A power cabinet and a converter

Abstract

The application discloses a power cabinet and a converter, and belongs to the technical field of power electronic devices. The power cabinet in the application comprises a cabinet body, a reactor assembly, a power module and a heat exchange assembly. The cabinet body is internally provided with a heat dissipation air duct. The cabinet body is provided with an air inlet and an air outlet which are in communication with the heat dissipation air duct. The reactor assembly, the power module and the heat exchange assembly are all arranged in the heat dissipation air duct. The heat exchange assembly is in heat conduction connection with the power module. The power cabinet further comprises a heat dissipation fan which is arranged in the heat dissipation air duct. On the one hand, the reactor assembly, the power device and the heat exchange assembly are air-cooled and heat-dissipated through the heat dissipation air duct. On the other hand, the heat exchange assembly is utilized to dissipate heat of the power module, so that heat accumulation in the power module is reduced, local hot spots are avoided, heat dissipation efficiency is improved, and power attenuation is reduced.

Description

Technical Field

[0001] This application relates to the field of power electronic equipment technology, and in particular to a power cabinet and converter. Background Technology

[0002] In power electronic equipment, the power cabinet is one of the core cabinets, containing a large number of heat-generating components that generate significant heat during operation. However, traditional heat dissipation methods are insufficient to meet the heat dissipation requirements of high-power-density equipment. Utility Model Content

[0003] This application provides a power cabinet to solve the technical problem that traditional heat dissipation methods are difficult to meet heat dissipation requirements; this application also provides a converter.

[0004] Technical solution: The power cabinet provided in this embodiment includes: a cabinet body, a reactor assembly, a power module and a heat exchange assembly. The cabinet body is provided with a heat dissipation duct, and the cabinet body is provided with an air inlet and an air outlet connected to the heat dissipation duct. The reactor assembly, the power module and the heat exchange assembly are all disposed in the heat dissipation duct, and the heat exchange assembly is thermally connected to the power module.

[0005] The power cabinet also includes a cooling fan, which is disposed within the cooling duct.

[0006] In some embodiments, the heat exchange assembly includes:

[0007] An evaporator, which is attached to the power module;

[0008] A condenser, which is connected to the evaporator;

[0009] Both the evaporator and the condenser are located within the heat dissipation duct.

[0010] In some embodiments, the condenser is positioned close to the air outlet relative to the power module.

[0011] In some embodiments, the power module includes:

[0012] A power module, which is attached to the evaporator;

[0013] A capacitor bank is disposed between the power module and the condenser.

[0014] In some embodiments, the power module includes:

[0015] A power module is attached to the evaporator, and the evaporator and the condenser are arranged along a first direction;

[0016] A capacitor bank is disposed on one side of the power module in a second direction, which intersects with the first direction.

[0017] In some embodiments, the reactor assembly is positioned relative to the power module near the air inlet.

[0018] In some embodiments, the cooling fan is disposed at the air inlet, or the cooling fan is disposed between the reactor assembly and the power module.

[0019] In some embodiments, the cabinet body is provided with a partition with a through hole, the partition is used to divide the internal space of the cabinet into a first chamber and a second chamber that are connected. The air inlet is provided on the side wall of the first chamber and the air outlet is provided on the side wall of the second chamber.

[0020] In some embodiments, the reactor assembly is housed in the first chamber, and the power module and the heat exchange assembly are housed in the second chamber.

[0021] In some embodiments, the air inlet is located below the air outlet.

[0022] This application also provides a converter, including the power cabinet in the above embodiments.

[0023] Beneficial Effects: The power cabinet in this embodiment includes a cabinet body, reactor components, power modules, and heat exchange components. The cabinet body has a heat dissipation duct, and the cabinet body has an air inlet and an air outlet connected to the heat dissipation duct. The reactor components, power modules, and heat exchange components are all housed within the heat dissipation duct, and the heat exchange components are thermally connected to the power modules. The power cabinet also includes a cooling fan housed within the heat dissipation duct. By placing the reactor components and power modules in the same heat dissipation duct and installing the heat exchange components within this duct, the heat from the reactor components, power devices, and heat exchange components is cooled by air through the heat dissipation duct. Furthermore, the thermal conductivity of the heat exchange components transfers the heat generated by the power modules, reducing heat accumulation within the power modules and avoiding localized hot spots. This solution improves the heat dissipation efficiency of the power modules, increases the operating efficiency of the power devices, reduces power attenuation, reduces the number of power modules used in the power modules, and further reduces the number of fans required, lowering costs and reducing losses due to fan failure probability, thus lowering the overall cost of the system.

[0024] The converter in this application embodiment includes the power cabinet in the above embodiment. Therefore, it can have all the technical features and effects of the power cabinet described above, which will not be repeated here.

[0025] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0028] Figure 1 This is a schematic diagram of the main structure of the power cabinet according to an embodiment of this application;

[0029] Figure 2 This is a schematic diagram of the left-side structure of the power cabinet according to an embodiment of this application;

[0030] Figure 3 This is a schematic diagram of the left-side structure of a power cabinet according to another embodiment of this application;

[0031] Figure 4 This is a front view structural schematic diagram of a power cabinet according to another embodiment of this application;

[0032] Figure 5 This is a schematic diagram of the left-side structure of a power cabinet according to another embodiment of this application;

[0033] Figure 6 This is a schematic diagram of the left-side structure of a power cabinet according to another embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 10. Cabinet; 20. Reactor assembly; 30. Power module; 40. Heat exchange assembly; 100. Heat dissipation duct; 101. Air inlet; 102. Air outlet; 41. Evaporator; 42. Condenser; 31. Power module; 32. Capacitor cell; X, first direction; Y, second direction; 50. Cooling fan; 11. Partition; 110. Through hole; 103. First chamber; 104. Second chamber. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0037] In the description of this application, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In the description of this application, "multiple" means two or more, and "at least one" can refer to one, two, or more, unless otherwise explicitly specified. The terms "first," "second," and "third," etc., are only for the convenience of description and are used to name parts or embodiments by number, and do not imply any order of importance between the parts or embodiments.

[0038] It should also be noted that in the accompanying drawings of this application, an arrow marked X indicates the first direction, and an arrow marked Y indicates the second direction. The introduction of the first and second directions in this application's description is to more clearly define the structure and relative positional relationships of the components in the power cabinet. In actual implementation, the first direction is generally the vertical direction or the height direction, and the second direction is generally the horizontal direction or the front-back direction. The first and second directions are perpendicular to each other to optimize the power cabinet layout. In the description of this application, "perpendicular" means completely perpendicular to 90° or almost completely perpendicular; for example, an angle between 80° and 100° is considered perpendicular.

[0039] As an introduction to this application, in power electronic equipment, the power cabinet is one of the core cabinets, containing a large number of heat-generating components such as reactors, power modules, and capacitors. These components generate a large amount of heat during operation, and poor heat dissipation will lead to a decline in equipment performance or even damage. Traditional cooling systems generally use multiple fans to cool multiple heat-generating components individually, and the cooling fans are usually located at the air outlet. This cooling airflow design has problems such as low cooling efficiency and short fan life. Moreover, traditional air-cooled heat sinks are difficult to meet the heat dissipation requirements of high-power-density equipment, have a large number of modules, and have high system costs.

[0040] In view of this, embodiments of this application provide a power cabinet, which aims to solve at least one of the above-mentioned technical problems.

[0041] Please see Figure 1 and Figure 2As shown, the power cabinet in this embodiment includes: a cabinet 10, a reactor assembly 20, a power module 30, and a heat exchange assembly 40. The cabinet 10 is provided with a heat dissipation duct 100, and the cabinet 10 is provided with an air inlet 101 and an air outlet 102 that are connected to the heat dissipation duct 100. The reactor assembly 20, the power module 30, and the heat exchange assembly 40 are all disposed in the heat dissipation duct 100, and the heat exchange assembly 40 is thermally connected to the power module 30. The power cabinet also includes a cooling fan 50, which is disposed in the heat dissipation duct 100. It is important to understand that by placing the reactor assembly 20 and the power module 30 in the same heat dissipation duct 100, and installing a heat exchange assembly 40 within this duct, airflow enters from the air inlet 101, flows along the path of the heat dissipation duct 100 through the reactor assembly 20, power devices, and heat exchange assembly 40, and finally dissipates heat through the air outlet 102, achieving air cooling. Furthermore, the thermal conductivity of the heat exchange assembly 40 transfers the heat generated by the power module 30, reducing heat accumulation within the power module 30 and avoiding localized hotspots. This solution employs a combination of direct heat conduction and airflow-assisted cooling, solving the technical problem of low heat dissipation efficiency in the power module 30. Even in high power density scenarios, its temperature can be quickly controlled, reducing the number of fans required, lowering costs, and reducing losses due to fan failure probability. Simultaneously, it improves the operating efficiency of power devices, reduces power attenuation, reduces the number of power modules 31 used in the power module 30, and lowers the overall cost of the system.

[0042] Please see Figure 2 As shown, in some embodiments, the heat exchange assembly 40 includes an evaporator 41 and a condenser 42. The evaporator 41 is attached to the power module 30; the condenser 42 is connected to the evaporator 41; both the evaporator 41 and the condenser 42 are disposed within the heat dissipation duct 100. It should be understood that the heat exchange assembly 40 uses a thermosiphon radiator. The evaporator 41 is attached to the power module 30 to conduct heat generated by the power module 31 within the power module 30. The gaseous working fluid vaporized in the evaporator 41, due to its lower density than the surrounding working fluid, automatically migrates upwards / towards the condenser 42 under the influence of gravity and pressure differences (without pump drive), directly transferring heat to the condenser 42. The entire process has no additional power loss, and the heat transfer speed is much faster than the forced flow of the liquid working fluid. The condenser 42 cools the gaseous working fluid into a liquid state. During the condensation process, the condenser 42 dissipates heat through the airflow within the heat dissipation duct 100, improving heat dissipation efficiency.

[0043] In some embodiments, the condenser 42 is positioned close to the air outlet 102 relative to the power module 30. This arrangement enhances the condensing effect of the condenser 42, ensuring that heat is directly carried away by the airflow about to exit the cabinet 10 (exhausted from the air outlet 102) and does not diffuse back to the upstream power module 30 or reactor, thus guaranteeing the heat dissipation efficiency and uniformity of the heat dissipation duct 100.

[0044] Please see Figure 2 and Figure 3 As shown, in some embodiments, the power module 30 includes a power module 31 and a capacitor bank 32. The power module 31 is attached to the evaporator 41; the capacitor bank 32 is disposed between the power module 31 and the condenser 42. It should be understood that there are multiple power modules 31, and the capacitor bank 32 includes multiple DC capacitors. The power module 31 is the core high heat flux density device of the power cabinet, with high heat dissipation requirements. The contact surface between the evaporator 41 and the power module 31 can cover the heat-generating area. The working fluid absorbs the concentrated heat of the power module 31 instantly through vaporization and directly transfers it to the condenser 42 through thermosiphon circulation, avoiding heat accumulation inside the power module 31, reducing the thermal resistance of the power module 31, and improving the utilization rate of the power module 31. The capacitor bank 32 is a secondary heat-generating device of the power module 30. By placing it between the power module 31 and the condenser 42, the temperature gradient advantage within the heat dissipation duct 100 is utilized to optimize the heat dissipation efficiency of the heat dissipation duct 100, achieving low-cost heat dissipation. The core heat of the power module 31 is directly discharged through the evaporator 41, and only a small amount of heat is diffused to the surrounding area through surface heat dissipation. After the airflow passes through the power module 31, its temperature still meets the heat dissipation requirements of the capacitor pool 32. The capacitor pool 32 does not need to be equipped with an additional heat sink or fan, which greatly simplifies the structure of the power module 30 and reduces hardware costs and installation complexity.

[0045] It should be understood that when the capacitor bank 32 is located between the power module 31 and the condenser 42, that is, when the capacitor bank 32 and the power module 31 are arranged along the first direction X, the power module 31, the evaporator 41, and the capacitor bank 32 form a single integrated structure. Multiple sets of the above integrated structures can be arranged inside the cabinet 10, and they are arranged along a direction perpendicular to the first direction X.

[0046] Please see Figure 4 and Figure 5As shown, in some embodiments, the power module 30 includes a power module 31 and a capacitor bank 32. The power module 31 is attached to the evaporator 41, and the evaporator 41 and the condenser 42 are arranged along a first direction X. The capacitor bank 32 is disposed on one side of the power module 31 in a second direction Y, which intersects with the first direction X. It should be understood that by arranging the power module 31 and the capacitor bank 32 along the second direction Y, the space of the cabinet 10 in the second direction Y is utilized, the devices are avoided from clustering in the first direction X, the size of the cabinet 10 in the first direction X is reduced, and the length of the heat dissipation duct 100 is shortened, thereby improving heat dissipation efficiency. The evaporator 41 is directly attached to the power module 31, and the two form the shortest thermosiphon path with the condenser 42 along the first direction X. The gaseous working fluid can quickly reach the condenser 42 without bypassing the capacitor bank 32, avoiding the delay in working fluid migration and the decrease in heat dissipation efficiency caused by the extended path. The capacitor bank 32 is located in the second direction Y and does not block the airflow through the air duct of the power module 31. The low-temperature airflow from the air inlet 101 can simultaneously and directly blow on the power module 31 and the capacitor bank 32, thereby removing the heat from the capacitor bank 32 and the power module 31. There is no need to configure an additional heat sink or fan, which satisfies the heat dissipation requirements of the capacitor bank 32 and avoids the increase in cost and energy consumption caused by active cooling.

[0047] It is important to understand that when the capacitor bank 32 is located on one side of the power module 31 in the second direction Y, the power module 31 and the capacitor bank 32 have a separate structure, which can reduce the weight of the core components and facilitate operation and maintenance. Multiple power modules 31 can share a single capacitor bank 32, reducing the number of DC capacitors and lowering costs.

[0048] It should be noted that the power module 31 and the capacitor bank 32 are arranged along the first direction X or the second direction Y. The projection of the condenser 42 on the horizontal plane completely covers the projection of the capacitor bank, the evaporator 41, the power module 31 and other auxiliary components on the horizontal plane, ensuring that the area of ​​the condenser 42 is maximized, improving heat dissipation efficiency, increasing the utilization rate of the power module 31, and thus reducing the number of power modules 31.

[0049] Please see Figure 2 , Figure 3 , Figure 5 and Figure 6As shown, in some embodiments, the reactor assembly 20 is positioned near the air inlet 101 relative to the power module 30. It should be understood that the reactor has relatively low heat generation power, a large volume, a wide heat dissipation area, and slightly higher temperature tolerance. Placing the reactor near the air inlet 101 / upstream of the power module 30 utilizes the lowest-temperature airflow within the duct, achieving low-cost, high-efficiency targeted heat dissipation. The power module 30 (especially the power module 31) is the core sensitive component of the power cabinet, with high heat generation power and high heat flux density. By placing the power device in the middle to rear section of the heat dissipation duct 100, the airflow, after initial heat dissipation by the reactor, still maintains a low temperature and can directly act on the power module 30, creating an airflow environment with an orderly increasing temperature gradient and reducing the risk of reverse heat accumulation.

[0050] Please see Figure 3 and Figure 6 As shown, in some embodiments, the cooling fan 50 is located at the air inlet 101. It is important to understand that placing the fan at the air inlet 101 actively introduces low-temperature air from the airflow source, providing basic power for the cooling duct 100, which is particularly suitable for high-power cabinets with long ducts and many components. The cooling fan 50 operates in a normal temperature environment, away from high-temperature and high-load areas, slowing down motor aging, extending its service life, and solving the maintenance pain point of frequent failures of traditional fans. The cooling fan 50 directly and actively blows ambient temperature air into the cooling duct 100, and the airflow immediately flows through the upstream reactor assembly 20, ensuring the cooling efficiency of the upstream components. The cooling fan 50 actively draws air into the cabinet 10, providing a stable airflow foundation for downstream components and ensuring airflow power at the end of the cooling duct 100.

[0051] Please see Figure 2 and Figure 5 As shown, in some embodiments, the cooling fan 50 is positioned between the reactor assembly 20 and the power module 30. It should be understood that the reactor assembly 20 generates relatively little heat; after the airflow passes through it, its temperature remains low, thus ensuring that the cooling fan 50 maintains a low ambient temperature and extends its service life. After passing through the reactor assembly 20, the airflow experiences kinetic energy attenuation due to passing through the reactor gaps. By placing the cooling fan 50 between the reactor assembly 20 and the power module 30, the attenuated airflow can be precisely pressurized to increase the airflow velocity in the latter half of the cooling duct 100, thereby improving heat dissipation efficiency. On the other hand, the reactor assembly 20 is relatively large, and the airflow is prone to forming turbulent eddies after passing through it. By setting a cooling fan 50 between the reactor assembly 20 and the power module 30, the turbulent airflow can be guided, the airflow coverage of the power module 30 can be improved, local hot spots of the power module 31 such as the corners of the power module 31 can be avoided, the heat dissipation efficiency of the power module 31 can be optimized, the utilization rate of the power module 31 can be improved, and the service life of the power module 31 can be extended.

[0052] Please see Figure 2 , Figure 3 , Figure 5 and Figure 6 As shown, in some embodiments, the cabinet 10 is provided with a partition 11, and the partition 11 has a through hole 110. The partition 11 is used to divide the internal space of the cabinet 10 into a first chamber 103 and a second chamber 104 that are connected. The air inlet 101 is provided on the side wall of the first chamber 103, and the air outlet 102 is provided on the side wall of the second chamber 104. It should be understood that by providing a partition 11 in the cabinet 10 and connecting the first chamber 103 and the second chamber 104 through the through hole 110, the airflow enters the first chamber 103 through the air inlet 101, then enters the second chamber 104 through the through hole 110, and finally exits through the air outlet 102, forming a unique path of air inlet 101 → first chamber 103 → through hole 110 → second chamber 104 → air outlet 102. The position of the through hole 110 corresponds to the gap between the reactor and the power module 30. When the airflow passes through the through hole 110, it is focused and flows directly to the core heat-generating components of the second chamber 104, such as the power module 31 and the thermosiphon condenser 42, avoiding airflow dispersion and waste. The space between the first chamber 103 and the second chamber 104 is defined by the partition 11, and there is no space for disorderly airflow diffusion. Vortexes may only be generated in a small area inside the chamber (such as around the reactor), but after passing through the through hole 110, they will be reoriented and sorted, improving the effective utilization rate of airflow and thus improving heat dissipation efficiency.

[0053] It is also important to understand that the first chamber 103 is directly connected to the external air inlet 101. The airflow temperature is low, but it may carry dust and impurities. The space is relatively independent, making it suitable for arranging devices that are highly temperature tolerant and insensitive to dust, such as reactor components 20.

[0054] Please see Figure 2 , Figure 3 , Figure 5 and Figure 6As shown, in some embodiments, the reactor assembly 20 is housed in the first chamber 103, and the power module 30 and heat exchange assembly 40 are housed in the second chamber 104. It should be understood that the second chamber 104 receives airflow that has been preliminarily filtered by the first chamber 103 and has not been overheated through a through-hole 110, and is directly connected to the air outlet 102. This is suitable for accommodating high-heat-flux, highly sensitive, and dust-sensitive core components, such as the power module 30 and thermosiphon radiators. By setting the partition 11, graded dust prevention is achieved, protecting the core components from dust corrosion. Simultaneously, the partition 11 also serves as an isolation layer, reducing interference from the reactor assembly 20 to the power module 30. Furthermore, the partition 11 can reduce heat conduction between the first chamber 103 and the second chamber 104, ensuring that the temperature gradients of the first chamber 103 and the second chamber 104 are independently controllable.

[0055] Please see Figure 2 , Figure 3 , Figure 5 and Figure 6 As shown, in some embodiments, the air inlet 101 is located below the air outlet 102. It should be understood that, utilizing the characteristics of low-temperature air (high density, prone to sinking) and high-temperature air (low density, prone to rising), and taking advantage of the temperature gradient within the heat dissipation duct 100, low-temperature air naturally enters from the lower air inlet 101, flows through the reactor and power module 30, becomes high-temperature air, and naturally rises along the upper part of the cabinet 10 to the air outlet 102 for discharge. Positioning the air inlet 101 on the bottom side wall of the power cabinet reduces the fan load, while positioning the air outlet 102 on the top side wall or top wall of the power cabinet accelerates the discharge of hot air from the outlet 102, improving overall airflow power, reducing fan energy consumption and wear rate, extending lifespan, and lowering maintenance costs. The air outlet 102 is located at the top of the cabinet 10. The high-temperature air discharged will naturally diffuse upward due to its low density, away from the air inlet 101 below. This ensures that the air inlet 101 draws in the normal-temperature air below the cabinet 10. The two are vertically isolated in space, with no airflow intersection path, blocking the hot air recirculation and ensuring heat dissipation efficiency.

[0056] In some embodiments, the air inlet 101 is located at the bottom of the cabinet 10, and the air outlet 102 is located at the top of the cabinet 10.

[0057] In some embodiments, the air inlet 101 and the air outlet 102 are located on different sides of the cabinet 10, or they may be located on the same side of the cabinet 10. Please refer to [link / reference]. Figure 2 , Figure 3 , Figure 5 and Figure 6As shown, it is important to understand that by placing the air inlet 101 and the air outlet 102 on different sides of the cabinet 10, a forced airflow is formed through a continuous path, ensuring that the airflow path covers the three major heat sources: the capacitor bank 32, the power module 31, and the reactor. Simultaneously, it ensures that the gas within the heat dissipation duct 100 is ambient temperature air, reducing the risk of hot air exhausted from the air outlet 102 circulating within the heat dissipation duct 100 and improving heat dissipation efficiency.

[0058] In some embodiments, the cabinet 10 is provided with an air duct enclosure to ensure that the airflow trajectory follows a predetermined direction and flows sequentially through the reactor assembly 20, power module 31, capacitor bank 32, evaporator 41 and condenser 42.

[0059] This application also discloses a converter, including the power cabinet in the above embodiments. Therefore, it can possess all the technical features and effects of the power cabinet described above, and will not be repeated here.

[0060] In the above embodiments, the descriptions of each embodiment have their own emphasis. Parts not described in detail in a particular embodiment can be referred to in the relevant descriptions of other embodiments. The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0061] The power cabinet and converter provided in the embodiments of this application have been described in detail above, and specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A power cabinet, characterized in that, include: The cabinet (10), reactor assembly (20), power module (30) and heat exchange assembly (40) are provided. The cabinet (10) is provided with a heat dissipation duct (100). The cabinet (10) is provided with an air inlet (101) and an air outlet (102) connected to the heat dissipation duct (100). The reactor assembly (20), the power module (30) and the heat exchange assembly (40) are all located in the heat dissipation duct (100). The heat exchange assembly (40) is thermally connected to the power module (30). The power cabinet also includes a cooling fan (50), which is disposed within the cooling duct (100).

2. The power cabinet according to claim 1, characterized in that, The heat exchange assembly (40) includes: Evaporator (41), which is attached to the power module (30); A condenser (42) is connected to the evaporator (41); Both the evaporator (41) and the condenser (42) are located within the heat dissipation duct (100).

3. The power cabinet according to claim 2, characterized in that, The condenser (42) is positioned relative to the power module (30) close to the air outlet (102).

4. The power cabinet according to claim 2, characterized in that, The power module (30) includes: A power module (31) is attached to the evaporator (41); A capacitor bank (32) is disposed between the power module (31) and the condenser (42).

5. The power cabinet according to claim 2, characterized in that, The power module (30) includes: A power module (31) is attached to the evaporator (41), and the evaporator (41) and the condenser (42) are arranged along a first direction (X); A capacitor bank (32) is disposed on one side of the power module (31) in a second direction (Y), which intersects the first direction (X).

6. The power cabinet according to claim 1, characterized in that, The reactor assembly (20) is positioned relative to the power module (30) and close to the air inlet (101).

7. The power cabinet according to claim 1, characterized in that, The cooling fan (50) is located at the air inlet (101), or the cooling fan (50) is located between the reactor assembly (20) and the power module (30).

8. The power cabinet according to claim 1, characterized in that, The cabinet (10) is provided with a partition (11), and the partition (11) is provided with a through hole (110). The partition (11) is used to divide the internal space of the cabinet (10) into a first chamber (103) and a second chamber (104) that are connected. The air inlet (101) is provided on the side wall of the first chamber (103), and the air outlet (102) is provided on the side wall of the second chamber (104).

9. The power cabinet according to claim 8, characterized in that, The reactor assembly (20) is housed in the first chamber (103), and the power module (30) and the heat exchange assembly (40) are housed in the second chamber (104).

10. A converter, characterized in that, The power cabinet includes any one of claims 1 to 9.

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