A power cabinet and a converter

Abstract

The application discloses a power cabinet and a converter, and belongs to the technical field of power electronic devices. The power cabinet in the application comprises a cabinet body, a reactor assembly, a power module and a heat exchange assembly. The inside of the cabinet body is provided with a first air duct and a second air duct which are independent of each other. The reactor assembly is arranged in the first air duct. The power module is arranged in the first air duct. The heat exchange assembly comprises an evaporator and a condenser which are connected in communication. The evaporator is arranged in the first air duct and is attached to the power module. The condenser is arranged in the second air duct. The power cabinet further comprises a first fan and a second fan. The first fan is arranged in the first air duct. The second fan is arranged in the second air duct. The first air duct is used for air cooling and heat dissipation of the reactor assembly, the power module and the evaporator. The heat exchange assembly is used for conducting the heat generated by the power module to the second air duct, thereby realizing independent heat dissipation of the power module, double heat dissipation of core heat generating devices and improvement of heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of power electronic equipment technology, and in particular to a power cabinet and converter. Background Technology

[0002] In power electronic equipment, the power cabinet is one of the core cabinets, containing a large number of heat-generating components that generate significant heat during operation. However, traditional heat dissipation methods are insufficient to meet the heat dissipation requirements of high-power-density equipment. Utility Model Content

[0003] This application provides a power cabinet to solve the technical problem that traditional heat dissipation methods are difficult to meet heat dissipation requirements; this application also provides a converter.

[0004] The power cabinet in this embodiment of the technical solution includes:

[0005] The cabinet has an internal first air duct and a second air duct that are independent of each other.

[0006] A reactor assembly, wherein the reactor assembly is disposed in the first air duct;

[0007] A power module, wherein the power module is disposed in the first air duct;

[0008] A heat exchange assembly, comprising an evaporator and a condenser connected in communication, wherein the evaporator is disposed in the first air duct and is in contact with the power module, and the condenser is disposed in the second air duct;

[0009] The power cabinet also includes a first fan and a second fan, with the first fan disposed in the first air duct and the second fan disposed in the second air duct.

[0010] In some embodiments, the power module includes:

[0011] A power module, which is attached to the evaporator;

[0012] A capacitor bank is located between the power module and the condenser.

[0013] In some embodiments, the power module includes:

[0014] A power module is attached to the evaporator, and the evaporator and the condenser are arranged along a first direction;

[0015] A capacitor bank is disposed on one side of the power module in a second direction, which intersects with the first direction.

[0016] In some embodiments, the cabinet is provided with a first air inlet and a first air outlet, and both the first air inlet and the first air outlet are connected to the first air duct.

[0017] One of the first air inlet and the first air outlet is disposed opposite to the reactor assembly, and the other is disposed opposite to the capacitor bank.

[0018] In some embodiments, the cabinet is provided with a first air inlet and a first air outlet, and both the first air inlet and the first air outlet are connected to the first air duct.

[0019] The first air inlet is located on the side of the capacitor bank away from the power module, and the first air outlet is located opposite to the reactor assembly.

[0020] Alternatively, the first air outlet is located on the side of the power module away from the capacitor bank, and the first air inlet is located opposite to the reactor assembly.

[0021] In some embodiments, the first air inlet and the first air outlet are located on different sides of the cabinet.

[0022] In some embodiments, the first fan is disposed in the first air duct and located between the power module and the reactor assembly.

[0023] In some embodiments, the cabinet is provided with a second air inlet and a second air outlet, and both the second air inlet and the second air outlet are connected to the second air duct.

[0024] The second air inlet and the second air outlet are located on opposite sides of the cabinet, or the second air outlet and the second air inlet are located on different sides of the cabinet, and the second air inlet is located on the top of the cabinet.

[0025] In some embodiments, the second fan is disposed at the second air inlet.

[0026] This application also discloses a converter, including the power cabinet in the above embodiments.

[0027] Beneficial Effects: The power cabinet in this embodiment includes: a cabinet body, a reactor assembly, a power module, and a heat exchange assembly. The cabinet body has independent first and second air ducts. The reactor assembly is disposed in the first air duct. The power module is disposed in the first air duct. The heat exchange assembly includes a connected evaporator and a condenser. The evaporator is disposed in the first air duct and is in contact with the power module. The condenser is disposed in the second air duct. The power cabinet also includes a first fan and a second fan. The first fan is disposed in the first air duct, and the second fan is disposed in the second air duct. The first air duct achieves air cooling for the reactor assembly, power module, and evaporator. The heat exchange assembly conducts the heat generated by the power module to the second air duct to achieve independent heat dissipation for the power module, thereby achieving dual heat dissipation for the core heat-generating components and improving heat dissipation efficiency. The dual independent air duct design enables precise heat dissipation for different heat-generating components, ensuring the heat exchange capacity of the condenser. This meets the long-term stable heat dissipation requirements of high power density equipment, improves the working efficiency of the power module, reduces power attenuation, reduces the number of power modules used in the power module, and lowers costs.

[0028] This application also discloses a converter, including the power cabinet in the above embodiments. Therefore, it can possess all the technical features and effects of the power cabinet described above, and will not be repeated here.

[0029] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0032] Figure 1 This is a schematic diagram of the main structure of the power cabinet according to an embodiment of this application;

[0033] Figure 2 This is a left-side view of the power cabinet according to an embodiment of this application, showing the first air duct and the second air duct.

[0034] Figure 3 This is a schematic diagram of the left-side structure of a power cabinet according to another embodiment of this application;

[0035] Figure 4This is a front view structural schematic diagram of a power cabinet according to another embodiment of this application;

[0036] Figure 5 This is a schematic diagram of the left-side structure of a power cabinet according to another embodiment of this application;

[0037] Figure 6 This is a schematic diagram of the left-side structure of a power cabinet according to another embodiment of this application;

[0038] Figure 7 This is a schematic diagram of the left-side structure of a power cabinet according to another embodiment of this application.

[0039] Explanation of reference numerals in the attached figures:

[0040] 10. Cabinet; 11. First air duct; 12. Second air duct; 20. Reactor assembly; 30. Power module; 40. Heat exchange assembly; 41. Evaporator; 42. Condenser; 31. Power module; 32. Capacitor cell; X, First direction; Y, Second direction; 111. First air inlet; 112. First air outlet; 51. First fan; 121. Second air inlet; 122. Second air outlet; 52. Second fan. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0042] In the description of this application, it should be understood that the terms "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In the description of this application, "multiple" means two or more, and "at least one" can refer to one, two, or more, unless otherwise explicitly specified. The terms "first," "second," and "third," etc., are only for the convenience of description and are used to name parts or embodiments by number, and do not imply any order of importance between the parts or embodiments.

[0043] It should also be noted that in the accompanying drawings of this application, an arrow marked X indicates the first direction, and an arrow marked Y indicates the second direction. The introduction of the first and second directions in this application's description is to more clearly define the structure and relative positional relationships of the components in the power cabinet. In actual implementation, the first direction is generally the vertical direction or the height direction, and the second direction is generally the horizontal direction. The first and second directions are perpendicular to each other to optimize the power cabinet layout. In the description of this application, "perpendicular" means completely perpendicular to 90° or almost completely perpendicular; for example, an angle between 80° and 100° is considered perpendicular.

[0044] As an introduction to this application, in power electronic equipment, the power cabinet is one of the core cabinets, containing a large number of heat-generating components such as reactors, power modules, and capacitors. These components generate a large amount of heat during operation, and poor heat dissipation will lead to a decline in equipment performance or even damage. Traditional cooling systems generally use multiple fans to cool multiple heat-generating components individually, and the cooling fans are usually located at the air outlet. This cooling airflow design has problems such as low cooling efficiency and short fan life. Moreover, traditional air-cooled heat sinks are difficult to meet the heat dissipation requirements of high-power-density equipment, have a large number of modules, and have high system costs.

[0045] In view of this, embodiments of this application provide a power cabinet, which aims to solve at least one of the above-mentioned technical problems.

[0046] Please see Figure 1 and Figure 2As shown, the power cabinet in this embodiment includes: a cabinet 10, a reactor assembly 20, a power module 30, and a heat exchange assembly 40. The cabinet 10 has an independent first air duct 11 and a second air duct 12 inside. The reactor assembly 20 is disposed in the first air duct 11. The power module 30 is disposed in the first air duct 11. The heat exchange assembly 40 includes an evaporator 41 and a condenser 42 that are connected to each other. The evaporator 41 is disposed in the first air duct 11 and is attached to the power module 30. The condenser 42 is disposed in the second air duct 12. The power cabinet also includes a first fan 51 and a second fan 52. The first fan 51 is disposed in the first air duct 11, and the second fan 52 is disposed in the second air duct 12. It is important to understand that by placing the reactor assembly 20, power module 30, and evaporator 41 in the heat exchange assembly 40 within the first air duct 11, the airflow path within the first air duct 11 covers the reactor assembly 20, power devices, and evaporator 41, achieving air-cooled heat dissipation. Simultaneously, the evaporator 41 conducts heat from the power module 30, achieving dual heat dissipation for the core heat-generating components and improving heat dissipation efficiency. The condenser 42, as the heat release end, is separately arranged in the second air duct 12, without sharing heat dissipation space with the heat source in the first air duct 11. Even if the heat load within the first air duct 11 is high, the airflow in the second air duct 12 can still undisturbedly expel the heat from the condenser 42, ensuring the continuous and efficient operation of the heat exchange cycle of evaporator 41 absorbing heat and condenser 42 releasing heat. The dual independent air duct design enables precise heat dissipation for different heat-generating components, ensuring the heat exchange capacity of the condenser 42. This meets the long-term stable heat dissipation requirements of high power density equipment, improves the working efficiency of power devices, reduces power attenuation, reduces the number of power modules 31 used in the power module 30, and lowers costs.

[0047] It is important to understand that the heat exchange component 40 employs a thermosiphon radiator, which is attached to the power module 30 via the evaporator 41 to conduct heat generated by the power module 31 within the power module 30. The gaseous working fluid, vaporized within the evaporator 41, has a lower density than the surrounding working fluid and will automatically migrate upwards / towards the condenser 42 under the influence of gravity and pressure differences (without requiring a pump), directly transferring heat to the condenser 42. The entire process involves no additional power loss, and the heat transfer speed is much faster than the forced flow of liquid working fluid. The condenser 42 cools the gaseous working fluid into a liquid state, and during condensation, the condenser 42 dissipates heat through the airflow within the second air duct 12.

[0048] Please see Figure 2As shown, in some embodiments, the power module 30 includes a power module 31 and a capacitor bank 32. The power module 31 is attached to the evaporator 41; the capacitor bank 32 is located between the power module 31 and the condenser 42. It should be understood that the heating intensity of different components in the power module 30 varies significantly: the power module 31 includes multiple power modules 31, which are core high heat flux density devices with high heat dissipation requirements; while the capacitor bank 32 includes multiple DC capacitors with lower heat generation. The contact surface between the evaporator 41 and the power module 31 can cover the heating area. The working fluid absorbs the concentrated heat from the power module 31 instantly through vaporization and directly transfers it to the condenser 42 through a thermosiphon cycle, preventing heat accumulation inside the power module 31, reducing the thermal resistance of the power module 31, and improving the utilization rate of the power module 31. The capacitor bank 32 is a secondary heating device in the power module 30. By placing it between the power module 31 and the condenser 42, the temperature gradient advantage within the air duct is utilized to optimize the heat dissipation efficiency of the first air duct 11, achieving low-cost heat dissipation. The core heat of the power module 31 is directly discharged through the evaporator 41, and only a small amount of heat is diffused to the surrounding area through surface heat dissipation. After the airflow passes through the power module 31, its temperature still meets the heat dissipation requirements of the capacitor pool 32. The capacitor pool 32 does not need to be equipped with an additional heat sink or fan, which greatly simplifies the structure of the power module 30 and reduces hardware costs and installation complexity.

[0049] It should be understood that when the capacitor bank 32 is located between the power module 31 and the condenser 42, that is, when the capacitor bank 32 and the power module 31 are arranged along the first direction X, the power module 31, the evaporator 41, and the capacitor bank 32 form a single integrated structure. Multiple sets of the above integrated structures can be arranged inside the cabinet 10, and they are arranged along a direction perpendicular to the first direction X.

[0050] Please see Figure 4 and Figure 5As shown, in some embodiments, the power module 30 includes a power module 31 and a capacitor bank 32. The power module 31 is attached to the evaporator 41, and the evaporator 41 and condenser 42 are arranged along a first direction X. The capacitor bank 32 is disposed on one side of the power module 31 in a second direction Y, which intersects with the first direction X. It should be understood that by arranging the power module 31 and the capacitor bank 32 along the second direction Y, the space of the cabinet 10 in the second direction Y is utilized, avoiding the clustering of devices in the first direction X, reducing the size of the cabinet 10 in the first direction X, and shortening the length of the first air duct 11, thereby improving heat dissipation efficiency. The evaporator 41 and the power module 31 are directly attached, and the two form the shortest thermosiphon path with the condenser 42 along the first direction X. The gaseous working fluid can quickly reach the condenser 42 without bypassing the capacitor bank 32, avoiding the working fluid migration delay and heat dissipation efficiency reduction caused by the extended path. The capacitor bank 32 is located in the second direction Y and does not block the airflow through the power module 31. The low-temperature airflow from the air inlet can simultaneously and directly blow on the power module 31 and the capacitor bank 32, thereby removing the heat from the capacitor bank 32 and the power module 31. There is no need to configure an additional heat sink or fan, which satisfies the heat dissipation requirements of the capacitor bank 32 and avoids the increased cost and energy consumption caused by active cooling.

[0051] It is important to understand that when the capacitor bank 32 is located on one side of the power module 31 in the second direction Y, the power module 31 and the capacitor bank 32 have a separate structure, which can reduce the weight of the core components and facilitate operation and maintenance. Multiple power modules 31 can share a single capacitor bank 32, reducing the number of DC capacitors and lowering costs.

[0052] It should be noted that the power module 31 and the capacitor bank 32 are arranged along the first direction X or the second direction Y. The projection of the condenser 42 on the horizontal plane completely covers the projection of the capacitor bank, the evaporator 41, the power module 31 and other auxiliary components on the horizontal plane, ensuring that the area of ​​the condenser 42 is maximized, improving heat dissipation efficiency, increasing the utilization rate of the power module 31, and thus reducing the number of power modules 31.

[0053] Please see Figure 2 and Figure 3As shown, in some embodiments, the cabinet 10 has a first air inlet 111 and a first air outlet 112, both of which are connected to the first air duct 11. One of the first air inlet 111 and the first air outlet 112 is positioned opposite to the reactor assembly 20, and the other is positioned opposite to the capacitor bank 32. It should be understood that by setting the positions of the first air inlet 111 and the first air outlet 112, the airflow path within the first air duct 11 is restricted to: from the air duct inlet → reactor assembly 20 → capacitor bank 32 → power module 31 → evaporator 41 → air duct outlet; or, from the air duct inlet → evaporator 41 → power module 31 → capacitor bank 32 → reactor assembly 20 → air duct outlet. This path design ensures that the airflow passes through all three heat sources within the first air duct 11 without omission: the reactor assembly 20, the power module 31, and the capacitor bank 32. The reactor assembly 20 is characterized by its large size and wide heat dissipation area, while the capacitor pool 32 adopts a modular layout, which makes it easy to trap heat. The bottom of the reactor and the gap between the capacitor pool 32 often have higher temperatures than the surrounding area due to insufficient airflow. By pointing the air inlet and outlet at a heat-generating device respectively, the airflow can completely cover the heat-generating area of ​​the device, reducing the risk of local heat accumulation.

[0054] Within the first air duct 11, the heat dissipation requirements of the reactor assembly 20 and the capacitor bank 32 differ significantly. If the first air inlet 111 is directed towards the reactor assembly 20 and the first air outlet 112 towards the capacitor bank 32, fresh, cool air will directly cool the reactor assembly 20 first, rapidly carrying away a large amount of heat and preventing the reactor assembly 20 from overheating and radiating heat to the surrounding area. Although the airflow passing through the reactor will increase in temperature, the capacitor bank 32 generates less heat, thus still meeting its heat dissipation requirements. Simultaneously, the gentle airflow will not cause temperature fluctuations in the capacitor bank 32, balancing its temperature control and stability requirements. This mode is suitable for scenarios where the reactor assembly 20 generates a high proportion of heat, such as industrial converter power cabinets. If the first air inlet 111 is aligned with the capacitor bank 32 and the first air outlet 112 is aligned with the reactor assembly 20, fresh, cold air first flows through the capacitor bank 32, maintaining a stable temperature at a low flow rate to prevent it from being affected by subsequent heat sources. The airflow then flows to the power module 31 and the reactor assembly 20. Although the airflow temperature rises slightly at this point, the reactor assembly 20 requires a large flow rate for heat dissipation, effectively carrying away its heat. Furthermore, the reactor assembly 20 is not sensitive to temperature fluctuations and its performance will not be affected. This mode is suitable for scenarios where the reliability of the capacitor bank 32 is critical, such as power cabinets in new energy vehicles.

[0055] When the capacitor bank 32 is located between the power module 31 and the condenser 42, the first air inlet 111 and the first air outlet 112 can be located on the same side or different sides of the cabinet 10.

[0056] Please see Figure 6As shown, in some embodiments, the cabinet 10 has a first air inlet 111 and a first air outlet 112, both of which are connected to the first air duct 11. The first air inlet 111 is located on the side of the capacitor bank 32 away from the power module 31, and the first air outlet 112 is located opposite to the reactor assembly 20. It should be understood that when the capacitor bank 32 is arranged along the second direction Y on one side of the power module 31, by setting the first air inlet 111 on the side of the capacitor bank 32 away from the power module 31, the ambient temperature airflow preferentially cools the low-heat sensitive device (capacitor bank 32), and then sequentially cools the high-heat device, forming a heat dissipation logic with increasing temperature gradient, thus avoiding heat accumulation.

[0057] Please see Figure 6 As shown, in some embodiments, the first air outlet 112 is located on the side of the power module 31 away from the capacitor bank 32, and the first air inlet 111 is located opposite to the reactor assembly 20. It should be understood that when the capacitor bank 32 is arranged along the second direction Y on one side of the power module 31, by setting the first air outlet 112 on the side of the power module 31 away from the capacitor bank 32, the ambient temperature airflow preferentially cools the reactor assembly 20, then cools the capacitor bank 32, and finally flows through the power module 31. By preferentially cooling the reactor assembly 20, the ambient temperature is reduced, alleviating the heat dissipation load on the evaporator 41; secondly, by cooling sensitive components, the stability of the capacitor bank 32 is ensured; finally, the heated airflow is discharged through the air outlet, no longer passing through the capacitor bank 32 area, and the capacitor bank 32 is only affected by a small amount of ambient heat dissipation, with no temperature fluctuations caused by airflow disturbance, further extending its lifespan.

[0058] Please see Figure 5 and Figure 6 As shown, in some embodiments, the first air inlet 111 and the first air outlet 112 are located on different sides of the cabinet 10. It should be understood that by placing the first air inlet 111 and the first air outlet 112 on different sides of the cabinet 10, a forced airflow is formed through a continuous path, ensuring that the airflow path covers the three major heat sources: the capacitor bank 32, the power module 31, and the reactor. Simultaneously, it ensures that the gas in the first air duct 11 is ambient temperature air, reducing the risk of hot air from the air outlet circulating within the first air duct 11 and improving heat dissipation efficiency.

[0059] Please see Figure 2 , Figure 3 , Figure 5 , Figure 6 and Figure 7As shown, in some embodiments, the first fan 51 is disposed in the first air duct 11 and located between the power module 30 and the reactor assembly 20. It should be understood that the reactor assembly 20 generates relatively little heat; after the airflow passes through the reactor assembly 20, its temperature remains at a low level, thus ensuring that the first fan 51 maintains a low ambient temperature and extends its service life. After the airflow passes through the reactor assembly 20, its kinetic energy is attenuated due to passing through the reactor gap. By placing a cooling fan between the reactor assembly 20 and the power module 30, the attenuated airflow can be precisely pressurized to increase the airflow velocity in the latter half of the first air duct 11, thereby improving heat dissipation efficiency. On the other hand, the reactor assembly 20 is relatively large, and the airflow is prone to forming turbulent eddies after passing through it. By setting a first fan 51 between the reactor assembly 20 and the power module 30, the turbulent airflow is guided, the coverage of the airflow on the surface of the power module 30 is improved, local hot spots of the power module 31, such as the corners of the power module 31 are avoided, the heat dissipation efficiency of the power module 31 is optimized, the utilization rate of the power module 31 is improved, and the service life of the power module 31 is extended.

[0060] Please see Figure 2 , Figure 3 , Figure 5 , Figure 6 As shown, in some embodiments, the cabinet 10 is provided with a second air inlet 121 and a second air outlet 122, both of which are connected to the second air duct 12. The second air inlet 121 and the second air outlet 122 are located on opposite sides of the cabinet 10. It should be understood that by arranging the second air inlet 121 and the second air outlet 122 on opposite sides, it is ensured that the second air inlet 121 draws in ambient temperature air, while hot air can be directly discharged from the cabinet 10 through the second air outlet 122 on the opposite side, without being re-drawn in by the second air inlet 121. A stable circulation of ambient temperature air in and hot air out is maintained at all times; there is no accumulation of hot air around the condenser 42, ensuring the continuous and stable operation of the heat exchange component 40. The arrangement on opposite sides makes the airflow path within the second air duct 12 nearly straight, without turns or detours, resulting in low airflow resistance and controllable fan energy consumption and noise.

[0061] Please see Figure 5 , Figure 6 and Figure 7 As shown in some embodiments, the first air outlet 112 and the second air outlet 122 are arranged on the same side of the cabinet 10, and the first air inlet 111 and the second air inlet 121 are arranged on the same side of the cabinet 10. The above arrangement ensures that the hot air discharged from the first air duct 11 or the second air duct 12 will not flow back into the other air duct, ensuring reliable heat dissipation of the first air duct 11 and the second air duct 12.

[0062] Please refer to the figure. Figure 7As shown, in some embodiments, the cabinet 10 has a second air inlet 121 and a second air outlet 122. The second air outlet 122 and the second air inlet 121 are located on different sides of the cabinet 10, and the second air inlet 121 is located on the top of the cabinet 10. It should be understood that the top of the cabinet 10 typically has a lower temperature and less dust environment compared to the sides or bottom. Top air intake avoids interference from ground heat sources, and opposite-side air outlets avoid hot air recirculation, providing stable heat dissipation redundancy for high power density scenarios and ensuring efficient operation of the phase change heat exchange cycle.

[0063] Please see Figure 5 and Figure 6 As shown, in some embodiments, the second fan 52 is located at the second air inlet 121. It should be understood that by placing the second fan 52 at the top second air inlet 121, the air intake can be actively enhanced, actively introducing low-temperature air from the airflow source to provide basic power for the air duct, especially suitable for high-power cabinets with long air ducts and many components. The second fan 52 operates in a normal temperature environment, away from high-temperature and high-load areas, slowing down motor aging, extending service life, and solving the maintenance pain point of frequent failures of traditional fans. It should be understood that when the second fan 52 is located at the top of the cabinet 10, the air inlet of the second fan 52 is located away from the second air outlet 122.

[0064] In some embodiments, the cabinet 10 is provided with an air duct enclosure to ensure that the airflow trajectory of the first air duct 11 flows through the reactor assembly 20, power module 31, evaporator 41 and capacitor pool 32 in a predetermined direction, or the path is reversed.

[0065] This application also discloses a converter, including the power cabinet in the above embodiments. Therefore, it can possess all the technical features and effects of the power cabinet described above, and will not be repeated here.

[0066] In the above embodiments, the descriptions of each embodiment have their own emphasis. Parts not described in detail in a particular embodiment can be referred to in the relevant descriptions of other embodiments. The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0067] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A power cabinet, characterized in that, include: Cabinet (10), the cabinet (10) is provided with a first air duct (11) and a second air duct (12) that are independent of each other; A reactor assembly (20) is disposed in the first air duct (11); A power module (30) is disposed in the first air duct (11); A heat exchange assembly (40) includes an evaporator (41) and a condenser (42) connected in communication. The evaporator (41) is disposed in the first air duct (11) and is in contact with the power module (30). The condenser (42) is disposed in the second air duct (12). The power cabinet also includes a first fan (51) and a second fan (52), the first fan (51) being disposed in the first air duct (11) and the second fan (52) being disposed in the second air duct (12).

2. The power cabinet according to claim 1, characterized in that, The power module (30) includes: A power module (31) is attached to the evaporator (41); A capacitor bank (32) is located between the power module (31) and the condenser (42).

3. The power cabinet according to claim 1, characterized in that, The power module (30) includes: A power module (31) is attached to the evaporator (41), and the evaporator (41) and the condenser (42) are arranged along a first direction (X); A capacitor bank (32) is disposed on one side of the power module (31) in a second direction (Y), which intersects the first direction (X).

4. The power cabinet according to claim 2, characterized in that, The cabinet (10) is provided with a first air inlet (111) and a first air outlet (112), and the first air inlet (111) and the first air outlet (112) are both connected to the first air duct (11); One of the first air inlet (111) and the first air outlet (112) is disposed opposite to the reactor assembly (20), and the other is disposed opposite to the capacitor bank (32).

5. The power cabinet according to claim 3, characterized in that, The cabinet (10) is provided with a first air inlet (111) and a first air outlet (112), and the first air inlet (111) and the first air outlet (112) are both connected to the first air duct (11); The first air inlet (111) is located on the side of the capacitor bank (32) away from the power module (31), and the first air outlet (112) is located opposite to the reactor assembly (20); Alternatively, the first air outlet (112) is located on the side of the power module (31) away from the capacitor bank (32), and the first air inlet (111) is located opposite to the reactor assembly (20).

6. The power cabinet according to claim 4 or 5, characterized in that, The first air inlet (111) and the first air outlet (112) are located on different sides of the cabinet (10).

7. The power cabinet according to claim 1, characterized in that, The first fan (51) is disposed in the first air duct (11) and located between the power module (30) and the reactor assembly (20).

8. The power cabinet according to claim 1, characterized in that, The cabinet (10) is provided with a second air inlet (121) and a second air outlet (122), and the second air inlet (121) and the second air outlet (122) are both connected to the second air duct (12); The second air inlet (121) and the second air outlet (122) are located on opposite sides of the cabinet (10), or the second air outlet (122) and the second air inlet (121) are located on different sides of the cabinet (10), and the second air inlet (121) is located on the top of the cabinet (10).

9. The power cabinet according to claim 8, characterized in that, The second fan (52) is located at the second air inlet (121).

10. A converter, characterized in that, The power cabinet includes any one of claims 1 to 9.

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