Anti-deformation high-density heat dissipation fin

CN224670159UActive Publication Date: 2026-08-21HUIZHOU SANKOU PRECISION PARTS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202522070740.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-25
Publication Date
2026-08-21
Estimated Expiration
2035-09-25

AI Technical Summary

Technical Problem

当前散热鳍片存在显著技术痛点:为提升单位面积散热面积采用高密度设计时,薄型鳍片易因气流冲击、装配应力或振动发生侧向弯曲,且鳍片与基板连接根部缺乏有效强化结构,常出现断裂失效;传统平直鳍片散热表面积有限,部分增面积改进结构(如异形凸起)易阻碍气流流通,导致风阻增大、鳍片间隙形成涡流死角,降低热交换均匀性;多采用拼接成型工艺,基板与鳍片间存在缝隙热阻,影响热量传导效率,且缺乏轻量化与结构稳定性的平衡设计,难以适配笔记本、迷你主机等紧凑设备

Benefits of technology

[0014]本实用新型的一种防变形高密度散热鳍片,在使用的过程中具有如下至少之一的有益效果:

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224670159U_ABST
    Figure CN224670159U_ABST
Patent Text Reader

Abstract

The utility model discloses a kind of anti-deformation high-density heat dissipation fins, including substrate and several vertical set on the fin unit of substrate surface, several the fin unit is arrayed distribution along the direction parallel to air-cooled airflow, the fin unit includes integrally formed wave-shaped section and trapezoidal reinforcing section, the trapezoidal reinforcing section is located at the junction of fin unit and substrate, the wave-shaped section is located at the top area of fin unit away from substrate, transverse support is equipped between adjacent fin unit, and the transverse support connects the side wall middle part or wave-shaped section area of at least two fin units. With substrate as heat receiving and conducting basis, vertically arranged fin unit is core heat dissipation carrier, and array distribution along air-cooled airflow direction (reduce airflow resistance), and overall structural strength is high, and heat dissipation efficiency is high.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation fin technology, specifically a high-density heat dissipation fin that is resistant to deformation. Background Technology

[0002] As the power of electronic devices (such as CPUs and graphics cards) continues to increase, heat dissipation efficiency has become a core factor restricting their performance release and stable operation. As a key component of air-cooled heat dissipation systems, heat sinks need to balance efficient heat dissipation and structural deformation resistance under high-density layout. Current heat sinks have significant technical pain points: when adopting high-density designs to increase the heat dissipation area per unit area, thin fins are prone to lateral bending due to airflow impact, assembly stress, or vibration, and the lack of effective reinforcement structures at the connection roots between the fins and the substrate often leads to breakage failure; traditional flat fins have limited heat dissipation surface area, and some area-enhancing structural improvements (such as irregular protrusions) can easily obstruct airflow, resulting in increased wind resistance, the formation of vortex dead zones between fins, and reduced heat exchange uniformity; most adopt splicing molding processes, resulting in gaps and thermal resistance between the substrate and fins, affecting heat conduction efficiency, and lacking a balance between lightweight and structural stability, making them difficult to adapt to compact devices such as laptops and mini PCs. Utility Model Content

[0003] In order to overcome the shortcomings of existing technical solutions, this utility model provides a deformation-resistant high-density heat dissipation fin, which can effectively solve the problems mentioned in the background art.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] A high-density heat dissipation fin with anti-deformation properties includes a substrate and a plurality of fin units vertically disposed on the surface of the substrate. The plurality of fin units are arranged in an array along a direction parallel to the airflow of the cooling system. Each fin unit includes an integrally formed wavy section and a trapezoidal reinforcing section. The trapezoidal reinforcing section is located at the connection between the fin unit and the substrate. The wavy section is located in the top region of the fin unit away from the substrate. A transverse support is provided between adjacent fin units. The transverse support connects the middle of the sidewall of at least two fin units or the wavy section region.

[0006] The line connecting the crest and trough of the wave-shaped section is parallel to the direction of the air-cooled airflow. The connection between the trapezoidal reinforcing section and the substrate is provided with reinforcing ribs. The cross-section of the reinforcing ribs is inverted L-shaped or T-shaped. The horizontal section of the reinforcing ribs is attached to the surface of the substrate, and the vertical section of the reinforcing ribs is fixedly connected to the side wall of the trapezoidal reinforcing section.

[0007] As a further description of the above technical solution, the wavelength of the wave-shaped segment is 3-5 times the thickness of the fin unit, the wave height is 1 / 3-1 / 2 of the distance between adjacent fin units, and the ratio of its wavelength to wave height is configured to improve the lateral bending stiffness of the fin unit.

[0008] As a further description of the above technical solution, the waist angle of the trapezoidal reinforcing section is 30-45°, and the height of the trapezoidal reinforcing section is 1 / 4-1 / 3 of the total height of the fin unit.

[0009] As a further description of the above technical solution, the transverse support is composed of several straight bridging pieces, and the straight bridging pieces are provided with weight-reducing holes with a diameter of no more than 0.5 mm.

[0010] As a further description of the above technical solution, a guide groove is provided on the wavy section along the length direction. The depth of the guide groove is less than the thickness of the fin unit, and the width of the guide groove is less than the spacing between adjacent fin units.

[0011] As a further description of the above technical solution, the substrate, fin unit and reinforcing rib are integrally formed of metal material, and the thickness of the substrate is 1.5-3mm.

[0012] As a further description of the above technical solution, the flatness error of the top end face of several fin units is no greater than 0.1 mm, and the spacing between each fin unit is 0.8-1.5 mm.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] The deformation-resistant high-density heat dissipation fin of this utility model has at least one of the following beneficial effects during use:

[0015] Firstly, the substrate, fin units, and reinforcing ribs are integrally molded from metal, eliminating the gaps and thermal resistance of traditional splicing. The 1.5-3mm substrate thickness balances load-bearing strength and thermal conductivity, allowing for rapid and uniform heat transfer and preventing localized heat buildup. The fins are arrayed along the airflow direction, balancing high density and low air resistance. The wavy section at the top increases the heat dissipation area by 25%-35% without obstructing airflow, and the guide channels eliminate vortex dead zones, improving heat exchange uniformity by 15%-20% and significantly enhancing heat dissipation efficiency. Secondly, the trapezoidal reinforcing section and reinforcing ribs form a triangular stability structure, greatly improving the torsional strength at the root. The horizontal support integrates the fins into a single frame, and the optimized wavelength and wave height design of the wavy section increases lateral bending stiffness by 50%-60%, effectively preventing breakage and bending. Thirdly, the weight-reducing holes in the horizontal support reduce weight by 10%-15%, and the fin top flatness of ≤0.1mm reduces airflow leakage, making it suitable for compact devices such as laptops, achieving a balance between efficient heat dissipation, strong resistance to deformation, and lightweight design. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of a deformation-resistant high-density heat dissipation fin according to the present invention;

[0017] Figure 2 This is a side view of the structure of a deformation-resistant high-density heat dissipation fin according to the present invention.

[0018] Figure 3 This is a top view of the structure of a deformation-resistant high-density heat dissipation fin according to the present invention.

[0019] Figure 4 This is a partial perspective structural diagram of a high-density heat dissipation fin that is resistant to deformation according to this utility model.

[0020] Numbering on the map:

[0021] 1. Substrate; 2. Fin unit; 21. Wavy section; 22. Trapezoidal reinforcing section; 3. Reinforcing rib; 4. Flow channel; 5. Lateral support; 51. Weight reduction hole; 52. Straight strip bridging piece. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] like Figure 1-4 As shown, this utility model provides a deformation-resistant high-density heat dissipation fin, including a substrate 1 and a plurality of fin units 2 vertically disposed on the surface of the substrate 1. The plurality of fin units 2 are arranged in an array along a direction parallel to the airflow of the cooling system. Each fin unit 2 includes an integrally formed wavy section 21 and a trapezoidal reinforcing section 22. The trapezoidal reinforcing section 22 is located at the connection between the fin unit 2 and the substrate 1. The wavy section 21 is located in the top region of the fin unit 2 away from the substrate 1. A transverse support member 5 is provided between adjacent fin units 2. The transverse support member 5 connects the middle of the side wall of at least two fin units 2 or the region of the wavy section 21.

[0024] The fin units 2 are arranged in an array parallel to the airflow direction, allowing the airflow to pass through the gaps between the fins in a straight line, avoiding airflow impact resistance caused by the arrangement perpendicular to the airflow direction; at the same time, the fin spacing is designed to be 0.8-1.5mm, balancing between "high density (increasing the number of fins per unit area)" and "low wind resistance (ensuring airflow space)"—a spacing of <0.8mm can easily lead to airflow congestion, while a spacing of >1.5mm will reduce the heat dissipation area density.

[0025] The line connecting the crest and trough of the wave-shaped section 21 is parallel to the direction of the air-cooled airflow. A reinforcing rib 3 is provided at the connection between the trapezoidal reinforcing section 22 and the substrate 1. The cross-section of the reinforcing rib 3 is inverted L-shape or T-shape. The horizontal section of the reinforcing rib 3 is attached to the surface of the substrate 1, and the vertical section of the reinforcing rib 3 is fixedly connected to the side wall of the trapezoidal reinforcing section 22.

[0026] In this embodiment, the substrate 1 serves as the basis for heat reception and conduction, while the vertically arranged fin units 2 act as the core heat dissipation carrier, and are arrayed along the direction of airflow (reducing airflow resistance). The trapezoidal reinforcing section 22 connecting the fin unit 2 to the substrate 1 is responsible for strengthening the stability of the root structure, while the wavy section 21 away from the substrate 1 is responsible for expanding the heat dissipation area. It is supplemented by inverted L-shaped reinforcing ribs 3 (reinforcing the connection between the fins and the substrate 1), straight horizontal support members 5 (resisting lateral deformation), and flow guide grooves 4 of the wavy section 21 (optimizing airflow distribution). Furthermore, the substrate 1, fins, and reinforcing ribs 3 are integrally formed by metal (without splicing thermal resistance), forming a dual-functional structural system of "heat dissipation + anti-deformation".

[0027] The horizontal section is attached to the substrate 1, and the vertical section is fixed to the side wall of the trapezoidal reinforcing section 22, forming a triangular stable structure of "substrate 1-reinforcing rib 3-fin" (the triangular structure is the mechanically optimal stable structure), which can increase the torsional strength at the root by 60%-70% and prevent the fin root from breaking due to vibration or external force.

[0028] Compared to a straight section, the "wavy section 21" at the top of the fins can increase the heat dissipation surface area by 25%-35% (both the crests and troughs of the wave structure participate in heat exchange); and the line connecting the crests and troughs is parallel to the airflow direction, avoiding the wave structure from obstructing the airflow - if the line is perpendicular to the airflow, the crest will form an airflow obstruction surface, causing the flow velocity to drop by more than 30%. This design can ensure smooth airflow while maximizing the use of surface area.

[0029] A "guide groove 4" is set along the length of the wavy section 21. The groove depth is less than the fin thickness and the groove width is less than the fin spacing (to avoid weakening the fin strength or blocking the airflow). This can guide the airflow to "flow in separate channels" on the fin surface, eliminate the "vortex dead angle" of airflow at the edge of the fin (traditional straight fins are prone to forming vortices at the edge, resulting in a 20% decrease in local heat dissipation efficiency), and improve the heat exchange uniformity by 15%-20%.

[0030] Furthermore, the wavelength of the wavy segment 21 is 3-5 times the thickness of the fin unit 2, and the wave height is 1 / 3-1 / 2 of the spacing between adjacent fin units 2. This wavelength-to-wave height ratio is configured to enhance the lateral bending stiffness of the fin unit 2. A wavelength less than 3 times the thickness results in an overly dense wave structure, weakening the overall stiffness; a wavelength greater than 5 times the thickness reduces the surface area increase; a wave height less than 1 / 3 of the spacing cannot effectively increase the area; and a wave height greater than 1 / 2 of the spacing easily leads to collisions between adjacent fin wave structures. This ratio, verified through mechanical simulation, can increase the lateral bending stiffness of the fins by 50%-60% (compared to straight fins).

[0031] Furthermore, the waist angle of the trapezoidal reinforcing section 22 is 30-45°, and the height of the trapezoidal reinforcing section 22 is 1 / 4-1 / 3 of the total height of the fin unit 2. A waist angle of 30-45° and a height of 1 / 4-1 / 3 of the total fin height—a waist angle <30° would lead to excessive root expansion, increasing airflow resistance; >45° would weaken the stress dispersion effect; the 1 / 4-1 / 3 height range allows the root stress dispersion range to cover the key area of ​​the fin height, reducing root bending stress by 40%-50% (the trapezoidal structure converts vertical stress into laterally dispersed stress through its inclined surface).

[0032] Furthermore, the transverse support 5 is composed of several straight bridging plates 52, each with a weight-reducing hole 51, the diameter of which is no greater than 0.5 mm. These straight bridging plates 52 connect the middle of the sidewalls or the wavy section 21 of at least two fins, integrating the dispersed fins into an "integrated frame" and preventing individual fins from swaying independently. The weight-reducing holes 51 (diameter ≤ 0.5 mm) on the bridging plates reduce weight by 10%-15% (lowering the overall load), and because of their small diameter (< 1 / 3 of the fin spacing), they do not weaken the support strength, allowing the lateral deformation of the fins to be controlled within 0.03 mm.

[0033] Furthermore, the wavy section 21 is provided with a guide groove 4 along its length. The depth of the guide groove 4 is less than the thickness of the fin unit 2, and the width of the guide groove 4 is less than the spacing between adjacent fin units 2. This design features integrated molding without splicing, reduced thermal resistance, an approximately 30% increase in heat dissipation area due to the wavy section 21, optimized airflow uniformity due to the guide groove 4, and reduced wind resistance due to the fin array.

[0034] Furthermore, the substrate 1, fin unit 2, and reinforcing rib 3 are integrally formed from metal materials, and the thickness of the substrate 1 is 1.5-3mm. Heat from the heat source is first conducted to the substrate 1. Because the substrate 1, fin unit 2, and reinforcing rib 3 are integrally formed from metal, the gap thermal resistance of traditional spliced ​​structures is eliminated (splicing thermal resistance typically accounts for 15%-20% of the total thermal resistance). Heat can be conducted quickly and evenly along the path "substrate 1 → trapezoidal reinforcing section 22 at the fin root → wavy section 21 at the fin top," avoiding heat dissipation bottlenecks caused by localized heat accumulation. Simultaneously, the substrate 1 thickness is designed to be 1.5-3mm, ensuring sufficient load-bearing strength while avoiding heat conduction delays caused by excessive thickness (metal thermal conductivity is negatively correlated with thickness; this thickness range balances strength and thermal conductivity).

[0035] Furthermore, the flatness error of the top end face of several of the fin units 2 is no greater than 0.1mm, and the spacing between each fin unit 2 is 0.8-1.5mm. A flatness error of ≤0.1mm on the top end face of the fins—if the flatness error is too large, the contact gap with the upper fan and air guide will increase, leading to airflow leakage (for every 0.1mm increase in gap, the airflow leakage rate increases by 8%). This precision ensures a contact gap <0.05mm, increasing airflow utilization by over 90%, while also avoiding assembly stress concentration caused by flatness differences (assembly stress easily causes fin deformation).

[0036] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A high-density heat dissipation fin with deformation resistance, comprising a substrate (1) and a plurality of fin units (2) vertically disposed on the surface of the substrate (1), wherein the plurality of fin units (2) are arranged in an array along a direction parallel to the airflow of cooling air, characterized in that, The fin unit (2) includes an integrally formed wave-shaped section (21) and a trapezoidal reinforcing section (22). The trapezoidal reinforcing section (22) is located at the connection between the fin unit (2) and the substrate (1). The wave-shaped section (21) is located in the top region of the fin unit (2) away from the substrate (1). A transverse support member (5) is provided between adjacent fin units (2). The transverse support member (5) connects the middle of the side wall of at least two fin units (2) or the region of the wave-shaped section (21). The line connecting the crest and trough of the wave-shaped section (21) is parallel to the direction of the air-cooled airflow. A reinforcing rib (3) is provided at the connection between the trapezoidal reinforcing section (22) and the substrate (1). The cross-section of the reinforcing rib (3) is inverted L-shape or T-shape. The horizontal section of the reinforcing rib (3) is attached to the surface of the substrate (1). The vertical section of the reinforcing rib (3) is fixedly connected to the side wall of the trapezoidal reinforcing section (22).

2. The anti-deformation high-density heat dissipation fin according to claim 1, characterized in that: The wavelength of the wave-shaped segment (21) is 3-5 times the thickness of the fin unit (2), the wave height is 1 / 3-1 / 2 of the distance between adjacent fin units (2), and the ratio of its wavelength to wave height is configured to enhance the lateral bending stiffness of the fin unit (2).

3. The anti-deformation high-density heat dissipation fin according to claim 1, characterized in that: The waist angle of the trapezoidal reinforcing section (22) is 30-45°, and the height of the trapezoidal reinforcing section (22) is 1 / 4-1 / 3 of the total height of the fin unit (2).

4. The anti-deformation high-density heat dissipation fin according to claim 1, characterized in that: The transverse support (5) is composed of several straight bridging pieces (52), and the straight bridging pieces (52) are provided with weight reduction holes (51), the diameter of which is no greater than 0.5mm.

5. The anti-deformation high-density heat dissipation fin according to claim 1, characterized in that: The wave-shaped section (21) is provided with a guide groove (4) along its length direction. The depth of the guide groove (4) is less than the thickness of the fin unit (2), and the width of the guide groove (4) is less than the spacing between adjacent fin units (2).

6. The anti-deformation high-density heat dissipation fin according to claim 1, characterized in that: The substrate (1), fin unit (2) and reinforcing rib (3) are integrally formed from metal materials, and the thickness of the substrate (1) is 1.5-3mm.

7. The anti-deformation high-density heat dissipation fin according to claim 1, characterized in that: The flatness error of the top end face of several of the fin units (2) is no greater than 0.1 mm, and the spacing between each of the fin units (2) is 0.8-1.5 mm.