A heat sink for electronic components

Abstract

The embodiment of the present application provides a heat dissipator for electronic components, comprising: a first positioning member comprising a positioning clamp fixed on a printed circuit board; a second positioning member formed on the printed circuit board, the structure of the second positioning member being different from that of the first positioning member; and a heat dissipator body provided with a first positioning part and a second positioning part, the heat dissipator body being detachably positioned on the printed circuit board through cooperation of the first positioning part with the first positioning member and cooperation of the second positioning part with the second positioning member, and being in contact with electronic components on the printed circuit board for dissipating heat of the electronic components. The present application has simple structure, convenient installation, small space occupation and can be applied to some extreme arrangement environment.

Description

Technical Field

[0001] This application belongs to the field of heat sink technology, and particularly relates to a heat sink for electronic components. Background Technology

[0002] With the rapid development of automotive intelligence, electrification, and connectivity, electronic chips are being used more and more extensively in automobiles, covering multiple fields such as autonomous driving, smart cockpits, electric drive control, and in-vehicle communication. As the computing power and integration of electronic chips continue to increase, power consumption also increases significantly, leading to a sharp rise in heat flux density. At the same time, automotive electronic devices operate in extremely harsh environments, requiring long-term stable operation under conditions of high temperature, high humidity, vibration, and shock. Therefore, efficient and reliable heat dissipation design has become a key factor in ensuring the performance and lifespan of automotive electronic systems.

[0003] With the increasing number of electronic components in automobiles, the placement of some components is limited, often encased in plastic parts with insufficient space for heat dissipation. The current conventional approach is to design a heatsink housing to conduct heat generated by the chip into the housing, which is then dissipated through air convection. This method requires a large heatsink housing, is unsuitable for certain environments, and also increases the cost of the finished product. Therefore, designing a heatsink that reduces installation space requirements and avoids limitations in specific spaces is a pressing issue. Utility Model Content

[0004] In view of the above-mentioned technical problems in the prior art, the present application provides a heat sink for electronic components that can be directly mounted on a PCB board, which can reduce the installation space requirement and is suitable for special installation environments.

[0005] The technical solution adopted in this application embodiment is: a heat sink for electronic components, comprising:

[0006] The first positioning component includes a positioning clip, which is fixed on the printed circuit board;

[0007] A second positioning member is formed on the printed circuit board, and the structure of the second positioning member is different from that of the first positioning member.

[0008] The heat sink body has a first positioning part and a second positioning part. The heat sink body is detachably positioned on the printed circuit board by the first positioning part cooperating with the first positioning member and the second positioning part cooperating with the second positioning member, and contacts the electronic components on the printed circuit board for heat dissipation of the electronic components.

[0009] In an optional embodiment, the positioning clamp includes two opposing and spaced-apart clamping arms. The first ends of the two clamping arms are fixed to the printed circuit board. The middle portions of the two clamping arms are bent toward each other and pressed together to form a clamping portion. The second ends of the two clamping arms are far apart to form an insertion port.

[0010] The heat sink body is provided with a plug plate protruding towards the printed circuit board. The plug plate forms the first positioning part. The plug plate is inserted into the clamping part through the insertion port, and the clamping part clamps and fixes the plug plate.

[0011] In an alternative embodiment, the first ends of the two clamping arms extend toward each other and are connected together to form a bottom arm. The outer wall surface of the bottom arm is flat and is soldered to the first plate surface of the printed circuit board on which the electronic components are located.

[0012] In an optional embodiment, the first positioning component includes a plurality of positioning clips, which are arranged in two rows corresponding to the first and second sides of the radiator body. The first and second sides of the radiator body are respectively provided with a plurality of insert plates that correspond one-to-one with the plurality of positioning clips.

[0013] In an optional embodiment, the radiator body is provided with a first clearance groove extending in a direction parallel to the first side near its first side, and a second clearance groove extending in a direction parallel to the second side near its second side. The first clearance groove and the second clearance groove divide the radiator body into a first side plate, a middle body and a second side plate arranged in sequence. The first side plate and the second side plate are respectively provided with a pair of slits. The slits penetrate to the edge of the side plate near the printed circuit board, so that the insert plate is formed between each pair of slits.

[0014] In an optional embodiment, the first side plate and the second side plate extend toward the printed circuit board to protrude from the intermediate body and abut against the first surface of the printed circuit board;

[0015] The heat sink body also includes a third side and a fourth side opposite to each other, the third side and the fourth side extending toward the printed circuit board to form a third side plate and a fourth side plate respectively, the third side plate and the fourth side plate abutting against the first plate surface of the printed circuit board;

[0016] The first side plate, the third side plate, the second side plate, and the fourth side plate are connected end to end to form a shielding cover for surrounding the electronic components.

[0017] In an optional embodiment, the second positioning member includes a positioning hole disposed on the printed circuit board;

[0018] The radiator body is provided with a positioning guide post, which forms the second positioning part and is inserted into the positioning hole.

[0019] In an optional embodiment, the heat sink further includes a heat-conducting plate, one side of which is attached to the electronic component and the other side of which is attached to the heat sink body, so that the heat sink body contacts the electronic component through the heat-conducting plate and conducts the heat generated by the electronic component to the heat sink body.

[0020] In optional embodiments, the thermally conductive sheet is formed of thermally conductive silicone, thermally conductive grease, or thermally conductive gel; and / or

[0021] The heat sink body is made of aluminum alloy.

[0022] In an optional embodiment, the radiator body is provided with a plurality of heat dissipation fins, which are parallel to each other and spaced apart from each other.

[0023] Compared with the prior art, the beneficial effects of the embodiments of this application are as follows: the application has a simple structure, is easy to install, occupies little space, and can be applied to some extreme layout environments; moreover, the application is directly mounted on the PCB board, reducing the need for other heat dissipation paths and significantly reducing product costs.

[0024] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative only, and are not intended to limit this application.

[0025] The overview of various implementations or examples of the technology described in this application is not a full disclosure of the entire scope or all features of the disclosed technology. Attached Figure Description

[0026] In drawings that are not necessarily drawn to scale, the same reference numerals may describe similar parts in different views. The drawings generally illustrate various embodiments by way of example rather than limitation and are used, together with the description and claims, to illustrate the disclosed embodiments. Where appropriate, the same reference numerals are used in all drawings to refer to the same or similar parts. Such embodiments are illustrative and not intended to be exhaustive or exclusive embodiments of the apparatus or method.

[0027] Figure 1 This is a three-dimensional structural diagram of a heat sink for electronic components according to an embodiment of this application.

[0028] Figure 2 This is an exploded view of a heat sink for electronic components according to an embodiment of this application.

[0029] Figure 3 This is a top view of a heat sink for electronic components according to an embodiment of this application.

[0030] Figure 4 for Figure 3 Sectional view along the AA direction.

[0031] Figure 5 for Figure 4 Enlarged view of section B.

[0032] Figure 6 This is a three-dimensional structural diagram of the heat sink body and heat dissipation fins according to an embodiment of this application.

[0033] Figure label:

[0034] 1-Positioning clamp; 11-Clamping arm; 12-Clamping part; 13-Insert port; 14-Bottom arm;

[0035] 2-Positioning holes;

[0036] 3-Radiator body; 31-Insert plate; 311-Rib; 32-Positioning guide post; 33-First clearance groove; 34-Second clearance groove; 35-First side plate; 36-Intermediate main body; 37-Second side plate; 38-Cut seam; 39-First surface;

[0037] 4-Heat-conducting sheet;

[0038] 5-Heat dissipation fins;

[0039] 6-Printed circuit board; 61-First board surface;

[0040] 7-Electronic components. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the described embodiments of this application without creative effort are within the scope of protection of this application.

[0042] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0043] To keep the following description of the embodiments of this application clear and concise, detailed descriptions of known functions and known components are omitted.

[0044] This application provides a heat sink for electronic components, wherein the electronic component 7 refers in particular to an electronic component on a printed circuit board 6 (PCB), and the electronic component 7 includes, but is not limited to, a chip.

[0045] like Figures 1 to 4 As shown, the heat sink of this embodiment includes a first positioning member, a second positioning member, and a heat sink body 3. The first positioning member includes a positioning clip 1, which is fixed to the printed circuit board 6. The second positioning member is formed on the printed circuit board 6, and its structure is different from that of the first positioning member. The heat sink body 3 is provided with a first positioning part and a second positioning part. The heat sink body 3 is detachably positioned on the printed circuit board 6 by the first positioning part cooperating with the first positioning member and the second positioning part cooperating with the second positioning member, and contacts the electronic component 7 on the printed circuit board 6 for heat dissipation of the electronic component 7.

[0046] The heat sink of this application is directly mounted on the printed circuit board 6 through the first positioning part and the second positioning part, which reduces the space occupation and the installation space requirement, meets the installation requirements of special spaces, can adapt to some extreme layout environments, and improves the practicality of the heat sink.

[0047] In some embodiments, such as Figure 1 and Figure 2As shown, the positioning clamp 1 includes two opposing and spaced-apart clamping arms 11. The first ends of the two clamping arms 11 are fixed to the first surface 61 of the printed circuit board 6. The middle portions of the two clamping arms 11 are bent toward each other and pressed together to form a clamping portion 12. The second ends of the two clamping arms 11 are far apart to form an insertion port 13. See [reference needed] Figure 5 .like Figure 6 As shown, the heat sink body 3 has a protruding insert plate 31 facing the printed circuit board 6, and the insert plate 31 forms a first positioning part. The insert plate 31 is inserted into the clamping part 12 through the insertion port 13 and is clamped and fixed by the clamping part 12. In this way, the heat sink body 3 is installed and positioned on the printed circuit board 6 by the positioning clip 1. See Figure 1 Using the positioning clamp 1 as the first positioning component not only simplifies the structure but also provides a stable clamping force for the radiator body 3, preventing it from loosening.

[0048] Furthermore, such as Figure 5 As shown, the first ends of the two clamping arms 11 extend toward each other and connect together to form a bottom arm 14. The outer wall surface of the bottom arm 14 is flat and is soldered to the first plate surface 61 of the printed circuit board 6, which is equipped with electronic components 7. By designing the outer wall surface of the bottom arm 14 of the positioning clamp 1 to be flat, and the flat surface is attached to and soldered to the first plate surface 61 of the printed circuit board 6, the soldering area between the positioning clamp 1 and the printed circuit board 6 can be increased, thereby improving the stability of the connection between the positioning clamp 1 and the printed circuit board 6.

[0049] The two clamping arms 11 of the positioning clamp 1 can be a single piece, meaning the positioning clamp 1 can be formed by bending a long strip of plate. This simplifies the structure and improves stability.

[0050] The number of positioning clips 1 depends on the size and shape of the radiator body 3. Increasing the number of positioning clips 1 and their proper placement can improve installation stability and prevent them from falling off due to vibration. For example, such as... Figure 1 and Figure 2 As shown, the first positioning component includes multiple positioning clips 1 arranged in two rows, corresponding to the first and second sides of the heat sink body 3 respectively. The first and second sides of the heat sink body 3 are respectively provided with multiple insert plates 31 corresponding to the multiple positioning clips 1, and the multiple insert plates 31 are inserted into their respective positioning clips 1. By setting multiple positioning clips 1, the heat sink body 3 can be positioned simultaneously from the first and second sides of the heat sink body 3, forming multi-point positioning, further ensuring the stability of the heat sink body 3 on the printed circuit board 6.

[0051] In some embodiments, such as Figure 6As shown, the radiator body 3 has a first clearance groove 33 extending in a direction parallel to the first side near its first side, and a second clearance groove 34 extending in a direction parallel to the second side near its second side. The first clearance groove 33 and the second clearance groove 34 divide the radiator body 3 into a first side plate 35, a middle body 36, and a second side plate 37 arranged sequentially. The first side plate 35 and the second side plate 37 are respectively provided with a pair of slits 38 (see...). Figure 2 The slits 38 extend to the edge of the side plate near the printed circuit board 6, so that each pair of slits 38 forms an insert plate 31. By setting the clearance groove, not only can the positioning clip 1 be avoided, but the heat sink body 3 is also separated from the side plate. By setting the slits 38 on the side plate to directly form the insert plate 31, the insert plate 31 and the heat sink body 3 are integrated into one structure, which can reduce the number of parts.

[0052] Specifically, continue to combine Figure 2 The second side plate 37 has two pairs of slits 38, both of which extend vertically and form vertical insert plates 31 located between each pair of slits 38. The insert plate 31 has a convex rib 311 extending horizontally in the middle, which cooperates with the slits 38 on both sides to form an H-shape.

[0053] like Figure 5 As shown, when the insert plate 31 is inserted through the insertion port 13 of the positioning clamp 1, the protruding rib 311 passes over the clamping part 12 and is located below the clamping part 12 to limit the insert plate 31 and prevent the insert plate 31 from coming out of the positioning clamp 1.

[0054] like Figure 1 As shown, and in combination Figure 6 The first side plate 35 and the second side plate 37 extend toward the printed circuit board 6, protruding from the central body 36 and abutting against the first surface 61 of the printed circuit board 6. The heat sink body 3 also includes opposing third and fourth sides, which can also extend toward the printed circuit board 6 to form third and fourth side plates (not shown in the figure), respectively, abutting against the first surface 61 of the printed circuit board 6. The first side plate 35, the third side plate, the second side plate 37, and the fourth side plate are connected end to end to form a shielding cover for surrounding the electronic component 7. The electronic component 7 is located in the enclosed space formed by the shielding cover and the central body 36 of the heat sink body 3, preventing electromagnetic interference (EMI) from affecting the electronic component 7, preventing the electromagnetic waves of the electronic component 7 from interfering with the external environment, and protecting the electronic component 7 from external physical damage, such as dust, moisture, and chemical corrosion, thereby ensuring the reliability, safety, and compliance of the equipment.

[0055] In some embodiments, such as Figure 2As shown, the second positioning component includes a positioning hole 2 on the printed circuit board 6. A positioning guide post 32 is provided on the heat sink body 3, forming the second positioning part, and the positioning guide post 32 is inserted into the positioning hole 2. Using the positioning guide post 32 in conjunction with the positioning hole 2 for second positioning is not only simple in structure but also convenient in operation; during installation and positioning, the positioning guide post 32 can be directly inserted into the positioning hole 2.

[0056] Multiple positioning holes 2 can be provided, and multiple positioning guide posts 32 are provided, each corresponding to one of the positioning holes 2. By providing multiple positioning holes 2 and multiple positioning guide posts 32, the stability after positioning can be ensured, and the tilting of the heat sink body 3 relative to the printed circuit board 6 can be avoided.

[0057] In some embodiments, such as Figure 2 and Figure 4 As shown, the heat sink also includes a heat-conducting plate 4. One side of the heat-conducting plate 4 is in contact with the electronic component 7, and the other side of the heat-conducting plate 4 is in contact with the heat sink body 3, so that the heat sink body 3 is in contact with the electronic component 7 through the heat-conducting plate 4. By setting the heat-conducting plate 4, the heat generated by the electronic component 7 can be quickly conducted to the heat sink body 3, improving heat dissipation efficiency, reducing the operating temperature of the electronic component 7, and avoiding failures caused by high temperature.

[0058] The heat-conducting pad 4 is formed of thermally conductive silicone, thermally conductive grease, or thermally conductive gel. That is, the material of the heat-conducting pad 4 is not limited to thermally conductive silicone; thermally conductive grease, thermally conductive gel, or other thermally conductive materials can also be used. The thermal conductivity of the thermally conductive material depends on the specific power consumption of the electronic component 7 being used.

[0059] like Figure 4 As shown, the heat sink body 3 is generally rectangular in shape and has a first surface 39 facing the printed circuit board 6 and a second surface facing away from the printed circuit board 6. The electronic component 7 is disposed on the first surface 61 of the printed circuit board 6 and has an outer surface facing the first surface 39 of the heat sink body 3. The first surface 39 of the heat sink body 3 is much larger than the outer surface of the electronic component 7. A heat-conducting plate 4 is disposed between the first surface 39 of the heat sink body 3 and the outer surface of the electronic component 7, and is in close contact with both the first surface 39 of the heat sink body 3 and the outer surface of the electronic component 7. Positioning guide posts 32 on the heat sink body 3 are disposed on the portion of the first surface 39 of the heat sink body 3 not covered by the heat-conducting plate 4.

[0060] like Figure 6 As shown, a plurality of heat dissipation fins 5 are provided on the second surface of the heat sink body 3. The plurality of heat dissipation fins 5 are parallel to each other and spaced apart from each other. By setting the heat dissipation fins 5, the surface area in contact with the air can be increased, the heat exchange efficiency can be improved, and heat can be conducted into the air through convection, thereby effectively reducing the temperature of the electronic component 7.

[0061] The design of specific parameters such as the thickness, height, and spacing of the heat sink fins 5 needs to be determined based on the power consumption of the electronic component 7; generally, the greater the power consumption of the electronic component 7, the larger the surface area of ​​the heat sink fins 5 needs to be.

[0062] Both the heat sink body 3 and the heat dissipation fins 5 can be made of aluminum alloy. For example, 6-series aluminum alloy or die-cast aluminum alloy (ADC12, AlSi10MuMg) can be used, with a thermal conductivity greater than 90 W / (m·K).

[0063] In use, firstly, the positioning clip 1 and the electronic component 7 are soldered to the corresponding positions on the PCB board using SMT (Surface Mount Technology) process. Then, the heat dissipation sheet 4 is attached to the outer surface of the electronic component 7. Figure 2 On the upper surface of the heat sink body 3, the positioning guide post 32 is inserted into the positioning hole 2 on the PCB board to prevent the heat sink body 3 from deviating from its installation position; then the insert plate 31 on the heat sink body 3 is inserted into the clamping part 12 in accordance with the guide of the insertion port 13 of the positioning clip 1. The positioning clip 1 clamps the insert plate 31, so that the heat sink body 3 is installed and fixed. At the same time, the heat sink body 3 is pressed onto the heat conduction plate 4, so that the heat conduction plate 4 is tightly clamped between the heat sink body 3 and the electronic component 7.

[0064] This application is easy to install. The heat sink body 3 can be directly inserted into the positioning hole 2 of the PCB board by conforming to the positioning guide post 32. Moreover, the heat sink occupies little space and does not require a huge shell enclosure, which can adapt to some extreme layout environments. Compared with the old shell heat sink, it can significantly reduce the cost of the product.

[0065] The heat sink of this application can be widely used on PCB boards of electronic products in fields such as autonomous driving, smart cockpits, electric drive control, and vehicle communication.

[0066] The above description is intended to be illustrative and not restrictive. Those skilled in the art can make variations, modifications, substitutions, and alterations to the above embodiments within the scope of this disclosure. Moreover, the above examples (or one or more of them) can be used in combination with each other, and these embodiments can be combined with each other in various combinations or arrangements.

Claims

1. A heat sink for electronic components, characterized in that, include: The first positioning component includes a positioning clip, which is fixed to the printed circuit board; A second positioning member is formed on the printed circuit board, and the structure of the second positioning member is different from that of the first positioning member. The heat sink body has a first positioning part and a second positioning part. The heat sink body is detachably positioned on the printed circuit board by the first positioning part cooperating with the first positioning member and the second positioning part cooperating with the second positioning member, and contacts the electronic components on the printed circuit board for heat dissipation of the electronic components.

2. The heat sink for electronic components according to claim 1, characterized in that, The positioning clamp includes two opposing and spaced-apart clamping arms. The first ends of the two clamping arms are fixed to the printed circuit board. The middle parts of the two clamping arms are bent toward each other and pressed together to form a clamping part. The second ends of the two clamping arms are far apart to form an insertion port. The heat sink body is provided with a plug plate protruding towards the printed circuit board. The plug plate forms the first positioning part. The plug plate is inserted into the clamping part through the insertion port, and the clamping part clamps and fixes the plug plate.

3. The heat sink for electronic components according to claim 2, characterized in that, The first ends of the two clamping arms extend toward each other and are joined together to form a bottom arm. The outer wall surface of the bottom arm is flat and is soldered to the first plate surface of the printed circuit board on which the electronic components are located.

4. The heat sink for electronic components according to claim 1, characterized in that, The first positioning component includes a plurality of positioning clips, which are arranged in two rows corresponding to the first and second sides of the radiator body. The first and second sides of the radiator body are respectively provided with a plurality of insert plates that correspond one-to-one with the plurality of positioning clips.

5. The heat sink for electronic components according to claim 4, characterized in that, The heat sink body has a first clearance groove extending in a direction parallel to the first side near its first side, and a second clearance groove extending in a direction parallel to the second side near its second side. The first clearance groove and the second clearance groove divide the heat sink body into a first side plate, a middle body and a second side plate arranged in sequence. The first side plate and the second side plate are respectively provided with a pair of slits. The slits penetrate to the edge of the side plate near the printed circuit board, so that the insert plate is formed between each pair of slits.

6. The heat sink for electronic components according to claim 5, characterized in that, The first side plate and the second side plate extend toward the printed circuit board to protrude from the central body and abut against the first surface of the printed circuit board; The heat sink body also includes a third side and a fourth side opposite to each other, the third side and the fourth side extending toward the printed circuit board to form a third side plate and a fourth side plate respectively, the third side plate and the fourth side plate abutting against the first plate surface of the printed circuit board; The first side plate, the third side plate, the second side plate, and the fourth side plate are connected end to end to form a shielding cover for surrounding the electronic components.

7. The heat sink for electronic components according to claim 1, characterized in that, The second positioning component includes positioning holes disposed on the printed circuit board; The radiator body is provided with a positioning guide post, which forms the second positioning part and is inserted into the positioning hole.

8. The heat sink for electronic components according to claim 1, characterized in that, The heat sink also includes a heat-conducting plate, one side of which is attached to the electronic component and the other side of which is attached to the heat sink body, so that the heat sink body contacts the electronic component through the heat-conducting plate and conducts the heat generated by the electronic component to the heat sink body.

9. The heat sink for electronic components according to claim 8, characterized in that, The thermally conductive sheet is formed of thermally conductive silicone, thermally conductive grease, or thermally conductive gel; and / or The heat sink body is made of aluminum alloy.

10. The heat sink for electronic components according to claim 1, characterized in that, The radiator body is provided with multiple heat dissipation fins, which are parallel to each other and spaced apart from each other.

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