A heat sink for a rack-mounted flow divider

Abstract

The utility model relates to the technical field of radiator, disclose a radiator for machine frame formula diverter, including base, the base upper end is equipped with multiple groups of radiating fins, the base lower extreme is equipped with the mounting groove, the inside plug -in of mounting groove is equipped with the heat conduction board, the heat conduction board lower extreme is coated and is equipped with the heat conduction coating. The heat conduction coating and exchange chip are pasted, when the heat of exchange chip produces, make the heat of chip can be through heat conduction coating fast transmission to heat conduction board, heat conduction board is inserted in the mounting groove, and heat conduction board and flat heat pipe are pasted, heat conduction board conduction heat to base upper end, and base and heat conduction board cooperate and transmit heat to flat heat pipe, because flat heat pipe and multiple groups of radiating fins contact, flat heat pipe fast conduction heat of chip to radiating fin and spread to air, cooperate fan can accelerate the heat dissipation of exchange chip, increased the heat dissipation rate of exchange chip.

Description

Technical Field

[0001] This utility model relates to the field of radiator technology, and in particular to a radiator for a frame-type splitter. Background Technology

[0002] A chassis-based traffic splitter is a modular and highly scalable network traffic splitting device. It typically adopts a chassis architecture and supports the flexible deployment of multiple service cards and switching cards. It can realize functions such as aggregation, splitting, replication, filtering, and protocol conversion of large traffic data. It is widely used in network security, traffic monitoring, and telecom-grade data centers. The chassis-based traffic splitter adopts a standardized chassis design and supports the insertion of multiple service cards and switching cards to form a modular structure. This design allows users to flexibly configure the type and quantity of cards according to actual needs and realize dynamic resource allocation.

[0003] Existing chassis-type shunts all use fans to cool the entire shunt, but fans are not very efficient at cooling the internal switching chips of the shunt, which affects the use of the shunt. Utility Model Content

[0004] Given that existing chassis-type shunts all rely on fans to cool the entire shunt, but the fans have low cooling efficiency for the internal switching chips, which affects the use of the shunt, this utility model is proposed.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a heat sink for a frame-type splitter, comprising a base, a plurality of heat sinks on the upper end of the base, a mounting groove on the lower end of the base, a heat-conducting plate inserted inside the mounting groove, a heat-conducting coating on the lower end of the heat-conducting plate, a plurality of heat-conducting grooves on the upper end of the base located at the mounting groove, flat heat pipes inserted inside the heat-conducting grooves, mounting holes on the four corners of the base, a second mounting component inserted in the middle of the mounting hole, the second mounting component comprising a rod inserted in the middle of the mounting hole, a threaded portion on the lower end of the rod, a dividing sleeve inserted on the upper end of the threaded portion of the outer wall of the rod, and a spring sleeved on the upper end of the dividing sleeve of the outer wall of the rod.

[0006] As a preferred embodiment of the heat sink for the chassis-type splitter described in this utility model, the base material is aluminum, the heat sink material is finned aluminum fins, and the thermally conductive coating material is Shin-Etsu 7783D thermal grease.

[0007] As a preferred embodiment of the heat sink for the frame-type splitter according to the present invention, wherein: the outer wall of the base is provided with a first mounting assembly, the first mounting assembly includes a mounting frame fixedly disposed on the outer wall of the base, a connecting plate is fixedly disposed at one end of the mounting frame, a screw is threadedly inserted into the middle of the connecting plate, and a connecting disc is fixedly disposed at the front end of the screw.

[0008] As a preferred embodiment of the heat sink for the frame-type splitter described in this utility model, the heat sink is inserted into the inner wall of the mounting frame, and the two ends of the heat sink are in contact with the inner wall of the mounting frame.

[0009] As a preferred embodiment of the heat sink for the frame-type splitter described in this utility model, a rubber pad is fixedly provided at the end of the connecting plate away from the screw.

[0010] As a preferred embodiment of the heat sink for the frame-type splitter described in this utility model, the flat heat pipe is movably inserted into the heat conduction groove, the upper end face of the flat heat pipe and the upper end face of the base are on the same horizontal plane, the lower end of the heat sink is in contact with the upper end face of the flat heat pipe, and the lower end of the flat heat pipe is in contact with the upper end face of the heat conduction plate.

[0011] As a preferred embodiment of the heat sink for the frame-type splitter described in this utility model, the lower end of the insert rod has a dividing groove on its outer wall that cooperates with the dividing sleeve, and the dividing sleeve is movably inserted into the dividing groove.

[0012] Compared with the prior art, the present invention has at least the following beneficial effects:

[0013] 1. In this utility model, the thermally conductive coating is attached to the switching chip. When the switching chip generates heat, the heat can be quickly transferred to the heat-conducting plate through the thermally conductive coating. The heat-conducting plate is inserted into the mounting slot and is attached to the flat heat pipe. The heat-conducting plate conducts heat to the upper end of the substrate. The substrate and the heat-conducting plate work together to transfer heat to the flat heat pipe. Since the flat heat pipe is in contact with multiple heat sinks, the flat heat pipe quickly conducts the heat of the chip to the heat sinks and diffuses it into the air. With the help of a fan, the heat dissipation of the switching chip can be accelerated, increasing the heat dissipation rate of the switching chip.

[0014] 2. In this utility model, during long-term use of the heat dissipation device, dust will be attracted to the upper part of the heat sink, affecting the heat dissipation rate of the heat sink. The operator can rotate the screw to move the rubber pad away from the heat sink and release the heat sink from its fixation. The heat sink can then be removed from the upper part of the base. After removing the heat sink from the upper part of the base, the flat heat pipe can be taken out from the heat conduction groove, which facilitates the cleaning and maintenance of the heat sink and the flat heat pipe. This avoids the accumulation of dust on the upper part of the heat sink after long-term use, which affects the heat dissipation effect of the device. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the heat sink for the frame-type splitter of this utility model;

[0016] Figure 2 This is a bottom-view three-dimensional structural diagram of the heat sink used in the frame-type splitter of this utility model;

[0017] Figure 3 This is an exploded three-dimensional structural diagram of the base of the heat sink used in the frame-type splitter of this utility model;

[0018] Figure 4 This is a three-dimensional structural diagram of the base of the heat sink used in the frame-type splitter according to this utility model;

[0019] Figure 5 This is a three-dimensional structural diagram of the first mounting component of the heat sink for the frame-type splitter according to this utility model;

[0020] Figure 6 This is a three-dimensional structural diagram of the second mounting component of the heat sink used in the frame-type splitter according to the present invention.

[0021] Explanation of reference numerals in the attached figures:

[0022] 1. Base; 2. Heat sink; 3. First mounting assembly; 31. Mounting frame; 32. Connecting plate; 33. Screw; 34. Connecting disc; 35. Rubber pad; 4. Second mounting assembly; 41. Insert rod; 42. Spring; 43. Threaded part; 44. Dividing sleeve; 5. Mounting groove; 6. Heat-conducting plate; 7. Heat-conducting coating; 8. Heat-conducting groove; 9. Flat heat pipe; 10. Mounting hole. Detailed Implementation

[0023] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0024] Example 1

[0025] Reference Figures 1-6This is the first embodiment of the present invention, which provides a heat sink for a frame-type splitter, including a base 1, a plurality of heat sinks 2 on the upper end of the base 1, a mounting groove 5 at the lower end of the base 1, a heat-conducting plate 6 inserted inside the mounting groove 5, a heat-conducting coating 7 coated on the lower end of the heat-conducting plate 6, a plurality of heat-conducting grooves 8 at the upper end of the mounting groove 5 on the base 1, a flat heat pipe 9 inserted inside the heat-conducting grooves 8, mounting holes 10 at the four corners of the base 1, a second mounting component 4 inserted in the middle of the mounting hole 10, the second mounting component 4 including a rod 41 inserted in the middle of the mounting hole 10, a threaded portion 43 at the lower end of the rod 41, a dividing sleeve 44 inserted in the upper end of the threaded portion 43 on the outer wall of the rod 41, and a spring 42 sleeved on the upper end of the dividing sleeve 44 on the outer wall of the rod 41.

[0026] The substrate 1 is made of aluminum, the heat sink 2 is made of finned aluminum, and the thermal coating 7 is made of Shin-Etsu 7783D thermal grease.

[0027] The flat heat pipe 9 is movably inserted into the heat conduction groove 8. The upper end face of the flat heat pipe 9 and the upper end face of the base 1 are on the same horizontal plane. The lower end of the heat sink 2 is in contact with the upper end face of the flat heat pipe 9, and the lower end of the flat heat pipe 9 is in contact with the upper end face of the heat conduction plate 6.

[0028] The lower end of the insert rod 41 has a dividing groove on its outer wall that mates with the dividing sleeve 44. The dividing sleeve 44 is movably inserted into the dividing groove. The insert rod 41 is passed through the mounting hole 10 and rotated to screw the threaded part 43 at the lower end of the insert rod 41 into the threaded hole pre-drilled in the distributor. During the process of screwing the insert rod 41 into the threaded hole, the insert rod 41 compresses the spring, causing the thermal conductive coating 7 to adhere to the exchange chip. Under the reverse elastic force of the insert rod 41, the thermal conductive coating 7 can adhere to the exchange chip more tightly.

[0029] The thermally conductive coating 7 is attached to the switching chip. When the switching chip generates heat, the heat can be quickly transferred to the heat-conducting plate 6 through the thermally conductive coating 7. The heat-conducting plate 6 is inserted into the mounting slot 5 and is attached to the flat heat pipe 9. The heat-conducting plate 6 conducts heat to the upper end of the substrate 1. The substrate 1 and the heat-conducting plate 6 work together to transfer heat to the flat heat pipe 9. Since the flat heat pipe 9 is in contact with multiple heat sinks 2, the flat heat pipe 9 quickly conducts the heat of the chip to the heat sinks 2 and diffuses it into the air. With the help of a fan, the heat dissipation of the switching chip can be accelerated, increasing the heat dissipation rate of the switching chip.

[0030] Example 2

[0031] Reference Figure 1-6This is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that: the outer wall of the base 1 is provided with a first mounting component 3. The first mounting component 3 includes a mounting frame 31 fixedly disposed on the outer wall of the base 1. A connecting plate 32 is fixedly disposed at one end of the mounting frame 31. A screw 33 is threadedly inserted into the middle end of the connecting plate 32. A connecting plate 34 is fixedly disposed at the front end of the screw 33.

[0032] The heat sink 2 is inserted into the inner wall of the mounting frame 31, and both ends of the heat sink 2 are in contact with the inner wall of the mounting frame 31.

[0033] A rubber pad 35 is fixedly provided at the end of the connecting plate 34 away from the screw 33.

[0034] During prolonged use of this heat dissipation device, dust will accumulate on the upper part of the heat sink 2, affecting its heat dissipation rate. Operators can rotate the screw 33 to move the rubber pad 35 away from the heat sink 2, releasing its fixation. The heat sink 2 can then be removed from the upper part of the base 1. After removing the heat sink 2 from the base 1, the flat heat pipe 9 can be removed from the heat conduction groove 8, facilitating cleaning and maintenance of the heat sink 2 and the flat heat pipe 9. When installing the heat sink 2, first insert the flat heat pipe 9 into the corresponding heat conduction groove 8, then place the heat sink 2 side-by-side along the mounting frame 31 on the upper part of the base 1. Next, rotate the screw 33 to make the rubber pad 35 contact the outer wall of the heat sink 2, fixing multiple heat sinks 2 between the rubber pad 35 and the mounting frame 31, thus completing the installation of the heat sink 2. This operation facilitates cleaning and maintenance of the heat sink 2, preventing excessive dust accumulation on its upper part during long-term use and ensuring effective heat dissipation.

[0035] The remaining structure is the same as that in Example 1.

[0036] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A heat sink for a chassis-type splitter, comprising a substrate (1), characterized in that: The base (1) has multiple heat sinks (2) on its upper end and a mounting groove (5) on its lower end. A heat-conducting plate (6) is inserted inside the mounting groove (5). A heat-conducting coating (7) is applied to the lower end of the heat-conducting plate (6). The base (1) has multiple heat-conducting grooves (8) on its upper end of the mounting groove (5). A flat heat pipe (9) is inserted inside the heat-conducting groove (8). The base (1) has mounting holes (10) at its four corners. A second mounting component (4) is inserted in the middle of the mounting hole (10). The second mounting component (4) includes a rod (41) inserted in the middle of the mounting hole (10). A threaded part (43) is provided at the lower end of the rod (41). A dividing sleeve (44) is inserted on the outer wall of the rod (41) at the upper end of the threaded part (43). A spring (42) is sleeved on the outer wall of the rod (41) at the upper end of the dividing sleeve (44).

2. The radiator for a frame-type splitter according to claim 1, characterized in that: The substrate (1) is made of aluminum, the heat sink (2) is made of FIN aluminum fins, and the thermal conductive coating (7) is made of Shin-Etsu 7783D thermal grease.

3. The radiator for a frame-type splitter according to claim 1, characterized in that: The base (1) has a first mounting assembly (3) on its outer wall. The first mounting assembly (3) includes a mounting frame (31) fixedly mounted on the outer wall of the base (1). A connecting plate (32) is fixedly mounted at one end of the mounting frame (31). A screw (33) is threadedly inserted into the middle of the connecting plate (32). A connecting disc (34) is fixedly mounted at the front end of the screw (33).

4. The radiator for a frame-type splitter according to claim 3, characterized in that: The heat sink (2) is inserted into the inner wall of the mounting frame (31), and both ends of the heat sink (2) are in contact with the inner wall of the mounting frame (31).

5. The radiator for a frame-type splitter according to claim 3, characterized in that: A rubber pad (35) is fixedly provided at the end of the connecting plate (34) away from the screw (33).

6. The heat sink for a frame-type splitter according to claim 1, characterized in that: The flat heat pipe (9) is movably inserted into the heat conduction groove (8). The upper end face of the flat heat pipe (9) and the upper end face of the base (1) are on the same horizontal plane. The lower end of the heat sink (2) is in contact with the upper end face of the flat heat pipe (9). The lower end of the flat heat pipe (9) is in contact with the upper end face of the heat conduction plate (6).

7. The radiator for a frame-type splitter according to claim 1, characterized in that: The lower end of the insert (41) has a dividing groove on its outer wall that cooperates with the dividing sleeve (44), and the dividing sleeve (44) is movably inserted into the dividing groove.

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