflow velocity, concentrated direction, and strong penetration, enabling efficient heat dissipation for the modular power supply. Furthermore, as the hot airflow flows through the first heat dissipation channels 311, it is constrained by the shape of the heat dissipation fins 31, causing continuous pressure changes. This enhances the disturbance effect on the airflow surface of the heat dissipation fins 31, efficiently and frequently disrupting the thermal boundary layer on the surface of the heat dissipation fins 31, further enhancing the heat dissipation efficiency.

[0056] Of course, the above embodiments are the preferred embodiments of this utility model, and are only used to illustrate the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it accordingly, and should not be used to limit the protection scope of this utility model. All modifications made in accordance with the spirit and essence of the main technical solution of this utility model should be included within the protection scope of this utility model.

Claims

1. A modular power supply, characterized in that, include: Power module; The housing contains the power module, which is installed inside the housing. The housing also has an interface. A heat sink plate is fixedly connected to the housing. The heat sink plate is provided with heat dissipation fins, and a first heat dissipation channel is formed between adjacent heat dissipation fins. A fan is fixedly connected to the heat sink, and the fan forms a second heat dissipation channel. Part or all of the first heat dissipation channel is connected to the second heat dissipation channel.

2. A modular power supply as described in claim 1, characterized in that, The heat dissipation fins are provided with contoured positions according to the shape of the fan. The contoured positions extend from the bottom end of the heat dissipation fins to the top end of the heat dissipation fins, and the fan is installed in the contoured positions.

3. A modular power supply as described in claim 2, characterized in that, The contour-following position is located away from the interface, and the first heat dissipation channel close to the interface is not connected to the contour-following position.

4. A modular power supply as described in claim 1, characterized in that, The heat dissipation fins include an expansion portion and a contraction portion, which are spaced apart. The expansion portions of adjacent heat dissipation fins are aligned with each other, and the contraction portions of adjacent heat dissipation fins are aligned with each other.

5. A modular power supply as described in claim 2, characterized in that, The upper surface of the fan is lower than the upper surface of the heat dissipation fins, and a fan cover is provided on the outer surface of the upper surface of the fan.

6. A modular power supply as described in claim 1, characterized in that, The housing includes a bottom plate and a side plate. The bottom plate is sealed to the end of the side plate away from the heat sink, and the end of the side plate facing the heat sink is connected to the heat sink.

7. A modular power supply as described in claim 6, characterized in that, A first connecting portion is fixed to the end face of the side plate facing the heat sink. The first connecting portion is arranged along the inner periphery of the side plate, and a first sealing strip is installed between the upper end face of the first connecting portion and the lower end face of the heat sink.

8. A modular power supply as described in claim 6, characterized in that, A second connecting part is fixed to the end face of the side plate opposite to the heat sink plate. The second connecting part is arranged along the inner periphery of the side plate, and a second sealing strip is installed between the lower end face of the second connecting part and the upper end face of the bottom plate.

9. A modular power supply as described in claim 7, characterized in that, The first connecting part and the first sealing strip are provided with a first connecting hole, and the outer periphery of the lower end face of the heat sink is provided with a second connecting hole. The second connecting hole is a blind hole, and the first connecting hole and the second connecting hole are aligned.

10. A modular power supply as described in claim 6, characterized in that, The outer periphery of the side plate is fixed with a third connecting part, and the third connecting part is provided with a third connecting hole.

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