Heat sink and heat sink assembly

CN224670149UActive Publication Date: 2026-08-21SUNGROW POWER SUPPLY CO LTD
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Patent Information

Application Number
CN202521995164.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-16
Publication Date
2026-08-21
Estimated Expiration
2035-09-16

AI Technical Summary

Technical Problem

[0004]本实用新型的目的是至少解决现有技术中,散热翅片无法兼顾轻量化和结构强度的问题

Benefits of technology

[0004] The purpose of this invention is to at least solve the problem in the prior art where heat sink fins cannot simultaneously achieve both lightweight design and structural strength. This purpose is achieved through the following means:

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Abstract

The utility model relates to a radiator and radiating assembly, and the radiator comprises: a substrate; at least one first fin; a plurality of second fins, the plurality of second fins are sequentially and interval set, and are connected with the substrate, and each support interval is arranged between any two adjacent second fins, at least one continuous bending first fin is arranged in each support interval, the first fin is connected with the substrate and / or the second fin, and the thickness size of the second fin is greater than the thickness size of the first fin. According to the radiator of the utility model, the fin is decoupled through the differentiated thickness design, the second fin is used as the force bearing structure, the rigid support structure is formed to enhance the overall strength of the radiator, the first fin is protected, and the overall structural strength is improved while maintaining the lightweight.
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Description

Technical Field

[0001] This utility model relates to the field of heat dissipation equipment technology, and in particular to a radiator and heat dissipation component. Background Technology

[0002] Traditional air-cooled radiators use a heat dissipation base plate and heat dissipation fins to be formed in one piece. The processing technology is usually a one-piece forming process such as toothing process and aluminum extrusion process. However, these processing technologies have minimum thickness requirements for the heat dissipation fins. When pursuing the goal of lightweight radiators, there are process limitations, resulting in the radiators being relatively heavy.

[0003] In related technologies, ultra-thin finned heat sinks are obtained by welding ultra-thin fins one by one to a substrate. However, when the heat sink fins are set too thin, their structural strength is significantly reduced, and they are prone to deformation, cracking or falling off when subjected to impact. Utility Model Content

[0004] The purpose of this invention is to at least solve the problem in the prior art where heat sink fins cannot simultaneously achieve both lightweight design and structural strength. This purpose is achieved through the following means:

[0005] According to a first aspect of the present invention, a heat sink is provided, the heat sink comprising: a substrate; at least one first fin; a plurality of second fins, the plurality of second fins being arranged sequentially at intervals and connected to the substrate, a support interval being provided between any two adjacent second fins, each support interval being provided with at least one continuously bent first fin, the first fin being connected to the substrate and / or the second fins, and the thickness of the second fins being greater than the thickness of the first fins.

[0006] According to the present invention, the radiator decouples the fins through a differentiated thickness design, making the second fin a load-bearing structure, forming a rigid support structure to enhance the overall strength of the radiator, protect the ultra-thin first fin, and improve the overall structural strength while maintaining lightweight.

[0007] In addition, the radiator according to this utility model may also have the following additional technical features:

[0008] In some embodiments of this utility model, the first fin is a metal plate, and the thickness of the first fin ranges from 0.05 mm to 1 mm.

[0009] In some embodiments of this utility model, the first fin is continuously bent to form a plurality of heat dissipation units, the plurality of heat dissipation units are connected in sequence along a first direction, each heat dissipation unit defines a first heat dissipation channel, and a second heat dissipation channel is defined between any two adjacent heat dissipation units. The first heat dissipation channel and the second heat dissipation channel both extend along a second direction, the first direction is perpendicular to the second direction, and the first direction and the second direction are parallel to the substrate.

[0010] In some embodiments of this utility model, the heat dissipation unit includes a first plate and a second plate; along a third direction, one end of the first plate and one end of the second plate are connected, and the first plate and the second plate are set at an acute angle; the other ends of the first plate and the other ends of the second plate are spaced apart along the first direction and are respectively connected to the substrate, and the first direction, the second direction and the third direction are perpendicular to each other.

[0011] In some embodiments of this utility model, the heat dissipation unit includes a first plate, a first bent portion, a second plate, and a second bent portion connected in sequence; the first plate and the second plate are spaced apart and are parallel to the second fins respectively; the first bent portion and the second bent portion are spaced apart and are parallel to the substrate respectively; the two ends of the first bent portion are respectively connected to the first end of the first plate and the first end of the second plate; the second end of the first plate, the second end of the second plate, and the second bent portion are connected to the substrate.

[0012] In some embodiments of this utility model, the heat dissipation unit includes a first plate, a first bent portion, a second plate, and a second bent portion connected in sequence; the first plate and the second plate are spaced apart and are parallel to the substrate respectively; the first bent portion and the second bent portion are spaced apart and are parallel to the second fin respectively, wherein the first bent portion is connected to one of the second fins and the second bent portion is connected to the other of the second fins.

[0013] In some embodiments of this invention, along a direction perpendicular to the substrate, the height of the second fin protruding from the substrate is greater than the height of the first fin protruding from the substrate.

[0014] In some embodiments of this utility model, the thickness of the first fin ranges from 0.1 mm to 0.3 mm.

[0015] In some embodiments of this utility model, the first fin is provided with a plurality of ventilation holes, which are connected to the first heat dissipation channel and the second heat dissipation channel.

[0016] According to a second aspect of the present invention, a heat dissipation assembly is also provided, the heat dissipation assembly comprising: a heating element; and the heat sink described in the first aspect, wherein the heat sink is thermally connected to the heating element. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. Wherein:

[0018] Figure 1 This is a schematic diagram of the structure of a heat sink according to an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the radiator structure from another perspective of an embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of the structure of a heat sink according to another embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the structure of a heat sink according to another embodiment of the present invention.

[0022] The labels in the attached diagram are as follows:

[0023] 100. Radiator;

[0024] 10. Substrate;

[0025] 20. First fin; 21. Heat dissipation unit; 211. First plate; 212. Second plate; 213. First bend; 214. Second bend; 201. First heat dissipation channel; 202. Second heat dissipation channel;

[0026] 30. Second fin; 31. Support section;

[0027] X, first direction; Y, second direction; Z, third direction. Detailed Implementation

[0028] Exemplary embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0029] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0030] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0031] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0032] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure rotates, then an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations.

[0033] This application proposes a heat sink 100, such as Figure 1 , Figure 2 and Figure 3 As shown, the heat sink 100 includes a substrate 10, a first fin 20, and a second fin 30. A plurality of second fins 30 are arranged sequentially at intervals and connected to the substrate 10 at an angle to the substrate 10. A support interval 31 is formed between two adjacent second fins 30. At least one continuously bent first fin 20 is provided in each support interval 31. The thickness of the second fin 30 is greater than the thickness of the first fin 20.

[0034] In this application, "angled" means: acute angle, obtuse angle, or perpendicular. For example, "angled" between the second fin and the substrate includes: the second fin being set at an acute angle to the substrate, or the second fin being perpendicular to the substrate, or the second fin being set at an obtuse angle to the substrate.

[0035] The second fin 30 refers to a plate-like structure extending perpendicularly to the substrate 10, or the second fin 30 may form an angle of less than 90° with the substrate 10. Specifically, the second fin 30 can be formed by stamping metal sheet, and the angled structure with the substrate 10 enhances the overall support rigidity. The support section 31 refers to the defined space between adjacent second fins 30, used to accommodate the first fin 20.

[0036] Specifically, the second fins 30 are arranged at intervals to form a rigid support frame, and at least one first fin 20 is embedded in the support interval 31 between adjacent second fins 30. The first fin 20 is formed by continuously bending a metal sheet, for example, processing the metal sheet into a wave shape, sawtooth shape, or Z-shape, so that the first fins 20 form multiple mutually supporting geometric configurations. The geometric configuration formed by the first fins 20 can be set as periodically arranged geometric structural units or as non-periodically arranged geometric structural units to improve the structural stability of the first fins. The second fins 30 form an angled structure with the substrate 10, which not only increases the bending resistance of the fins themselves, but also provides a protective enclosure for the first fins 20 through the support interval 31. The second fins 30 use a thicker material, which preferentially absorbs energy when subjected to assembly impacts or vibrations, reducing the probability of the ultra-thin first fins 20 being directly subjected to force.

[0037] In this embodiment, through differentiated thickness design, the second fin 30 serves as a load-bearing structure to protect the ultra-thin first fin 20, thereby improving overall impact resistance while maintaining heat dissipation efficiency. The rigid support structure formed by the second fin 30 enhances the overall strength of the heat sink 100, while maintaining the thin and lightweight design of the first fin 20.

[0038] In some embodiments, the first fin 20 is formed by continuously bending a metal plate to form an integral structure of multiple heat dissipation units 21. The first fin 20 is connected to the substrate 10, and its thickness can be in the range of 0.05 mm to 1 mm.

[0039] The substrate 10 refers to a metal plate that carries the heat source and conducts heat, such as aluminum or copper, and heat transfer is achieved through planar contact. The first fin 20 is a heat dissipation structure formed by sheet metal forming processes, such as bending, stretching, stamping, rolling, etc., to process the metal plate into a wave shape, sawtooth shape, or Z-shape, so that multiple heat dissipation units 21 form a mutually supporting geometric configuration. The integrated structure means that the fin is made of a single material continuously, avoiding local stress concentration. The heat dissipation unit 21 is a periodically arranged geometric structure unit, such as a U-shaped or V-shaped groove formed by bending, and the connection of adjacent units enhances the structural stability.

[0040] Specifically, the substrate 10 acts as a heat transfer carrier, bonded to the surface of the heat source, and heat is transferred to the first fin 20 through the substrate 10. The first fin 20 is formed by continuous bending to create multiple interconnected heat dissipation units 21. For example, each heat dissipation unit 21 includes two parallel plates and a connecting bend. This continuous structure provides natural support between adjacent units, maintaining sufficient rigidity even with reduced fin thickness. When airflow passes through the channels formed by the heat dissipation units 21, heat is quickly carried away. Compared to the risk of deformation and detachment associated with welding ultra-thin fins, the continuous molding of the first fin 20 eliminates weak points in the connection. Furthermore, each heat dissipation unit 21 is connected to the substrate 10, providing multiple connection points between the first fin 20 and the substrate 10. This increases the connection strength between the first fin 20 and the substrate 10 and reduces the swaying deformation of the first fin 20 under conditions of collision, vibration, and forced airflow impact.

[0041] The heat sink 100 proposed in this application achieves both lightweight design and structural strength. The integrated fins disperse stress through geometric configuration, preventing localized deformation; the continuous support structure enhances bending resistance, enabling the ultra-thin fins to withstand assembly impacts and airflow pressure. The stable connection between the substrate 10 and the first fin 20 further ensures efficient heat transfer, resolving the inherent trade-off between lightweight design and structural strength in traditional processes.

[0042] In some embodiments, such as Figure 1 and Figure 2 As shown, multiple heat dissipation units 21 are connected sequentially along a first direction X. The first direction X refers to the extension direction of the continuous arrangement of heat dissipation units 21, which can be achieved by connecting the heat dissipation units 21 sequentially along a straight or curved path. The first direction X is parallel to the plane of the substrate 10. Each heat dissipation unit 21 defines a first heat dissipation channel 201, and a second heat dissipation channel 202 is defined between any two adjacent heat dissipation units 21. Both the first heat dissipation channel 201 and the second heat dissipation channel 202 extend along a second direction Y, and form ventilation openings at both ends of the second direction Y. The first direction X and the second direction Y are parallel to the substrate 10. The second direction Y refers to the direction of the extension axis of the heat dissipation channel, which can be formed by creating grooves or bending on the surface of the heat dissipation unit 21. The first direction X is perpendicular to the second direction Y, which is used to expand the heat dissipation surface area and guide the airflow path. The first heat dissipation channel 201 is a spatial area defined by the recessed or raised structure formed on the surface of the heat dissipation unit 21 itself. Specifically, it can be achieved by processing continuous grooves on the surface of the plate through stamping or bending processes, which is used to increase the heat dissipation area and maintain structural rigidity. The second heat dissipation channel 202 is the spatial area formed by the gap between adjacent heat dissipation units 21, used to supplement the heat dissipation surface area and form an airflow channel. The vent refers to the opening structure at both ends of the heat dissipation channel in the second direction Y, used to promote air convection and reduce airflow resistance inside the channel.

[0043] Specifically, the heat dissipation units 21 are arranged continuously along the first direction X to form an integrated support structure. The front and back surfaces of each heat dissipation unit 21 are respectively formed with grooved first heat dissipation channels 201 and second heat dissipation channels 202 through a processing technology. For example, a continuous bending process is used to make the plate material have a wavy or sawtooth profile, thereby forming alternating raised and recessed areas on the unit surface. The gap area between adjacent heat dissipation units 21 constitutes the second heat dissipation channel 202, and the extension direction of the second heat dissipation channel 202 is parallel to the first heat dissipation channel 201. The first heat dissipation channel 201 and the second heat dissipation channel 202 form parallel heat dissipation paths in the plane of the substrate 10, and bidirectional airflow within the channels is achieved through ventilation openings. While maintaining an ultra-thin thickness, the heat dissipation unit 21 improves its overall bending resistance through the continuous support structure of the channel walls, reducing structural deformation caused by external impacts or vibrations.

[0044] In this embodiment, the support frame formed by the continuous arrangement of heat dissipation units 21 is interconnected through the flow channel walls, effectively dispersing external loads and suppressing fin bending deformation. The first heat dissipation flow channel 201 and the second heat dissipation flow channel 202 on both sides increase the heat dissipation surface area and improve heat dissipation efficiency. At the same time, the through-type design of the vents promotes air convection and reduces flow resistance, thus balancing structural strength and heat dissipation performance.

[0045] In some exemplary embodiments, such as Figure 1 and Figure 2 As shown, the heat dissipation unit 21 includes a first plate 211 and a second plate 212, which are set at an acute angle. The first plate 211 and the second plate 212 are two planar structures constituting the heat dissipation unit 21, which can be formed by bending metal sheets. The acute angle between them forms a V-shaped support structure, dispersing external loads and enhancing bending resistance. Along the third direction Z, one end of the first plate 211 and one end of the second plate 212 are connected, and the other ends of the first plate 211 and the second plate 212 are spaced apart along the first direction X and connected to the substrate 10 respectively. The third direction Z is perpendicular to the substrate 10. The first direction X refers to the horizontal dimension that forms an angle with the second direction Y. The arrangement of the other ends of the first plate 211 and the second plate 212 along the first direction X forms a double fixed-point support structure, increasing the contact area between the heat dissipation unit 21 and the substrate 10.

[0046] Specifically, in this embodiment, the first plate 211 and the second plate 212 are connected at an acute angle to form a V-shaped structure. The integrated structure with multiple heat dissipation units 21 connected in sequence has a continuous sawtooth shape. When the heat dissipation unit 21 is subjected to vibration or airflow impact, the load is distributed to the connection point between the two plates and the substrate 10, avoiding stress concentration that could lead to deformation or cracking. The plate ends connected along the third direction provide continuous support for the heat dissipation unit 21 in the direction parallel to the second fin 30, ensuring a stable connection between the heat dissipation unit 21 and the substrate 10 within the support interval 31 between adjacent second fins 30. The other ends of the first plate 211 and the second plate 212 are spaced apart along the first direction X and connected to the substrate 10, forming a double fixed-point support structure. This not only improves the connection strength but also forms directional heat dissipation channels in the first direction X through spaced arrangement.

[0047] Understandably, traditional heat dissipation units 21 employ a single-plate or parallel-plate structure, which is prone to bending or detachment under thin-walled conditions, and the heat dissipation channel layout is singular. In contrast, this embodiment, through a V-shaped support structure and a double-fixed-point connection design, significantly improves structural stability at the same thickness, distributes loads, enhances impact resistance, and avoids deformation or detachment caused by vibration or airflow impact. The acute-angle layout forms a multi-directional heat dissipation channel, allowing airflow to simultaneously flow along the first heat dissipation channel 201 and the second heat dissipation channel 202, thereby improving heat dissipation efficiency.

[0048] In this embodiment, the thickness of the second fin 30 refers to the dimension of the second fin 30 along the first direction X. The thickness of the first fin 20 refers to the dimension of the first plate 211 or the second plate 212 along the first direction X.

[0049] In some embodiments, such as Figure 3 As shown, the first fin 20 is formed by continuously bending a metal plate to form multiple heat dissipation units 21 in the shape of the letter Z. The zigzag structure formed by continuous bending refers to a periodic geometric shape formed by continuously bending a single metal plate. Specifically, it can be achieved by stamping or roll forming processes. This structure can eliminate welding seams and form an overall support frame.

[0050] The heat dissipation unit 21 includes a first plate 211, a first bend 213, a second plate 212, and a second bend 214 connected in sequence. The first plate 211 and the second plate 212 are parallel and spaced apart, forming a double-wall support structure to enhance longitudinal rigidity. The first bend 213 forms an angle with both the first plate 211 and the second plate 212, and along the extension direction of the first plate 211, the first bend 213 and the second bend 214 are parallel and spaced apart. The first bend 213 forming an angle perpendicular to the plate means that the transition area connecting the two plates forms a right-angle bend or a non-right-angle bend, thereby forming a triangular stress dispersion structure between adjacent plates. The first bend 213 and the second bend 214 being parallel and spaced apart along the extension direction means that multiple bend areas are equidistantly distributed in the length direction. The first bend 213 and the second bend 214 respectively form a transverse reinforcing rib structure to enhance impact resistance.

[0051] Specifically, the metal sheet is continuously bent to form a periodic Z-shaped integral structure. Each heat dissipation unit 21 constructs a parallel double-wall support structure through the first plate 211 and the second plate 212. This double-wall design enhances longitudinal bending strength even with limited fin thickness. The first bend 213 connects the two plates at a specific angle, forming a triangular support area between adjacent plates, effectively dispersing stress concentration under external impact loads. Multiple bends evenly distributed along the extension direction form a transverse reinforcing rib network, suppressing transverse torsional deformation of the fins under high-speed airflow impact conditions. The entire fin adopts an integrated molding process, eliminating the weak points of traditional welded fins and ensuring structural integrity while achieving an ultra-thin fin design.

[0052] In this embodiment, the first plate 211 and the second plate 212 are the main heat dissipation structures, and the first bending portion 213 and the second bending portion 214 mainly serve to connect and reinforce the structure. Specifically, along a third direction, the lengths of the first plate 211 and the second plate 212 are equal, and the length of the first plate 211 and the second plate 212 is L1. Along a first direction X, the lengths of the first bending portion 213 and the second bending portion 214 are equal, and the lengths of the first bending portion 213 and the second bending portion 214 are L2 respectively. Therefore, the value range of L1 / L2 is 10 to 20. For example, in an exemplary embodiment, if L1 is set to 50 mm, then L2 is 5 mm; or if L1 is set to 50 mm, then L2 is 3 mm.

[0053] In this embodiment, the first plate 211 and the second plate 212 are parallel to the second fin 30, and the first bent portion 213 and the second bent portion 214 are parallel to the substrate 10, with the second bent portion 214 connected to the substrate 10. Since the second bent portion 214 is parallel to the substrate 10, it is entirely attached to the substrate 10. This increases the contact area between the first fin 20 and the substrate 10, improving thermal conductivity. Furthermore, it enhances the structural strength of the connection between the first fin 20 and the substrate 10, further improving the impact resistance of the first fin 20 and reducing the probability of it detaching from the substrate 10. In this embodiment, the thickness of the second fin 30 refers to its dimension along the first direction X. The thickness of the first fin 20 refers to the dimension of the first plate 211 or the second plate 212 along the third direction Z.

[0054] In other embodiments, such as Figure 4 As shown, the first plate 211 and the second plate 212 are parallel to the substrate 10, and the first bent portion 213 and the second bent portion 214 are parallel to the second fins 30. The first bent portion 213 is connected to one second fin 30, and the second bent portion 214 is connected to the other second fin 30. The first plate 211 and the second plate 212 refer to the planar structure constituting the heat dissipation unit 21, and their extension direction is parallel to the surface of the substrate 10. Specifically, they can be formed by bending metal sheets, and the horizontal support surface is formed by the layout parallel to the substrate 10 to distribute the load. The first bent portion 213 refers to the transition area connecting the first plate 211 and the second plate 212. The extension direction of the first bent portion 213 is parallel to the second fins 30, and it can be formed by bending metal sheets to form a right-angle or acute-angle structure. The lateral support is formed by the perpendicular connection with the second fins 30. The second bend 214 refers to the transition area located at the end of the heat dissipation unit 21. The extension direction of the second bend 214 is parallel to the second fin 30. Specifically, it can be fixed to the adjacent second fin 30 by welding or riveting to form multi-point constraints to limit vibration displacement. The thickness dimension of the second fin 30 refers to its dimension in the first direction X. The thickness dimension of the first fin 20 refers to the dimension of the first plate 211 or the second plate 212 in the first direction X.

[0055] Specifically, the first plate 211 and the second plate 212 are arranged parallel to the substrate 10, so that the heat dissipation unit 21 forms a double-layer flat plate structure, which can evenly transfer the load to the substrate 10 when subjected to airflow impact. The first bending portion 213 and the second bending portion 214 are respectively arranged along the extension direction of the second fin 30 and are perpendicularly connected to two adjacent second fins 30 to form a three-dimensional frame structure supported by the second fins 30. When external vibration or airflow impact acts on the first fin 20, the first bending portion 213 and the second bending portion 214 respectively transfer the stress to the two independent second fins 30, avoiding stress concentration that could lead to structural failure.

[0056] In this embodiment, traditional ultra-thin fins are fixed by single-point welding, which is prone to cracking due to weld fatigue in a vibration environment. This solution, however, connects the first bending portion 213 and the second bending portion 214 perpendicularly to the adjacent second fin 30, giving the first fin 20 two independent support points simultaneously. This reduces welding stress and creates cross-constraints, allowing the second fin 30 to resist multi-directional loads. This enhances the fatigue resistance of the ultra-thin fins in a vibration environment and reduces fin bending deformation caused by high-speed airflow. The three-dimensional support structure formed by the first fin 20 and the second fin 30 effectively improves the overall rigidity of the radiator 100, preventing cracking or detachment caused by localized stress concentration.

[0057] In some embodiments, such as Figure 3 and Figure 4 As shown, along the direction perpendicular to the substrate 10, the height dimension of the second fin 30 protruding from the substrate 10 is greater than the height dimension of the first fin 20 protruding from the substrate 10. The height dimension of the second fin 30 protruding from the substrate 10 refers to the dimension by which the second fin 30 extends vertically from the surface of the substrate 10. The height dimension of the first fin 20 protruding from the substrate 10 refers to the dimension by which the first fin 20 extends vertically from the surface of the substrate 10. Specifically, the second fin 30 is set higher than the first fin 20, so that the first fin 20 is completely located within the support interval 31 between adjacent second fins 30. The second fin 30, as the main support structure, bears the external load. The height advantage of the second fin 30 can prevent external objects from directly contacting the first fin 20, reducing the risk of deformation caused by collisions during assembly or transportation. At the same time, the first fin 20 maintains a smaller height within the support interval 31, which avoids additional stress due to excessive height and maintains effective space for heat dissipation channels, ensuring smooth airflow.

[0058] Compared to traditional radiators 100 where all fins are of uniform height, resulting in thin fins being directly exposed to the external environment and susceptible to deformation from impacts or airflow, this embodiment utilizes a stepped height difference to create a physical barrier, with the second fin 30 forming a protective barrier within the support area 31. Simultaneously, the higher structural rigidity of the second fin 30 disperses external loads, thereby improving impact resistance while maintaining heat dissipation performance. This enveloping protection of the first fin 20 by the second fin 30 reduces the direct impact of external shocks on the thin fins, enhancing the stability of the radiator 100 under vibration or high-speed airflow conditions, while also preventing a significant increase in overall weight due to added support structures.

[0059] In some embodiments, the thickness of the first fin 20 ranges from 0.1 mm to 0.3 mm. The thickness of the first fin 20 refers to the dimension of the metal sheet constituting the fin in the direction perpendicular to the substrate 10. This thickness range optimizes the balance between material utilization and structural strength, ensuring that the fin maintains sufficient bending resistance while meeting lightweight requirements. Specifically, the thickness of the first fin 20 can be set to 0.1 mm, 0.12 mm, 0.15 mm, 0.18 mm, 0.2 mm, 0.22 mm, 0.25 mm, 0.26 mm, 0.28 mm, 0.3 mm, etc.

[0060] Specifically, in this embodiment, by limiting the lower limit of the fin thickness, the limitations of traditional toothing or aluminum extrusion processes on minimum thickness are overcome, and the integrity of the fin structure is ensured by using an integral molding process. At the same time, by setting an upper limit, the overall weight of the radiator 100 is avoided from increasing due to excessive thickness, ensuring that the fins are not easily deformed under vibration or airflow impact conditions. The selection of the thickness range comprehensively considers the material's mechanical properties and processing feasibility, enabling the fins to meet the lightweight target while withstanding the mechanical stress during assembly and the dynamic loads in the operating environment.

[0061] In some specific embodiments, the first fin 20 can be formed into multiple heat dissipation units 21 by continuously bending a metal plate, and the units are connected by bending portions to enhance the overall rigidity. The substrate 10 and the fin can be fixed by welding or bonding processes to ensure connection strength.

[0062] Compared to existing technologies, traditional processes limit fin thickness due to processing methods, making it impossible to achieve thin-walled structures below 0.3mm. Furthermore, welded ultra-thin fins suffer from insufficient strength. This solution combines a specific thickness range with a one-piece molding process, overcoming the lightweight bottleneck of traditional processes while avoiding the defects of easy detachment or deformation of ultra-thin fins.

[0063] Through the above technical solution, this application can reduce the weight of the radiator by 100 while ensuring the structural stability of the fins during assembly and use, preventing the fins from cracking, falling off or deforming due to airflow impact caused by excessive thickness, thus taking into account both lightweight design and reliability requirements.

[0064] In some embodiments, the first fin 20 is welded to the substrate 10. Welding refers to combining the contact interface between the first fin 20 and the substrate 10 into a single unit using molten metal. This can be achieved using laser welding, resistance welding, or brazing processes, enhancing the mechanical strength of the connection interface through metallurgical bonding. Welding eliminates interfacial gaps caused by traditional mechanical fasteners or adhesives, creating a continuous force transmission path between the first fin 20 and the substrate 10, thereby avoiding the risk of fracture due to stress concentration under vibration or impact loads.

[0065] Furthermore, the first fin 20 is provided with multiple ventilation holes (not shown in the figure), which connect the first heat dissipation channel 201 and the second heat dissipation channel 202. The ventilation holes refer to perforated structures penetrating the surface of the first fin 20, and can be formed using stamping, etching, or laser cutting processes. For example, they can be circular, rectangular, polygonal, or irregularly shaped holes. The edges of the ventilation holes can be chamfered or flanged to reduce stress concentration. By breaking the physical isolation between adjacent channels, the ventilation holes allow airflow to flow laterally between channels, increasing turbulence and improving convective heat transfer efficiency. Simultaneously, they balance the air pressure distribution within the channels, preventing localized airflow stagnation.

[0066] This application achieves a high-strength connection between the ultra-thin fins and the substrate 10, preventing the fins from falling off or cracking under vibration, while optimizing the airflow distribution in the heat dissipation channel to improve heat dissipation efficiency and thermal uniformity.

[0067] According to an embodiment of this utility model, a heat dissipation assembly is also proposed, comprising a heating element and a heat sink, wherein the heating element and the heat sink are thermally connected. In this embodiment, the heating element can be a power device, such as an electronic component that performs power conversion (e.g., rectification, inversion, voltage regulation) or power control, or other devices that generate heat during operation. For example, the heating element includes power semiconductor devices, resistors, capacitors, and modular devices integrating IGBTs, diodes, and drive circuits. Thermal connection between the heating element and the heat sink means that the heating element is in direct contact with the heat sink or indirect contact through a thermally conductive medium (e.g., thermally conductive grease, thermally conductive pads, thermally conductive adhesive, etc.), so that heat from the heating element can be transferred to the heat sink, achieving heat dissipation. In this embodiment, by efficiently transferring heat from the heating element to the heat sink through thermal connection, the temperature of the heating element can be effectively controlled, significantly improving the lifespan and operational stability of the assembly.

[0068] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A radiator, characterized in that, The heat sink includes: substrate; At least one first fin; A plurality of second fins are arranged sequentially at intervals and connected to the substrate. A support interval is provided between any two adjacent second fins. At least one continuously bent first fin is provided in each support interval. The first fin is connected to the substrate and / or the second fin. The thickness of the second fin is greater than that of the first fin.

2. The radiator according to claim 1, characterized in that, The first fin is a metal plate, and the thickness of the first fin ranges from 0.05 mm to 1 mm.

3. The radiator according to claim 1, characterized in that, The first fin is continuously bent to form a plurality of heat dissipation units, which are connected sequentially along a first direction. Each heat dissipation unit defines a first heat dissipation channel, and a second heat dissipation channel is defined between any two adjacent heat dissipation units. Both the first and second heat dissipation channels extend along a second direction, which is perpendicular to the second direction and parallel to the substrate.

4. The radiator according to claim 3, characterized in that, The heat dissipation unit includes a first plate and a second plate; Along a third direction, one end of the first plate and one end of the second plate are connected, and the first plate and the second plate are set at an acute angle; The other ends of the first plate and the other ends of the second plate are spaced apart along the first direction and are respectively connected to the substrate. The first direction, the second direction and the third direction are perpendicular to each other.

5. The radiator according to claim 3, characterized in that, The heat dissipation unit includes a first plate, a first bent portion, a second plate, and a second bent portion connected in sequence. The first plate and the second plate are spaced apart and are parallel to the second fin, respectively; The first bending portion and the second bending portion are spaced apart and are parallel to the substrate respectively. The two ends of the first bending portion are respectively connected to the first end of the first plate and the first end of the second plate. The second end of the first plate, the second end of the second plate and the second bending portion are connected to the substrate.

6. The radiator according to claim 3, characterized in that, The heat dissipation unit includes a first plate, a first bent portion, a second plate, and a second bent portion connected in sequence. The first plate and the second plate are spaced apart and are parallel to the substrate, respectively; The first bend and the second bend are spaced apart and are parallel to the second fin, wherein the first bend is connected to one of the second fins and the second bend is connected to the other of the second fins.

7. The radiator according to any one of claims 2 to 6, characterized in that, Along a direction perpendicular to the substrate, the height dimension of the second fin protruding from the substrate is greater than the height dimension of the first fin protruding from the substrate.

8. The radiator according to any one of claims 2 to 6, characterized in that, The thickness of the first fin ranges from 0.1 mm to 0.3 mm.

9. The radiator according to any one of claims 3 to 6, characterized in that, The first fin is provided with multiple ventilation holes, which are connected to the first heat dissipation channel and the second heat dissipation channel.

10. A heat dissipation component, characterized in that, The heat dissipation component includes: Heating element; The radiator as described in any one of claims 1 to 9, wherein the radiator is thermally connected to the heating element.