Pressure gauge heat dissipation system
Patent Information
- Application Number
- CN202522084535.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-28
- Publication Date
- 2026-08-21
- Estimated Expiration
- 2035-09-28
AI Technical Summary
[0011] As can be seen, in the pressure gauge heat dissipation system provided by this embodiment of the present invention, on the one hand, heat dissipation of the pressure gauge is achieved through the coordinated use of an adjustable heat dissipation element and a heat exchange enhancement structure. On the other hand, since the output of the adjustable heat dissipation element is adjustable, and this adjustment is based on the target operating temperature of the pressure gauge, and since the target operating temperature of the pressure gauge is the temperature that ensures stable operating performance of the pressure gauge, the output of the adjustable heat dissipation element, combined with the heat exchange enhancement structure, can accelerate the heat transfer efficiency of the heat exchange enhancement structure while accurately and reliably maintaining the actual operating temperature of the pressure gauge within the target operating temperature range. This avoids zero-point drift of the pressure gauge at high temperatures, thereby ensuring accurate and stable measurement results. Therefore, the technical solution provided by this embodiment of the present invention can improve the measurement accuracy and stability of the pressure gauge.
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Figure CN224670161U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor technology, specifically to a pressure gauge heat dissipation system. Background Technology
[0002] In the semiconductor industry, pressure gauges are core sensing devices specifically designed to monitor and control the pressure of various fluids (gas / liquid) during semiconductor manufacturing. Their accuracy, stability, and anti-interference capabilities directly impact wafer fabrication yield and process consistency. For example, processes such as Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) require a vacuum environment. These processes necessitate the use of pressure gauges to provide feedback on pressure values within chambers or pipelines, ensuring process stability and product quality. The accuracy of pressure gauge measurements is fundamental to ensuring the stability of the entire semiconductor manufacturing process, wafer yield, equipment safety, and cost control.
[0003] Therefore, how to provide technical solutions to improve the measurement accuracy and stability of pressure gauges has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0004] To address the aforementioned issues, this application provides a pressure gauge heat dissipation system to improve the measurement accuracy and stability of the pressure gauge.
[0005] In a first aspect, embodiments of this application provide a pressure gauge heat dissipation system, including:
[0006] pressure gauge;
[0007] A heat exchange enhancement structure is fixedly installed on the outer wall of the pressure gauge housing to transfer heat from inside the pressure gauge to the external environment;
[0008] An adjustable heat dissipation element is fixedly installed on the outer wall of the pressure gauge housing, and the fixed position of the adjustable heat dissipation element corresponds to the heat dissipation area of the heat exchange enhancement structure.
[0009] The output of the adjustable heat dissipation element is adjustable according to the target operating temperature of the pressure gauge. The output of the adjustable heat dissipation element, combined with the heat exchange enhancement structure, dissipates heat from the pressure gauge, so that the actual operating temperature of the pressure gauge is maintained within the target temperature range.
[0010] The pressure gauge heat dissipation system provided in this application includes: a pressure gauge; a heat exchange enhancement structure fixedly installed on the outer wall of the pressure gauge housing for transferring heat from inside the pressure gauge to the external environment; and an adjustable heat dissipation element fixedly installed on the outer wall of the pressure gauge housing, wherein the fixed position of the adjustable heat dissipation element corresponds to the heat dissipation area of the heat exchange enhancement structure; wherein the output of the adjustable heat dissipation element is adjustable according to the target operating temperature of the pressure gauge, so that the output of the adjustable heat dissipation element combined with the heat exchange enhancement structure dissipates heat from the pressure gauge, thereby maintaining the actual operating temperature of the pressure gauge within the target temperature range.
[0011] As can be seen, in the pressure gauge heat dissipation system provided by this embodiment of the present invention, on the one hand, heat dissipation of the pressure gauge is achieved through the coordinated use of an adjustable heat dissipation element and a heat exchange enhancement structure. On the other hand, since the output of the adjustable heat dissipation element is adjustable, and this adjustment is based on the target operating temperature of the pressure gauge, and since the target operating temperature of the pressure gauge is the temperature that ensures stable operating performance of the pressure gauge, the output of the adjustable heat dissipation element, combined with the heat exchange enhancement structure, can accelerate the heat transfer efficiency of the heat exchange enhancement structure while accurately and reliably maintaining the actual operating temperature of the pressure gauge within the target operating temperature range. This avoids zero-point drift of the pressure gauge at high temperatures, thereby ensuring accurate and stable measurement results. Therefore, the technical solution provided by this embodiment of the present invention can improve the measurement accuracy and stability of the pressure gauge. Attached Figure Description
[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0013] Figure 1 This is a structural schematic diagram of the pressure gauge heat dissipation system provided in an embodiment of the present invention;
[0014] Figure 2 This is a schematic diagram of a heat exchange enhancement structure in the pressure gauge heat dissipation system provided in this embodiment of the utility model;
[0015] Figure 3 This is another structural schematic diagram of the pressure gauge heat dissipation system provided in this embodiment of the utility model;
[0016] Figure 4 This is a schematic diagram of the structure of an adjustable heat dissipation element provided in an embodiment of the present invention. Detailed Implementation
[0017] In semiconductor manufacturing, processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD) require a vacuum environment. These processes necessitate the use of pressure gauges to monitor pressure within chambers or pipelines, ensuring process stability and product quality. Currently, commonly used high-temperature pressure gauges (such as CDG160 and CDG200) typically maintain a contact temperature below 200 degrees Celsius at the gooseneck VCR (Vacuum Coupling Radius) connector. However, these gauges face even greater temperature challenges in practical applications. During semiconductor manufacturing, chamber temperatures may need to be maintained between 100°C and 250°C, and some specialized gas pipelines may even require preheating to 100°C to 230°C.
[0018] When a pressure gauge is connected to a special gas pipeline or cavity, temperature is transferred to the gauge's interior through the metal, causing zero-point drift. This not only reduces the gauge's measurement accuracy but may also accelerate its aging process and even damage the sensor. Generally, when the gauge surface temperature exceeds 70°C, significant zero-point drift occurs, posing a serious threat to process stability and success rate. Therefore, effectively controlling the pressure gauge's operating temperature to ensure accurate operation in high-temperature environments has become a pressing technical challenge.
[0019] Based on this, this utility model provides a pressure gauge heat dissipation system to improve the measurement accuracy and stability of the pressure gauge.
[0020] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the improved pressure gauge heat dissipation system according to an embodiment of the present invention.
[0021] like Figure 1 As shown, the pressure gauge heat dissipation system includes:
[0022] Pressure gauge 1;
[0023] The heat exchange enhancement structure 2 is fixedly installed on the outer wall of the housing of the pressure gauge 1, and is used to transfer the heat inside the pressure gauge 1 to the external environment;
[0024] An adjustable heat dissipation element 3 is fixedly installed on the outer wall of the housing of the pressure gauge 1, and the fixed position of the adjustable heat dissipation element 3 corresponds to the heat dissipation area of the heat exchange enhancement structure 2.
[0025] The output of the adjustable heat dissipation element 3 is adjustable according to the target operating temperature of the pressure gauge 1. The output of the adjustable heat dissipation element, combined with the heat exchange enhancement structure 2, dissipates heat from the pressure gauge 1, so that the actual operating temperature of the pressure gauge 1 is maintained within the target temperature range.
[0026] The heat exchange enhancement structure 2 is a structural design or functional component that can reduce thermal resistance and accelerate heat transfer by changing the "solid heat conduction path morphology", "fluid (air / liquid) flow mode" or "heat exchange interface area". Through design optimization, it maximizes the heat exchange efficiency between the structural surface and the fluid (air / liquid).
[0027] The adjustable heat dissipation element 3 can work in conjunction with the heat exchange enhancement structure 2 to improve the heat transfer efficiency of the heat exchange enhancement structure 2.
[0028] The essence of heat exchange is the transfer of heat between different media (such as solid-air, solid-liquid); therefore, the heat dissipation area of the heat exchange enhancement structure 2 can be the area where two media are in direct contact and heat transfer occurs.
[0029] The fixed position of the adjustable heat dissipation element 3 is set to correspond to the heat dissipation area, so as to better assist the heat transfer of the heat exchange enhancement structure 2 and improve the heat transfer efficiency.
[0030] On the other hand, the heat transfer of the adjustable heat dissipation element 3 to assist the heat exchange enhancement structure 2 is mainly reflected in the output of the adjustable heat dissipation element 3. Therefore, in this embodiment of the present invention, the output of the adjustable heat dissipation element 3 is designed to be adjustable, and its output is adjusted according to the actual working temperature of the pressure gauge 1. Therefore, when the output is adjusted based on the actual working temperature, the adjusted output can be combined with the heat exchange enhancement structure 2 to accelerate the heat transfer efficiency of the heat exchange enhancement structure 2 to the inside of the pressure gauge 1, and also to ensure that the actual working temperature of the pressure gauge 1 can always meet the target working temperature, so that the actual working temperature of the pressure gauge 1 is maintained within the range of the target working temperature.
[0031] At the same time, by using the adjustable heat dissipation element 3 and the heat exchange enhancement structure 2 in conjunction, the actual operating temperature of the pressure gauge 1 can be maintained at the target operating temperature, ensuring the stable working performance of the pressure gauge 1, thereby effectively slowing down the aging rate of the pressure gauge 1 and improving its service life.
[0032] The target operating temperature is the "ideal temperature range" used to ensure that the pressure gauge 1 can operate stably and reliably. It is essentially the "design benchmark of the heat dissipation system" and can be determined by combining the hardware characteristics, operating requirements and environmental conditions of the pressure gauge 1.
[0033] As can be seen, in the pressure gauge heat dissipation system provided by this embodiment of the present invention, on the one hand, the adjustable heat dissipation element 3 and the heat exchange enhancement structure 2 work together to dissipate heat from the pressure gauge 1. On the other hand, since the output of the adjustable heat dissipation element 3 is adjustable, and this adjustment is based on the target operating temperature of the pressure gauge 1, and since the target operating temperature of the pressure gauge is the temperature that ensures the pressure gauge 1 has stable operating performance, the output of the adjustable heat dissipation element 3, combined with the heat exchange enhancement structure 2, can accelerate the heat transfer efficiency of the heat exchange enhancement structure 2 while accurately and reliably maintaining the actual operating temperature of the pressure gauge 1 within the target operating temperature range. This avoids zero-point drift of the pressure gauge 1 at high temperatures, thereby ensuring accurate and stable measurement results. Therefore, the technical solution provided by this embodiment of the present invention can improve the measurement accuracy and stability of the pressure gauge 1.
[0034] To enable adjustable output of the adjustable heat dissipation element 3, in one embodiment, the pressure gauge heat dissipation system may further include:
[0035] A control unit, which is electrically connected to the adjustable heat dissipation element 3, is used to regulate the output of the adjustable heat dissipation element 3 based on the target operating temperature.
[0036] A temperature sensing element is used to measure the actual operating temperature of the pressure gauge 1 in real time; the temperature sensing element is disposed on the outer wall of the housing of the pressure gauge 1, or disposed between the heat exchange enhancement structure 2 and the adjustable heat dissipation element 3.
[0037] The control component is also used to be electrically connected to the temperature sensing element, to receive the actual operating temperature measured by the temperature sensing element, and to determine a temperature compensation value based on the actual operating temperature and the target temperature, so as to adjust the output of the adjustable heat dissipation element 3 based on the temperature compensation value to obtain the adjusted output.
[0038] The control component can be set independently of the pressure gauge 1, the heat exchange enhancement structure 2, and the adjustable heat dissipation element 3, ensuring that the control component, the adjustable heat dissipation element 3, and the temperature measuring element are electrically connected.
[0039] The temperature sensing element can measure the actual working temperature of the pressure gauge 1 in real time, thereby achieving the purpose of real-time monitoring of the working status of the pressure gauge 1. The measured actual working temperature is then sent to the control component through the signal output terminal of the temperature sensing element, thereby realizing the automatic regulation of the actual working temperature based on the control component.
[0040] In one alternative implementation, the process by which the control unit determines the temperature compensation value may include the following steps:
[0041] First, after receiving the actual operating temperature, the control unit determines the temperature difference based on the target operating temperature, and calculates the output of the adjustable heat dissipation element 3 based on the temperature difference, that is, calculates the temperature compensation value.
[0042] Next, after calculating the temperature compensation value, the temperature compensation value is converted into a signal that can be recognized by the adjustable heat dissipation element 3, so as to drive the adjustable heat dissipation element 3 to adjust the output and obtain the adjusted output.
[0043] Optionally, after the output is regulated, the actual operating temperature measured in real time by the temperature sensing element can be used to determine whether it is within the range of the target operating temperature. This will determine whether the heat dissipation of the pressure gauge 1 based on the regulated output combined with the heat exchange enhancement structure can meet the normal operating requirements of the pressure gauge 1, thereby avoiding zero drift of the pressure gauge 1 and improving the measurement accuracy and stability of the pressure gauge 1.
[0044] Since the temperature sensing element is mainly used to measure the actual working temperature of the pressure gauge 1, it can be set on the outer wall of the pressure gauge 1 housing and directly contact the pressure gauge 1 body. This allows for the integrated acquisition of "pressure-temperature" parameters, simplifies installation, and accurately correlates with the temperature influence of the local environment where the pressure gauge 1 is located.
[0045] Alternatively, the temperature sensing element can be placed between the adjustable heat dissipation element 3 and the heat exchange enhancement structure 2, thereby accurately capturing the true temperature of the key heat dissipation link, so as to more efficiently and reliably control the adjustable heat dissipation element 3, while avoiding the temperature sensing element itself from being interfered with by extreme environments.
[0046] Optionally, the temperature sensing element can be an adhesive temperature sensor, which facilitates the setting of the temperature sensing element. For example, when using an adhesive temperature sensor, it can be directly adhered between the outer wall of the housing of the pressure gauge 1 / the adjustable heat dissipation element 3 and the heat exchange enhancement structure 2 for real-time measurement of the actual operating temperature of the pressure gauge 1.
[0047] In one embodiment, the control component may include: a main controller and a sensor interface;
[0048] The main controller is used to receive the actual operating temperature measured by the temperature sensing element, and calculate the temperature compensation value based on the target temperature and the actual operating temperature;
[0049] The sensor interface is used to receive the temperature compensation value and adjust the adjustable heat dissipation element based on the temperature compensation value, so that the output of the adjustable heat dissipation element after adjustment, combined with the heat exchange enhancement structure, adjusts the actual working temperature to the target temperature range.
[0050] The control unit uses the main controller to calculate the temperature compensation value and uses a sensor interface to transmit the temperature compensation value (e.g., a signal that can be identified by an adjustable heat dissipation element based on the temperature compensation value conversion). Thus, the calculation part and the output part of the temperature compensation value are implemented with independent hardware. By splitting the hardware functions, each module can focus on its own core task, avoiding interference at the physical level and decoupling functions at the logical level. Ultimately, this ensures that the temperature compensation value acts accurately, in real time, and stably on the pressure gauge heat dissipation system.
[0051] For example, the main controller can be an industrial-grade microcontroller with an integrated temperature compensation algorithm. It can automatically calculate the temperature compensation value of the pressure gauge 1 based on the actual working temperature measured by the temperature sensing element and the target working temperature. It can also adjust the output of the adjustable heat dissipation element 3 through the sensor interface so that the actual working temperature of the pressure gauge 1 is within the range of the target working temperature.
[0052] In other embodiments, the control component may further include a display screen for displaying and setting process parameters, allowing the user to view the current operating status and historical information of the pressure gauge 1. This visualization solves the problems of the pressure gauge 1's invisible status, unclear operational feedback, and difficulty in tracing historical data, ultimately ensuring stable operation of the pressure gauge 1, simplifying operation management, and assisting in optimized decision-making.
[0053] Please continue to refer to this. Figure 1 In one embodiment, the pressure gauge heat dissipation system may further include: a fixing component 4 for fixing the heat exchange enhancement structure 2 to the outer wall of the housing of the pressure gauge 1.
[0054] The fixing component 4 ensures the installation stability of the heat exchange enhancement structure 2. Furthermore, by using an independent fixing component 4 to securely mount the heat exchange enhancement structure 2 to the outer wall of the housing, the fixing requirements of the heat exchange enhancement structure 2 are decoupled from the functional requirements of the pressure gauge 1's housing. In other words, the independent fixing component 4 satisfies both the installation stability and heat dissipation efficiency of the heat exchange enhancement structure 2, while maximizing the protection of the integrity, sealing, and measurement accuracy of the pressure gauge 1's housing and internal precision components. It also considers scenario adaptability and ease of maintenance, avoiding the problem of sacrificing the core performance of the pressure gauge 1 for heat dissipation.
[0055] In one embodiment, the heat exchange enhancement structure 2 can be a heat dissipation fin 21.
[0056] Please refer to Figure 2 , Figure 2 This is a schematic diagram of a heat exchange enhancement structure in a pressure gauge heat dissipation system provided in an embodiment of this utility model.
[0057] like Figure 2As shown, the heat dissipation fins 21 may include a heat-conducting base 211 and an array of fins 212, and the area formed by the array of fins 212 is a heat dissipation area;
[0058] The inner wall contour of the heat-conducting base 211 matches the outer wall contour of the outer shell of the pressure gauge 1, and the array fins 212 are disposed on the outer wall of the heat-conducting base 211.
[0059] When the heat dissipation fins 21 are attached to the outer wall of the housing of the pressure gauge 1, the heat dissipation fins 21 are fixedly attached to the outer wall of the housing of the pressure gauge 1 by the fixing component 4.
[0060] The heat dissipation fins 21 can be made as follows: Figure 2 The arc shape shown is adapted to the outer wall of the pressure gauge 1 housing, and the heat dissipation fins 21 are locked and fixed to the outer wall of the pressure gauge 1 housing by the fixing component 4.
[0061] The heat transfer path of the heat sink fins 21 is as follows: heat inside the pressure gauge 1 (heat source) → heat-conducting base 211 (usually in direct contact with the pressure gauge 1, where heat is first collected) → array fins 212 (which diffuses heat to all fin teeth through heat conduction) → air (which carries away heat from the fin surface through convection). By placing the adjustable heat dissipation element 3 at a position corresponding to the array fins 212 of the heat sink fins 21, its output can accelerate convection, thereby improving the heat transfer efficiency of the heat sink fins 21.
[0062] The array fins 212, by arranging multiple thin metal fins in a parallel and dense manner (such as in a comb-like or fence-like pattern), effectively divide the originally single "large plane" into dozens or even hundreds of "small planes," thus exponentially increasing the total heat dissipation area. A larger total heat dissipation area means more heat exchange interfaces in contact with the air, resulting in higher heat transfer efficiency. Therefore, the heat dissipation fins 21, with their thermally conductive base and array fin design, can achieve a small-volume, high-efficiency heat dissipation effect, accelerating the transfer of internal heat from the pressure gauge 1.
[0063] Optionally, the material of each fin arranged in the array fin 212 is aluminum alloy, copper, molybdenum, or silicon carbide. Aluminum alloy, copper, molybdenum, or silicon carbide are materials with high thermal conductivity. By using materials with high thermal conductivity, the array fin 212 made of them can have better heat conduction effect and can quickly conduct heat to the external environment of the pressure gauge 1.
[0064] In other embodiments, the heat exchange enhancement structure 2 may also be a heat pipe, a heat spreader, a microchannel, or other similar structure.
[0065] Among them, the heat pipe has high thermal conductivity, which can quickly transfer the heat inside the pressure gauge 1 to the external environment.
[0066] Optionally, the heat sink 21 and the heat pipe can be used together to transfer the heat inside the pressure gauge 1. For example, one end of the heat pipe can be in close contact with the heat-generating component of the pressure gauge 1, and the other end can be installed on the heat sink 21 to achieve rapid heat transfer.
[0067] A vapor chamber is a highly efficient heat dissipation structure with excellent temperature uniformity and high thermal conductivity, capable of evenly distributing heat across the entire surface with minimal temperature differences. When pressure gauge 1 is in a high-temperature environment or measuring a high-temperature medium, excessive temperature may occur, affecting measurement accuracy or even damaging the device. In such cases, effective heat dissipation measures are required. The vapor chamber, by being in close contact with the heat-generating components of pressure gauge 1, rapidly conducts heat away, thereby reducing the temperature of pressure gauge 1 and ensuring its normal operation.
[0068] Microchannels can increase the heat transfer area and improve heat transfer efficiency. Microchannels can be integrated inside or outside the pressure gauge 1 as heat dissipation channels. For example, in some miniaturized, highly integrated pressure gauges, the use of microchannel heat dissipation structures can achieve efficient heat dissipation within a limited space, ensuring the normal operation of the pressure gauge.
[0069] The heat dissipation fins 21, the heat spreader, the microchannel, and the heat pipe described in the foregoing embodiments can be used individually or in combination to meet the heat dissipation requirements of the pressure gauge 1.
[0070] Please combine Figure 2 refer to Figure 3 , Figure 3 This is another structural schematic diagram of the pressure gauge heat dissipation system provided in this embodiment of the utility model.
[0071] like Figure 2 and Figure 3 As shown, the fixing component 4 can be a clamp sheet metal 41; the heat dissipation fin 21 is a clamp-fixed heat dissipation fin; the heat-conducting base 211 is a clamp-fixed heat-conducting base; the clamp-fixed heat dissipation fin also includes at least one first snap-fit structure 213, which is arranged on both sides of the clamp-fixed heat-conducting base along the diameter D of the pressure gauge 1.
[0072] The inner wall contour of the clamp sheet metal 41 fits the outer wall contour of the pressure gauge 1, and a second snap-fit structure 42 matching the first snap-fit structure 213 is provided at both ends of the clamp sheet metal 41.
[0073] The clamp sheet metal 41 surrounds the area on the outer wall of the outer shell where the clamp-fixed heat dissipation fins are not provided, and the two ends of the clamp sheet metal 41 are respectively connected to the two sides of the clamp-fixed heat-conducting base, so as to fix the clamp-fixed heat dissipation fins to the outer wall of the outer shell through the first snap-fit structure 213 and the second snap-fit structure 42.
[0074] The outline of the clamp sheet metal 41 matches the outline of the outer wall of the pressure gauge 1. Therefore, the compatibility, protection and maintainability issues between the heat exchange enhancement structure 2 and the heat conduction base 211 can be solved through the encircling structure of the clamp sheet metal 41.
[0075] The clamping structure (first clamping structure 213 and second clamping structure 42) is used to fix the clamping sheet metal 41 to the heat-conducting base 211 of the heat exchange enhancement structure 2. This can solve the problem of efficient assembly in a compact space, ensure connection reliability and adaptability to working conditions, control the total life cycle cost, and not damage the two core functions of heat dissipation and measurement accuracy. It is fully compatible with the characteristics and usage requirements of the pressure gauge 1.
[0076] In other embodiments, the fixing component 4 may be an adhesive; the heat dissipation fins 21 may be wraparound heat dissipation fins; and the thermally conductive base may be a wraparound thermally conductive base to surround the outer wall of the housing.
[0077] The surrounding heat-conducting base is bonded to the outer wall of the housing using the adhesive, thereby fixing the surrounding heat dissipation fins to the outer wall of the housing.
[0078] Using adhesive to fix the wraparound heat sink fins not only facilitates their fixation but also further increases the total heat dissipation area of the wraparound heat sink fins, thereby improving heat dissipation efficiency.
[0079] For example, the heat dissipation fins 21 can be corrugated heat sinks. Corrugated heat sinks are heat dissipation elements formed by processing a substrate (such as aluminum alloy or copper) into a continuous undulating "corrugated" structure. Their core design principle is to optimize heat transfer paths and airflow efficiency within a limited space. The "crests" and "troughs" of the corrugations form a three-dimensional structure. Compared to traditional flat heat sinks, heat can not only be transferred to the air through the "corrugated surface," but also dissipate heat in multiple directions through the gaps between adjacent corrugations, avoiding the problem of localized heat accumulation in flat heat sinks.
[0080] Please combine Figure 3 refer to Figure 4 , Figure 4 This is a schematic diagram of the structure of an adjustable heat dissipation element provided in an embodiment of the present invention.
[0081] like Figure 3 and Figure 4As shown, the adjustable heat dissipation element 3 is an adjustable fan assembly 31; the adjustable fan assembly 31 includes: an adjustable speed motor and fan blades;
[0082] The adjustable speed motor is used to adjust the rotation direction and / or speed of the fan blades to form an adjusted output.
[0083] The rotation direction of the fan blades can determine the direction of airflow (e.g., forward rotation blows cold air, reverse rotation draws in hot air), and the rotation speed can determine the intensity of airflow (e.g., high speed corresponds to large air volume, low speed corresponds to small air volume). The control logic of the two can be independent of each other. Therefore, the rotation direction and / or speed of the fan blades can be flexibly adjusted by an adjustable speed motor according to actual needs, so as to maintain the actual working temperature of pressure gauge 1 within the target working temperature range.
[0084] For example, the adjustable speed motor can be a low-noise, low-power stepper motor. Since a stepper motor is an open-loop control element that converts electrical pulse signals into angular or linear displacement, under non-overload conditions, the motor's speed and stopping position depend only on the frequency and number of pulse signals, and are unaffected by load changes. Therefore, a stepper motor can simultaneously adjust the fan blade's speed and direction of rotation, and also supports independent adjustment of both.
[0085] The fan blades can be made of high-temperature resistant plastic material. The rotation direction and / or speed of the fan blades can be switched by a stepper motor as needed to achieve precise cooling or heat dissipation of the pressure gauge 1.
[0086] The adjustable speed motor can be electrically connected to the control unit. Based on the signal converted from the temperature compensation value calculated by the control unit, the rotation direction and / or speed of the fan blades can be adjusted so that the actual working temperature of the pressure gauge 1 is within the target working temperature range.
[0087] In one embodiment, the adjustable fan assembly 31 is mounted to an accessory door panel on the outer wall of the housing via a fan mounting assembly;
[0088] The fan mounting assembly includes a fan mounting bracket and a locking structure. The adjustable fan assembly 31 is mounted via the fan mounting bracket, and the fan mounting bracket is fixedly mounted to the accessory door panel on the outer wall of the housing via the locking structure.
[0089] The locking structure is either a snap-fit or a thread.
[0090] The fan mounting bracket can be made of aluminum alloy and fixed to the door panel of the housing accessory of the pressure gauge 1 by a locking structure such as a buckle or thread.
[0091] The door panel of the housing accessory of pressure gauge 1 can refer to the housing accessory panel that covers / protects the pressure gauge body or interface and can be opened / removed.
[0092] By utilizing the inherent structure of the pressure gauge 1 itself—the door panel of the outer casing accessory—the adjustable fan assembly 31 can be fixedly installed. This not only takes advantage of the door panel's load-bearing capacity, openability, and spatial position, but also solves the pressure gauge's heat dissipation needs in a low-cost and efficient manner, while avoiding damage to the main structure and protective performance of the equipment.
[0093] Please continue to refer to this. Figure 2 and Figure 3 The pressure gauge heat dissipation system may further include:
[0094] Vacuum connection radial sealing joint 5 is connected to the gooseneck 11 of the pressure gauge 1;
[0095] Special gas pipeline 6 is connected to the vacuum connection radial sealing joint 5.
[0096] The gooseneck 11 refers to a flexible but dimensionally or shape-stable arm-like structure. It can be composed of coiled metal tubes, or it can be hollow or solid, made of materials such as metal or plastic, and can be spirally coiled or have other structures. The function of the gooseneck is to allow the components connected to it (such as the operating unit of the pressure gauge 1, the radial sealing joint 5 of the vacuum connection, etc.) to be positioned relatively freely in space, while maintaining a certain degree of stability.
[0097] VCR connector 5 adopts a metal-to-metal sealing method. The interlocking of internal and external threads causes the flanges on both sides to press against the metal gasket. The gasket deforms and fills the gap, which can achieve leak-free service in the range of vacuum to positive pressure. It can effectively prevent gas leakage at the gooseneck 11 connection of pressure gauge 1, and ensure the accuracy of pressure measurement and the safety of the system.
[0098] Furthermore, since the special gas pipeline 6 is used to transport high-purity special gases, such as silane and ammonia used in semiconductor manufacturing, it has extremely high requirements for the sealing performance and purity of the pipeline connections. The VCR connector 5 is a pipeline connection specifically designed for high-purity and ultra-high-purity applications. It possesses high-purity metal-to-metal sealing performance, providing leak-free service within a vacuum to positive pressure range, with an extremely low leakage rate and high pressure resistance. Therefore, the characteristics of the VCR connector 5 meet these requirements of the special gas pipeline 6, making it widely used in special gas delivery systems.
[0099] The foregoing describes multiple embodiments of the present invention. The optional methods described in each embodiment can be combined and cross-referenced without conflict, thereby extending to a variety of possible embodiments. These can all be considered as embodiments disclosed or made public by the present invention.
[0100] While this application discloses the above information, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of this application; therefore, the scope of protection of this application shall be determined by the scope defined in the claims.
Claims
1. A pressure gauge heat dissipation system, characterized in that, include: pressure gauge; A heat exchange enhancement structure is fixedly installed on the outer wall of the pressure gauge housing to transfer heat from inside the pressure gauge to the external environment; An adjustable heat dissipation element is fixedly installed on the outer wall of the pressure gauge housing, and the fixed position of the adjustable heat dissipation element corresponds to the heat dissipation area of the heat exchange enhancement structure. The output of the adjustable heat dissipation element is adjustable according to the target operating temperature of the pressure gauge. The output of the adjustable heat dissipation element, combined with the heat exchange enhancement structure, dissipates heat from the pressure gauge, so that the actual operating temperature of the pressure gauge is maintained within the target temperature range.
2. The pressure gauge heat dissipation system as described in claim 1, characterized in that, Also includes: A control unit electrically connected to the adjustable heat dissipation element to regulate the output of the adjustable heat dissipation element based on the target operating temperature; A temperature sensing element is used to measure the actual operating temperature of the pressure gauge in real time; the temperature sensing element is disposed on the outer wall of the pressure gauge housing, or disposed between the heat exchange enhancement structure and the adjustable heat dissipation element; The control component is also used to be electrically connected to the temperature sensing element, to receive the actual operating temperature measured by the temperature sensing element, and to determine a temperature compensation value based on the actual operating temperature and the target temperature, so as to adjust the output of the adjustable heat dissipation element based on the temperature compensation value to obtain the adjusted output.
3. The pressure gauge heat dissipation system as described in claim 2, characterized in that, Also includes: A fixing component is used to fix the heat exchange enhancement structure to the outer wall of the pressure gauge housing.
4. The pressure gauge heat dissipation system as described in claim 3, characterized in that, The heat exchange enhancement structure is a heat dissipation fin; the heat dissipation fin includes a heat-conducting base and an array of fins, and the area formed by the array of fins is a heat dissipation area; The inner wall contour of the heat-conducting base matches the outer wall contour of the pressure gauge housing, and the array fins are disposed on the outer wall of the heat-conducting base. When the heat dissipation fins are attached to the outer wall of the pressure gauge housing, the heat dissipation fins are fixedly attached to the outer wall of the pressure gauge housing by the fixing component.
5. The pressure gauge heat dissipation system as described in claim 4, characterized in that, The fixing component is a clamp sheet metal; the heat dissipation fins are clamp-fixed heat dissipation fins; the heat-conducting base is a clamp-fixed heat-conducting base; the clamp-fixed heat dissipation fins also include at least one first snap-fit structure, which is arranged on both sides of the clamp-fixed heat-conducting base along the diameter of the pressure gauge. The inner wall contour of the clamp sheet metal fits the outer wall contour of the pressure gauge housing, and a second snap-fit structure matching the first snap-fit structure is provided at both ends of the clamp sheet metal. The clamp sheet metal surrounds the area on the outer wall of the housing where the clamp-fixed heat dissipation fins are not provided, and the two ends of the clamp sheet metal are respectively connected to the two sides of the clamp-fixed heat-conducting base, so as to fix the clamp-fixed heat dissipation fins to the outer wall of the housing through the first snap-fit structure and the second snap-fit structure.
6. The pressure gauge heat dissipation system as described in claim 4, characterized in that, The fixing component is an adhesive; the heat dissipation fins are wraparound heat dissipation fins; the thermally conductive base is a wraparound thermally conductive base to surround the outer wall of the outer casing; The surrounding heat-conducting base is bonded to the outer wall of the housing using the adhesive, thereby fixing the surrounding heat dissipation fins to the outer wall of the housing.
7. The pressure gauge heat dissipation system as described in claim 4, characterized in that, The material of each fin arranged in the array is aluminum alloy, copper, molybdenum, or silicon carbide.
8. The pressure gauge heat dissipation system as described in claim 1, characterized in that, The adjustable heat dissipation element is an adjustable fan assembly; the adjustable fan assembly includes a speed-adjustable motor and fan blades. The adjustable speed motor is used to adjust the rotation direction and / or speed of the fan blades to form an adjusted output.
9. The pressure gauge heat dissipation system as described in claim 8, characterized in that, The adjustable fan assembly is mounted to the accessory door panel on the outer wall of the housing via a fan mounting assembly; The fan mounting assembly includes a fan mounting bracket and a locking structure. The adjustable fan assembly is mounted via the fan mounting bracket, and the fan mounting bracket is fixedly mounted to the accessory door panel on the outer wall of the housing via the locking structure. The locking structure is either a snap-fit or a thread.
10. The pressure gauge heat dissipation system as described in claim 2, characterized in that, The control components include: a main controller and a sensor interface; The main controller is used to receive the actual operating temperature measured by the temperature sensing element, and calculate the temperature compensation value based on the target temperature and the actual operating temperature; The sensor interface is used to receive the temperature compensation value and adjust the adjustable heat dissipation element based on the temperature compensation value, so that the output of the adjustable heat dissipation element after adjustment, combined with the heat exchange enhancement structure, adjusts the actual working temperature to the target temperature range.
11. The pressure gauge heat dissipation system as described in claim 10, characterized in that, The control component also includes: The display screen is used to display and set process parameters, and to view the current operating status and historical information of the pressure gauge.
12. The pressure gauge heat dissipation system according to any one of claims 1-3, characterized in that, The heat exchange enhancement structure is a heat spreader, a heat pipe, or a microchannel.
13. The pressure gauge heat dissipation system as described in claim 12, characterized in that, Also includes: A vacuum connection radial sealing joint is connected to the gooseneck of the pressure gauge; The special gas pipeline is connected to the vacuum connection radial sealing joint.